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1. 发明授权

US5449584A Positive photo-sensitive resin composition comprising a photosensitive polybenzoxazole or a mixture of a polybenzoxazole, an organic solvent soluble polymer and a diazoquinone and/or a dihydropyridine compound 失效
标题翻译：包含光敏聚苯并恶唑或聚苯并恶唑，有机溶剂可溶性聚合物和重氮醌和/或二氢吡啶化合物的混合物的正型光敏树脂组合物
公开(公告)号：US5449584A
公开(公告)日：1995-09-12
申请号：US210417
申请日：1994-03-18
申请人： Toshio Banba , Etsu Takeuchi , Toshiro Takeda , Naoshige Takeda , Akira Tokoh
发明人： Toshio Banba , Etsu Takeuchi , Toshiro Takeda , Naoshige Takeda , Akira Tokoh
IPC分类号： G03F7/004 , G03F7/022 , G03F7/023 , G03F7/039 , G03F7/075
CPC分类号： G03F7/0233 , G03F7/0045 , G03F7/0046 , G03F7/0226 , G03F7/039 , G03F7/0757 , Y10S430/107
摘要： The present invention provides a positive photo-sensitive resin composition comprising a polybenzoxazole precursor as a base resin, an organic solvent-soluble polymer or its precursor (e.g., a polyamic acid) as a component for imparting improved adhesion, flexibility or heat resistance, and a diazoquinone compound and/or a dihydropyridine compound as a photosensitive agent. This photo-sensitive resin composition can form a pattern of high resolution and further has excellent adhesion and mechanical properties. The present invention further provides three novel diazoquinone compounds as a photo-sensitive agent, which compounds give high resolution, high contrast and thick-film formability when compounded in a positive photo-sensitive resin composition. The present invention furthermore provides a new type positive photo-sensitive resin composition obtained by reacting a polybenzoxazole precursor with a diazoquinone compound as a photo-sensitive agent. This photo-sensitive resin composition has excellent alkali resistance when unexposed to a light and accordingly can give a high residual film ratio.
摘要翻译：本发明提供一种正型光敏树脂组合物，其包含作为基础树脂的聚苯并恶唑前体，作为赋予改善的粘合性，柔软性或耐热性的组分的有机溶剂可溶性聚合物或其前体（例如，聚酰胺酸），以及重氮醌化合物和/或二氢吡啶化合物作为感光剂。该感光性树脂组合物可以形成高分辨率的图案，并且还具有优异的粘附性和机械性能。本发明还提供三种新型的重氮醌化合物作为光敏剂，当在正性光敏树脂组合物中配合时，该化合物具有高分辨率，高对比度和厚膜成形性。本发明还提供了一种通过聚苯并恶唑前体与重氮醌化合物作为感光剂反应获得的新型正光敏树脂组合物。该光敏树脂组合物在未曝光时具有优异的耐碱性，因此可以得到高残留膜比。

2. 发明授权

US06235436B1 Semiconductor device using positive photosensitive resin composition and process for preparation thereof 有权
标题翻译：使用正型感光性树脂组合物的半导体装置及其制备方法
公开(公告)号：US06235436B1
公开(公告)日：2001-05-22
申请号：US09442277
申请日：1999-11-17
申请人： Takashi Hirano , Toshio Banba , Hiroaki Makabe , Naoshige Takeda , Toshiro Takeda
发明人： Takashi Hirano , Toshio Banba , Hiroaki Makabe , Naoshige Takeda , Toshiro Takeda
IPC分类号： G03F730
CPC分类号： G03F7/0226 , G03F7/0755 , G03F7/0757 , Y10S430/107
摘要： A positive type photosensitive resin composition which comprises (A) 100 parts by weight of a polyamide represented by the general formula (1): wherein X represents a tetravalent aromatic group; Y represents a divalent aromatic group; Z represents a divalent group represented by the formula: in which R1 and R2 represent divalent organic groups and R3 and R4 represent monovalent organic groups; a and b represent molar fractions; a+b=100 mole %; a=60.0-100.0 mole %; b=0-40.0 mole %; and n represents an integer of 2 to 500, (B) 1 to 100 parts by weight of a photosensitive diazoquinone compound and (C)1 to 50 parts by weight of a phenol compound represented by a specific structural formula and/or (D) 0.1 to 20 parts by weight of an organosilicon compound represented by a specific structural formula; and a semiconductor device in which a pattern of a polybenzoxazole resin obtained by using the above photosensitive resin composition is formed in a thickness of 0.1 to 20 &mgr;m on a semiconductor element.
摘要翻译：一种正型感光性树脂组合物，其包含（A）100重量份由通式（1）表示的聚酰胺：其中X表示四价芳族基团; Y表示二价芳基; Z表示由下式表示的二价基团：其中R 1和R 2表示二价有机基团，并且R 3和R 4表示一价有机基团; a和b表示摩尔分数; a + b = 100摩尔％ a = 60.0-100.0摩尔％ b = 0-40.0摩尔％ n表示2〜500的整数，（B）1〜100重量份感光性重氮醌化合物和（C）1〜50重量份由特定结构式表示的酚化合物和/或（D） 0.1〜20重量份的由具体结构式表示的有机硅化合物; 以及半导体装置，其中通过使用上述感光性树脂组合物得到的聚苯并恶唑树脂的图案在半导体元件上形成为0.1〜20μm的厚度。

