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1. 发明授权

US5171869A Allyl or propenyl group-containing naphthalene derivatives 失效
标题翻译：含烯丙基或含丙烯基的萘衍生物
公开(公告)号：US5171869A
公开(公告)日：1992-12-15
申请号：US825222
申请日：1992-01-24
申请人： Toshio Shiobara , Kazutoshi Tomiyoshi , Hisashi Shimizu , Manabu Narumi
发明人： Toshio Shiobara , Kazutoshi Tomiyoshi , Hisashi Shimizu , Manabu Narumi
IPC分类号： C07D303/27 , C07C39/225 , C07D303/24 , C08F290/00 , C08F299/02 , C08G8/08 , C08G8/24 , C08G8/36 , C08G59/08 , C08G59/32
CPC分类号： C07D303/24 , C08G59/3218 , C08G8/08
摘要： A naphthalene of the following formula (1) having at least two allyl or propenyl groups ##STR1## wherein each G represents a hydrogen atoms or ##STR2## R.sup.1 's independently represent a hydrogen atom or an unsubstituted or substituted monovalent hydrocarbon group having from 1 to 6 carbon atoms, R.sup.2 's independently represent a hydrogen atom, an allyl group or a propenyl group, R.sup.3 represents an allyl group or a propenyl group, X represents a hydrogen atom or a halogen atom, and n is an integer of from 0 to 6. The derivative is useful for modifying curable resins or resin compositions to provide cured products which have a low water absorption, high strength and a high glass transition temperature. The derivative has good working properties and a good heat resistance.
摘要翻译：具有至少两个烯丙基或丙烯基的下式（1）的萘，其中每个G表示氢原子，或者R 1独立地表示氢原子或未取代或取代的一价烃基，其具有 1〜6个碳原子，R2独立地表示氢原子，烯丙基或丙烯基，R3表示烯丙基或丙烯基，X表示氢原子或卤素原子，n表示0〜该衍生物可用于改性可固化树脂或树脂组合物以提供具有低吸水性，高强度和高玻璃化转变温度的固化产物。该衍生物具有良好的加工性能和良好的耐热性。

2. 发明授权

US5290882A Thermosetting resin compositions 失效
标题翻译：热固性树脂组合物
公开(公告)号：US5290882A
公开(公告)日：1994-03-01
申请号：US928064
申请日：1992-08-11
申请人： Toshio Shiobara , Hisashi Shimizu , Manabu Narumi
发明人： Toshio Shiobara , Hisashi Shimizu , Manabu Narumi
IPC分类号： C08G59/32 , C08G59/40 , C08G77/42 , C08L61/06 , C08L63/00 , C08L79/08 , C08L83/04 , C08L63/04 , C08L63/10
CPC分类号： C08L61/06 , C08G59/3218 , C08G59/4042 , C08G77/42 , C08L63/00 , C08L79/08 , C08L83/04
摘要： A thermosetting resin composition contains (A) an imide compound having a maleimide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organopolysiloxane copolymer. Component (B) and/or (C) includes a compound containing a naphthalene ring having an allyl group and preferably, a compound containing a naphthalene ring and a double bond conjugated with an aromatic ring. The composition is easily workable and cures to products having improved heat resistance, low thermal expansion, and low water absorption.
摘要翻译：热固性树脂组合物含有（A）具有马来酰亚胺基团的酰亚胺化合物，（B）环氧树脂，（C）酚醛树脂和任选的（D）芳族聚合物/有机聚硅氧烷共聚物。组分（B）和/或（C）包括含有具有烯丙基的萘环的化合物，优选含有萘环和与芳环共轭的双键的化合物。该组合物易于加工并固化成具有改善的耐热性，低热膨胀性和低吸水性的产品。

