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1. 发明授权

US5458998A Method of making mask pattern data and process for manufacturing the mask 失效
标题翻译：制作掩模图案数据的方法和用于制造掩模的工艺
公开(公告)号：US5458998A
公开(公告)日：1995-10-17
申请号：US886403
申请日：1992-05-21
申请人： Toshitsugu Takekuma , Toshio Suzuki , Hidetoshi Iwai , Masamichi Ishihara
发明人： Toshitsugu Takekuma , Toshio Suzuki , Hidetoshi Iwai , Masamichi Ishihara
IPC分类号： G03F1/00 , G03F1/26 , G03F1/30 , G03F1/36 , G03F1/68 , G03F1/84 , H01L21/027 , H01L21/30 , G03F9/00
CPC分类号： G03F1/26 , G03F1/29 , G03F1/84
摘要： Pattern data of a phase shift mask can be inspected: (101) by separating and laying out pattern data of a phase shift mask in an actual pattern data layer, an auxiliary pattern data layer and a phase shift pattern data layer; (102) by inspecting and correcting only the data of the actual pattern of the actual pattern data layer; (108) by making data of an estimated pattern estimated to be transferred to a semiconductor wafer from the data of the synthetic data of the correct actual pattern data, the auxiliary pattern data and the phase shift pattern data, which are inspected and corrected; and (104) by comparing the estimated pattern data and the actual pattern data to inspect the data of the auxiliary pattern and the phase shift pattern.
摘要翻译：可以检查相移掩模的图案数据：（101）通过在实际图案数据层，辅助图案数据层和相移图案数据层中分离和布置相移掩模的图案数据; （102），通过检查和校正实际图案数据层的实际图案的数据; （108）通过从被检查和校正的正确的实际图案数据，辅助图案数据和相移图案数据的合成数据的数据中制作估计传送到半导体晶片的估计图案的数据; 和（104）通过比较估计的图案数据和实际图案数据来检查辅助图案和相移图案的数据。

2. 发明授权

US5736277A Method of making mask pattern data and process for manufacturing the mask 失效
公开(公告)号：US5736277A
公开(公告)日：1998-04-07
申请号：US678662
申请日：1996-07-11
申请人： Toshitsugu Takekuma , Toshio Suzuki , Hidetoshi Iwai , Masamichi Ishihara
发明人： Toshitsugu Takekuma , Toshio Suzuki , Hidetoshi Iwai , Masamichi Ishihara
IPC分类号： G03F1/00 , G03F1/26 , G03F1/30 , G03F1/36 , G03F1/68 , G03F1/84 , H01L21/027 , H01L21/30 , G03F9/00
CPC分类号： G03F1/26 , G03F1/29 , G03F1/84
摘要： Pattern data of a phase shift mask can be inspected: (101) by separating and laying out pattern data of a phase shift mask in an actual pattern data layer, an auxiliary pattern data layer and a phase shift pattern data layer; (102) by inspecting and correcting only the data of the actual pattern of the actual pattern data layer; (103) by making data of an estimated pattern estimated to be transferred to a semiconductor wafer from the data of the synthetic data of the correct actual pattern data, the auxiliary pattern data and the phase shift pattern data, which are inspected and corrected; and (104) by comparing the estimated pattern data and the actual pattern data to inspect the data of the auxiliary pattern and the phase shift pattern.

3. 发明授权

US5565285A Method of making mask pattern data and process for manufacturing the mask 失效
标题翻译：制作掩模图案数据的方法和用于制造掩模的工艺
公开(公告)号：US5565285A
公开(公告)日：1996-10-15
申请号：US534829
申请日：1995-09-27
申请人： Toshitsugu Takekuma , Toshio Suzuki , Hidetoshi Iwai , Masamichi Ishihara
发明人： Toshitsugu Takekuma , Toshio Suzuki , Hidetoshi Iwai , Masamichi Ishihara
IPC分类号： G03F1/00 , G03F1/26 , G03F1/30 , G03F1/36 , G03F1/68 , G03F1/84 , H01L21/027 , H01L21/30 , G03F9/00
CPC分类号： G03F1/26 , G03F1/29 , G03F1/84
摘要： Pattern data of a phase shift mask can be inspected: (101) by separating and laying out pattern data of a phase shift mask in an actual pattern data layer, an auxiliary pattern data layer and a phase shift pattern data layer; (102) by inspecting and correcting only the data of the actual pattern of the actual pattern data layer; (103) by making data of an estimated pattern estimated to be transferred to a semiconductor wafer from the data of the synthetic data of the correct actual pattern data, the auxiliary pattern data and the phase shift pattern data, which are inspected and corrected; and (104) by comparing the estimated pattern data and the actual pattern data to inspect the data of the auxiliary pattern and the phase shift pattern.
摘要翻译：可以检查相移掩模的图案数据：（101）通过在实际图案数据层，辅助图案数据层和相移图案数据层中分离和布置相移掩模的图案数据; （102），通过检查和校正实际图案数据层的实际图案的数据; （103）通过从被检查和校正的正确实际图案数据，辅助图案数据和相移图案数据的合成数据的数据中制作估计传送到半导体晶片的估计图案的数据; 和（104）通过比较估计的图案数据和实际图案数据来检查辅助图案和相移图案的数据。

