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1. 发明专利

JP2014093413A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2014093413A
公开(公告)日：2014-05-19
申请号：JP2012242924
申请日：2012-11-02
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： TAKEUCHI KAZUYOSHI , MASUTANI MUNEHIKO , HIGASHIMOTO SHIGEKAZU , KAMIYA KAZUNOBU
IPC分类号： H01L21/60
CPC分类号： H01L24/73 , H01L2224/48091 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To improve heat transfer performance between a semiconductor element and an electrode.SOLUTION: A semiconductor device comprises a circuit board on which a semiconductor element 21 is bonded. In the circuit board, a first metal plate 13, a second metal plate and a third metal plate are arranged on a top face of the insulating substrate. An undersurface 22a of an emitter electrode 22 of the semiconductor element 21 and a top face 13a of the first metal plate 13 are bonded with a conductive adhesive. A plurality of salients 41 are formed on the undersurface 22a of the emitter electrode 22 and the top face 13a of the first metal plate 13. The salients 41 are particles having good thermal conductivity which adhere to the undersurface 22a of the emitter electrode 22 and the top face 13a of the first metal plate 13. A conductive filler 51 is brought in contact with outer peripheral edges of a plurality of salients 41 (adjacent salients 41) without entering between the adjacent salients 41.
摘要翻译：要解决的问题：提高半导体元件和电极之间的传热性能。解决方案：半导体器件包括其上结合有半导体元件21的电路板。在电路板中，第一金属板13，第二金属板和第三金属板布置在绝缘基板的顶面上。半导体元件21的发射电极22的下表面22a和第一金属板13的顶面13a用导电粘合剂粘接。在发射电极22的下表面22a和第一金属板13的顶面13a上形成有多个凸起41.这些凸部41是具有良好导热性的颗粒，其粘附到发射极22的下表面22a和第一金属板13的顶面13a。导电填料51与多个凸部41（相邻的凸部41）的外周边缘接触而不进入相邻凸起部41之间。

2. 发明专利

JP2014017895A Inverter device 有权
标题翻译：逆变器装置
公开(公告)号：JP2014017895A
公开(公告)日：2014-01-30
申请号：JP2012151573
申请日：2012-07-05
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： MASUTANI MUNEHIKO
IPC分类号： H02M7/48
摘要： PROBLEM TO BE SOLVED: To provide an inverter device which improves the mountability.SOLUTION: An inverter device includes: a lower arm switching element; an upper arm switching element; a positive electrode terminal 26 connected with a positive electrode of a battery; and a negative electrode terminal connected with a negative electrode of the battery. The upper arm switching element is disposed on a first placement surface S1. The lower arm switching element is disposed on a second placement surface S2. The lower arm switching element is serially connected with the upper arm switching element by electrode plates 27, 31, 32. Output terminals 33 are connected with the electrode plates 27, 31, 32, and the multiple output terminals 33 are provided so as to be arranged along the first placement surface S1 or the second placement surface S2 which serves as a reference surface and are disposed covering at least one of the first placement surface S1 and the second placement surface S2.
摘要翻译：要解决的问题：提供一种提高安装性能的逆变器装置。解决方案：逆变器装置包括：下臂开关元件; 上臂开关元件; 与电池的正极连接的正极端子26; 以及与电池的负极连接的负极端子。上臂开关元件设置在第一放置面S1上。下臂开关元件设置在第二放置面S2上。下臂开关元件通过电极板27,31,32与上臂开关元件串联连接。输出端子33与电极板27,31,32连接，多个输出端子33设置成沿着作为基准面的第一放置面S1或第二放置面S2布置，并且被设置为覆盖第一放置面S1和第二放置面S2的至少一个。

