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1. 发明专利

JP2012065914A Wiring board and ultrasonic probe 审中-公开
标题翻译：接线板和超声波探头
公开(公告)号：JP2012065914A
公开(公告)日：2012-04-05
申请号：JP2010214352
申请日：2010-09-24
申请人： Toshiba Corp , 株式会社東芝
发明人： ONO MICHIKO , ASAGIRI SATOSHI , TOGASAKI TAKASHI , MIYAGI TAKESHI
IPC分类号： A61B8/00
摘要： PROBLEM TO BE SOLVED: To provide an ultrasonic probe which prevents increase in size as well as thickness of a cable connected to a probe diagnostic device.SOLUTION: The ultrasonic probe 1 includes a plurality of elements 19 for emitting/receiving an ultrasonic wave and transmitting a signal of the ultrasonic wave received. In a piezoelectric body 10, the elements 19 are divided into pairs of sections, and another section is arranged between the pair of sections. A circuit board 13 includes a plurality of receiving circuits 44 connected to the elements respectively arranged in the pair of the sections for receiving the signal transmitted from the elements 19 connected to one of the pair of the sections. Further, the ultrasonic probe 1 includes a wiring board 11 which has a first wiring board 28 connected to the plurality of elements 19, and a second wiring board 29 with flexibility connected to the first wiring board 28 while electrically connecting the elements 19 to a circuit board 13 for each of the sections, respectively, and whose second wiring board 29 connected to the pair of the sections is adjacently connected to the circuit board 13.
摘要翻译：要解决的问题：提供一种防止连接到探针诊断装置的电缆的尺寸以及厚度增加的超声波探头。解决方案：超声波探头1包括用于发射/接收超声波并发送接收到的超声波的信号的多个元件19。在压电体10中，元件19分成一对部分，另一部分设置在该对部分之间。电路板13包括多个接收电路44，多个接收电路44连接到分别布置在一对部分中的元件，用于接收从连接到该对部分中的一个部分的元件19发送的信号。此外，超声波探头1包括具有连接到多个元件19的第一布线板28的布线板11和具有挠性的第二布线板29，第二布线板29与第一布线板28电连接，同时将元件19电连接到电路并且其连接到所述一对部分的第二布线板29相邻地连接到电路板13.版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2008078482A Method of manufacturing semiconductor device 审中-公开
标题翻译：制造半导体器件的方法
公开(公告)号：JP2008078482A
公开(公告)日：2008-04-03
申请号：JP2006257529
申请日：2006-09-22
申请人： Toshiba Corp , 株式会社東芝
发明人： HIGUCHI KAZUTO , TOGASAKI TAKASHI , UCHIDA MASAYUKI , ITO HISASHI
IPC分类号： H01L21/60
CPC分类号： H01L2224/11 , H01L2224/81
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device, where two kinds of methods of physical deposition and plating are used for forming a bump electrode so that improvement in productivity is attained by improving the yield of manufacturing, while attaining miniaturization of the semiconductor device, high integration and lead-free handling, and ensuring high reliability. SOLUTION: The disclosed method includes the steps of forming an opening H that communicates with an external terminal 5 on an insulating film 6 covering the external terminal 5 on a substrate 3; forming a first metal film 9 to generate a bump electrode 7 by physical deposition on the external terminal 5 within the opening H; forming a second metal film 11 to generate the bump electrode 7, by electroless plating on the first metal film 9 and at the edge of the opening H on the insulating film 6; and forming the bump electrode 7 by collecting the second metal film 11 on the insulating film 6 inside the opening H, while melting the first metal film 9 and the second metal film 11. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：为了提供一种制造半导体器件的方法，其中使用两种物理沉积和电镀方法来形成凸块电极，从而通过提高制造成品率来提高生产率，同时实现半导体器件的小型化，高集成度和无铅处理，并确保高可靠性。解决方案：所公开的方法包括以下步骤：在覆盖基板3上的外部端子5的绝缘膜6上形成与外部端子5连通的开口H; 形成第一金属膜9以通过在开口H内的外部端子5上的物理沉积产生凸起电极7; 通过在绝缘膜6上的第一金属膜9和开口H的边缘上进行化学镀来形成第二金属膜11以产生凸块电极7; 并且在熔融第一金属膜9和第二金属膜11的同时，通过在开口H内部的绝缘膜6上收集第二金属膜11来形成突起电极7.版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2005017910A Optical fiber connecting structure, and image display 审中-公开
标题翻译：光纤连接结构和图像显示
公开(公告)号：JP2005017910A
公开(公告)日：2005-01-20
申请号：JP2003185276
申请日：2003-06-27
申请人： Toshiba Corp , 株式会社東芝
发明人： FUSE KAZUYOSHI , KATO SHIGERU , TOGASAKI TAKASHI
IPC分类号： G02B6/24 , G02B6/38 , G02B6/42
CPC分类号： G02B6/3801 , G02B6/3833 , G02B6/4201 , G02B6/424
摘要： PROBLEM TO BE SOLVED: To provide a structure of connecting optical fibers that less damages the optical fibers and can obtain the correct centering of them and ruggedly maintain this state. SOLUTION: The tips of the optical fiber 28, 41 are held in the ferrules 51, 52 whose abutting ends 51a, 52a are PC polished. The end 28a of the optical fiber 28 is made flush with the end 51a of the ferrule 51, and the end 41a of the optical fiber 41 is also made flush with the end 52a of the ferrule 52 in the same way. The end 51a of the ferrule 51 and the end 52a of the ferrule 52 are made to face each other, and the end 28a of the optical fiber 28 and the end 41a of the optical fiber 41 are aligned centering together. The optical fibers 28, 41 are connected by filling adhesive 55 and curing it between the end 52a of the ferrule 52 and the end 52a of the ferrule 52. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供连接光纤的结构，其损伤光纤并且能够获得正确的定心并且坚固地保持这种状态。解决方案：光纤28,41的尖端被保持在其对端51a，52a被PC抛光的套圈51,52中。光纤28的端部28a与套圈51的端部51a齐平，光纤41的端部41a也以同样的方式与套圈52的端部52a齐平。套圈51的端部51a和套圈52的端部52a彼此面对，并且光纤28的端部28a和光纤41的端部41a对准在一起。光纤28,41通过填充粘合剂55连接并固化在套圈52的端部52a和套圈52的端部52a之间。（C）2005，JPO＆NCIPI

