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1. 发明专利

JP2013183024A Semiconductor device and semiconductor apparatus 审中-公开
标题翻译：半导体器件和半导体器件
公开(公告)号：JP2013183024A
公开(公告)日：2013-09-12
申请号：JP2012045895
申请日：2012-03-01
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： MASUTANI MUNEHIKO , TAKEUCHI KAZUYOSHI , HIGASHIMOTO SHIGEKAZU , KAMIYA KAZUNOBU , ISHIKAWA JUN
IPC分类号： H01L25/07 , H01L25/18
CPC分类号： H01L2224/32245 , H01L2224/34 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/37099 , H01L2224/37599
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device and a semiconductor apparatus which have high design flexibility.SOLUTION: A semiconductor element 20 is sealed by a resin 60 and is disposed in the resin 60. A source electrode material 30 is joined to the semiconductor element 20 and has a source pad 31 exposed on an upper surface of the resin 60. A drain electrode material 40 is joined to the semiconductor element 20 and has a drain pad 41 exposed on a lower surface of the resin 60. A gate electrode material 50 is joined to the semiconductor element 20 at the one end side and has gate pads 51, 52 which are respectively exposed on the upper surface and the lower surface of the resin 60 at the other end side.
摘要翻译：要解决的问题：提供具有高设计灵活性的半导体器件和半导体器件。解决方案：半导体元件20由树脂60密封并设置在树脂60中。源电极材料30连接到半导体元件20并且具有暴露在树脂60的上表面上的源极焊盘31.漏电极材料40接合到半导体元件20，并且具有暴露在树脂60的下表面上的漏极焊盘41.栅电极材料 50在一端侧连接到半导体元件20，并且具有在另一端侧分别暴露在树脂60的上表面和下表面上的栅极焊盘51,52。

