专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5735203A Apparatus for printing solder paste to a printed circuit board and separating a screen mask plate from the printed circuit board 失效
标题翻译：用于将焊膏印刷到印刷电路板并将屏蔽掩模板与印刷电路板分离的装置
公开(公告)号：US5735203A
公开(公告)日：1998-04-07
申请号：US762872
申请日：1996-12-12
申请人： Masahiro Taniguchi , Toshinori Mimura , Kazue Okanoue , Hiroaki Onishi , Nobuya Matsumura
发明人： Masahiro Taniguchi , Toshinori Mimura , Kazue Okanoue , Hiroaki Onishi , Nobuya Matsumura
IPC分类号： B41F15/08 , B41F15/16 , H05K3/12 , B41F15/26
CPC分类号： B41F15/0818 , B41F15/16 , H05K3/1233 , B41P2215/14 , H05K2201/10151 , H05K2203/0264
摘要： An apparatus for printing a solder paste to a printed circuit board with use of a screen mask plate and a squeegee. The apparatus includes a device for moving one of the printed circuit board and the screen mask plate at a first moving speed in a direction to be separated from the other of them after printing of the solder paste and until the moving one of the printed circuit board and the screen mask plate reaches a plate-separation position which is a position immediately before the screen mask plate and the printed circuit board are completely separated from each other, and a controller for changing the first moving speed to a second moving speed higher than the first moving speed when the moving one of the printed circuit board and the screen mask plate reaches the plate-separation position.
摘要翻译：一种使用屏蔽掩模板和刮板将焊膏印刷到印刷电路板的设备。该装置包括：在印刷焊膏之后，以与第一移动速度相对应的方向移动印刷电路板和屏蔽掩模板中的一个的装置，并且直到移动的印刷电路板屏幕掩模板到达位于屏幕掩模板之前的位置和印刷电路板完全分离的平板分离位置，以及控制器，用于将第一移动速度改变为高于当移动的印刷电路板和屏幕掩模板之一到达平板分离位置时的第一移动速度。

2. 发明授权

US5693559A Method for printing solder paste 失效
标题翻译：焊膏印刷方法
公开(公告)号：US5693559A
公开(公告)日：1997-12-02
申请号：US631021
申请日：1996-04-12
申请人： Masahiro Taniguchi , Toshinori Mimura , Kazue Okanoue , Hiroaki Onishi , Nobuya Matsumura
发明人： Masahiro Taniguchi , Toshinori Mimura , Kazue Okanoue , Hiroaki Onishi , Nobuya Matsumura
IPC分类号： B41F15/08 , B41F15/16 , H05K3/12 , H01L21/48
CPC分类号： B41F15/0818 , B41F15/16 , H05K3/1233 , B41P2215/14 , H05K2201/10151 , H05K2203/0264
摘要： A method for printing a solder paste to a printed circuit board with use of a screen mask plate and a squeegee, the method includes steps of moving one of the printed circuit board and the screen mask plate at a first moving speed in a direction to be separated from the other of them after printing of the solder paste and until the moving one of the printed circuit board and the screen mask plate reaches a plate-separation position which is a position immediately before the screen mask plate and the printed circuit board are completely separated from each other, and changing the first moving speed to a second moving speed higher than the first moving speed when the moving one of the printed circuit board and the screen mask plate reaches the plate-separation position.
摘要翻译：一种使用屏蔽掩模板和刮板将焊膏印刷到印刷电路板的方法，所述方法包括以一个方向移动印刷电路板和屏蔽掩模板之一的步骤：在印刷焊膏之后与另一个分离，并且直到印刷电路板和屏蔽掩模板上移动的一个到达屏幕掩模板和印刷电路板之前的位置的板分离位置是完全的并且当印刷电路板和屏蔽掩模板中的移动的一个到达分隔位置时，将第一移动速度改变到高于第一移动速度的第二移动速度。