4. 发明授权

US5410507A Special mode control method for dynamic random access memory 失效
标题翻译：动态随机存取存储器的特殊模式控制方法
公开(公告)号：US5410507A
公开(公告)日：1995-04-25
申请号：US977212
申请日：1992-11-16
申请人： Masanori Tazunoki , Shigetoshi Sakomura , Toshitsugu Takekuma , Yutaka Ito , Kazuya Ito , Wataru Arakawa , Hidetoshi Iwai , Toshiyuki Sakuta , Masamichi Ishihara
发明人： Masanori Tazunoki , Shigetoshi Sakomura , Toshitsugu Takekuma , Yutaka Ito , Kazuya Ito , Wataru Arakawa , Hidetoshi Iwai , Toshiyuki Sakuta , Masamichi Ishihara
IPC分类号： G11C11/4074 , G11C11/4076 , G11C13/00
CPC分类号： G11C11/4076 , G11C11/4074
摘要： A dynamic RAM provided with a data retention mode intended for low power consumption is provided. In the data retention mode, the current supply capabilities of voltage generation circuits which generate decreased voltage, increased voltage, reference voltage, etc., are limited in the range in which information retention operation in memory cells can be maintained, and the number of selected memory mats in the data retention mode is increased with respect to that of memory mats selected in the normal read/write mode and refresh mode. Special modes such as the data retention mode are set by combining an address strobe signal and other control signals and dummy CBR refresh is executed to release the special mode.
摘要翻译：提供了具有旨在低功耗的数据保留模式的动态RAM。在数据保持模式下，产生电压降低，电压升高，参考电压等的电压产生电路的电流供应能力在保持存储器单元的信息保持操作的范围内被限制，并且所选择的数量相对于在正常读/写模式和刷新模式中选择的存储器垫，数据保持模式中的存储器垫增加。通过组合地址选通信号和其他控制信号来设置数据保持模式等特殊模式，执行虚拟CBR刷新以释放特殊模式。

5. 发明授权

US5217917A Semiconductor memory device with improved substrate arrangement to permit forming a plurality of different types of random access memory, and a testing method therefor 失效
标题翻译：具有改进的基板布置以允许形成多种不同类型的随机存取存储器的半导体存储器件及其测试方法
公开(公告)号：US5217917A
公开(公告)日：1993-06-08
申请号：US496280
申请日：1990-03-20
申请人： Yasushi Takahashi , Hidetoshi Iwai , Satoshi Oguchi , Hisashi Nakamura , Hiroyuki Uchiyama , Toshitugu Takemuma , Shigetoshi Sakomura , Kazuyuki Miyazawa , Masamichi Ishihara , Ryoichi Hori , Takeshi Kizaki , Yoshihisa Koyama , Haruo Ii , Masaya Muranaka , Hidetomo Aoyagi , Hiromi Matsuura
发明人： Yasushi Takahashi , Hidetoshi Iwai , Satoshi Oguchi , Hisashi Nakamura , Hiroyuki Uchiyama , Toshitugu Takemuma , Shigetoshi Sakomura , Kazuyuki Miyazawa , Masamichi Ishihara , Ryoichi Hori , Takeshi Kizaki , Yoshihisa Koyama , Haruo Ii , Masaya Muranaka , Hidetomo Aoyagi , Hiromi Matsuura
IPC分类号： G11C5/00 , G11C5/02 , G11C7/10 , G11C11/4074 , G11C11/408 , G11C11/4096 , G11C29/00 , G11C29/02 , G11C29/46 , G11C29/50
CPC分类号： G11C29/027 , G11C11/4074 , G11C11/4082 , G11C11/4096 , G11C29/02 , G11C29/46 , G11C29/50 , G11C29/50012 , G11C5/00 , G11C5/025 , G11C7/1045 , G11C11/401 , G11C2029/5006 , G11C29/78
摘要： A semiconductor memory device is provided which includes a substrate arrangement which is suitable for forming a large number of types of DRAMs having different package specifications, different bit structure and different operating modes. In conjunction with this, the bonding pads are arranged at optimum locations for accommodating the different package types. Various layout arrangements are also provided to minimize space and to improve access time. Additional features are provided, including improved output buffer circuitry, protection circuitry and testing methods to facilitate operation of the semiconductor memory device.
摘要翻译：提供了一种半导体存储器件，其包括适于形成具有不同封装规格，不同位结构和不同工作模式的大量类型的DRAM的衬底布置。结合这些，接合垫被布置在适于不同包装类型的最佳位置处。还提供了各种布局布置以最小化空间并改善访问时间。提供了额外的功能，包括改进的输出缓冲器电路，保护电路和测试方法以便于半导体存储器件的操作。