2. 发明专利

JP2009213270A Power conversion device 有权
标题翻译：电源转换器件
公开(公告)号：JP2009213270A
公开(公告)日：2009-09-17
申请号：JP2008054049
申请日：2008-03-04
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： ONISHI HIROYUKI , NAGASE TOSHIAKI , ISHIKAWA JUN , KONYA KAZUYOSHI , FUKATSU TOSHISHIGE
IPC分类号： H02M1/00 , H02M7/48
CPC分类号： H01L2224/0603 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/19107 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a power conversion device which further reduces inductance parasitic to the wiring of a capacitor. SOLUTION: A semiconductor chip 23 is mounted to a base board 22, flat-plate shaped main bodies 27a, 28a at a positive electrode wiring member 27 and a negative electrode wiring member 28 are arranged so as to be parallel with the base board 22, and closely overlapped with each other while they are electrically insulated from each other in an upper part of the base board 22. The capacitor 17 is arranged on the body 28a of the negative electrode wiring member 28. In the positive electrode wiring member 27 and the negative electrode wiring member 28, hang-down parts 27b, 28b extending toward the base board 22 from the main bodies 27a, 28a are formed into flat-plate shapes, and the hang-down parts 27b, 28b are held while they approximate each other in a parallel state up to the vicinity of a connecting part with the base board 22. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：提供进一步降低寄生于电容器布线的电感的电力转换装置。解决方案：半导体芯片23安装在基板22上，正电极配线构件27和负极配线构件28的平板状主体27a，28a布置成与基座平行板22，并且在基板22的上部彼此电绝缘的情况下彼此紧密地重叠。电容器17布置在负极配线构件28的主体28a上。在正极布线构件如图27所示，负极配线部件28，从主体部27a，28a向基板22延伸的吊挂部件27b，28b形成为平板形状，并且保持部件27b，28b同时以平行状态彼此近似，直到与基板22的连接部分附近。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2009213269A Power conversion apparatus 有权
标题翻译：功率转换装置
公开(公告)号：JP2009213269A
公开(公告)日：2009-09-17
申请号：JP2008054048
申请日：2008-03-04
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： NAGASHIMA TAKASHI , ONISHI HIROYUKI , NAGASE TOSHIAKI , ISHIKAWA JUN , KONYA KAZUYOSHI , FUKATSU TOSHISHIGE
IPC分类号： H02M7/48 , H02M1/08
CPC分类号： H01L2224/32225 , H01L2224/48137 , H01L2224/73265 , H01L2924/30107 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To level wiring inductance between switching elements and wiring members when wiring inductance as a whole power conversion apparatus is reduced and a plurality of switching elements are used to play the role equivalent to a function of one switching element. SOLUTION: A plurality of groups of switching element groups formed of a plurality of semiconductor chips 23 for playing the role equivalent to the function of one switching element are mounted on a substrate. An anode wiring member 27 and a cathode wiring member 28 are disposed in such a way that they are closely overlapped in a state where they are made parallel to the substrate and are mutually insulated. The anode wiring member 27 is bonded to a circuit pattern 24b of the substrate at a terminal part 27a. A plurality of capacitors 17 are installed on the cathode wiring member 28 in the state where an anode terminal is electrically connected to the anode wiring member 27 and a cathode terminal to the cathode wiring member 28. The same number of semiconductor chips 23 are disposed on both sides of the bonding parts 27b of the anode wiring member 27. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了降低作为整体电力转换装置的布线电感的开关元件和配线构件之间的布线电感，并且使用多个开关元件发挥与一个开关元件的功能相同的作用。解决方案：由多个用于发挥与一个开关元件的功能相当的作用的半导体芯片23形成的多组开关元件组安装在基板上。阳极配线构件27和阴极配线构件28以与衬底平行的状态彼此紧密地重叠的方式设置，并且彼此绝缘。阳极配线构件27在端子部27a处接合到基板的电路图案24b。在阳极端子与阳极配线构件27电连接的状态和阴极配线构件28的阴极端子的状态下，在阴极配线构件28上安装多个电容器17.将相同数量的半导体芯片23配置在阳极配线构件27的接合部27b的两侧。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2007329236A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2007329236A
公开(公告)日：2007-12-20
申请号：JP2006158359
申请日：2006-06-07
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： NAGASE TOSHIAKI , ONISHI HIROYUKI , ISHIKAWA JUN , KONYA KAZUYOSHI
IPC分类号： H01L23/40
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device for achieving the semiconductor device that can be reduced in size, simplified in structure, and assure higher heat radiating property.
SOLUTION: The semiconductor device is formed as a power module of the 3-phase bridge structure wherein a couple of base plates 12 are fixed with screws on a heat sink 11 using four screw members 13. On each base plate 12, three switching elements 14 are arranged with an interval kept with each other. Since the couple of base plates 12 are used, warp of the base plate 12 can be reduced when the base plate 12 is manufactured and when an insulating substrate is soldered to the base plate 12. Accordingly, close contact between the base plate 12 and the heat sink 11 can be improved and the device as a whole can be reduced in size and simplified in structure.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于实现可以减小尺寸，简化结构并确保更高散热性能的半导体器件的半导体器件。解决方案：半导体器件形成为三相桥结构的功率模块，其中一对基板12使用四个螺钉构件13用螺钉固定在散热器11上。在每个基板12上，三个开关元件14以间隔保持彼此排列。由于使用了一对基板12，所以当制造基板12时，并且当将绝缘基板焊接到基板12时，可以减小基板12的翘曲。因此，基板12与基板12之间的紧密接触可以改善散热器11，并且可以将装置整体尺寸减小并且结构简化。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2007234695A Semiconductor module 审中-公开
标题翻译：半导体模块
公开(公告)号：JP2007234695A
公开(公告)日：2007-09-13
申请号：JP2006051507
申请日：2006-02-28
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： ISHIKAWA JUN , NAGASE TOSHIAKI , ONISHI HIROYUKI , KONYA KAZUYOSHI
IPC分类号： H01L23/12
CPC分类号： H01L2224/48091 , H01L2924/30107 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor module capable of bonding an external electrode to an external connection terminal by ultrasonic bonding without trouble in the semiconductor module in a configuration where a planar external connection terminal is supported by a cover made of resin for covering one portion of the opening of a vessel.
SOLUTION: The semiconductor module 10 comprises: the vessel 12 for storing electronic components 11; and the cover 13 for covering one portion of the opening of the vessel 12. In the semiconductor module, electronic components are stored in the vessel. Planar external connection terminals 17, 18, where one end is connected to the electronic components 11 electrically via a bonding wire 11a, are formed so that they are extended along the outer surface of the cover 13 while the other end side is supported by the cover 13. A reinforcing member 20 is provided at a position corresponding to the other end side of the external connection terminals 17, 18 of the cover 13.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种半导体模块，其能够通过超声波接合将外部电极连接到外部连接端子，而无需在半导体模块中以平面的外部连接端子由树脂制成的盖子支撑的结构用于覆盖容器的开口的一部分。解决方案：半导体模块10包括：用于存储电子部件11的容器12; 以及用于覆盖容器12的开口的一部分的盖13.在半导体模块中，将电子部件存储在容器中。其一端通过接合线11a电连接到电子部件11的平面外部连接端子17,18形成为使得它们沿着盖13的外表面延伸，而另一端由盖 13.一种加强构件20设置在与盖13的外部连接端子17,18的另一端侧对应的位置。（C）2007年，JPO和INPIT

