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1. 发明专利

JP2009277787A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2009277787A
公开(公告)日：2009-11-26
申请号：JP2008126108
申请日：2008-05-13
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： ONISHI HIROYUKI , NAGASE TOSHIAKI , ISHIKAWA JUN , KONYA KAZUYOSHI , FUKATSU TOSHISHIGE
IPC分类号： H01L25/07 , H01L25/18
CPC分类号： H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device that saves a space as compared with use of a semiconductor chip having a sensor formed in one body while the sensor detects the temperature of a semiconductor chip mounted on a circuit pattern of a ceramic substrate more precisely than a conventional external sensor.
SOLUTION: A support plate 35 is fixed to a support frame 30 with a screw 36, and the temperature sensor 34 is engaged with and fixed to a tip of the support plate 35. A leaf spring is used as the support plate 35. The temperature sensor 34 has a thermistor built in a metallic cylindrical case 37 with good thermal conductivity, and is sealed with an electric insulating material with good thermal conductivity. A signal line 38 is led out of the cylindrical case 37. The temperature of the semiconductor chip 23 is detected in a state that a tip of the cylindrical case 37 is pressed against a ceramic substrate 21.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种半导体器件，与使用具有形成在一体中的传感器的半导体芯片相比，节省空间，同时传感器检测到安装在陶瓷的电路图案上的半导体芯片的温度基板比传统的外部传感器更精确。解决方案：支撑板35用螺钉36固定到支撑框架30上，并且温度传感器34与支撑板35的尖端接合并固定到支撑板35的顶端。板簧用作支撑板35 温度传感器34具有内置在具有良好导热性的金属圆筒形壳体37中的热敏电阻，并用具有良好导热性的电绝缘材料密封。信号线38从圆筒形壳体37中引出。半导体芯片23的温度是在圆筒形壳体37的顶端压在陶瓷基板21上的状态下被检测的。（C）2010 ，JPO＆INPIT

2. 发明专利

JP2007234693A Semiconductor device, and bonding method of external connection terminal of same and external electrode 有权
标题翻译：半导体器件及其外部连接端子和外部电极的接合方法
公开(公告)号：JP2007234693A
公开(公告)日：2007-09-13
申请号：JP2006051505
申请日：2006-02-28
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： ONISHI HIROYUKI , NAGASE TOSHIAKI , ISHIKAWA JUN , KONYA KAZUYOSHI
IPC分类号： H01L23/48
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device securing insulation even if the distance between external connection terminals and that between external electrodes is short by reducing the resistance of the bonding section between the positive side external connection terminal and negative side external connection terminal of the semiconductor device while the occurrence of inductance is being suppressed and the external electrode bonded to each external connection terminal.
SOLUTION: The semiconductor device 10 comprises: the planar positive side external connection terminal 11 and the planar negative side one 12. The positive side external electrode 14 and the negative side one 15 are electrically connected to both the external connection terminals 11, 12 while being bonded by each entire opposing surface. Both the positive side and negative side external connection terminals 11, 12 and the positive side and negative side external electrodes 14, 15 are electrically connected while the faces are in parallel and an electrical insulation section (insulator plate 16, insulating resin section 17) is arranged continuously between both the external connection terminals 11, 12 and both the external electrodes 14, 15.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种半导体器件，即使通过降低正侧外部连接端子和负侧外部连接之间的接合部分的电阻，外部连接端子与外部电极之间的距离短而确保绝缘性端子，同时抑制电感的发生，并且将外部电极接合到每个外部连接端子。解决方案：半导体器件10包括：平面正侧外部连接端子11和平面负极侧12。正侧外部电极14和负极侧15电连接到两个外部连接端子11，同时被每个整个相对表面粘合。正极侧负极侧和负极侧外部连接端子11,12以及正极侧和负极侧外部电极14,15均被电连接，并且电绝缘部（绝缘体板16，绝缘树脂部17）为连接在两个外部连接端子11,12和两个外部电极14,15之间。版权所有：（C）2007，JPO＆INPIT