6. 发明授权

US5151772A Semiconductor integrated circuit device 失效
标题翻译：半导体集成电路器件
公开(公告)号：US5151772A
公开(公告)日：1992-09-29
申请号：US616705
申请日：1990-11-20
申请人： Yasushi Takahashi , Hiromi Matsuura , Yoshihisa Koyama , Masaya Muranaka , Katsutaka Kimura , Kazuyuki Miyazawa , Masamichi Ishihara , Hidetoshi Iwai
发明人： Yasushi Takahashi , Hiromi Matsuura , Yoshihisa Koyama , Masaya Muranaka , Katsutaka Kimura , Kazuyuki Miyazawa , Masamichi Ishihara , Hidetoshi Iwai
IPC分类号： H01L23/522 , H01L27/108
CPC分类号： H01L23/5226 , H01L27/10805 , H01L2924/0002 , Y10S257/923
摘要： A semiconductor integrated circuit device is provided which includes a memory cell array located in a generally central area of a semiconductor substrate with peripheral circuits located at both ends of the semiconductor substrate. A wiring layer is also provided which couples the peripheral circuits to one another. This wiring layer is arranged to have a double-layer structure of first and second aluminum layers which are electrically coupled to one another.
摘要翻译：提供一种半导体集成电路器件，其包括位于半导体衬底的大致中心区域中的存储单元阵列，其具有位于半导体衬底两端的外围电路。还提供了将外围电路彼此耦合的布线层。该布线层被布置成具有彼此电耦合的第一和第二铝层的双层结构。

7. 发明授权

US5805513A Semiconductor memory device with improved substrate arrangement to permit forming a plurality of different types of random access memory, and a testing method therefor 失效
公开(公告)号：US5805513A
公开(公告)日：1998-09-08
申请号：US432867
申请日：1995-05-02
申请人： Yasushi Takahashi , Hidetoshi Iwai , Satoshi Oguchi , Hisashi Nakamura , Hiroyuki Uchiyama , Toshitugu Takekuma , Shigetoshi Sakomura , Kazuyuki Miyazawa , Masamichi Ishihara , Ryoichi Hori , Takeshi Kizaki , Yoshihisa Koyama , Haruo Ii , Masaya Muranaka , Hidetomo Aoyagi , Hiromi Matsuura
发明人： Yasushi Takahashi , Hidetoshi Iwai , Satoshi Oguchi , Hisashi Nakamura , Hiroyuki Uchiyama , Toshitugu Takekuma , Shigetoshi Sakomura , Kazuyuki Miyazawa , Masamichi Ishihara , Ryoichi Hori , Takeshi Kizaki , Yoshihisa Koyama , Haruo Ii , Masaya Muranaka , Hidetomo Aoyagi , Hiromi Matsuura
IPC分类号： G11C5/00 , G11C5/02 , G11C7/10 , G11C11/4074 , G11C11/408 , G11C11/4096 , G11C29/00 , G11C29/02 , G11C29/46 , G11C29/50 , G11C7/00
CPC分类号： G11C29/027 , G11C11/4074 , G11C11/4082 , G11C11/4096 , G11C29/02 , G11C29/46 , G11C29/50 , G11C29/50012 , G11C5/00 , G11C5/025 , G11C7/1045 , G11C11/401 , G11C2029/5006 , G11C29/78
摘要： A semiconductor memory device is provided which includes a substrate arrangement which is suitable for forming a large number of types of DRAMs having different package specifications, different bit structure and different operating modes. In conjunction with this, the bonding pads are arranged at optimum locations for accommodating the different package types. Various layout arrangements are also provided to minimize space and to improve access time. Additional features are provided, including improved output buffer circuitry, protection circuitry and testing methods to facilitate operation of the semiconductor memory device.

