专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06235867B1 Aligning agents for liquid crystal 失效
标题翻译：液晶对准剂
公开(公告)号：US06235867B1
公开(公告)日：2001-05-22
申请号：US09403614
申请日：1999-11-05
申请人： Toshimasa Eguchi , Toshiro Takeda
发明人： Toshimasa Eguchi , Toshiro Takeda
IPC分类号： C08G7310
CPC分类号： C08G73/106 , G02F1/133723 , Y10T428/10 , Y10T428/1005 , Y10T428/1014 , Y10T428/1023
摘要： The present invention provides a liquid crystal-aligning agent including, as the resin component, a polyimide precursor containing a chemical structure represented by the following formula (1): The present invention further provides a liquid crystal-aligning agent including, the above polyimide precursor and a polyimide precursor represented by the following general formula (2): (wherein Y is a tetravalent aliphatic group, Z is a bivalent aromatic group, and R is H or an alkyl group).
摘要翻译：本发明提供一种液晶取向剂，其包含作为树脂成分的含有下述式（1）表示的化学结构的聚酰亚胺前体：本发明还提供一种液晶取向剂，其包含上述聚酰亚胺前体和由以下通式（2）表示的聚酰亚胺前体:(其中Y是四价脂族基，Z是二价芳基，R是H或烷基）。

2. 发明授权

US6071666A Positive type photosensitive resin composition and semiconductor device using the same 失效
标题翻译：正型感光性树脂组合物及使用其的半导体装置
公开(公告)号：US6071666A
公开(公告)日：2000-06-06
申请号：US854863
申请日：1997-05-12
申请人： Takashi Hirano , Toshio Banba , Hiroaki Makabe , Naoshige Takeda , Toshiro Takeda
发明人： Takashi Hirano , Toshio Banba , Hiroaki Makabe , Naoshige Takeda , Toshiro Takeda
IPC分类号： G03F7/022 , G03F7/075 , G03F7/023
CPC分类号： G03F7/0226 , G03F7/0755 , G03F7/0757 , Y10S430/107
摘要： A positive type photosensitive resin composition which comprises (A) 100 parts by weight of a polyamide represented by the general formula (1): ##STR1## wherein X represents a tetravalent aromatic group; Y represents a divalent aromatic group; Z represents a group represented by the formula: ##STR2## in which R.sub.1 and R.sub.2 represent organic groups and R.sub.3 and R.sub.4 represent monovalent organic groups; a and b represent molar fractions; a+b=100 mole %; a=60.0-100.0 mole %; b=0-40.0 mole %; and n represents an integer of 2 to 500, (B) 1 to 100 parts by weight of a photosensitive diazoquinone compound and (C) 1 to 50 parts by weight of a phenol compound represented by a specific structural formula and/or (D) 0.1 to 20 parts by weight of an organosilicon compound represented by a specific structural formula; and a semiconductor device in which a pattern of a polybenzoxazole resin obtained by using the above photosensitive resin composition is formed in a thickness of 0.1 to 20 .mu.m on a semiconductor element.
摘要翻译：一种正型感光性树脂组合物，其包含（A）100重量份由通式（1）表示的聚酰胺：其中X表示四价芳族基团; Y表示二价芳基; Z表示由下式表示的基团：其中R1和R2表示有机基团，R3和R4表示一价有机基团; a和b表示摩尔分数; a + b = 100摩尔％ a = 60.0-100.0摩尔％ b = 0-40.0摩尔％ n表示2〜500的整数，（B）1〜100重量份感光性重氮醌化合物和（C）1〜50重量份由特定结构式表示的酚化合物和/或（D） 0.1〜20重量份的由具体结构式表示的有机硅化合物; 以及半导体装置，其中通过使用上述感光性树脂组合物得到的聚苯并恶唑树脂的图案在半导体元件上形成为0.1〜20μm的厚度。