3. 发明专利

JP2012084390A Connection structure of electrode 审中-公开
标题翻译：电极连接结构
公开(公告)号：JP2012084390A
公开(公告)日：2012-04-26
申请号：JP2010229764
申请日：2010-10-12
申请人： Toyota Industries Corp , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社豊田自動織機
发明人： HIGASHIMOTO SHIGEKAZU , TAKEUCHI MASAMI , ISHIZAKI TAKUYA , MASUTANI MUNEHIKO , SUZUKI SACHIKAZU , OTSUKA MIKI
IPC分类号： H01R4/02
摘要： PROBLEM TO BE SOLVED: To provide a connection structure of an electrode of which supplied solder can be easily observed from the outside.SOLUTION: A connection structure of an electrode comprises a power module Mp, an upper electrode 20, and solder 30 and 31. The upper electrode 20 is disposed above the top surface of a semiconductor element 11 of the power module Mp with an interval (distance d1) from the top surface. Additionally, the upper electrode 20 has notches 21 and 22, and is disposed at the position where the semiconductor element 11 of the power module Mp can be seen from above through the notches 21 and 22. The semiconductor element 11 of the power module Mp and the upper electrode 20 are bonded by the solder 30 and 31 supplied to the notches 21 and 22.
摘要翻译：要解决的问题：提供从外部容易观察到提供的焊料的电极的连接结构。解决方案：电极的连接结构包括功率模块Mp，上电极20和焊料30和31.上电极20设置在功率模块Mp的半导体元件11的上表面上方，具有间距（距离d1）。此外，上电极20具有凹口21和22，并且设置在从上方通过切口21和22可以看到功率模块Mp的半导体元件11的位置。功率模块Mp的半导体元件11和上电极20通过提供给凹口21和22的焊料30和31粘结。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2012023125A Method for soldering electrode member 审中-公开
标题翻译：焊接电极部件的方法
公开(公告)号：JP2012023125A
公开(公告)日：2012-02-02
申请号：JP2010158557
申请日：2010-07-13
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： ISHIZAKI TAKUYA , TAKEUCHI MASAMI , HIGASHIMOTO SHIGEKAZU , MASUTANI MUNEHIKO
IPC分类号： H01L23/48
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method for soldering an electrode member to enable soldering of a stable quality for an electrode member.SOLUTION: A lead 2 is soldered to a semiconductor element 3 through the steps of: disposing a solid soldering material 1 and the lead 2, provided on the soldering material 1, on an upper portion of the semiconductor element 3 at an interval from the semiconductor element 3; and heating the soldering material 1.
摘要翻译：要解决的问题：提供一种用于焊接电极部件以实现电极部件稳定质量的焊接的方法。解决方案：引线2通过以下步骤焊接到半导体元件3：将固体焊料1和设置在焊接材料1上的引线2以间隔设置在半导体元件3的上部从半导体元件3; 并加热焊接材料1.版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2012004374A Soldering jig 审中-公开
标题翻译：焊接大
公开(公告)号：JP2012004374A
公开(公告)日：2012-01-05
申请号：JP2010138472
申请日：2010-06-17
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： MASUTANI MUNEHIKO , TAKEUCHI MASAMI , HIGASHIMOTO SHIGEKAZU , ISHIZAKI TAKUYA
IPC分类号： H01L21/60
CPC分类号： H01L2224/34 , H01L2224/376 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2224/37599 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a soldering jig capable of preventing the remelting of solder connecting a first member and a second member, when a third member is soldered on the first member and the second member which are soldered with each other.SOLUTION: A soldering device 10 solders an upper electrode 54 on a semiconductor element 51 and a heat spreader 52 which are soldered with each other. A heating plate 24 can heat the semiconductor element 51, the heat spreader 52 and the upper electrode 54. A first component functioning as a heat transfer path from the heating plate 24 to the upper electrode 54 is composed of a lower jig 21 and an upper jig 22, and a second component functioning as a heat transfer path from the heating plate 24 to the semiconductor element 51 and the heat spreader 52 is composed of the lower jig 21 and a pedestal 23. As compared with the first component (the lower jig 21 and the upper jig 22), the second component (the lower jig 21 and the pedestal 23) is hard to transfer heat.