3. 发明授权

US5243058A Allyl or propenyl group-containing naphthalene derivatives 失效
标题翻译：含烯丙基或含丙烯基的萘衍生物
公开(公告)号：US5243058A
公开(公告)日：1993-09-07
申请号：US824967
申请日：1992-01-24
申请人： Toshio Shiobara , Kazutoshi Tomiyoshi , Hisashi Shimizu , Manabu Narumi
发明人： Toshio Shiobara , Kazutoshi Tomiyoshi , Hisashi Shimizu , Manabu Narumi
IPC分类号： C07C39/225 , C07C43/215 , C07D303/24 , C08G59/24 , C08G59/32 , C08G59/40
CPC分类号： C07C43/215 , C07C39/225 , C07D303/24 , C08G59/245 , C08G59/3218 , C08G59/4042
摘要： A naphthalene derivative of the following general formula (1) having at least one allyl or propenyl group is described. ##STR1## In the formula, each G represents a hydrogen atoms or ##STR2## R.sup.1 's independently represent a hydrogen atom, an allyl group or a propenyl group provided that at least one or R.sup.1 's is an allyl group or a propenyl group, and R.sup.2 's independently represent a hydrogen atom, an unsubstituted or substituted monovalent hydrocarbon group having from 1 to 6 carbon atoms, or a halogen atom. The derivative is useful for modifying curable resins or resin compositions to provide cured products which have a low water absorption, high strength and a high glass transition temperature. The derivative has good working properties and a good heat resistance.
摘要翻译：描述了具有至少一个烯丙基或丙烯基的下述通式（1）的萘衍生物。（1）在该式中，每个G表示氢原子，或者如果至少一个或R 1为烯丙基或丙烯基，则R 1独立地表示氢原子，烯丙基或丙烯基，并且R 2独立地表示氢原子，具有1至6个碳原子的未取代或取代的一价烃基或卤素原子。该衍生物可用于改性可固化树脂或树脂组合物以提供具有低吸水性，高强度和高玻璃化转变温度的固化产物。该衍生物具有良好的加工性能和良好的耐热性。

4. 发明授权

US5306748A Fluorine-modified thermosetting resin and thermosetting resin composition 失效
标题翻译：氟改性热固性树脂和热固性树脂组合物
公开(公告)号：US5306748A
公开(公告)日：1994-04-26
申请号：US921251
申请日：1992-07-29
申请人： Toshio Shiobara , Hisashi Shimizu , Manabu Narumi
发明人： Toshio Shiobara , Hisashi Shimizu , Manabu Narumi
IPC分类号： C08G8/08 , C08G59/08 , C08G59/32 , C08L61/06 , C08L63/00 , C08G59/00 , C08G8/04 , C08G14/04
CPC分类号： C08L61/06 , C08G59/08 , C08G59/3218 , C08G59/3254 , C08G8/08 , C08L63/00
摘要： Fluorine-modified thermosetting reins are available as phenolic or epoxy resins having trifluoromethyl groups and a naphthalene skeleton in a molecule. They are useful as components of resin compositions or resin modifiers and cure to products having low water pickup, low coefficient of thermal expansion, and adhesion as well as heat resistance and mechanical strength. Thermosetting resin compositions having such a thermosetting resin blended therein are useful in semiconductor element packaging.
摘要翻译：氟改性的热固性榫头可以作为分子中具有三氟甲基和萘骨架的酚醛树脂或环氧树脂来获得。它们可用作树脂组合物或树脂改性剂的组分，并且固化成具有低吸水率，低热膨胀系数和粘合性以及耐热性和机械强度的产品。具有这样的热固性树脂的热固性树脂组合物可用于半导体元件封装。

5. 发明授权

US07563854B2 Method of producing high molecular weight organopolysiloxane, composition comprising the high molecular weight organopolysiloxane, and optical semiconductor device sealed with cured product thereof 有权
标题翻译：生产高分子量有机聚硅氧烷的方法，包含高分子量有机聚硅氧烷的组合物和用其固化产物密封的光学半导体器件
公开(公告)号：US07563854B2
公开(公告)日：2009-07-21
申请号：US11586525
申请日：2006-10-26
申请人： Hisashi Shimizu , Toshio Shiobara , Tsutomu Kashiwagi
发明人： Hisashi Shimizu , Toshio Shiobara , Tsutomu Kashiwagi
IPC分类号： C08G77/06
CPC分类号： C08G77/04 , C08G77/06 , C08G77/08 , C08G77/14 , Y10T428/31663
摘要： Provided is a method of producing a high molecular weight organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 5×104, comprising the steps of producing an organopolysiloxane by subjecting a silane compound having a hydrolyzable group to a first hydrolysis and condensation, and then subjecting that organopolysiloxane to an additional second hydrolysis and condensation. The high molecular weight organopolysiloxane is stable, resistant to gelling, and resistant to cracking even when formed as a thick film. A resin composition comprising the high molecular weight organopolysiloxane and a condensation catalyst is useful for sealing an optical element and for producing an optical semiconductor device.
摘要翻译：本发明提供一种聚苯乙烯换算重均分子量为5×10 4以上的高分子量有机聚硅氧烷的制造方法，其特征在于，包括使具有水解性基团的硅烷化合物进行第一次水解缩合而制造有机聚硅氧烷的工序，该有机聚硅氧烷再次进行水解和缩合。高分子量有机聚硅氧烷是稳定的，耐胶凝的，即使形成厚膜也能耐裂纹。包含高分子量有机聚硅氧烷和缩合催化剂的树脂组合物可用于密封光学元件并用于制造光学半导体器件。