4. 发明专利

JP2004134821A Semiconductor apparatus 有权
公开(公告)号：JP2004134821A
公开(公告)日：2004-04-30
申请号：JP2004031161
申请日：2004-02-06
申请人： Toshiba Corp , 株式会社東芝
发明人： YAMADA HIROSHI , TOGASAKI TAKASHI , SAITO MASAYUKI , HONMA SOICHI , MORI MIKI
IPC分类号： H01L21/60 , H01L21/56
CPC分类号： H01L2224/16 , H01L2224/26175 , H01L2224/73104 , H01L2224/73204 , H01L2224/83102 , H01L2224/83104 , H01L2224/83191 , H01L2224/83192 , H01L2224/92125 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15151 , H01L2924/3025
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor apparatus having an improvement in reliability by preventing the occurrence of bubbles from resin disposed in a gap between a semiconductor device and a circuit board. SOLUTION: The semiconductor apparatus has a circuit board and a semiconductor device mounted on the board through bump electrodes, wherein resin is disposed in a gap between the circuit board and the semiconductor device, and around the semiconductor device. The bump electrodes are formed along the circumference of the semiconductor device, and a concave portion is formed in an area surrounded by the bump electrodes on the surface of the circuit board. COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2015053346A 半導体装置有权
标题翻译：半导体器件
公开(公告)号：JP2015053346A
公开(公告)日：2015-03-19
申请号：JP2013184507
申请日：2013-09-05
申请人：株式会社東芝 , Toshiba Corp
发明人： MASUNAGA TAKAYUKI , UEDA KAZUHIRO , WATANABE NAOTAKE , NISHIUCHI HIDEO , MARUNO KOJI , TOGASAKI TAKASHI
IPC分类号： H01L25/07 , H01L23/34 , H01L25/18
CPC分类号： H01L24/33 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/13055 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要：【課題】小型化が可能で、製造コスト、重量の増大を抑制することのできる半導体装置を提供する。【解決手段】実施形態によれば、半導体装置は、第1導電体34および第2導電体36と、第1導電体34と第2導電体36との間に接合された板状の第1半導体素子38と、第1導電体34と第2導電体36との間に接合された板状の第2半導体素子と、第1、第2導電体、第1、第2半導体素子を覆う直方体形状の封止体52と、第1半導体素子の接続端子に電気的に接続され封止体から外方へ突出する信号端子50と、を備えている。第1導電体は、上端縁35を有する平坦な第1接合面34a、この第1接合面と平行に対向する第1側面、前記第1接合面、第1側面と直交する平坦な第1底面34b、この第1底面と対向する第1上面を有し、前記第1上面は、第1接合面の上端縁よりも、第1底面から離れる方向に突出した上部突出部33を有する立方体形状に形成されている。【選択図】図4
摘要翻译：要解决的问题：提供允许小型化并防止制造成本和重量增加的半导体器件。解决方案：半导体器件包括：第一导体34和第二导体36; 接合在第一导体34和第二导体36之间的片状第一半导体元件38; 结合在第一导体34和第二导体36之间的片状第二半导体元件; 覆盖第一和第二导体以及第一和第二半导体元件的矩形平行六面体形状的密封体52; 电连接到第一半导体元件的连接端子并从密封体向外部突出的信号端子50。第一导体具有平坦的第一接合表面34a，其具有上边缘35，与第一接合表面平行的第一侧表面，与第一接合表面和第一侧表面正交的平坦的第一底表面34b和第一接合表面顶表面面对第一底面，并且其形成为立方体形状，使得第一顶表面具有比第一接合表面的上边缘沿远离第一底表面的方向进一步突出的上突起33。

