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1. 发明专利

JP2017116317A センサ装置审中-公开
公开(公告)号：JP2017116317A
公开(公告)日：2017-06-29
申请号：JP2015249684
申请日：2015-12-22
申请人：株式会社豊田中央研究所 , Toyota Central R&D Labs Inc , トヨタ自動車株式会社 , Toyota Motor Corp , 国立大学法人東北大学 , Tohoku Univ
发明人： HATA YOSHIYUKI , FUJIYOSHI MOTOHIRO , NONOMURA YUTAKA , NAKAYAMA TAKAHIRO , BITO KOJI , ESASHI MASAKI , MUROYAMA MASANORI , TANAKA SHUJI
IPC分类号： G01L1/14 , G01L5/00
摘要：【課題】接触センシング面から見て側面側から直接、外力を受けることなく、センサ構造部及び信号処理用集積回路の欠損及び故障を低減すること。【解決手段】センサ装置は、検出対象物と直接に接触する接触センシング面を外部に露出する一面に有するとともに、接触センシング面の変化に感応してセンサ信号を出力するセンサ構造部と、一方の面に第1凹状部が形成され、該一方の面の反対側の面に第2凹状部が形成された基板と、センサ構造部が出力するセンサ信号を処理する信号処理用集積回路と、を備えている。センサ構造部は、基板の第1凹状部内に配置されている。信号処理用集積回路は、基板の第2凹状部内に配置されている。【選択図】図1

2. 发明专利

JP2013126694A Mems device 有权
标题翻译： MEMS器件
公开(公告)号：JP2013126694A
公开(公告)日：2013-06-27
申请号：JP2011276119
申请日：2011-12-16
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所
发明人： FUJIYOSHI MOTOHIRO , NONOMURA YUTAKA , OMURA YOSHITERU , FUNABASHI HIROBUMI , AKASHI TERUHISA , HATA YOSHIYUKI
IPC分类号： B81B3/00 , G01P15/125 , H01L21/822 , H01L27/04 , H01L29/84
摘要： PROBLEM TO BE SOLVED: To provide a technique capable of preventing bending of a substrate, in a MEMS device including the substrate and a movable part.SOLUTION: A MEMS device including a substrate and a movable part movable relative to the substrate is disclosed. The MEMS device includes a lower conductive layer, an intermediate insulating layer, and an upper conductive layer. The lower conductive layer is formed so as to be thicker than the upper conductive layer. A bending prevention layer is formed at the outer side of the lower conductive layer. The bending prevention layer is formed in a range corresponding to the intermediate insulating layer.
摘要翻译：要解决的问题：提供一种能够防止基板弯曲的技术，在包括基板和可移动部件的MEMS装置中。公开了一种包括基板和可相对于基板移动的可移动部件的MEMS装置。 MEMS器件包括下导电层，中间绝缘层和上导电层。下导电层形成为比上导电层厚。在下导电层的外侧形成弯曲防止层。弯曲防止层形成在与中间绝缘层对应的范围内。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2014108501A Mems devices 审中-公开
标题翻译： MEMS器件
公开(公告)号：JP2014108501A
公开(公告)日：2014-06-12
申请号：JP2012265178
申请日：2012-12-04
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所
发明人： AKASHI TERUHISA , FUJIYOSHI MOTOHIRO , OMURA YOSHITERU , HATA YOSHIYUKI
IPC分类号： B81B3/00 , G01C19/5762 , G01P15/125
摘要： PROBLEM TO BE SOLVED: To provide a technology that can improve thermal behavior in a MEMS device in which a movable part is formed by removing selectively a sacrificial layer layered between a first layer and a second layer substantially made of a same material.SOLUTION: In a MEMS device in which a movable part is formed by removing selectively a sacrificial layer layered between a first layer and a second layer substantially made of a same material, the movable part has a connection part where the first layer and the second layer are connected physically by an interlamellar connection part filling mainly between the first layer and the second layer. In the MEMS device, a coefficient of linear expansion of a material constituting the interlamellar connection part is approximate to a coefficient of linear expansion of the material constituting the first layer and the second layer in comparison with a coefficient of linear expansion of the material constituting the sacrificial layer.
摘要翻译：要解决的问题：提供一种可以改善MEMS器件中的热性能的技术，其中通过选择性地移除基本上由相同材料制成的第一层和第二层之间的牺牲层来形成可移动部分。解决方案：在 MEMS器件，其中可移动部分通过选择性地去除基本上由相同材料制成的第一层和第二层之间的牺牲层而形成，所述可移动部分具有第一层和第二层物理连接的连接部分通过主要在第一层和第二层之间填充的层间连接部分。在MEMS器件中，构成层间连接部的材料的线膨胀系数与构成第一层和第二层的材料的线膨胀系数相比，构成第一层和第二层的材料的线膨胀系数牺牲层。