8. 发明授权

US5610089A Method of fabrication of semiconductor integrated circuit device 失效
标题翻译：半导体集成电路器件制造方法
公开(公告)号：US5610089A
公开(公告)日：1997-03-11
申请号：US429868
申请日：1995-04-27
申请人： Hidetoshi Iwai , Kazumichi Mitsusada , Masamichi Ishihara , Tetsuro Matsumoto , Kazuyuki Miyazawa , Hisao Katto , Kousuke Okuyama
发明人： Hidetoshi Iwai , Kazumichi Mitsusada , Masamichi Ishihara , Tetsuro Matsumoto , Kazuyuki Miyazawa , Hisao Katto , Kousuke Okuyama
IPC分类号： H01L21/8238 , H01L21/8242 , H01L27/02 , H01L27/092 , H01L29/78
CPC分类号： H01L27/10873 , H01L21/823864 , H01L27/0251 , H01L27/0266 , H01L27/0922 , H01L29/78 , H01L29/7836
摘要： Disclosed is a semiconductor device having an internal circuit protected by an electrostatic protective circuit, the internal circuit and electrostatic protective circuit being formed on the same semiconductor substrate. The internal circuit includes MIS elements and has a double-diffused drain structure, while the protective circuit has a single-diffused drain structure. The internal circuit can be, e.g., a DRAM, and the protective circuit can have diffused resistors and clamping MIS elements. The single-diffused drain structure can be formed in the protective circuit on the semiconductor substrate, while providing double-diffused drain structure in the internal circuit on the same substrate, by: (1) scanning the ion implanting apparatus to avoid ion implantation of the first ions into the region of the protective circuit, and/or (2) forming a photoresist film over the region of the protective circuit to prevent ion implanation of the first ions into the protective circuit region. As a further embodiment of the present invention, a semiconductor integrated circuit device is provided wherein the source and drain regions of an MOSFET in the internal circuit have lightly doped drain (LDD) structure in order to suppress the appearance of hot carriers, and the source and drain regions of an MOSFET in the input/output circuit have structure doped with phosphorus at a high impurity concentration, in order to enhance an electrostatic breakdown voltage.
摘要翻译：公开了具有被静电保护电路保护的内部电路的半导体器件，内部电路和静电保护电路形成在同一半导体衬底上。内部电路包括MIS元件，并具有双扩散漏极结构，而保护电路具有单扩散漏极结构。内部电路可以是例如DRAM，并且保护电路可以具有扩散电阻器和钳位MIS元件。单扩散漏极结构可以形成在半导体衬底上的保护电路中，同时通过以下步骤在同一衬底上的内部电路中提供双扩散漏极结构：（1）扫描离子注入装置以避免离子注入第一离子进入保护电路的区域，和/或（2）在保护电路的区域上形成光致抗蚀剂膜，以防止第一离子离子注入保护电路区域。作为本发明的另一实施例，提供了一种半导体集成电路器件，其中内部电路中的MOSFET的源极和漏极区域具有轻掺杂漏极（LDD）结构，以便抑制热载流子的出现，源极并且输入/输出电路中的MOSFET的漏极区域掺杂有高杂质浓度的磷的结构，以增强静电击穿电压。