3. 发明专利

JP2014183719A Member for holding distance between substrates, and inverter device 有权
标题翻译：用于保持基板和反相器件之间的距离的成员
公开(公告)号：JP2014183719A
公开(公告)日：2014-09-29
申请号：JP2013058574
申请日：2013-03-21
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： HIGASHIKAWA NAOKI , KONYA KAZUYOSHI
IPC分类号： H02M7/48
CPC分类号： H05K1/144 , H05K1/0203 , H05K7/142 , H05K2201/041
摘要： PROBLEM TO BE SOLVED: To provide: a member for holding a distance between substrates which makes it possible to readily position and hold a part to arrange between two substrates which are held apart from each other by a predetermined distance; and an inverter device.SOLUTION: A member 30 for holding a distance between substrates comprises: spacer members 41 for keeping the distance between two substrates constant with both end portions disposed in contact with a metal substrate 20 and a capacitor substrate 60; spacer-member-holding parts 31 for holding spacer members 41; a frame part 33 connecting between the spacer-member-holding parts 31; branch parts 35 each extending from the frame part 33 or the spacer-member-holding part 31 towards a predetermined position between the two substrates; and electrode holding parts 37 each provided on the branch part 35 and holding an electrode 51 at the predetermined position.
摘要翻译：要解决的问题：提供：用于保持基板之间的距离的部件，其使得可以容易地定位和保持部件以布置在彼此保持预定距离的两个基板之间; 用于保持基板之间距离的构件30包括：用于保持两个基板之间的距离恒定的间隔构件41，两个端部设置成与金属基板20和电容器基板60接触; 用于保持间隔件41的间隔件保持部31; 连接在间隔件构件保持部31之间的框架部33; 分支部35各自从框架部33或间隔件保持部31向两个基板之间的预定位置延伸; 以及电极保持部37，各自设置在分支部35上，并将电极51保持在规定位置。