4. 发明专利

JP2013064724A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2013064724A
公开(公告)日：2013-04-11
申请号：JP2012122267
申请日：2012-05-29
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所
发明人： HATA YOSHIYUKI , NONOMURA YUTAKA , AKASHI TERUHISA , FUNABASHI HIROBUMI , FUJIYOSHI MOTOHIRO , OMURA YOSHITERU
IPC分类号： G01P15/125 , G01P15/18 , H01L29/84
CPC分类号： B81C1/00825 , B81B2201/0235 , B81B2203/033 , B81B2203/0392 , G01C19/5762 , G01C19/5769 , G01P15/0802 , G01P15/125 , G01P15/18 , G01P2015/0814 , G01P2015/084
摘要： PROBLEM TO BE SOLVED: To provide a technique for forming a trench without leaving residues of a semiconductor in forming a narrow trench on a thick semiconductor layer.SOLUTION: The semiconductor device where a trench is formed on a semiconductor layer is disclosed. In the semiconductor layer of the semiconductor device, a compensation pattern for compensating a radical change of width of the trench is formed at a place where the width of the trench radically changes. In the semiconductor device, since the compensation pattern is formed at the place where the width of the trench radically changes in the semiconductor layer, generation of a steep slope part which causes residues of the semiconductor is suppressed in performing trench processing by a deep RIE (Reactive Ion Etching) method. Thus, generation of residues of the semiconductor is preventable in forming a narrow trench in the thick semiconductor layer.
摘要翻译：要解决的问题：提供一种在厚半导体层上形成窄沟槽而不留下半导体残留物的沟槽形成技术。公开了在半导体层上形成沟槽的半导体器件。在半导体器件的半导体层中，在沟槽宽度急剧变化的地方形成用于补偿沟槽宽度的根本变化的补偿图案。在半导体器件中，由于补偿图案形成在半导体层中的沟槽宽度发生变化的位置，所以通过深度RIE进行沟槽加工时抑制导致半导体残留的陡峭部分的产生（反应离子蚀刻）方法。因此，在厚半导体层中形成窄沟槽时，可以防止半导体残留物的产生。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2012183612A Mems device 审中-公开
标题翻译： MEMS器件
公开(公告)号：JP2012183612A
公开(公告)日：2012-09-27
申请号：JP2011048938
申请日：2011-03-07
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所
发明人： OMURA YOSHITERU , FUJIYOSHI MOTOHIRO , NONOMURA YUTAKA , AKASHI TERUHISA , HATA YOSHIYUKI , FUNABASHI HIROBUMI
IPC分类号： B81B3/00 , G01P15/125 , G01P15/18 , H01L29/84
摘要： PROBLEM TO BE SOLVED: To provide a technology that suppresses a warpage occurring in a movable electrode fixed to a movable mass body having a laminated structure.SOLUTION: A micro-electromechanical system (MEMS) device includes: a substrate; the movable mass body that is formed by laminating a second conductive region on a first conductive region via a first insulating region and relatively movable to the substrate; an elastically supporting member for coupling the substrate with the movable mass body; a fixed electrode fixed to