3. 发明授权

US6071666A Positive type photosensitive resin composition and semiconductor device using the same 失效
标题翻译：正型感光性树脂组合物及使用其的半导体装置
公开(公告)号：US6071666A
公开(公告)日：2000-06-06
申请号：US854863
申请日：1997-05-12
申请人： Takashi Hirano , Toshio Banba , Hiroaki Makabe , Naoshige Takeda , Toshiro Takeda
发明人： Takashi Hirano , Toshio Banba , Hiroaki Makabe , Naoshige Takeda , Toshiro Takeda
IPC分类号： G03F7/022 , G03F7/075 , G03F7/023
CPC分类号： G03F7/0226 , G03F7/0755 , G03F7/0757 , Y10S430/107
摘要： A positive type photosensitive resin composition which comprises (A) 100 parts by weight of a polyamide represented by the general formula (1): ##STR1## wherein X represents a tetravalent aromatic group; Y represents a divalent aromatic group; Z represents a group represented by the formula: ##STR2## in which R.sub.1 and R.sub.2 represent organic groups and R.sub.3 and R.sub.4 represent monovalent organic groups; a and b represent molar fractions; a+b=100 mole %; a=60.0-100.0 mole %; b=0-40.0 mole %; and n represents an integer of 2 to 500, (B) 1 to 100 parts by weight of a photosensitive diazoquinone compound and (C) 1 to 50 parts by weight of a phenol compound represented by a specific structural formula and/or (D) 0.1 to 20 parts by weight of an organosilicon compound represented by a specific structural formula; and a semiconductor device in which a pattern of a polybenzoxazole resin obtained by using the above photosensitive resin composition is formed in a thickness of 0.1 to 20 .mu.m on a semiconductor element.
摘要翻译：一种正型感光性树脂组合物，其包含（A）100重量份由通式（1）表示的聚酰胺：其中X表示四价芳族基团; Y表示二价芳基; Z表示由下式表示的基团：其中R1和R2表示有机基团，R3和R4表示一价有机基团; a和b表示摩尔分数; a + b = 100摩尔％ a = 60.0-100.0摩尔％ b = 0-40.0摩尔％ n表示2〜500的整数，（B）1〜100重量份感光性重氮醌化合物和（C）1〜50重量份由特定结构式表示的酚化合物和/或（D） 0.1〜20重量份的由具体结构式表示的有机硅化合物; 以及半导体装置，其中通过使用上述感光性树脂组合物得到的聚苯并恶唑树脂的图案在半导体元件上形成为0.1〜20μm的厚度。