9. 发明授权

US5534723A Semiconductor integrated circuit device having output and internal circuit MISFETS 失效
标题翻译：具有输出和内部电路MISFETS的半导体集成电路器件
公开(公告)号：US5534723A
公开(公告)日：1996-07-09
申请号：US431568
申请日：1995-04-27
申请人： Hidetoshi Iwai , Kazumichi Mitsusada , Masamichi Ishihara , Tetsuro Matsumoto , Kazuyuki Miyazawa , Hisao Katto , Kousuke Okuyama
发明人： Hidetoshi Iwai , Kazumichi Mitsusada , Masamichi Ishihara , Tetsuro Matsumoto , Kazuyuki Miyazawa , Hisao Katto , Kousuke Okuyama
IPC分类号： H01L21/8238 , H01L21/8242 , H01L27/02 , H01L27/092 , H01L29/78 , H01L29/06
CPC分类号： H01L21/823864 , H01L27/0251 , H01L27/0266 , H01L27/0922 , H01L27/10873 , H01L29/78
摘要： Disclosed is a semiconductor device having an internal circuit protected by an electrostatic protective circuit, the internal circuit and electrostatic protective circuit being formed on the same semiconductor substrate. The internal circuit includes MIS elements and has a double-diffused drain structure, while the protective circuit has a single-diffused drain structure. The internal circuit can be, e.g., a DRAM, and the protective circuit can have diffused resistors and clamping MIS elements. The single-diffused drain structure can be formed in the protective circuit on the semiconductor substrate, while providing double-diffused drain structure in the internal circuit on the same substrate, by: (1) scanning the ion implanting apparatus to avoid ion implantation of the first ions into the region of the protective circuit, and/or (2) forming a photoresist film over the region of the protective circuit to prevent ion implantation of the first ions into the protective circuit region. As a further embodiment of the present invention, a semiconductor integrated circuit device is provided wherein the source and drain regions of an MOSFET in the internal circuit have lightly doped drain (LDD) structure in order to suppress the appearance of hot carriers, and the source and drain regions of an MOSFET in the input/output circuit have structure doped with phosphorus at a high impurity concentration, in order to enhance an electrostatic breakdown voltage.
摘要翻译：公开了具有被静电保护电路保护的内部电路的半导体器件，内部电路和静电保护电路形成在同一半导体衬底上。内部电路包括MIS元件，并具有双扩散漏极结构，而保护电路具有单扩散漏极结构。内部电路可以是例如DRAM，并且保护电路可以具有扩散电阻器和钳位MIS元件。单扩散漏极结构可以形成在半导体衬底上的保护电路中，同时通过以下步骤在同一衬底上的内部电路中提供双扩散漏极结构：（1）扫描离子注入装置以避免离子注入第一离子进入保护电路的区域，和/或（2）在保护电路的区域上形成光致抗蚀剂膜，以防止第一离子离子注入保护电路区域。作为本发明的另一实施例，提供了一种半导体集成电路器件，其中内部电路中的MOSFET的源极和漏极区域具有轻掺杂漏极（LDD）结构，以便抑制热载流子的出现，源极并且输入/输出电路中的MOSFET的漏极区域掺杂有高杂质浓度的磷的结构，以增强静电击穿电压。

10. 发明授权

US5483490A Semiconductor integrated device and wiring correction arrangement therefor 失效
标题翻译：半导体集成器件及其布线校正装置
公开(公告)号：US5483490A
公开(公告)日：1996-01-09
申请号：US159619
申请日：1993-12-01
申请人： Hidetoshi Iwai , Masamichi Ishihara , Kazuya Ito , Wataru Arakawa , Yoshinobu Nakagome
发明人： Hidetoshi Iwai , Masamichi Ishihara , Kazuya Ito , Wataru Arakawa , Yoshinobu Nakagome
IPC分类号： G11C11/401 , G06F11/20 , G11C11/409 , G11C29/00 , G11C29/04 , H01L21/768 , H01L21/82 , H01L21/8242 , H01L27/10 , H01L27/108 , G11C13/00
CPC分类号： H01L21/76894 , G11C29/83 , G11C29/832 , H01L21/76888 , G11C8/16
摘要： An arrangement is provided for preventing DC defects in a memory or logic device after switching to a redundant circuit, improving the product yield of the device by cutting a leakage current path through a defective element or circuit. The cutting points formed by the predetermined wirings as a whole or a part thereof are provided to the device. A probe test of the formed chip is executed under the wafer condition by predetermined test equipment, and wiring correction data regarding the cutting of the cutting points is generated based on the result of test. Moreover, this wiring correction data is transmitted in an on-line fashion to the wiring correction equipment so that the corresponding cutting points can be cut. The wiring correction equipment can be formed by an EB direct writing apparatus, an FIB apparatus or a laser repair apparatus. With this arrangement, the leakage current path formed by a defective element or circuit left unused in conventional circuits is cut, and the product yield of the device is raised significantly. This arrangement can be used for a variety of memory or logic devices, including DRAMs, SRAMs, multiport memories and gate arrays.
摘要翻译：提供一种用于在切换到冗余电路之后防止存储器或逻辑器件中的DC缺陷的布置，通过切断通过故障元件或电路的漏电流路径来提高器件的产品产量。由该预定布线整体形成的切割点或其一部分设置在该装置上。通过预定的测试设备在晶片状态下执行形成的芯片的探针测试，并且基于测试结果产生关于切割点的切割的布线校正数据。此外，该布线校正数据以线上方式发送到布线校正设备，使得可以切割相应的切割点。布线校正装置可以由EB直接书写装置，FIB装置或激光修复装置形成。利用这种布置，切割由常规电路中未使用的缺陷元件或电路形成的漏电流路径，并且显着提高器件的产品产量。这种布置可以用于各种存储器或逻辑器件，包括DRAM，SRAM，多端口存储器和门阵列。

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