6. 发明专利

JP2014113025A Semiconductor power converter and manufacturing method of the same 有权
标题翻译：半导体功率转换器及其制造方法
公开(公告)号：JP2014113025A
公开(公告)日：2014-06-19
申请号：JP2013137218
申请日：2013-06-28
申请人： Toshiba Corp , 株式会社東芝
发明人： NISHIUCHI HIDEO , UEDA KAZUHIRO , MASUNAGA TAKAYUKI , WATANABE NAOTAKE , MARUNO KOJI , TOGASAKI TAKASHI , SHIMIZU SADAYUKI
IPC分类号： H02M7/48 , H01L25/07 , H01L25/18
CPC分类号： H01L25/50 , H01L21/4839 , H01L21/4842 , H01L23/3107 , H01L23/4006 , H01L23/473 , H01L23/49562 , H01L23/50 , H01L25/072 , H01L2224/48247 , H01L2224/49171 , H01L2924/1305 , H01L2924/13055 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor power converter which achieves downsizing, improvement of the reliability, and high assembly yield and is excellent in dimensional stability of the finished product, and to provide a manufacturing method of the semiconductor power converter.SOLUTION: A semiconductor power converter comprises: a first conductor 34; a second conductor 36 which faces the first conductor so as to be spaced away from the first conductor; a first semiconductor element 38 where one electrode is joined to the first conductor; a second semiconductor element 40 where one electrode is joined to the first conductor; a first protruding type conductor 44a which is joined to the other electrode of the first semiconductor element; a second protruding type conductor 44b which is joined to the other electrode of the second semiconductor element; a plate like connection part which has a first opening and a second opening into which protruding parts of the first and second protruding type conductors fit, and is joined to the first and second protruding type conductors and the second conductor; a first power terminal; a second power terminal; a signal terminal; and an insulator 52 which covers base end parts of the first and second power terminals, a base end part of the signal terminal, and other component members. The insulator has a bottom surface which extends in a direction perpendicular to the first and second semiconductor elements and where the first and second conductors are exposed.
摘要翻译：要解决的问题：提供实现小型化，可靠性提高，组装产率高，成品尺寸稳定性优异的半导体功率转换器，提供半导体功率转换器的制造方法。解决方案：A 半导体功率转换器包括：第一导体34; 第二导体36，其面向第一导体以与第一导体间隔开; 第一半导体元件38，其中一个电极连接到第一导体; 第二半导体元件40，其中一个电极接合到第一导体; 与第一半导体元件的另一个电极接合的第一突出型导体44a; 第二突出型导体44b，其连接到第二半导体元件的另一个电极; 具有第一开口和第二开口的板状连接部，第一突出型导体和第二突出型导体的突出部嵌入到该第一开口和第二开口中，并且与第一和第二突出型导体和第二导体接合; 第一个电源端子; 第二个电源端子; 信号端子; 以及绝缘体52，其覆盖第一和第二电力端子的基端部分，信号端子的基端部分和其它部件。绝缘体具有在垂直于第一和第二半导体元件的方向上延伸的第一和第二导体暴露的底面。