4. 发明授权

US5756260A Photosensitive polyimide resin composition containing a stabilizer and method for formation of relief pattern using same 失效
标题翻译：含有稳定剂的感光性聚酰亚胺树脂组合物和使用其形成浮雕图案的方法
公开(公告)号：US5756260A
公开(公告)日：1998-05-26
申请号：US732836
申请日：1996-10-15
申请人： Nobuyuki Sashida , Toshio Banba , Naoshige Takeda , Mitsuhiro Yamamoto
发明人： Nobuyuki Sashida , Toshio Banba , Naoshige Takeda , Mitsuhiro Yamamoto
IPC分类号： G03F7/004 , G03F7/012 , G03F7/023 , G03F7/037 , G03F7/038 , H05K1/00 , G03C1/73
CPC分类号： G03F7/0233 , G03F7/0045 , G03F7/0125 , G03F7/037 , G03F7/0387 , H05K3/4676
摘要： By using a polyamic acid ester comprising the following structural units (1a), (1b) and (1c) as a photosensitive resin and a sulfonamide compound or a specific glycol ether acetate as a stabilizer, a photo-sensitive resin composition excellent especially in viscosity stability can be obtained, and by using the above photosensitive resin and a specific developer, a relief pattern of high resolution can be formed. ##STR1## (the symbols in the formulas are as defined in the specification)
摘要翻译：通过使用包含以下结构单元（1a），（1b）和（1c）作为感光性树脂和磺酰胺化合物或特定二醇醚乙酸酯作为稳定剂的聚酰胺酸酯，特别优选粘度可以获得稳定性，并且通过使用上述感光性树脂和特定的显影剂，可以形成高分辨率的浮雕图案。（1a）在规范中定义的（1b）

5. 发明授权

US5648451A Process for producing photosensitive resin 失效
标题翻译：感光性树脂的制造方法
公开(公告)号：US5648451A
公开(公告)日：1997-07-15
申请号：US541582
申请日：1995-10-10
申请人： Nobuyuki Sashida , Toshio Banba , Naoshige Takeda
发明人： Nobuyuki Sashida , Toshio Banba , Naoshige Takeda
IPC分类号： C07D249/18 , C08G73/10 , G03F7/037 , C08G69/26
CPC分类号： G03F7/037 , C07D249/18 , C08G73/1007
摘要： A process for producing a photosensitive resin, comprises reacting a diamine with a tetracarboxylic acid tetraester represented by the formula (1) at a temperature of 0.degree. to 50.degree. C. in an aprotic polar solvent: ##STR1## wherein R.sub.1 is a tetravalent organic group; R.sub.2 is a group represented by the formula: ##STR2## in which R.sub.5 is a divalent to hexavalent organic group, R.sub.6 is H or CH.sub.3 and p is an integer of 1 to 5; R.sub.3 is a group represented by --OCH.sub.3, --OC.sub.2 H.sub.5, --OC.sub.3 H.sub.7 or the formula: ##STR3## and R.sub.4 is a group of the formula: ##STR4## the tetracarboxylic acid tetraester of the formula (1) is obtained by subjecting to addition reaction a tetracarboxylic dianhydride, an alcohol compound represented by the formula R.sub.2 H in which R.sub.2 is as defined above and an alcohol compound represented by the formula R.sub.3 H in which R.sub.3 is as defined above and thereafter subjecting the resulting addition reaction product to dehydration-condensation with 1-hydroxy-1,2,3-benzotriazole using a carbodiimide compound as a condensation agent.
摘要翻译：一种感光性树脂的制造方法，其特征在于，在0〜50℃的温度下，使二胺与式（1）表示的四羧酸四酯在非质子传递极性溶剂中反应：（1）其中R1为四价有机基团; R2是由下式表示的基团：其中R5是二价至六价有机基团，R6是H或CH3，p是1至5的整数; R3是由-OCH3，-OC2H5，-OC3H7或式AGE表示的基团，式（1）的四羧酸四酯通过将四羧酸二酐，由式R 2 H表示的醇化合物加成其中R 2如上所定义，和由式R3H表示的醇化合物，其中R3如上定义，然后使用碳二亚胺化合物将所得加成反应产物与1-羟基-1,2,3-苯并三唑进行脱水缩合作为缩合剂。