4. 发明专利

JP2009213272A Power conversion device 有权
标题翻译：电源转换器件
公开(公告)号：JP2009213272A
公开(公告)日：2009-09-17
申请号：JP2008054051
申请日：2008-03-04
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： ONISHI HIROYUKI , NAGASE TOSHIAKI , ISHIKAWA JUN , KONYA KAZUYOSHI , FUKATSU TOSHISHIGE
IPC分类号： H02M7/48 , H02M1/00
CPC分类号： H02M7/003 , H01L24/73 , H01L25/072 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/30107 , H05K3/301 , H05K2201/068 , H05K2201/10272 , H05K2201/10522 , H05K2201/2018 , H01L2924/00012 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a power conversion device which reduces stress applied to a joining part between a positive electrode wiring member and a positive electrode wiring member, and a base board caused by the extension and the contraction of the base board by heat. SOLUTION: A semiconductor chip is mounted to the base board, flat-plate shaped main bodies 27a, 28a at the positive electrode wiring member 27 and the negative electrode wiring member 28 are arranged so as to be parallel with the base board, and closely overlapped with each other while they are electrically insulated from each other. A capacitor 17 is arranged on the body 28a of the negative electrode wiring member 28. In the positive electrode wiring member 27 and the negative electrode wiring member 28, hang-down parts 27b, 28b extending toward the base board from the main bodies 27a, 28a are formed into flat-plate shapes, and joined to the base board by terminals 27c, 28c. Notches 27d, 28d are extensively formed at the hang-down parts 27b, 28b from lower ends to upper ends of the hang-down parts 27b, 28b. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：提供一种功率转换装置，其降低施加到正电极布线构件和正极布线构件之间的接合部分的应力以及由基板的延伸和收缩引起的基板通过加热。解决方案：半导体芯片安装在基板上，正极布线构件27和负极布线构件28上的平板状主体27a，28a布置成与基板平行，并且彼此电绝缘时彼此紧密地重叠。在负极配线构件28的主体28a上配置有电容器17.在正极配线构件27和负极配线构件28中，从主体27a朝向基板延伸的挂起部27b，28b， 28a形成为平板形状，并通过端子27c，28c与基板接合。凹槽27d，28d从下端部分27b，28b的下端部到下端部分27b，28b的上端形成在下垂部分27b，28b处。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2009213271A Power conversion device 有权
标题翻译：电源转换器件
公开(公告)号：JP2009213271A
公开(公告)日：2009-09-17
申请号：JP2008054050
申请日：2008-03-04
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： ONISHI HIROYUKI , NAGASE TOSHIAKI , ISHIKAWA JUN , KONYA KAZUYOSHI , FUKATSU TOSHISHIGE
IPC分类号： H02M7/48 , H02M1/08
CPC分类号： H01L2924/30107 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To reduce wiring inductance between joining parts to circuit patterns of wiring members electrically connected to a capacitor, and each switching element.
SOLUTION: A positive electrode wiring member and a negative electrode wiring member which are formed into flat-plate shapes are arranged so as to approximate each other while they are insulated from each other, and a positive electrode terminal and a negative electrode terminal of the capacitor are connected to the positive electrode wiring member and the negative electrode wiring member, respectively. A base board includes a circuit pattern 24b to which a drain of a semiconductor chip 23 is connected, and a circuit pattern 24c to which a source of the semiconductor chip 23 is connected. A region to which at least the joining part 27b of the positive wiring member or a joining part 35 of an output electrode member of the circuit pattern 24b is connected, and a region to which at least the joining part 35 of the output electrode member of the circuit pattern 24c which corresponds to the circuit pattern 24b is connected, or a region to which the joining part 28b of the negative electrode wiring member is connected are arranged so as to be adjacent with each other.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题是：将接合部件之间的布线电感减小为电连接到电容器的布线构件的电路图案和每个开关元件。解决方案：形成为平板形状的正极配线部件和负极配线部件被布置为彼此相互近似地彼此相邻，并且正极端子和负极端子的电容器分别与正极配线部件和负极配线部件连接。基板包括连接有半导体芯片23的漏极的电路图案24b和连接有半导体芯片23的源极的电路图案24c。至少连接有正极配线部件的接合部27b或电路图案24b的输出电极部件的接合部35的区域，至少连接有输出电极部件的接合部35的区域连接与电路图案24b对应的电路图形24c，或者连接有负极配线构件的接合部28b的区域彼此相邻配置。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2007330013A Power device 审中-公开
标题翻译：电源设备
公开(公告)号：JP2007330013A
公开(公告)日：2007-12-20
申请号：JP2006158360
申请日：2006-06-07
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： ONISHI HIROYUKI , NAGASE TOSHIAKI , ISHIKAWA JUN , KONYA KAZUYOSHI , FUKATSU TOSHISHIGE
IPC分类号： H02M7/00