6. 发明专利

JP2005333073A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2005333073A
公开(公告)日：2005-12-02
申请号：JP2004152199
申请日：2004-05-21
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： ISHIKAWA JUN , NAGASE TOSHIAKI , ONISHI HIROYUKI , AKAGAWA KOICHI , IIDA SUMIKO
IPC分类号： H01L21/60
CPC分类号： H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/4899 , H01L2224/49 , H01L2924/01004 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/00014 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device preventing the disconnection and short circuit of a wire. SOLUTION: A semiconductor chip 3 is mounted on a substrate 1 through a radiating board 2, and an external electrode 4 is arranged on the substrate 1. An electrode pad that is formed on the surface of the semiconductor chip 3 is connected with the external electrode 4 through a wire 5. In a region between the electrode pad of the semiconductor chip 3 and the wire bonding part of the external electrode 4, a rubber-like insulating member 7 is projected and formed on the corner 6 of the radiating board 2 located at the lower part of the wire 5. Even if the wire 5 is moved owing to the oscillation or the like from the outside, the direct contact of the wire 5 with the corner 6 of the radiating board 2 is prevented by the contact of the wire 5 with the insulating member 7. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种防止线断开和短路的半导体器件。解决方案：半导体芯片3通过散热板2安装在基板1上，外部电极4设置在基板1上。形成在半导体芯片3的表面上的电极焊盘与外部电极4通过线5.在半导体芯片3的电极焊盘与外部电极4的引线接合部分之间的区域中，橡胶状绝缘部件7突出并形成在辐射的角部6上板2位于线5的下部。即使线5由于外部的振动等而移动，则线5与散热板2的角部6的直接接触被防止了导线5与绝缘构件7的接触。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2005136229A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2005136229A
公开(公告)日：2005-05-26
申请号：JP2003371243
申请日：2003-10-30
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： AKAGAWA KOICHI , NAGASE TOSHIAKI , ONISHI HIROYUKI , ISHIKAWA JUN
IPC分类号： H01L23/40 , H01L25/04 , H01L25/18
CPC分类号： H01L2224/48091 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device for improving the heat radiation of a semiconductor element at the central part of a space where a plurality of semiconductor elements are arranged, and for preventing turning into a large scaling. SOLUTION: Semiconductor elements 14 in horizontal 6 columns are arranged on a space(or heat spreader 12), on which 12 pieces of semiconductor elements 14 are arranged so that the arrangement intervals of the semiconductor elements 14 can be made wide at the central part of the heat spreader 12, and made narrower, according as they go away from the central part of the arrangement space. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于改善半导体元件在布置多个半导体元件的空间的中心部分处的散热的半导体器件，并且用于防止变成大的刻度。解决方案：水平6列的半导体元件14布置在其上布置有12个半导体元件14的空间（或散热器12）上，使得半导体元件14的布置间隔可以在散热器12的中央部分，当它们远离安排空间的中心部分时变窄。版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2004363339A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2004363339A
公开(公告)日：2004-12-24
申请号：JP2003160211
申请日：2003-06-05
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： ONISHI HIROYUKI , NAGASE TOSHIAKI , ISHIKAWA JUN , AKAGAWA KOICHI
IPC分类号： H01L25/18 , H01L21/60 , H01L25/04
CPC分类号： H01L2224/0603 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/49 , H01L2224/49111 , H01L2224/49175 , H01L2924/01004 , H01L2924/01006 , H01L2924/01033 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To miniaturize a semiconductor device and to simplify steps for manufacturing the same. SOLUTION: A first row of semiconductor elements and a second row of semiconductor elements are in parallel with each other, in which semiconductor elements 1a-1c and 1d-1f are arranged, respectively. A gate pad is formed on the surface of each of the semiconductor elements 1a-1f. The gate pads for the semiconductor elements 1d-1f that belong to the second row are connected to a gate electrode 3 through the gate pads of the semiconductor elements 1a-1c that belong to the first row, respectively, by means of bonding wires 5a-5c. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了使半导体器件小型化并简化其制造步骤。解决方案：第一排半导体元件和第二排半导体元件分别彼此并联，其中分别布置有半导体元件1a-1c和1d-1f。在每个半导体元件1a-1f的表面上形成栅极焊盘。属于第二行的半导体元件1d-1f的栅极焊盘通过分别通过接合线5a-的第一行的半导体元件1a-1c的栅极焊盘连接到栅电极3， 5C。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2004327813A Semiconductor device 审中-公开
公开(公告)号：JP2004327813A
公开(公告)日：2004-11-18
申请号：JP2003122043
申请日：2003-04-25
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： AKAGAWA KOICHI , NAGASE TOSHIAKI , ONISHI HIROYUKI , ISHIKAWA JUN , SHIMOKAWA MOTOMARE
IPC分类号： H01L23/36
CPC分类号： H01L2224/32013 , H01L2224/48 , H01L2224/48472 , H01L2224/73265 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a small and inexpensive semiconductor device in which contact between a heat spreader and wiring is prevented without lowering the capacity of the heat spreader. SOLUTION: A metal insulating substrate 13 is bent such that a semiconductor chip 46 and a conductor 45 being connected with wiring 48 have the same height and then an electrode on the surface of the semiconductor chip 46 is connected with the conductor 45 on the metal insulating substrate 13 such that the wiring 48 does not slack. COPYRIGHT: (C)2005,JPO&NCIPI