6. 发明授权

US06207356B1 Method for the pattern-processing of photosensitive resin composition 失效
标题翻译：感光性树脂组合物的图案处理方法
公开(公告)号：US06207356B1
公开(公告)日：2001-03-27
申请号：US09287118
申请日：1999-04-07
申请人： Toshio Banba , Toshiro Takeda
发明人： Toshio Banba , Toshiro Takeda
IPC分类号： G03F730
CPC分类号： G03F7/0233 , G03F7/0757 , G03F7/322
摘要： A method of pattern-processing a photosensitive resin composition which comprises coating on a substrate a positive photosensitive resin composition of a polyamide of formula (1) below and a diazoquinone compound, subjecting the same to prebaking and then to irradiation with light, thereafter dissolving the exposed portion in an alkaline aqueous solution containing an alkylbenzenesulfonic acid to remove the same, thereby obtaining a pattern. wherein X is a tetravalent aromatic group; Y is a divalent aromatic group; Z is in which R1 and R2 are divalent organic groups and R3 and R4 are nonvalent organic groups; a and b are mole fractions; a+b=100 mole %; a=60.0-100 mole %; b=0-40.0 mole % and n=2-500. When the development is effected with the alkaline aqueous solution containing the alkylbenzenesulfonic acid, a scum-free, very high resolution pattern is obtained.
摘要翻译：一种感光性树脂组合物的图案处理方法，其特征在于，在基材上涂布下述式（1）的聚酰胺的正型感光性树脂组合物和重氮醌化合物，使其进行预烘烤，然后用光照射，暴露部分在含有烷基苯磺酸的碱性水溶液中以除去它，从而获得图案。其中X是四价芳族基团; Y为二价芳基; 其中R1和R2是二价有机基团，R3和R4是非常有机基团; a和b是摩尔分数; a + b = 100摩尔％ a = 60.0-100摩尔％ b = 0-40.0摩尔％，n = 2-500。当用含有烷基苯磺酸的碱性水溶液进行显影时，获得无浮渣，非常高的分辨率图案。

7. 发明申请

US20100239977A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE 有权
标题翻译：阳离子型感光树脂组合物，固化膜，保护膜，绝缘膜和半导体器件
公开(公告)号：US20100239977A1
公开(公告)日：2010-09-23
申请号：US12669565
申请日：2008-08-08
申请人： Toshio Banba
发明人： Toshio Banba
IPC分类号： G03F7/004
CPC分类号： G03F7/0233 , G03F7/40
摘要： A positive-type photosensitive resin composition includes (A) a polyamide resin that includes a structural unit shown by the following formula (1) and a structural unit shown by the following formula (2), and (B) a photosensitive compound, the polyamide resin (A) having a weight average molecular weight (Mw) of 5000 to 80,000, and a cured film obtained by curing the positive-type photosensitive resin composition at 250° C. having a tensile modulus of elasticity of 2.0 to 4.0 GPa and a tensile elongation of 10 to 100%. According to the present invention, a positive-type photosensitive resin composition that can be cured at a low temperature and a highly reliable semiconductor device including a cured film of the positive-type photosensitive resin composition can be provided.
摘要翻译：正型感光性树脂组合物包括（A）包含下式（1）所示的结构单元和下述式（2）所示的结构单元的聚酰胺树脂，（B）感光性化合物，聚酰胺重均分子量（Mw）为5000〜80,000的树脂（A）和通过使正型感光性树脂组合物在250℃下固化而得到的固化膜，拉伸弹性模量为2.0〜4.0GPa，拉伸伸长率为10〜100％。根据本发明，可以提供能够在低温下固化的正型感光性树脂组合物和包含正型感光性树脂组合物的固化膜的高可靠性的半导体装置。