摘要翻译：要解决的问题：提供一种焊接夹具，其能够防止在连接第一构件和第二构件的焊料上重熔，当第三构件焊接在彼此焊接的第一构件和第二构件上时。焊接装置10焊接半导体元件51上的上电极54和彼此焊接的散热器52。加热板24可以加热半导体元件51，散热器52和上电极54.用作从加热板24到上电极54的传热路径的第一部件由下夹具21和上电极夹具22，作为从加热板24到半导体元件51和散热器52的传热路径的第二部件由下夹具21和基座23构成。与第一部件（下夹具 21和上夹具22），第二部件（下夹具21和基座23）难以传递热量。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2011066358A Soldering method and device 有权
标题翻译：焊接方法和装置
公开(公告)号：JP2011066358A
公开(公告)日：2011-03-31
申请号：JP2009218058
申请日：2009-09-18
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： HIGASHIMOTO SHIGEKAZU , MASUTANI MUNEHIKO , TAKEUCHI MASAMI
IPC分类号： H05K3/34 , B23K3/00 , B23K3/04 , B23K101/42
摘要： PROBLEM TO BE SOLVED: To provide a soldering method and device for reliably soldering a component to the lower surface of a substrate without receiving an effect of the thickness of a component.
SOLUTION: The soldering method includes moving downward a plate solder 60 before melting and an electronic component 11 only by specific quantity to a substrate 10 whose downward movement is regulated from a state that the plate solder 60 before melting arranged on an upper surface 11a of the electronic component 11 is brought into contact with a lower surface 10b of the substrate 10 by using a rod 45, a collar 40, and a plunger 34, and isolating the lower surface 10b of the substrate 10 and the plate solder 60 before melting only by a specific quantity. Then, the electronic component 11 is soldered to the lower surface 10b side of the substrate 10 by lifting up the electronic component 11 to the lower surface 10b side of the substrate 10 with a surface tension of solder brought into contact with and melted to the lower surface 10b of the substrate 10 by the aggregation of solder by melting the plate solder 60.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于将元件可靠地焊接到基板的下表面的焊接方法和装置，而不会受到部件厚度的影响。解决方案：焊接方法包括：将熔融前的板焊料60向下移动，仅将特定量的电子部件11向基板10向下方移动，该基板10的下降运动由上述熔融前的板焊料60 11a通过使用杆45，轴环40和柱塞34与基板10的下表面10b接触，并且将基板10的下表面10b和板焊料60隔离，之后仅熔化一定量。然后，将电子部件11焊接到基板10的下表面10b侧，通过将电子部件11提升到基板10的下表面10b侧，焊料的表面张力与下部表面10b接触并熔化通过熔化板焊料60使焊料聚集，从而衬底10的表面10b。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2009239179A Soldering device and soldering method 审中-公开
标题翻译：焊接设备和焊接方法
公开(公告)号：JP2009239179A
公开(公告)日：2009-10-15
申请号：JP2008086228
申请日：2008-03-28
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： MASUTANI MUNEHIKO
IPC分类号： H05K3/34 , B23K1/002 , B23K3/00 , B23K101/42
摘要： PROBLEM TO BE SOLVED: To achieve a uniform temperature distribution of each object to be soldered in an appropriate soldering condition when a plurality of objects are to be soldered simultaneously, thereby reducing energy consumption for heating.
SOLUTION: A plurality of objects 16 are soldered simultaneously by induction heating of a support stage 14 using a high-frequency heating coil 31 while the support stage 14 supporting the objects 16 is held in a floating state. The support stage 14 is held in the floating state by making use of repulsive forces of a first magnet 12 and a second magnet 15. The support stage 14 is heated while its horizontal movement is regulated by a regulation pin 13.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了在要同时焊接多个物体时在适当的焊接条件下实现要焊接的每个物体的均匀的温度分布，从而减少加热的能量消耗。解决方案：通过使用高频加热线圈31的支撑台14的感应加热同时焊接多个物体16，而支撑物体16的支撑台14被保持在浮动状态。支撑台14通过利用第一磁体12和第二磁体15的排斥力而保持在浮动状态。支撑台14在其水平运动由调节销13调节的同时被加热。版权所有：（C）2010，JPO＆INPIT