3. 发明授权

US5579981A Reflow apparatus 失效
标题翻译：回流装置
公开(公告)号：US5579981A
公开(公告)日：1996-12-03
申请号：US371776
申请日：1995-01-12
申请人： Nobuya Matsumura , Kazumi Ishimoto , Yoichi Nakamura , Kurayasu Hamasaki , Kimihito Kuwabara , Masahiro Taniguchi
发明人： Nobuya Matsumura , Kazumi Ishimoto , Yoichi Nakamura , Kurayasu Hamasaki , Kimihito Kuwabara , Masahiro Taniguchi
IPC分类号： H05K3/34 , B23K1/008 , B23K1/012
CPC分类号： B23K1/008 , B23K2201/42
摘要： A reflow apparatus includes a reflow furnace. A transfer device holds and transfers printed circuit boards with to-be-reflowed electronic components thereon from an inlet to an outlet of the furnace within the furnace. A plurality of adjusting/circulating sections separate an ambient gas for heating the printed circuit boards into predetermined temperature regions in the furnace in which the ambient gas is circulated in a heated state. A feed port is formed in the furnace to feed the ambient gas into the furnace under pressure. Residence parts each provided between adjacent adjusting/circulating sections regulate the amount of the ambient gas when the ambient gas, after having been sent to and heated in the adjusting/circulating section adjacent to the feed port, is circulated and sequentially moved to the adjusting/circulating sections at the inlet or the outlet and finally flows out through the inlet or outlet into atmosphere. Suction ports are open to the furnace to suck the ambient gas from the inside of the furnace. A flux removing unit is separate from the furnace and removes components of a flux from the ambient gas sucked through the suction ports from the inside of the furnace.
摘要翻译：回流装置包括回流炉。转移装置在炉内从炉内的入口到出口保持并转移其上具有待回流电子部件的印刷电路板。多个调节/循环部分将用于将印刷电路板加热的环境气体分离成炉中的环境气体在加热状态下循环的预定温度区域。在炉中形成进料口，以在压力下将环境气体进料到炉中。每个设置在相邻的调节/循环部分之间的居间部分调节环境气体的量，当环境气体在已经被送入并在与进料口邻近的调节/循环部分中被加热并循环并顺序地移动到调节/ 在入口或出口处循环切片，最后通过入口或出口流入大气。吸入口向炉内开放以从炉内吸入环境气体。助熔剂去除单元与炉分离，并从炉内部从吸入口吸入的环境气体中除去助熔剂的组分。

4. 发明授权

US5472135A Reflow apparatus and method 失效
标题翻译：回流装置及方法
公开(公告)号：US5472135A
公开(公告)日：1995-12-05
申请号：US152143
申请日：1993-11-16
申请人： Masahiro Taniguchi , Youichi Nakamura , Kazumi Ishimoto , Kimihito Kuwabara , Toshinori Mimura , Kurayasu Hamasaki , Kenichi Nakano , Manabu Ando
发明人： Masahiro Taniguchi , Youichi Nakamura , Kazumi Ishimoto , Kimihito Kuwabara , Toshinori Mimura , Kurayasu Hamasaki , Kenichi Nakano , Manabu Ando
IPC分类号： B23K1/008 , B23K1/012 , H02K3/34 , B23K35/38 , B23K31/02
CPC分类号： H02K3/34 , B23K1/008 , B23K1/012 , B23K2201/40 , B23K2201/42
摘要： The present invention provides a reflow apparatus and method effective to make constant the internal gas flow direction in a heating section within a reflow furnace. A circulating gas path is formed in a heating unit which collects and causes the gas to flow from a sirocco fan, up the rear side of the heating unit and then down towards a circuit board moving along a transfer path at the front side of the heating unit. Moreover, a plurality of straightening plates are arranged above the transfer path of the heating unit so as to guide the hot gas, which is flowing forwardly downwardly toward the circuit board moving along the transfer path. A blow-down nozzle is provided and includes a plurality of plates aligned in rows in the transferring direction of the circuit boards. The plates have an inverse U-shaped cross section. The blow-down nozzle is arranged below the straightening plates to cause the vertical hot gas flows to flow uniformly over the whole surface of the circuit board.
摘要翻译：本发明提供一种有效地使回流炉内的加热部内部的气体流动方向恒定的回流装置和方法。在加热单元中形成循环气体路径，该加热单元收集并使得气体从加热单元的后侧上的西洛克风扇流出，然后向下朝着在加热前侧沿着传送路径移动的电路板单元。此外，多个矫直板布置在加热单元的传送路径的上方，以引导沿着传送路径移动的电路板向下流动的热气体。设置吹扫喷嘴，并且在电路板的传送方向上包括排成行的多个板。板具有相反的U形横截面。吹出喷嘴布置在矫直板的下方，使垂直热气流均匀地流过电路板的整个表面。