the substrate; the movable electrode fixed to the movable mass body and disposed opposite to the fixed electrode; and a reinforcing member that is formed by laminating a second conductive reinforcing region on a first conductive reinforcing region via an insulative reinforcing region and is fixed to the movable mass body, the reinforcing member supporting the movable mass electrode from at least both sides.
摘要翻译：解决的问题：提供抑制固定在具有层叠结构的可移动质量体的可动电极中发生翘曲的技术。微机电系统（MEMS）装置包括：基板; 所述移动质量体通过经由第一绝缘区域在第一导电区域上层叠第二导电区域并且能够相对于所述基板形成; 弹性支撑构件，用于将所述基底与所述可移动块体联接; 固定在基板上的固定电极; 所述可动电极固定在所述可移动质量体上并与所述固定电极相对设置; 以及加强部件，其通过绝缘加强区域在第一导电性加强区域上层压第二导电性加强区域而固定到可动体本体，所述加固部件至少从两侧支撑可动质量电极。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2012159417A Displacement sensor, method for manufacturing the same, and semiconductor wafer for the same 有权
标题翻译：位移传感器，其制造方法和相同的半导体滤波器
公开(公告)号：JP2012159417A
公开(公告)日：2012-08-23
申请号：JP2011019884
申请日：2011-02-01
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所
发明人： FUNABASHI HIROBUMI , NONOMURA YUTAKA , HATA YOSHIYUKI , FUJIYOSHI MOTOHIRO , AKASHI TERUHISA , OMURA YOSHITERU
IPC分类号： G01P15/125 , G01P15/18 , H01L29/84
摘要： PROBLEM TO BE SOLVED: To provide a displacement sensor capable of accurately detecting a displacement amount in a direction orthogonal to a laminate direction without being affected by displacement in the laminate direction.SOLUTION: The displacement sensor includes: a substrate; a movable mass body supported displaceably in two axial directions with respect to the substrate; a first fixed electrode and a first movable electrode for detecting a displacement amount in a direction orthogonal to a laminate direction; and a second fixed electrode and a second movable electrode for detecting a displacement amount in the laminate direction. In the displacement sensor, the first fixed electrode and the first movable electrode are formed so that one outer end portions of the first fixed electrode and the first movable electrode are located in the inside of the other outer end portions of the first fixed electrode and the first movable electrode, and the one inner end portions of the first fixed electrode and the first movable electrode are located in the outside of the other inner end portions of the first fixed electrode and the first movable electrode.
摘要翻译：解决的问题：提供一种能够精确地检测与层叠方向正交的方向上的位移量而不受层叠方向的位移的影响的位移传感器。位移传感器包括：基板; 相对于基板在两个轴向上可移动地支撑的可移动质量体; 用于检测与层叠方向正交的方向上的位移量的第一固定电极和第一可动电极; 以及用于检测层叠方向上的位移量的第二固定电极和第二可动电极。在位移传感器中，第一固定电极和第一可动电极形成为使得第一固定电极和第一可动电极的一个外端部位于第一固定电极的另一外端部的内侧，第一可动电极，第一固定电极和第一可动电极的一个内端部位于第一固定电极和第一可动电极的另一内端部的外侧。版权所有（C）2012，JPO＆INPIT