7. 发明专利

JP2010003914A Method for manufacturing solder bump 有权
标题翻译：制造焊接块的方法
公开(公告)号：JP2010003914A
公开(公告)日：2010-01-07
申请号：JP2008161959
申请日：2008-06-20
申请人： Toshiba Corp , 株式会社東芝
发明人： KATO KYOKO , TOGASAKI TAKASHI
IPC分类号： H01L21/60
CPC分类号： H01L2224/11 , H01L2224/11849 , H01L2224/11901 , H01L2224/13111 , H01L2924/01029 , H01L2224/11462
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing solder bumps, which can improve the accuracy in the weight ratio of Sn to Cu. SOLUTION: A resist layer 40 having an aperture 41 is formed on a UBM layer 30 formed on a semiconductor element 20, and a Cu plating layer 11 of which the thickness is substantially 0 is formed on the inner surface of the aperture 41 by an electric plating method; and after further forming an Sn plating layer 12 in the aperture 41, the resist layer 40 is removed, the UBM layer 30 is etched, and the Cu plating layer 11 and the Sn plating layer 12 are reflowed to form a solder bump of Sn-0.7Cu. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造焊锡凸块的方法，其可以提高Sn与Cu的重量比的精度。解决方案：在形成在半导体元件20上的UBM层30上形成具有孔41的抗蚀剂层40，并且在孔41的内表面上形成厚度基本为0的Cu镀层11 通过电镀法; 并且在孔41中进一步形成Sn镀层12之后，去除抗蚀剂层40，对UBM层30进行蚀刻，并且Cu镀层11和Sn镀层12回流以形成Sn- 0.7Cu钎。版权所有（C）2010，JPO＆INPIT

8. 发明专利

JP2009147220A Manufacturing method of semiconductor device, and semiconductor device 有权
标题翻译：半导体器件的制造方法和半导体器件
公开(公告)号：JP2009147220A
公开(公告)日：2009-07-02
申请号：JP2007324934
申请日：2007-12-17
申请人： Toshiba Corp , 株式会社東芝
发明人： UDA TATSUO , EZAWA HIROKAZU , IIJIMA TADASHI , TOGASAKI TAKASHI
IPC分类号： H01L21/60 , H01L21/3205 , H01L23/52
CPC分类号： H01L23/525 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/17 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L25/18 , H01L2224/0401 , H01L2224/05548 , H01L2224/13027 , H01L2224/13099 , H01L2224/131 , H01L2224/1403 , H01L2224/14051 , H01L2225/06513 , H01L2225/06527 , H01L2225/06568 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/30105
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device, along with the semiconductor device, capable of manufacturing a rearrangement wiring and a solder bump in a simple process. SOLUTION: In the manufacturing method of the semiconductor device, rearrangement wiring and bumps are formed in which an electrode terminal is electrically led out on the main surface side where the electrode terminal of a semiconductor element of a semiconductor substrate is provided. The manufacturing method includes a process for forming a first conductive layer which is electrically connected to the electrode terminal on the main surface side of the semiconductor substrate, a process in which a mask layer comprising an opening at a predetermined position on the first conductive layer is formed on the first conductive layer, a process in which a second conductive layer is formed in the opening of the mask layer, a process for removing the mask layer, a process in which the first conductive layer is anisotropically etched using the second conductive layer as a mask for forming a rearrangement wiring comprising the first conductive layer, and a process in which the second conductive layer is subjected to reflowing to form a bump on the rearrangement wiring. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种半导体器件与半导体器件的制造方法，其能够以简单的工艺制造重排布线和焊料凸块。解决方案：在半导体器件的制造方法中，形成了在设置有半导体衬底的半导体元件的电极端子的主表面侧电极引出电极端子的重排布线和凸块。该制造方法包括：形成与半导体衬底的主表面侧上的电极端子电连接的第一导电层的工艺，其中包括在第一导电层上的预定位置处的开口的掩模层是形成在第一导电层上，其中在掩模层的开口中形成第二导电层的工艺，去除掩模层的工艺，使用第二导电层将第一导电层各向异性地蚀刻的工艺用于形成包括第一导电层的重排布线的掩模，以及第二导电层经过回流以在重排布线上形成凸块的工艺。版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2004214325A Optical fiber heat sink and manufacturing method thereof 审中-公开
公开(公告)号：JP2004214325A
公开(公告)日：2004-07-29
申请号：JP2002380282
申请日：2002-12-27
申请人： Toshiba Corp , 株式会社東芝
发明人： SUGA KENTARO , TOGASAKI TAKASHI , HIGUCHI KAZUTO , KARASAWA JUN , FUSE KAZUYOSHI
IPC分类号： H01S3/06 , H01S3/04 , H01S3/10
摘要： PROBLEM TO BE SOLVED: To provide an optical fiber heat sink of high reliability in moisture resistance by employing a fiber housing structure of high moisture resistance. SOLUTION: An optical fiber 301, an input optical fiber 201, and an output optical fiber 211 which are added with rare earth are arranged in an air-tight case 103. The inside of the case is filled with a hydrophobic liquid or a flexible resin 501, to suppress an arbitrary optical fiber from degrading as molecules of water in the outside air reach any optical fiber. The heat generated at the optical fibers is transmitted to the case through the hydrophobic liquid or the flexible resin, and dissipated in the outside air from the surface of the case. COPYRIGHT: (C)2004,JPO&NCIPI