3. 发明授权

US06235436B1 Semiconductor device using positive photosensitive resin composition and process for preparation thereof 有权
标题翻译：使用正型感光性树脂组合物的半导体装置及其制备方法
公开(公告)号：US06235436B1
公开(公告)日：2001-05-22
申请号：US09442277
申请日：1999-11-17
申请人： Takashi Hirano , Toshio Banba , Hiroaki Makabe , Naoshige Takeda , Toshiro Takeda
发明人： Takashi Hirano , Toshio Banba , Hiroaki Makabe , Naoshige Takeda , Toshiro Takeda
IPC分类号： G03F730
CPC分类号： G03F7/0226 , G03F7/0755 , G03F7/0757 , Y10S430/107
摘要： A positive type photosensitive resin composition which comprises (A) 100 parts by weight of a polyamide represented by the general formula (1): wherein X represents a tetravalent aromatic group; Y represents a divalent aromatic group; Z represents a divalent group represented by the formula: in which R1 and R2 represent divalent organic groups and R3 and R4 represent monovalent organic groups; a and b represent molar fractions; a+b=100 mole %; a=60.0-100.0 mole %; b=0-40.0 mole %; and n represents an integer of 2 to 500, (B) 1 to 100 parts by weight of a photosensitive diazoquinone compound and (C)1 to 50 parts by weight of a phenol compound represented by a specific structural formula and/or (D) 0.1 to 20 parts by weight of an organosilicon compound represented by a specific structural formula; and a semiconductor device in which a pattern of a polybenzoxazole resin obtained by using the above photosensitive resin composition is formed in a thickness of 0.1 to 20 &mgr;m on a semiconductor element.
摘要翻译：一种正型感光性树脂组合物，其包含（A）100重量份由通式（1）表示的聚酰胺：其中X表示四价芳族基团; Y表示二价芳基; Z表示由下式表示的二价基团：其中R 1和R 2表示二价有机基团，并且R 3和R 4表示一价有机基团; a和b表示摩尔分数; a + b = 100摩尔％ a = 60.0-100.0摩尔％ b = 0-40.0摩尔％ n表示2〜500的整数，（B）1〜100重量份感光性重氮醌化合物和（C）1〜50重量份由特定结构式表示的酚化合物和/或（D） 0.1〜20重量份的由具体结构式表示的有机硅化合物; 以及半导体装置，其中通过使用上述感光性树脂组合物得到的聚苯并恶唑树脂的图案在半导体元件上形成为0.1〜20μm的厚度。

4. 发明授权

US06207356B1 Method for the pattern-processing of photosensitive resin composition 失效
标题翻译：感光性树脂组合物的图案处理方法
公开(公告)号：US06207356B1
公开(公告)日：2001-03-27
申请号：US09287118
申请日：1999-04-07
申请人： Toshio Banba , Toshiro Takeda
发明人： Toshio Banba , Toshiro Takeda
IPC分类号： G03F730
CPC分类号： G03F7/0233 , G03F7/0757 , G03F7/322
摘要： A method of pattern-processing a photosensitive resin composition which comprises coating on a substrate a positive photosensitive resin composition of a polyamide of formula (1) below and a diazoquinone compound, subjecting the same to prebaking and then to irradiation with light, thereafter dissolving the exposed portion in an alkaline aqueous solution containing an alkylbenzenesulfonic acid to remove the same, thereby obtaining a pattern. wherein X is a tetravalent aromatic group; Y is a divalent aromatic group; Z is in which R1 and R2 are divalent organic groups and R3 and R4 are nonvalent organic groups; a and b are mole fractions; a+b=100 mole %; a=60.0-100 mole %; b=0-40.0 mole % and n=2-500. When the development is effected with the alkaline aqueous solution containing the alkylbenzenesulfonic acid, a scum-free, very high resolution pattern is obtained.
摘要翻译：一种感光性树脂组合物的图案处理方法，其特征在于，在基材上涂布下述式（1）的聚酰胺的正型感光性树脂组合物和重氮醌化合物，使其进行预烘烤，然后用光照射，暴露部分在含有烷基苯磺酸的碱性水溶液中以除去它，从而获得图案。其中X是四价芳族基团; Y为二价芳基; 其中R1和R2是二价有机基团，R3和R4是非常有机基团; a和b是摩尔分数; a + b = 100摩尔％ a = 60.0-100摩尔％ b = 0-40.0摩尔％，n = 2-500。当用含有烷基苯磺酸的碱性水溶液进行显影时，获得无浮渣，非常高的分辨率图案。