摘要： PROBLEM TO BE SOLVED: To provide a power device which has small and simple constitution and facilitates assembly. SOLUTION: The sections of the power terminals 3 of a board 1 are fixed each to tip faces of the projections 5 of a pair of external input terminal blocks 2 by the use of a pair of screws 6, whereby the board 1 is supported by the pair of external input terminal blocks 2, and also the pair of external input terminal blocks 2 and the pair of power terminals 3 of the board 1 are electrically connected with each other. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有简单结构且便于组装的功率器件。解决方案：板1的电源端子3的部分通过使用一对螺钉6固定到一对外部输入端子块2的突起5的尖端面上，由此板1是由一对外部输入端子块2支撑，并且一对外部输入端子块2和板1的一对电源端子3彼此电连接。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2007329383A Electrode structure of the semiconductor module 有权
标题翻译：半导体模块的电极结构
公开(公告)号：JP2007329383A
公开(公告)日：2007-12-20
申请号：JP2006160764
申请日：2006-06-09
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： KONYA KAZUYOSHI , FUKATSU TOSHISHIGE , NAGASE TOSHIAKI , ONISHI HIROYUKI , ISHIKAWA JUN
IPC分类号： H01L25/07 , H01L23/48 , H01L25/18
CPC分类号： H01L2224/48091 , H01L2224/48111 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide the electrode structure of a semiconductor module in which a layout arrangement is easy to be carried out while suppressing the generation of a surge voltage. SOLUTION: From the right extension 9b of an output electrode plate 9 to the right half portion of an isosceles triangle of a central portion 9a, a positive side input electrode 10 is arranged so as to overlap in parallel near to the output electrode 9 under the output electrode 9. From the left extension 9c of the output electrode 9 to the left half portion of the isosceles triangle of the central portion 9a, a negative side input electrode 11 is arranged so as to overlap in parallel being near to the output electrode 9 above the output electrode 9. An output terminal 9t of the output electrode 9, a positive side input terminal 10t of the positive side input terminal 10, and a negative side input electrode 11t of the negative side input electrode 11, are arranged so as to be near mutually and draw the isosceles triangle whose top is at the output terminal 9t. One end 10a of the positive side electrode 10 is joined to a conductive pattern 4 of a circuit board 3 of an upper arm side element 1. The left side extending portion 9c of the output electrode 9 is joined to the conductive pattern 8 of a circuit board 7 of a lower arm side element 5. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供在抑制浪涌电压的产生的同时易于执行布局布置的半导体模块的电极结构。解决方案：从输出电极板9的右侧延伸部9b到中央部9a的等腰三角形的右半部分，正极侧输入电极10配置成与输出电极平行地重叠从输出电极9的左延伸部9c到中央部分9a的等腰三角形的左半部分，负侧输入电极11被布置成平行重叠，靠近输出电极9的上方。输出电极9的输出端子9t，正极侧输入端子10的正极侧输入端子10t，负极侧输入电极11的负极侧输入电极11t配置以便相互靠近并绘制顶部位于输出端9t处的等腰三角形。正侧电极10的一端10a与上臂侧元件1的电路基板3的导电图案4接合。输出电极9的左侧延伸部9c与电路的导电图案8接合下臂侧元件5的板7。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2014011319A Electronic apparatus 有权
标题翻译：电子设备
公开(公告)号：JP2014011319A
公开(公告)日：2014-01-20
申请号：JP2012147171
申请日：2012-06-29
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： HIGASHIKAWA NAOKI , KONYA KAZUYOSHI
IPC分类号： H05K7/12 , G01R15/20
CPC分类号： G01R1/04 , H05K1/0271 , H05K3/301 , H05K3/306 , H05K7/1432 , H05K2201/10151 , H05K2201/10409 , H05K2201/10424
摘要： PROBLEM TO BE SOLVED: To provide an electronic apparatus capable of increasing a mounting area on a substrate even while being provided with a current sensor, and also capable of reducing vibrations of the current sensor.SOLUTION: A semiconductor device 10 includes a control circuit board 40, and the control circuit board 40 is supported by a support member 50. The support member 50 includes a leg attached to a main circuit board, and a support part 51 supported on the leg. Also, the semiconductor device 10 has a current sensor 33 signal-connected with the control circuit board 40 through a signal terminal 35, The current sensor 33 is suspended and supported by the control circuit board 40 through the support part 51, and is also fastened to the control circuit board 40 together with the support part 51 by using a screw 38.
摘要翻译：要解决的问题：提供即使在设置电流传感器的同时也能够增加基板上的安装面积的电子设备，并且还能够减少电流传感器的振动。解决方案：半导体器件10包括控制电路板 40，并且控制电路板40由支撑构件50支撑。支撑构件50包括附接到主电路板的脚和支撑在腿上的支撑部51。此外，半导体器件10具有通过信号端子35与控制电路板40信号连接的电流传感器33.电流传感器33通过支撑部51被控制电路板40悬挂和支撑，并且还被固定通过使用螺钉38与支撑部51一起连接到控制电路板40。