10. 发明专利

JP2014093411A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2014093411A
公开(公告)日：2014-05-19
申请号：JP2012242865
申请日：2012-11-02
申请人： Toshiba Corp , 株式会社東芝
发明人： MASUNAGA TAKAYUKI , UEDA KAZUHIRO , WATANABE NAOTAKE , SHIMIZU SADAYUKI , NISHIUCHI HIDEO , TOGASAKI TAKASHI , SAYAMA SATOSHI
IPC分类号： H01L25/07 , H01L21/56 , H01L23/28 , H01L23/29 , H01L23/48 , H01L25/18
CPC分类号： H01L23/495 , H01L23/492 , H01L23/49562 , H01L23/49575 , H01L23/49811 , H01L25/115 , H01L25/18 , H01L2924/0002 , H01L2924/1815 , H02M7/003 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device that can be miniaturized, be improved in its reliability, and be densely installed.SOLUTION: According to an embodiment, the semiconductor device comprises a first conductor, a second conductor, a first semiconductor element and a second semiconductor element which are bonded between the first conductor and the second conductor, a first power terminal 46a, a second power terminal 46b, a signal terminal 50, and a rectangular parallelepiped shaped insulator 52 covering these component members. The insulator has a flat bottom surface from which the first and second conductors are exposed, a flat first side surface 52a extending perpendicularly to the bottom surface, a second side surface 52b that extends perpendicularly to the bottom surface and is opposed in parallel to the first side surface, a ceiling surface 52d, a first end surface 52e, and a second end surface 52e. The first power terminal extends outward from the first end surface. The second power terminal extends outward from the second end surface. The signal terminal extends outward from the ceiling surface. A parting line 54 is formed over the first end surface, the ceiling surface, and the second end surface of the insulator.
摘要翻译：要解决的问题：提供可以小型化的半导体器件，其可靠性提高并且被紧密地安装。解决方案：根据实施例，半导体器件包括第一导体，第二导体，第一半导体元件和接合在第一导体和第二导体之间的第二半导体元件，覆盖这些部件的第一电源端子46a，第二电源端子46b，信号端子50和矩形平行六面体形状的绝缘体52。绝缘体具有平坦的底表面，第一和第二导体从该底表面露出，垂直于底表面延伸的平坦的第一侧表面52a，垂直于底表面延伸且平行于第一侧表面，天花板表面52d，第一端面52e和第二端面52e。第一电源端子从第一端面向外延伸。第二电源端子从第二端面向外延伸。信号端子从天花板表面向外延伸。分离线54形成在绝缘体的第一端面，天花板表面和第二端面之上。

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