7. 发明专利

JP2011177858A Mems structure and manufacturing method thereof 有权
标题翻译： MEMS结构及其制造方法
公开(公告)号：JP2011177858A
公开(公告)日：2011-09-15
申请号：JP2010046496
申请日：2010-03-03
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所
发明人： FUNABASHI HIROBUMI , NONOMURA YUTAKA , HATA YOSHIYUKI , FUJIYOSHI MOTOHIRO , AKASHI TERUHISA , OMURA YOSHITERU
IPC分类号： B81B3/00 , B81C1/00 , G02B26/08
CPC分类号： H01L21/02 , H01L29/84
摘要： PROBLEM TO BE SOLVED: To manufacture an MEMS structure having a displacement portion and an opposite position by machining a laminated substrate while using etching technique. SOLUTION: On the MEMS structure 1, a first etching groove 7a penetrating an electric conductor lower layer 2, an insulator lower layer 3, and an electric conductor middle layer 4; and a second etching groove 7b penetrating an electric conductor upper layer 6, an insulator upper layer 5, and the electric conductor middle layer 4 are formed. The first etching groove 7a forms a part of an outline of the displacement portion 4a. The second etching groove 7b also forms a part of the outline of the displacement portion 4a. When observed from a laminating direction, at least a part of the first etching groove 7a is provided within a range overlapped with a first extension portion 6a. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：通过在使用蚀刻技术的情况下通过机械加工层压基板来制造具有位移部分和相对位置的MEMS结构。解决方案：在MEMS结构1上，穿过导电体下层2，绝缘体下层3和电导体中间层4的第一蚀刻槽7a; 并且形成贯穿导电体上层6，绝缘体上层5和电导体中间层4的第二蚀刻槽7b。第一蚀刻槽7a形成位移部分4a的轮廓的一部分。第二蚀刻槽7b也形成位移部分4a的轮廓的一部分。当从层叠方向观察时，第一蚀刻槽7a的至少一部分设置在与第一延伸部6a重叠的范围内。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2014145717A Tactile sensor system, orbit acquisition device, and robot hand 有权
标题翻译：触觉传感器系统，轨道采集设备和机器人手
公开(公告)号：JP2014145717A
公开(公告)日：2014-08-14
申请号：JP2013015459
申请日：2013-01-30
申请人： Toyota Motor Corp , トヨタ自動車株式会社 , Toyota Central R&D Labs Inc , 株式会社豊田中央研究所
发明人： NAKAYAMA TAKAHIRO , KIDA YUSUKE , DEO TAKASHI , FUNAHASHI HIROFUMI , NONOMURA YUTAKA , HATA YOSHIYUKI , FUJIYOSHI MOTOHIRO
IPC分类号： G01L5/00 , B25J15/08 , G01L5/16
摘要： PROBLEM TO BE SOLVED: To provide a tactile sensor system, orbit acquisition device, and robot hand that are able to estimate the movement locus in finer unit and more correctly.SOLUTION: A tactile sensor system 100 comprises: a plurality of tactile sensors 3-1, 3-2, and 3-m and a plurality of buses 1-1, 1-2, and 1-n which include at least one position sensor 4; and an arithmetic processing part 2 connected to the plurality of buses 1. An interval between the tactile sensors 3 is shorter than the minimal value of the resolution of the position sensor 4. The arithmetic processing part 2 calculates a pressure distribution on the basis of a value detected by the plurality of tactile sensors 3 adjacent to each other, and calculates a movement distance on the basis of the value detected by the position sensor 4. If the movement distance is not smaller than the minimal value of the resolution of the position sensor 4, the arithmetic processing part 2 estimates the locus of the movement. If the movement distance is smaller than the minimal value of the resolution of the position sensor 4, the arithmetic processing part 2 estimates the locus of the movement on the basis of the pressure distribution.
摘要翻译：要解决的问题：提供能够以更精细的单元估计运动轨迹并且更正确的触觉传感器系统，轨道获取装置和机器人手。解决方案：触觉传感器系统100包括：多个触觉传感器3- 1,2,3和3-m以及包括至少一个位置传感器4的多个总线1-1,1-2和1-n; 以及与多个总线1连接的算术处理部2.触觉传感器3之间的间隔比位置传感器4的分辨率的最小值短。算术处理部2基于由彼此相邻的多个触觉传感器3检测到的值，并且基于由位置传感器4检测到的值来计算移动距离。如果移动距离不小于位置传感器的分辨率的最小值如图4所示，运算处理部2估计运动的轨迹。如果移动距离小于位置传感器4的分辨率的最小值，则算术处理部2基于压力分布来估计移动的轨迹。

