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1. 发明授权

US07133733B2 Design support system 失效
标题翻译：设计支持系统
公开(公告)号：US07133733B2
公开(公告)日：2006-11-07
申请号：US10806105
申请日：2004-03-23
申请人： Toru Okada , Masanao Fujii , Takatoyo Yamakami , Kazuhisa Mishima , Toshiaki Otsuka
发明人： Toru Okada , Masanao Fujii , Takatoyo Yamakami , Kazuhisa Mishima , Toshiaki Otsuka
IPC分类号： G06F19/00
CPC分类号： G05B19/41885 , G05B2219/31334 , G05B2219/31343 , G05B2219/35029 , G05B2219/35179 , G06Q10/06 , G06Q50/04 , Y02P90/185 , Y02P90/26 , Y02P90/265 , Y02P90/30
摘要： The present invention relates to a design support system constructed so as to comprise a manufacturing line information preparation section and an output section. On the basis of element types selected by a selection section as arbitrary element types to be used for constituting a manufacturing line, the manufacturing line information preparation section prepares information about the manufacturing line by means of acquiring information about element types stored in an element type database beforehand. The output section can output the information about the manufacturing line prepared by the manufacturing line information preparation section. A manufacturing line including a plurality of steps is efficiently examined, determined, and established, thereby shortening the time required to design and manufacture the manufacturing line and curtailing manufacturing costs.
摘要翻译：本发明涉及一种构造为包括制造线信息准备部分和输出部分的设计支撑系统。基于由选择部分选择的元素类型作为用于构成生产线的任意元素类型，生产线信息准备部分通过获取关于元素类型数据库中存储的元素类型的信息来准备关于生产线的信息预先。输出部可以输出由制造线信息准备部准备的生产线的信息。包括多个步骤的生产线被有效地检查，确定和建立，从而缩短了设计和制造生产线所需的时间并缩短了制造成本。

2. 发明申请

US20050038537A1 Design support system 失效
标题翻译：设计支持系统
公开(公告)号：US20050038537A1
公开(公告)日：2005-02-17
申请号：US10806105
申请日：2004-03-23
申请人： Toru Okada , Masanao Fujii , Takatoyo Yamakami , Kazuhisa Mishima , Toshiaki Otsuka
发明人： Toru Okada , Masanao Fujii , Takatoyo Yamakami , Kazuhisa Mishima , Toshiaki Otsuka
IPC分类号： G06F17/50 , G05B19/418 , G06F19/00 , G06Q50/00 , G06Q50/04 , H01L21/02
CPC分类号： G05B19/41885 , G05B2219/31334 , G05B2219/31343 , G05B2219/35029 , G05B2219/35179 , G06Q10/06 , G06Q50/04 , Y02P90/185 , Y02P90/26 , Y02P90/265 , Y02P90/30
摘要： The present invention relates to a design support system constructed so as to comprise a manufacturing line information preparation section and an output section. On the basis of element types selected by a selection section as arbitrary element types to be used for constituting a manufacturing line, the manufacturing line information preparation section prepares information about the manufacturing line by means of acquiring information about element types stored in an element type database beforehand. The output section can output the information about the manufacturing line prepared by the manufacturing line information preparation section. A manufacturing line including a plurality of steps is efficiently examined, determined, and established, thereby shortening the time required to design and manufacture the manufacturing line and curtailing manufacturing costs.
摘要翻译：本发明涉及一种构造为包括制造线信息准备部分和输出部分的设计支撑系统。基于由选择部分选择的元素类型作为用于构成生产线的任意元素类型，生产线信息准备部分通过获取关于元素类型数据库中存储的元素类型的信息来准备关于生产线的信息预先。输出部可以输出由制造线信息准备部准备的生产线的信息。包括多个步骤的生产线被有效地检查，确定和建立，从而缩短了设计和制造生产线所需的时间并缩短了制造成本。