9. 发明专利

JP2009283856A Structure and method for mounting heat-generating component 有权
标题翻译：用于安装发热元件的结构和方法
公开(公告)号：JP2009283856A
公开(公告)日：2009-12-03
申请号：JP2008136935
申请日：2008-05-26
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： KONYA KAZUYOSHI
IPC分类号： H01L23/36
CPC分类号： H05K7/2049
摘要： PROBLEM TO BE SOLVED: To provide a mounting structure that not only prevents a heat dissipation material from being deformed associated with sliding movement of a cover but also allows the heat dissipation material accurately to have a press-contact with the dissipated surface. SOLUTION: In the mounting structure of an electronic component 15, a heat radiation sheet 18 is bonded to the heat dissipated surface 15a which is not only opposite to a wall portion 31 of the cover 30 in the electronic component 15 but also extended in a direction of a slide of the cover 30. Also, a heat conducting board 22 for covering a covering surface 18a of the heat radiation sheet 18 is mounted on an end of a circuit board 16 so that the heat radiation sheet 18 is covered from an upstream in a direction of the slide of the cover 30. Further, the electronic component 15 and wall portion 31 are thermally coupled through the heat radiation sheet 18 and heat conducting board 22 by allowing the heat conducting board 22 to be in press-contact with the covering surface 18a from a direction intersecting with the covering surface 18a by the wall portion 31 of the cover 30 in press-contact with the heat conducting board 22. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种安装结构，其不仅防止散热材料与盖的滑动运动相关而变形，而且允许散热材料准确地与散开的表面进行压接。解决方案：在电子部件15的安装结构中，散热片18被接合到散热表面15a，散热表面15a不仅与电子部件15中的盖30的壁部31相反，而且延伸在盖30的滑动方向上。另外，用于覆盖散热片18的覆盖表面18a的导热板22安装在电路板16的一端，使得散热片18被覆盖在盖30的滑动方向的上游。此外，电子部件15和壁部31通过使导热板22压接而通过散热片18和导热板22热耦合覆盖表面18a与覆盖表面18a相交的方向由盖30的壁部31与导热板22压力接触。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2009283567A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2009283567A
公开(公告)日：2009-12-03
申请号：JP2008132267
申请日：2008-05-20
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： NAGASE TOSHIAKI , ISHIKAWA JUN , KONYA KAZUYOSHI , FUKATSU TOSHISHIGE , ONISHI HIROYUKI
IPC分类号： H01L25/07 , H01L25/18 , H02M7/48
CPC分类号： H01L2224/37 , H01L2224/371 , H01L2224/40 , H01L2224/40225 , H01L2224/83801 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15787 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device with a wiring member having board thickness with necessary current capacity and terminal part bendability and reducing inductance of wiring. SOLUTION: The semiconductor device is formed of a sheet conductor, and a positive electrode wring member 27 and a negative electrode wiring member 28, which have a plurality of terminal parts 27a and 28a, are closely arranged in parallel while being electrically insulated. The terminal parts 27a and 28a have bending parts 27c and 28c, which are bent so that they form angle shapes with respect to main body parts 27A and 28A, bonding parts 27b and 28b, which extend in parallel to the main body parts 27A and 28A on a tip side and are formed to be thinner than the main body parts 27A and 28A. The bending parts 27c and 28c are formed in thin parts. The positive electrode wiring member 27 and the negative electrode wring member 28 are arranged so that surfaces without steps confront each other. The bonding parts 27b and 28b are bonded to a circuit pattern by ultrasonic bonding. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有布线构件的布线构件，所述布线构件具有具有必要电流容量的板厚度和端子部分弯曲性，并且减小布线的电感。解决方案：半导体器件由片状导体形成，并且具有多个端子部分27a和28a的正极绞合构件27和负极配线构件28在电绝缘的情况下并联紧密地布置。端子部分27a和28a具有弯曲部分27c和28c，弯曲部分27c和28c相对于主体部分27A和28A形成角度形状，平行于主体部分27A和28A延伸的接合部分27b和28b 形成为比主体部27A，28A薄。弯曲部分27c和28c形成为薄的部分。正电极配线构件27和负极电连接构件28被布置成使得没有台阶的表面彼此面对。接合部27b，28b通过超声波接合与电路图形接合。版权所有（C）2010，JPO＆INPIT

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