5. 发明授权

US5524812A Reflow apparatus and method 失效
公开(公告)号：US5524812A
公开(公告)日：1996-06-11
申请号：US442886
申请日：1995-05-17
申请人： Masahiro Taniguchi , Youichi Nakamura , Kazumi Ishimoto , Kimihito Kuwabara , Toshinori Mimura , Kurayasu Hamasaki , Kenichi Nakano , Manabu Ando
发明人： Masahiro Taniguchi , Youichi Nakamura , Kazumi Ishimoto , Kimihito Kuwabara , Toshinori Mimura , Kurayasu Hamasaki , Kenichi Nakano , Manabu Ando
IPC分类号： B23K1/008 , B23K1/012 , H02K3/34
CPC分类号： H02K3/34 , B23K1/008 , B23K1/012 , B23K2201/40 , B23K2201/42
摘要： The present invention provides a reflow apparatus and method effective to make constant the internal gas flow direction in a heating section within a reflow furnace. A circulating gas path is formed in a heating unit which collects and causes the gas to flow from a sirocco fan, up the rear side of the heating unit and then down towards a circuit board moving along a transfer path at the front side of the heating unit. Moreover, a plurality of straightening plates are arranged above the transfer path of the heating unit so as to guide the hot gas, which is flowing forwardly downwardly toward the circuit board moving along the transfer path. A blow-down nozzle is provided and includes a plurality of plates aligned in rows in the transferring direction of the circuit boards. The plates have an inverse U-shaped cross section. The blow-down nozzle is arranged below the straightening plates to cause the vertical hot gas flows to flow uniformly over the whole surface of the circuit board.

6. 发明授权

US5715990A Reflow apparatus and method 失效
公开(公告)号：US5715990A
公开(公告)日：1998-02-10
申请号：US601590
申请日：1996-02-14
申请人： Masahiro Taniguchi , Youichi Nakamura , Kazumi Ishimoto , Kimihito Kuwabara , Toshinori Mimura , Kurayasu Hamasaki , Kenichi Nakano , Manabu Ando
发明人： Masahiro Taniguchi , Youichi Nakamura , Kazumi Ishimoto , Kimihito Kuwabara , Toshinori Mimura , Kurayasu Hamasaki , Kenichi Nakano , Manabu Ando
IPC分类号： B23K1/008 , B23K1/012 , H02K3/34
CPC分类号： H02K3/34 , B23K1/008 , B23K1/012 , B23K2201/40 , B23K2201/42
摘要： The present invention provides a reflow apparatus and method effective to make constant the internal gas flow direction in a heating section within a reflow furnace. A circulating gas path is formed in a heating unit which collects and causes the gas to flow from a sirocco fan, up the rear side of the heating unit and then down towards a circuit board moving along a transfer path at the front side of the heating unit. Moreover, a plurality of straightening plates are arranged above the transfer path of the heating unit so as to guide the hot gas, which is flowing forwardly downwardly toward the circuit board moving along the transfer path. A blow-down nozzle is provided and includes a plurality of plates aligned in rows in the transferring direction of the circuit boards. The plates have an inverse U-shaped cross section. The blow-down nozzle is arranged below the straightening plates to cause the vertical hot gas flows to flow uniformly over the whole surface of the circuit board.

7. 发明申请

US20060006210A1 Method, apparatus and program of thermal analysis, heat controller and heating furnace using the same 有权
标题翻译：热分析的方法，装置和程序，使用其的加热控制器和加热炉
公开(公告)号：US20060006210A1
公开(公告)日：2006-01-12
申请号：US10523196
申请日：2003-07-30
申请人： Masaru Nonomura , Yoshimori Isobata , Hiroaki Onishi , Masahiro Taniguchi
发明人： Masaru Nonomura , Yoshimori Isobata , Hiroaki Onishi , Masahiro Taniguchi
IPC分类号： A47J36/02
CPC分类号： G05D23/1951 , H05K3/3494
摘要： Heating characteristic value at any measuring point of an object at any measuring location of an heating furnace is determined as a single invariable by using temperature (Tint and Ts) measured at the measuring point of the object and heating temperature (Ta) and heating time (t) at the measuring location of the heating furnace. The heating characteristic value (m-value) may be calculated without using physical characteristics of the object. By using the m-value, temperature profile of the object heated under modified heating condition may be simulated in a short period of time without actually heating and measuring temperature of the object at high accuracy level. By using such simulation, appropriate heating condition for heating an object in accordance with desired heating condition may easily be determined.
摘要翻译：在加热炉的任何测量位置处的物体的任何测量点处的加热特性值通过使用在物体的测量点和加热温度（Ta）和加热时间（Ta）处测量的温度（Tint和Ts）而被确定为单一的 t）在加热炉的测量位置。可以在不使用物体的物理特性的情况下计算加热特性值（m值）。通过使用m值，可以在短时间内模拟在改进加热条件下加热的物体的温度分布，而实际上不会以高精度水平加热和测量物体的温度。通过使用这种模拟，可以容易地确定用于根据期望的加热条件加热物体的合适的加热条件。