5. 发明授权

US06733695B2 Electrically conductive paste and semiconductor device prepared by using the paste 失效
标题翻译：通过使用糊料制备导电胶和半导体器件
公开(公告)号：US06733695B2
公开(公告)日：2004-05-11
申请号：US10176377
申请日：2002-06-21
申请人： Kazuto Onami , Toshiro Takeda , Akira Fukuizumi , Yoshihiro Nakajima
发明人： Kazuto Onami , Toshiro Takeda , Akira Fukuizumi , Yoshihiro Nakajima
IPC分类号： H01B122
CPC分类号： H01B1/22 , H01L24/29 , H01L2224/29499 , H01L2224/45124 , H01L2224/45144 , H01L2924/00014 , H01L2924/01322 , H01L2924/10253 , H01L2924/12042 , H01L2924/13091 , H01L2924/181 , Y10T29/49169 , H01L2924/00 , H01L2224/48
摘要： An electrically conductive paste comprises 80% by weight or more of silver powder and 20% by weight or less of a thermosetting resin. The silver powder has a particle size distribution having two peaks at specific positions. Viscosities of the paste measured under a low shearing stress and under a high shearing stress are in respective specific ranges and the ratio of these viscosities is in a specific range. A cured product obtained by heating the paste has a tensile modulus in a specific range. The paste has thermal and electric conductivities approximately the same as those of solder, shows little change in properties under a high temperature and a high humidity or under cyclic cooling and heating, exhibits excellent workability in coating and can be applied to coating by using nozzles having a wide range of diameters. A reliable semiconductor device is prepared by using the paste.
摘要翻译：导电性糊剂包含80重量％以上的银粉和20重量％以下的热固性树脂。银粉末具有在特定位置具有两个峰的粒度分布。在低剪切应力下和在高剪切应力下测量的糊的粘度分别在各自的特定范围内，并且这些粘度的比例在特定范围内。通过加热糊料而得到的固化物的拉伸弹性模量为特定范围。该糊具有与焊料大致相同的热电导率，在高温和高湿度下或在循环冷却和加热下性能几乎没有变化，表现出优异的涂布加工性，并且可以通过使用具有广泛的直径。通过使用糊料制备可靠的半导体器件。

6. 发明授权

US5449584A Positive photo-sensitive resin composition comprising a photosensitive polybenzoxazole or a mixture of a polybenzoxazole, an organic solvent soluble polymer and a diazoquinone and/or a dihydropyridine compound 失效
标题翻译：包含光敏聚苯并恶唑或聚苯并恶唑，有机溶剂可溶性聚合物和重氮醌和/或二氢吡啶化合物的混合物的正型光敏树脂组合物
公开(公告)号：US5449584A
公开(公告)日：1995-09-12
申请号：US210417
申请日：1994-03-18
申请人： Toshio Banba , Etsu Takeuchi , Toshiro Takeda , Naoshige Takeda , Akira Tokoh
发明人： Toshio Banba , Etsu Takeuchi , Toshiro Takeda , Naoshige Takeda , Akira Tokoh
IPC分类号： G03F7/004 , G03F7/022 , G03F7/023 , G03F7/039 , G03F7/075
CPC分类号： G03F7/0233 , G03F7/0045 , G03F7/0046 , G03F7/0226 , G03F7/039 , G03F7/0757 , Y10S430/107
摘要： The present invention provides a positive photo-sensitive resin composition comprising a polybenzoxazole precursor as a base resin, an organic solvent-soluble polymer or its precursor (e.g., a polyamic acid) as a component for imparting improved adhesion, flexibility or heat resistance, and a diazoquinone compound and/or a dihydropyridine compound as a photosensitive agent. This photo-sensitive resin composition can form a pattern of high resolution and further has excellent adhesion and mechanical properties. The present invention further provides three novel diazoquinone compounds as a photo-sensitive agent, which compounds give high resolution, high contrast and thick-film formability when compounded in a positive photo-sensitive resin composition. The present invention furthermore provides a new type positive photo-sensitive resin composition obtained by reacting a polybenzoxazole precursor with a diazoquinone compound as a photo-sensitive agent. This photo-sensitive resin composition has excellent alkali resistance when unexposed to a light and accordingly can give a high residual film ratio.
摘要翻译：本发明提供一种正型光敏树脂组合物，其包含作为基础树脂的聚苯并恶唑前体，作为赋予改善的粘合性，柔软性或耐热性的组分的有机溶剂可溶性聚合物或其前体（例如，聚酰胺酸），以及重氮醌化合物和/或二氢吡啶化合物作为感光剂。该感光性树脂组合物可以形成高分辨率的图案，并且还具有优异的粘附性和机械性能。本发明还提供三种新型的重氮醌化合物作为光敏剂，当在正性光敏树脂组合物中配合时，该化合物具有高分辨率，高对比度和厚膜成形性。本发明还提供了一种通过聚苯并恶唑前体与重氮醌化合物作为感光剂反应获得的新型正光敏树脂组合物。该光敏树脂组合物在未曝光时具有优异的耐碱性，因此可以得到高残留膜比。