6. 发明授权

US07550204B2 Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor element 有权
标题翻译：用于密封光学元件的树脂组合物，其固化产物，以及密封半导体元件的方法
公开(公告)号：US07550204B2
公开(公告)日：2009-06-23
申请号：US11586564
申请日：2006-10-26
申请人： Hisashi Shimizu , Toshio Shiobara , Tsutomu Kashiwagi
发明人： Hisashi Shimizu , Toshio Shiobara , Tsutomu Kashiwagi
IPC分类号： B32B9/04 , C08G77/18
CPC分类号： C08L83/04 , C08G77/14 , C08G77/18 , C08G77/20 , C08G77/70 , C08J7/047 , C08J2483/00 , C08K5/0091 , H01L23/296 , H01L2924/0002 , Y10T428/31663 , H01L2924/00
摘要： The present invention provides a composition for sealing an optical device comprising (i) a silylated organopolysiloxane with a polystyrene equivalent weight average molecular weight of 5×104 or greater, represented by an average composition formula: R1a(OX)bSiO(4−a−b)/2 (wherein, R1 represents an alkyl group, alkenyl group, or aryl group; X represents a combination of a group represented by a formula —SiR2R3R4 (wherein, RE to R4 are monovalent hydrocarbon groups), and an alkyl group, alkenyl group, alkoxyalkyl group or acyl group; a represents a number within a range from 1.00 to 1.5; b represents a number that satisfies 0 b 2, and a+b satisfies 1.00 a+b 2), and (ii) a condensation catalyst, as well as a transparent cured product obtained by curing the composition, and a method of sealing a semiconductor element that comprises a step of applying the composition to a semiconductor element, and a step of curing the composition that has been applied to the semiconductor element. The composition can form a coating film that exhibits excellent levels of heat resistance, ultraviolet light resistance, optical transparency, toughness and adhesion.
摘要翻译：本发明提供了一种用于密封光学装置的组合物，其包含（i）聚苯乙烯换算的重均分子量为5×10 4或更大的甲硅烷基化有机聚硅氧烷，其平均组成式为：<？in-line-formula description =“In- 线形式“end =”lead“→> R1a（OX）bSiO（4-ab）/ 2 <？in-line-formula description =”In-line Formulas“end =”tail“？>（其中，R1表示烷基，烯基或芳基; X表示由式-SiR 2 R 3 R 4表示的基团（其中，RE至R 4为一价烃基）和烷基，烯基，烷氧基烷基或酰基的组合; 表示在1.00〜1.5的范围内的数字; b表示满足0 b 2的数，a + b满足1.00 a + b 2），（ii）缩合催化剂，以及由固化组合物，以及密封半导体元件的方法，其包括施加组合物的步骤涉及半导体元件，以及固化已经施加到半导体元件上的组合物的步骤。该组合物可以形成表现出优异的耐热性，耐紫外线性，光学透明性，韧性和粘附性的涂膜。

7. 发明申请

US20060035092A1 Resin composition for sealing LED elements and cured product generated by curing the composition 审中-公开
标题翻译：用于密封LED元件的树脂组合物和通过固化组合物产生的固化产物
公开(公告)号：US20060035092A1
公开(公告)日：2006-02-16
申请号：US11199175
申请日：2005-08-09
申请人： Hisashi Shimizu , Tsutomu Kashiwagi , Toshio Shiobara
发明人： Hisashi Shimizu , Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： B32B27/04 , C08L83/04 , H01L21/00
CPC分类号： C09D183/04 , H01L33/56 , Y10T428/31663
摘要： Provided is a resin composition for sealing LED elements, including (i) an organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 5×103, represented by an average composition formula (1): R1a(OX)bSiO(4-a-b)/2, in which, each R1 represents, independently, an alkyl group, alkenyl group or aryl group of 1 to 6 carbon atoms, each X represents, independently, a hydrogen atom, or an alkyl group, alkenyl group, alkoxyalkyl group or acyl group of 1 to 6 carbon atoms, a represents a number within a range from 1.05 to 1.5, b represents a number that satisfies 0
摘要翻译：提供一种用于密封LED元件的树脂组合物，其包含（i）由平均组成式（1）表示的聚苯乙烯换算重均分子量为至少5×10 3的有机聚硅氧烷：R