8. 发明专利

JP2008229709A Soldering device, soldering method and manufacturing method of electronic equipment 审中-公开
标题翻译：焊接设备，焊接方法和电子设备的制造方法
公开(公告)号：JP2008229709A
公开(公告)日：2008-10-02
申请号：JP2007076990
申请日：2007-03-23
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： HIGASHIMOTO SHIGEKAZU , TAKEUCHI KAZUYOSHI , MASUTANI MUNEHIKO , MATSUMOTO SHOHEI
IPC分类号： B23K1/002 , B23K101/42 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a soldering device that, when soldering electronic components by high frequency induction heating to a workpiece having a plurality of parts to be soldered, can uniformize the temperature rise speed of an object to be heated even if a workpiece shape has variations and maintains a solder temperature within a prescribed range thereby excellently performs soldering, and also to provide a soldering method and a manufacturing method of electronic equipment.
SOLUTION: The soldering device 21 includes a high frequency heating coil 20 and cores 40 which are arranged opposite to a plurality of spindles 17 to be simultaneously heated by high frequency induction heating, which are also disposed movably relatively to the high frequency heating coil 20, and which have magnetic path forming parts 40b installed so as to extend toward the spindles 17. In addition, the soldering device 21 is provided with bolts 50 and nuts 51 for individually positioning and supporting the cores 40. The plurality of cores 40 are positioned and supported using the bolts 50 and the nuts 51 in a state where gaps G between the end face of the magnetic path forming parts 40b and the spindles 17 are adjusted to a value which is set according to the temperature rise speed of the spindles.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种焊接装置，当通过高频感应加热将电子部件焊接到具有多个要被焊接的部件的工件时，即使在被加热物体的升温速度也能够均匀化工件形状具有变化并将焊锡温度保持在规定范围内，从而优异地进行焊接，并且还提供电子设备的焊接方法和制造方法。解决方案：焊接装置21包括高频加热线圈20和与多个主轴相对设置的芯40，以与高频感应加热同时加热，高频加热线圈20也可相对于高频加热线圈20，并且其具有安装成朝向主轴17延伸的磁路形成部分40b。另外，焊接装置21设置有用于单独定位和支撑芯部40的螺栓50和螺母51.多个芯部40 在将磁路形成部40b的端面与主轴17之间的间隙G调整为根据主轴的升温速度而设定的值的状态下，使用螺栓50和螺母51进行定位和支撑。版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2014029955A Sealing part molding jig, semiconductor device, and method for manufacturing semiconductor device 审中-公开
标题翻译：密封件成型夹具，半导体器件及制造半导体器件的方法
公开(公告)号：JP2014029955A
公开(公告)日：2014-02-13
申请号：JP2012170323
申请日：2012-07-31
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： KAMIYA KAZUNOBU , TAKEUCHI KAZUYOSHI , HIGASHIMOTO SHIGEKAZU , MASUTANI MUNEHIKO
IPC分类号： H01L21/56
CPC分类号： H01L2224/33 , H01L2224/48091 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a sealing part molding jig capable of preventing a fillet projecting upward from being formed on a sealing part, a semiconductor device, and a method for manufacturing a semiconductor device.SOLUTION: A sealing part molding jig 40 molds a sealing part 30 which surrounds a laminate 44 including a semiconductor element 20 and seals an upper end face 14a of an upper electrode 14 in the laminate 44 while exposing the upper end face 14a from a top face 30a. The sealing part molding jig 40 has a jig body 41 surrounding the laminate 44, the jig body 41 has an inside face 41a which is brought into contact with an outside face 30b of the sealing part 30 to mold the outside face 30b, and a height H2 at a top edge of the inside face 41a in the jig body 41 is set lower than a height H1 of the upper end face 14a of the upper electrode 14.
摘要翻译：要解决的问题：提供一种能够防止在密封部上形成向上突出的圆角的密封部成型夹具，半导体装置以及半导体装置的制造方法。封装部成形模具40将模具密封部件30围绕包括半导体元件20的层压体44并且密封层压体44中的上电极14的上端面14a，同时使顶端面14a从顶面30a露出。密封部成型夹具40具有围绕层叠体44的夹具主体41，夹具主体41具有与密封部30的外侧面30b接触以形成外侧面30b的内侧面41a，夹具本体41的内侧面41a的顶端部的H2被设定为低于上部电极14的上端面14a的高度H1。

10. 发明专利

JP2013183105A Circuit board and manufacturing method of the same 有权
标题翻译：电路板及其制造方法
公开(公告)号：JP2013183105A
公开(公告)日：2013-09-12
申请号：JP2012047221
申请日：2012-03-02
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： MASUTANI MUNEHIKO
IPC分类号： H05K1/11 , H01L23/48 , H01L25/07 , H01L25/18 , H05K3/40
CPC分类号： H01L2224/34 , H01L2224/37011 , H01L2924/15787 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a circuit board in which an upper electrode is stably bonded on a top face of a circuit pattern, and provide a manufacturing method of the circuit board.SOLUTION: A circuit board comprises: a circuit pattern 22; and an upper electrode 30 bonded on a top face of the circuit pattern 22 by a bonding material 40. The upper electrode 30 includes: a horizontal part 36 which extends along the top face of the circuit pattern 22 and serves as a part bonded with the top face of the circuit pattern 22 by the bonding material; a standing part 34 for external connection; and horizontal parts 31, 33 and vertical parts 32, 35 which serve as a jig receiving for receiving a jig.
摘要翻译：要解决的问题：提供一种电路板，其中上电极稳定地接合在电路图案的顶面上，并提供电路板的制造方法。解决方案：电路板包括：电路图案22; 以及通过接合材料40接合在电路图案22的顶面上的上电极30.上电极30包括：水平部分36，其沿着电路图案22的顶面延伸，并且用作与通过接合材料的电路图案22的顶面; 用于外部连接的站立部分34; 以及用作接收夹具的夹具的水平部分31,33和垂直部分32,35。

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