10. 发明专利

JP2009213272A Power conversion device 有权
标题翻译：电源转换器件
公开(公告)号：JP2009213272A
公开(公告)日：2009-09-17
申请号：JP2008054051
申请日：2008-03-04
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： ONISHI HIROYUKI , NAGASE TOSHIAKI , ISHIKAWA JUN , KONYA KAZUYOSHI , FUKATSU TOSHISHIGE
IPC分类号： H02M7/48 , H02M1/00
CPC分类号： H02M7/003 , H01L24/73 , H01L25/072 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/30107 , H05K3/301 , H05K2201/068 , H05K2201/10272 , H05K2201/10522 , H05K2201/2018 , H01L2924/00012 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a power conversion device which reduces stress applied to a joining part between a positive electrode wiring member and a positive electrode wiring member, and a base board caused by the extension and the contraction of the base board by heat. SOLUTION: A semiconductor chip is mounted to the base board, flat-plate shaped main bodies 27a, 28a at the positive electrode wiring member 27 and the negative electrode wiring member 28 are arranged so as to be parallel with the base board, and closely overlapped with each other while they are electrically insulated from each other. A capacitor 17 is arranged on the body 28a of the negative electrode wiring member 28. In the positive electrode wiring member 27 and the negative electrode wiring member 28, hang-down parts 27b, 28b extending toward the base board from the main bodies 27a, 28a are formed into flat-plate shapes, and joined to the base board by terminals 27c, 28c. Notches 27d, 28d are extensively formed at the hang-down parts 27b, 28b from lower ends to upper ends of the hang-down parts 27b, 28b. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：提供一种功率转换装置，其降低施加到正电极布线构件和正极布线构件之间的接合部分的应力以及由基板的延伸和收缩引起的基板通过加热。解决方案：半导体芯片安装在基板上，正极布线构件27和负极布线构件28上的平板状主体27a，28a布置成与基板平行，并且彼此电绝缘时彼此紧密地重叠。在负极配线构件28的主体28a上配置有电容器17.在正极配线构件27和负极配线构件28中，从主体27a朝向基板延伸的挂起部27b，28b， 28a形成为平板形状，并通过端子27c，28c与基板接合。凹槽27d，28d从下端部分27b，28b的下端部到下端部分27b，28b的上端形成在下垂部分27b，28b处。版权所有（C）2009，JPO＆INPIT

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