8. 发明授权

US06210811B1 Epoxy resin composition, laminate film using the same, and semiconductor device 有权
标题翻译：环氧树脂组合物，使用其的层压膜和半导体器件
公开(公告)号：US06210811B1
公开(公告)日：2001-04-03
申请号：US09404301
申请日：1999-09-24
申请人： Tsuyoshi Honda , Miyuki Wakao , Hisashi Shimizu , Toshio Shiobara
发明人： Tsuyoshi Honda , Miyuki Wakao , Hisashi Shimizu , Toshio Shiobara
IPC分类号： H01L2912
CPC分类号： H01L23/293 , C08G59/32 , C08G59/3254 , C08L63/00 , H01L21/563 , H01L24/29 , H01L2224/73203 , H01L2224/73204 , H01L2924/01012 , H01L2924/01025 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , Y10T428/12528 , C08L83/00 , H01L2924/3512 , H01L2924/00
摘要： An epoxy resin composition comprising an epoxy resin containing 0-10% by weight of a 2-nucleus compound and 50-100% by weight of 3 to 5-nucleus compounds combined and having a dispersity (Mw/Mn) of 1.0-1.7, an inorganic filler, a curing catalyst, and optionally a phenolic resin, and having a Tg of lower than 15° C. in an uncured state is effective in forming a flexible film which is easy to work at room temperature. A laminate film includes a layer of the epoxy resin composition and a protective layer. By sealing a semiconductor chip with the film, there is obtained a semiconductor package having improved heat resistance, improved moisture resistance, low stress property.
摘要翻译：一种环氧树脂组合物，其包含含有0-10重量％的2-核化合物和50-100重量％组合并具有1.0-1.7分散性（Mw / Mn）的3至5个核化合物的环氧树脂，无机填料，固化催化剂和任选的酚醛树脂，并且在未固化状态下具有低于15℃的Tg，有效地形成易于在室温下加工的柔性膜。层压膜包括环氧树脂组合物层和保护层。通过用膜密封半导体芯片，获得了具有改善的耐热性，改进的耐湿性，低应力性能的半导体封装。

9. 发明授权

US5182351A Thermosetting resin compositions 失效
标题翻译：热固性树脂组合物
公开(公告)号：US5182351A
公开(公告)日：1993-01-26
申请号：US580668
申请日：1990-09-11
申请人： Toshio Shiobara , Hisashi Shimizu
发明人： Toshio Shiobara , Hisashi Shimizu
IPC分类号： C08F222/40 , C08F20/52 , C08F30/08 , C08F230/08 , C08F290/00 , C08F299/00 , C08F299/08 , C08G59/20 , C08G59/30 , C08G59/40 , C08G73/12 , C08K5/3415 , C08L79/08 , C08L83/04 , C08L83/07
CPC分类号： C08L79/08 , C08F299/08 , C08F30/08 , C08G73/12 , C08G73/125 , C08G73/126 , C08G73/127 , C08L83/04 , C08G77/045 , C08G77/12 , C08G77/20 , C08G77/24 , C08G77/44 , C08G77/70
摘要： A thermosetting resin composition comprising a maleimide having at least one N-substituted maleimide group in the molecule thereof and a silicon compound having conjugated double bonds is easily workable and yields cured products having improved heat resistance.
摘要翻译：包含其分子中具有至少一个N-取代的马来酰亚胺基团的马来酰亚胺和具有共轭双键的硅化合物的热固性树脂组合物易于加工，并产生具有改善的耐热性的固化产物。

10. 发明授权

US5298548A Epoxy resin composition and semiconductor devices encapsulated therewith 失效
标题翻译：环氧树脂组合物和封装的半导体器件
公开(公告)号：US5298548A
公开(公告)日：1994-03-29
申请号：US885965
申请日：1992-05-20
申请人： Toshio Shiobara , Takayuki Aoki , Kazutoshi Tomiyoshi , Hisashi Shimizu , Takashi Tsuchiya
发明人： Toshio Shiobara , Takayuki Aoki , Kazutoshi Tomiyoshi , Hisashi Shimizu , Takashi Tsuchiya
IPC分类号： C08G59/24 , C08G59/00 , C08G59/20 , C08G59/32 , C08G59/38 , C08G59/62 , C08L63/00 , H01B3/40 , H01L23/29 , H01L23/31 , C08G59/22
CPC分类号： H01B3/40 , C08G59/3218 , C08G59/38 , C08L63/00
摘要： An epoxy resin composition comprising (A) a naphthalene ring-containing epoxy resin, (B) a biphenyl-containing epoxy resin, (C) a specific phenolic resin, and (D) an inorganic filler shows good flow and cures to products having low modulus of elasticity, especially at temperatures above Tg, a low coefficient of expansion, high Tg irrespective of low stresses, and minimized water absorption. Then semiconductor devices encapsulated with the present composition remain highly reliable even after being subject to thermal shocks upon surface mounting.
摘要翻译：包含（A）含萘环氧树脂，（B）含联苯的环氧树脂，（C）特定酚醛树脂和（D）无机填料的环氧树脂组合物显示出良好的流动性和固化性，弹性模量，特别是在高于Tg的温度下，低膨胀系数，高Tg，不论低应力如何，吸水率最小化。然后，即使在表面安装时受到热冲击，用本发明组合物封装的半导体器件也保持高度可靠性。

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