7. 发明授权

US5206337A Solvent-soluble polyimidesiloxane oligomer and process for producing the same 失效
标题翻译：溶剂型溶胶聚硅氧烷低聚物及其制造方法
公开(公告)号：US5206337A
公开(公告)日：1993-04-27
申请号：US696647
申请日：1991-05-07
申请人： Toshiro Takeda , Naoshige Takeda , Akira Tokoh
发明人： Toshiro Takeda , Naoshige Takeda , Akira Tokoh
IPC分类号： C08G73/10 , C08G77/455
CPC分类号： C08G73/106 , C08G77/455
摘要： The present invention provides an oligomer having an inherent viscosity .eta. of 0.001-0.5 dl/g as measured at a concentration of 0.5 g/dl in N-methyl-2-pyrrolidone at 30.degree. C., which has been obtained by subjecting to polymerization and imidization (a) an acid component consisting of an aromatic tetracarboxylic acid dianhydride and/or a derivative thereof and (b) a diamine component consisting of 5-100 mole % of a diaminosiloxane represented by the undermentioned formula (I) and 95-0 mole % of an organic diamine other than the formula (I): ##STR1## wherein R.sub.1 is a divalent aliphatic group of 1-5 carbon atoms or a divalent aromatic group of 6 or more carbon atoms; R.sub.2 and R.sub.3 are each a monovalent aliphatic or aromatic group and may be the same or different; and m is an integer of 1-100, as well as an oligomer solution obtained by dissolving the above oligomer in an organic solvent.