8. 发明授权

US06927013B2 Positive photosensitive resin compositions and semiconductor device 有权
标题翻译：正型感光性树脂组合物和半导体装置
公开(公告)号：US06927013B2
公开(公告)日：2005-08-09
申请号：US10474831
申请日：2002-04-30
申请人： Toshio Banba , Hiroaki Makabe , Takashi Hirano
发明人： Toshio Banba , Hiroaki Makabe , Takashi Hirano
IPC分类号： G03F7/022 , G03F7/023 , G03F7/075 , G03F7/039
CPC分类号： G03F7/037 , G03F7/022 , G03F7/0233 , G03F7/0757
摘要： The present invention provides a positive-working photosensitive resin composition with high sensitivity that gives a pattern having a high resolution and a high film thickness retention rate. In other words, the present invention provides a positive-working photosensitive resin composition comprising 100 parts by weight of a polyamide and 1 to 50 parts by weight of a photosensitive material, that is, a 1,2-naphthoquinone-2-diazide-5-sulfonate ester compound or a 1,2-naphthoquinone-2-diazide-4-sulfonate ester compound of a phenol compound. In addition, the present invention provides a positive-working photosensitive resin composition comprising 100 parts by weight of a polyamide, 1 to 50 parts by weight of a photosensitive material, that is, a 1,2-naphthoquinone-2-diazide-5-sulfonate ester compound or a 1,2-naphthoquinone-2-diazide-4-sulfonate ester compound of a phenol compound and 1 to 30 parts by weight of a phenol compound. Furthermore, the present invention provides a semiconductor device manufactured by using said positive-working photosensitive resin composition.
摘要翻译：本发明提供一种具有高灵敏度的正性感光性树脂组合物，其具有高分辨率和高膜厚保持率的图案。换句话说，本发明提供一种正性感光性树脂组合物，其包含100重量份的聚酰胺和1至50重量份的感光材料，即1,2-萘醌-2-重氮化物-5 - 磺酸酯化合物或酚化合物的1,2-萘醌-2-重氮化物-4-磺酸酯化合物。此外，本发明提供一种正性感光性树脂组合物，其包含100重量份的聚酰胺，1至50重量份的感光材料，即1,2-萘醌-2-重氮基-5- 磺酸酯化合物或酚化合物的1,2-萘醌-2-二叠氮-4-磺酸酯化合物和1〜30重量份苯酚化合物。此外，本发明提供了通过使用所述正性感光性树脂组合物制造的半导体器件。

9. 发明授权

US4417130A Transistor type pulse welding device 失效
标题翻译：晶体管型脉冲焊接装置
公开(公告)号：US4417130A
公开(公告)日：1983-11-22
申请号：US326993
申请日：1981-12-03
申请人： Toshio Banba , Masanori Mizuno , Takaii Mizuno
发明人： Toshio Banba , Masanori Mizuno , Takaii Mizuno
IPC分类号： B23K9/09
CPC分类号： B23K9/091
摘要： The inductive elements in the background and pulse current portions of a pulse welding circuit are wound around separate cores and the background current path is connected in series with the pulse current inductive element to prevent damage to the background current switching element due to reverse voltage or current.
摘要翻译：脉冲焊接电路的背景和脉冲电流部分中的感应元件缠绕在分离的芯上，并且背景电流路径与脉冲电流感应元件串联连接，以防止由于反向电压或电流而损坏背景电流开关元件。

10. 发明授权

US08530119B2 Positive photosensitive resin composition, cured film, protective film, interlayer insulating film, and semiconductor device and display element using the same 有权
标题翻译：正型感光性树脂组合物，固化膜，保护膜，层间绝缘膜，以及使用其的显示元件
公开(公告)号：US08530119B2
公开(公告)日：2013-09-10
申请号：US13321180
申请日：2009-05-20
申请人： Takashi Hirano , Toshio Banba , Shusaku Okamyo , Hiroaki Makabe
发明人： Takashi Hirano , Toshio Banba , Shusaku Okamyo , Hiroaki Makabe
IPC分类号： G03F7/023
CPC分类号： G03F7/0233 , G03F7/0226
摘要： A positive photosensitive resin composition includes (A) a polybenzoxazole precursor resin, (B) a photosensitive diazoquinone compound, (C) a hindered phenol antioxidant shown by the following general formula (1), and (D) a phenol compound shown by the following general formula (2). Formula (1) is: wherein R1 represents a hydrogen atom or an organic group having 1 to 4 carbon atoms, a is an integer from 1 to 3, and b is an integer from 1 to 3. Formula (2) is: wherein R2 represents a methylene group or a single bond, c is an integer from 1 to 3, and d is an integer from 1 to 3. A protective film, an interlayer insulating film, and a semiconductor device and a display element using the same are also disclosed.
摘要翻译：正型感光性树脂组合物包含（A）聚苯并恶唑前体树脂，（B）感光性重氮醌化合物，（C）下述通式（1）所示的受阻酚抗氧化剂，（D）下述通式通式（2）。式（1）为：式中，R 1表示氢原子或碳原子数1〜4的有机基团，a为1〜3的整数，b为1〜3的整数。式（2）表示亚甲基或单键，c为1〜3的整数，d为1〜3的整数。保护膜，层间绝缘膜及半导体装置以及使用该键的显示元件也是披露

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