9. 发明专利

JP2014004676A Mems structure 有权
标题翻译： MEMS结构
公开(公告)号：JP2014004676A
公开(公告)日：2014-01-16
申请号：JP2012282404
申请日：2012-12-26
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所 , Toyota Motor Corp , トヨタ自動車株式会社
发明人： OMURA YOSHITERU , FUJIYOSHI MOTOHIRO , NONOMURA YUTAKA , AKASHI TERUHISA , FUNAHASHI HIROFUMI , HATA YOSHIYUKI , NAKAYAMA TAKAHIRO
IPC分类号： B81B3/00 , G01C19/5755 , G01P15/125 , G02B26/08
摘要： PROBLEM TO BE SOLVED: To provide a technique capable of preventing the occurrence of warp such as the distal end of the movable unit flipping up and the concentration of stress at the movable unit or the coupling unit, which are caused from the release of residual strain of a stacked substrate in an MEMS structure formed in the stacked substrate in which linear expansion coefficients of adjacent layers are different.SOLUTION: The present specification discloses an MEMS structure. The MEMS structure includes a substrate unit formed in a first layer; an intermediate fixing unit formed in a second layer, and an upper fixing unit, a coupling unit, and a movable unit formed in a third layer, where the upper fixing unit is fixed to the substrate unit by way of the intermediate fixing unit, the movable unit is cantilever supported by the coupling unit, and the coupling unit is supported by the upper fixing unit. In the MEMS structure, the coupling unit is connected to the upper fixing unit at a position distant from the distal end of the movable unit than an end of the intermediate fixing unit closer to the distal end of the movable unit with respect to a supporting direction of the movable unit.
摘要翻译：要解决的问题：提供一种能够防止由于残留应变的释放引起的可动单元的前端起翘和可动单元或联接单元的应力集中的翘曲的发生的技术在层叠基板中形成的MEMS结构中的层叠基板，其中相邻层的线性膨胀系数不同。解决方案：本说明书公开了一种MEMS结构。 MEMS结构包括形成在第一层中的衬底单元; 形成在第二层中的中间固定单元，以及形成在第三层中的上固定单元，联接单元和可移动单元，其中上固定单元通过中间固定单元固定到基板单元，可移动单元是由联接单元支撑的悬臂，并且联接单元由上固定单元支撑。在MEMS结构中，耦合单元在远离可移动单元的远端的位置处连接到上固定单元，而不是相对于支撑方向更靠近可移动单元的远端的中间固定单元的端部的可移动单元。

10. 发明专利

JP2013211365A Integrated device 有权
标题翻译：集成设备
公开(公告)号：JP2013211365A
公开(公告)日：2013-10-10
申请号：JP2012079811
申请日：2012-03-30
申请人： Tohoku Univ , 国立大学法人東北大学 , Toyota Central R&D Labs Inc , 株式会社豊田中央研究所 , Toyota Motor Corp , トヨタ自動車株式会社
发明人： MAKIHATA MITSUTOSHI , ESASHI MASAKI , TANAKA HIDEJI , MUROYAMA MASANORI , FUNABASHI HIROBUMI , NONOMURA YUTAKA , HATA YOSHIYUKI , YAMADA HITOSHI , NAKAYAMA TAKAHIRO , YAMAGUCHI TAKATADA
IPC分类号： H01L21/76 , G01L9/00 , H01L21/02 , H01L21/3205 , H01L21/683 , H01L21/768 , H01L21/8234 , H01L23/522 , H01L25/04 , H01L25/065 , H01L25/07 , H01L25/18 , H01L27/06 , H01L27/088 , H01L27/12 , H01L29/84
CPC分类号： H01L23/552 , B81B7/008 , B81C1/00238 , B81C2203/0792 , H01L21/3043 , H01L21/30625 , H01L21/6835 , H01L21/6836 , H01L21/76898 , H01L21/78 , H01L23/5386 , H01L25/072 , H01L25/16 , H01L25/18 , H01L25/50 , H01L27/0611 , H01L29/0657 , H01L2221/68327 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an integrated device having excellent insulation resistance.SOLUTION: A groove having a side face consisting of an inclined surface is provided between adjoining devices. When the side provided with an electronic circuit or an MEMS device is the front face, the groove is made narrower from the front face toward the back face by the inclined surface. Since a mold material (insulation material) exists in the groove, a plurality of devices are bonded mechanically while being insulated electrically from each other. A wiring material for electrically conducting the adjoining devices is formed along the side face and bottom face of the groove. When taking out the wiring to the back face, a hole is formed in the bottom face of the groove so that the wiring material is exposed from the hole to the back face.
摘要翻译：要解决的问题：提供具有优异的绝缘电阻的集成装置。解决方案：在相邻的装置之间设置具有由倾斜表面组成的侧面的凹槽。当设置有电子电路或MEMS装置的一侧是前表面时，通过倾斜表面使凹槽从前表面朝向后表面变窄。由于在槽中存在模具材料（绝缘材料），所以多个装置在彼此电绝缘的同时机械地结合。沿着槽的侧面和底面形成用于导电邻接装置的布线材料。当将布线取出到背面时，在槽的底面形成孔，使得布线材料从孔暴露到背面。

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