8. 发明授权

US07549566B2 Method, apparatus and program of thermal analysis, heat controller and heating furnace using the method 有权
标题翻译：热分析方法，装置和程序，热控制器和加热炉采用该方法
公开(公告)号：US07549566B2
公开(公告)日：2009-06-23
申请号：US10523196
申请日：2003-07-30
申请人： Masaru Nonomura , Yoshinori Isobata , Hiroaki Onishi , Masahiro Taniguchi
发明人： Masaru Nonomura , Yoshinori Isobata , Hiroaki Onishi , Masahiro Taniguchi
IPC分类号： B23K31/02
CPC分类号： G05D23/1951 , H05K3/3494
摘要： A heating characteristic value at any measuring point of an object at any measuring location of a heating furnace is determined as a single invariable by using temperature (Tint and Ts) measured at the measuring point of the object and heating temperature (Ta) and heating time (t) at the measuring location of the heating furnace. The heating characteristic value (m-value) may be calculated without using physical characteristics of the object. By using the m-value, a temperature profile of the object heated under a modified heating condition may be simulated in a short period of time without actually heating and measuring the temperature of the object at a high accuracy level. By using such a simulation, an appropriate heating condition for heating an object in accordance with a desired heating condition may easily be determined.
摘要翻译：在加热炉的任何测量位置处的物体的任何测量点处的加热特性值通过使用在物体的测量点处测量的温度（Tint和Ts）和加热温度（Ta）和加热时间（Tint和Ts）而被确定为单一的（t）在加热炉的测量位置。可以在不使用物体的物理特性的情况下计算加热特性值（m值）。通过使用m值，可以在短时间内模拟在改进的加热条件下加热的物体的温度分布，而不实际加热并以高精度水平测量物体的温度。通过使用这样的模拟，可以容易地确定用于根据期望的加热条件加热物体的适当的加热条件。

9. 发明申请

US20130057676A1 COMPONENT MOUNTING METHOD AND COMPONENT MOUNTER 有权
标题翻译：组件安装方法和组件安装
公开(公告)号：US20130057676A1
公开(公告)日：2013-03-07
申请号：US13698682
申请日：2011-06-14
申请人： Masanori Ikeda , Michinori Tomomatsu , Satoshi Furuichi , Masahiro Taniguchi
发明人： Masanori Ikeda , Michinori Tomomatsu , Satoshi Furuichi , Masahiro Taniguchi
IPC分类号： G06K9/00 , H04N7/18
CPC分类号： H05K13/0417 , H05K13/0812
摘要： A component mounting method includes: identifying, by image processing, a dark color region from image data obtained by imaging a two-dimensional region including a pickup face of a component to be picked up; deriving position data indicating a position of the identified dark color region; and deriving, based on the derived position data, a pickup position indicating a position at which a nozzle picks up the component. The imaging is performed by an imaging unit, and the dark color region indicates a dark color portion between electrodes of the component.
摘要翻译：一种部件安装方法包括：通过图像处理从通过对包括要拾取的部件的拾取面的二维区域进行成像而获得的图像数据来识别暗色区域; 导出指示所识别的深色区域的位置的位置数据; 并且基于导出的位置数据导出指示喷嘴拾取部件的位置的拾取位置。成像由成像单元执行，暗色区域表示部件的电极之间的深色部分。

10. 发明申请

US20120000958A1 TAPE FEEDER AND CARRIER TAPE FEEDING METHOD USING SAME 审中-公开
标题翻译：带子进纸器和使用相同的传送带输送方法
公开(公告)号：US20120000958A1
公开(公告)日：2012-01-05
申请号：US13225772
申请日：2011-09-06
申请人： Masanori IKEDA , Satoshi Furuichi , Masahiro Taniguchi , Yousuke Hassaku
发明人： Masanori IKEDA , Satoshi Furuichi , Masahiro Taniguchi , Yousuke Hassaku
IPC分类号： B65H20/02
CPC分类号： H05K13/0419
摘要： To provide a tape feeder capable of reducing absorption dislocation, a tape feeder according to the present invention is a feeder feeding a carrier tape including a plurality of component storage units of a rectangular shape provided at predetermined intervals in a feed direction. The tape feeder includes a first magnet which is provided below a bottom surface of the component storage unit fed to a feed region so as to extend in the feed direction below one side of the bottom surface of the component storage unit in a width direction, and which attracts a component of the component storage unit fed to the feed region to one side of the bottom surface of the component storage unit in the width direction.
摘要翻译：为了提供能够减少吸收位错的带式给料机，根据本发明的带式进料器是一种给料器，该进料器供给载带，该载带包括沿进给方向以预定间隔设置的多个矩形部件存储单元。带式给送器包括：第一磁体，其设置在部件存储单元的底面下方，供给到进给区域，以便在宽度方向上沿部件存储部件的底面的一侧沿进给方向延伸;以及其吸引向元件存放部的宽度方向的一部分供给到供给区域的部件存储部的一部分。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式