8. 发明授权

US5739263A Film adhesive and process for production thereof 失效
标题翻译：胶粘剂及其生产方法
公开(公告)号：US5739263A
公开(公告)日：1998-04-14
申请号：US182194
申请日：1994-01-28
申请人： Tatsuhiro Yoshida , Yoshitaka Okugawa , Toshio Suzuki , Toshiro Takeda , Yushi Sakamoto , Takuya Tochimoto
发明人： Tatsuhiro Yoshida , Yoshitaka Okugawa , Toshio Suzuki , Toshiro Takeda , Yushi Sakamoto , Takuya Tochimoto
IPC分类号： C08G73/10 , C09J7/00 , C09J179/08 , C08G69/26
CPC分类号： C08G73/106 , C08G73/1014 , C08G73/1017 , C08G73/1042 , C09J179/08 , C09J7/00 , Y10S526/935 , Y10T428/31681 , Y10T428/31721
摘要： The present invention provides a film adhesive comprising, as the main constituent, a polyimide resin having a glass transition temperature of 350.degree. C. or lower and soluble in organic solvents, which polyimide resin is obtained by reacting at least one of the following acid components (A) and (B) (A) 4,4'-oxydiphthalic acid dianhydride (B) 3,3',4,4'-biphenyltetracarboxylic acid dianhydride and/or 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride with at least one of the following amine components (C) and (D) (C) a siloxane compound represented by the following general formula (1) and/or 2,2-bis(4-(4-amino-phenoxy)phenyl)propane ##STR1## wherein R.sub.1 and R.sub.2 are each a bivalent aliphatic (C.sub.1-4) or aromatic group; R.sub.3, R.sub.4, R.sub.5 and R.sub.6 are each a mono-valent aliphatic or aromatic group; and k is an integer of 1-20, (D) bis(aminophenoxy)benzene and/or dimethylphenylene-diamine to give rise to ring closure of imide, as well as a process for producing said film adhesive.
摘要翻译： PCT No.PCT / JP93 / 00351 Sec。 371日期1994年1月28日 102（e）日期1994年1月28日PCT 1993年3月24日PCT公布。公开号WO93 / 24583 日期：1993年12月9日本发明提供一种胶粘剂，其包含玻璃化转变温度为350℃以下且可溶于有机溶剂的聚酰亚胺树脂作为主要成分，该聚酰亚胺树脂通过使至少一种的下列酸组分（A）和（B）（A）4,4'-氧联二邻苯二甲酸二酐（B）3,3'，4,4'-联苯四羧酸二酐和/或3,3'，4,4 （C）和（D）（C）中的至少一种下列通式（1）表示的硅氧烷化合物和/或2,2-双（4-（4-（4-甲基苯基）氨基 - 苯氧基）苯基）丙烷基脂族（C 1-4）或芳基; R3，R4，R5和R6分别为1价脂肪族或芳香族基团; 并且k为1-20的整数，（D）双（氨基苯氧基）苯和/或二甲基亚苯基二胺以引起酰亚胺的闭环，以及制备所述膜粘合剂的方法。

9. 发明授权

US5284899A Resin paste for tight sealing 失效
标题翻译：树脂糊密封
公开(公告)号：US5284899A
公开(公告)日：1994-02-08
申请号：US942489
申请日：1992-09-09
申请人： Sueo Morishige , Kenichi Kaneda , Katsushi Terajima , Toshiro Takeda , Yushi Sakamoto , Takashi Suzuki
发明人： Sueo Morishige , Kenichi Kaneda , Katsushi Terajima , Toshiro Takeda , Yushi Sakamoto , Takashi Suzuki
IPC分类号： H01B1/22 , C08K3/04 , C08K3/08 , C09D179/08 , C09J179/08 , H01L23/10 , C08K3/10 , C08G69/26
CPC分类号： C09J179/08 , C08K3/04 , C08K3/08
摘要： A resin paste for tight sealing, comprising(A) at least one filler selected from the group consisting of Ag, Au, Cu, diamond, high-temperature sintered graphite and beryllia,(B) at least one metal filler selected from the group consisting of Al, Fe and Mg,(C) a polyimide resin having an imidization degree of 80% or more, obtained by reacting 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride or 3,3',4,4'-oxydiphthalic acid dianhydride with a diamine, and(D) an organic solvent, wherein the weight proportions of (A), (B) and (C) are(A)/[(B)+(C)]=10/90 to 90/10(B)/[(A)+(C)]=5/95 to 90/10 and the weight proportion of (D) is(D)/[(A)+(B)+(C)]=0.01/100 to 50/100.
摘要翻译：一种用于紧密密封的树脂浆料，包含（A）至少一种选自Ag，Au，Cu，金刚石，高温烧结石墨和铍的填料，（B）至少一种选自以下的金属填料：的Al，Fe和Mg，（C）通过使3,3'，4,4'-二苯甲酮四羧酸二酐或3,3'，4,4'-二苯甲酸二酐反应得到的酰亚胺化度为80％以上的聚酰亚胺树脂，（D）有机溶剂，其中（A），（B）和（C）的重量比为（A）/（（B）+（C））= 10/90〜 90/10（B）/（（A）+（C））= 5/95〜90/10，（D）的重量比为（D）/（（A）+（B）+（C） = 0.01 / 100〜50/100。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式