3. 发明申请

US20050034960A1 Parts mounting and assembling apparatus 有权
标题翻译：零件安装和组装设备
公开(公告)号：US20050034960A1
公开(公告)日：2005-02-17
申请号：US10804040
申请日：2004-03-19
申请人： Koichi Shimamura , Kazuhisa Mishima , Toshiaki Otsuka , Toru Okada , Masanao Fujii
发明人： Koichi Shimamura , Kazuhisa Mishima , Toshiaki Otsuka , Toru Okada , Masanao Fujii
IPC分类号： H01L21/50 , B65G49/02
CPC分类号： B81C3/002 , Y10T29/53 , Y10T29/53174 , Y10T29/534 , Y10T29/53417
摘要： The present invention provides an apparatus combining a high-speed high-precision characteristic equivalent to that of a die bonder and a flexibility of coping quickly with a process variation and product variation along with size reduction and economics. This apparatus comprises a base unit including a body containing a device to be used in common among a plurality of processes for mounting and assembling parts, a mechanism for conveying a workpiece in a predetermined conveying direction and a mechanism for positioning the workpiece, a dedicated unit including an end effector, and a selected mechanism unit including a mechanism for moving the end effector in two axial directions perpendicular to the predetermined conveying direction to adjust a relative position between the end effector and the workpiece or a part. The moving mechanism is interchangeably attached on the base unit, and the end effector is interchangeably attached on the moving mechanism.
摘要翻译：本发明提供了一种结合了与模具接合机相当的高速高精度特性和快速应对的灵活性的设备，以及工艺变化和产品变化以及尺寸减小和经济性。该装置包括：基座单元，包括：主体，其包含用于安装和组装部件的多个工艺中共同使用的装置;用于沿预定输送方向输送工件的机构和用于定位工件的机构;专用单元包括端部执行器，以及选择的机构单元，其包括用于在垂直于预定输送方向的两个轴向方向上移动末端执行器的机构，以调节端部执行器和工件或部件之间的相对位置。移动机构可互换地安装在基座单元上，并且端部执行器可互换地附接在移动机构上。

4. 发明授权

US07111390B2 Parts mounting and assembling apparatus 有权
标题翻译：零件安装和组装设备
公开(公告)号：US07111390B2
公开(公告)日：2006-09-26
申请号：US10804040
申请日：2004-03-19
申请人： Koichi Shimamura , Kazuhisa Mishima , Toshiaki Otsuka , Toru Okada , Masanao Fujii
发明人： Koichi Shimamura , Kazuhisa Mishima , Toshiaki Otsuka , Toru Okada , Masanao Fujii
IPC分类号： B23P19/00
CPC分类号： B81C3/002 , Y10T29/53 , Y10T29/53174 , Y10T29/534 , Y10T29/53417
摘要： An apparatus combining a high-speed high-precision characteristic equivalent to that of a die bonder and a flexibility of coping quickly with a process variation and product variation along with size reduction and economics. This apparatus comprises a base unit including a body containing a device to be used in common among a plurality of processes for mounting and assembling parts, a mechanism for conveying a workpiece in a predetermined conveying direction and a mechanism for positioning the workpiece, a dedicated unit including an end effector, and a selected mechanism unit including a mechanism for moving the end effector in two axial directions perpendicular to the predetermined conveying direction to adjust a relative position between the end effector and the workpiece or a part. The moving mechanism is interchangeably attached on the base unit, and the end effector is interchangeably attached on the moving mechanism.
摘要翻译：一种结合了与模具接合机相当的高速高精度特性的装置和快速应对的过程变化和产品变化以及尺寸减小和经济性的灵活性。该装置包括：基座单元，包括：主体，其包含用于安装和组装部件的多个工艺中共同使用的装置;用于沿预定输送方向输送工件的机构和用于定位工件的机构;专用单元包括端部执行器，以及选择的机构单元，其包括用于在垂直于预定输送方向的两个轴向方向上移动末端执行器的机构，以调节端部执行器和工件或部件之间的相对位置。移动机构可互换地安装在基座单元上，并且端部执行器可互换地附接在移动机构上。

5. 发明申请

US20080101746A1 OPTICAL MODULE 有权
标题翻译：光学模块
公开(公告)号：US20080101746A1
公开(公告)日：2008-05-01
申请号：US11553743
申请日：2006-10-27
申请人： Toru Okada , Masanao Fujii , Yutaka Noda
发明人： Toru Okada , Masanao Fujii , Yutaka Noda
IPC分类号： G02B6/12
CPC分类号： G03B17/00 , H05K3/303 , H05K2201/0305 , H05K2201/09781 , H05K2201/10121 , H05K2201/10727 , H05K2203/0182 , Y02P70/613
摘要： An optical module has a substrate having a substrate surface provided with terminal pads and landing pads, and an optical element package having terminals and mounted on the substrate surface with a gap formed therebetween. The gap between the optical element package and the substrate surface is determined by the landing pads when the optical element package is mounted on the substrate surface. The terminal pads and the landing pads are exposed in a state where the optical element package is mounted on the substrate surface, and the terminal pads are electrically connected to corresponding terminals by solder.
摘要翻译：光学模块具有具有设置有端子焊盘和着陆焊盘的基板表面的基板，以及具有端子的光学元件封装，并且安装在基板表面上，其间形成有间隙。当光学元件封装安装在基板表面上时，光学元件封装和基板表面之间的间隙由着陆焊盘确定。端子焊盘和着陆焊盘在光学元件封装安装在基板表面上的状态下露出，并且端子焊盘通过焊料电连接到相应的端子。

6. 发明授权

US06744183B2 Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method 失效
标题翻译：压电元件与电极的接合方法以及使用该接合方法的压电微型致动器
公开(公告)号：US06744183B2
公开(公告)日：2004-06-01
申请号：US10347708
申请日：2003-01-21
申请人： Masayuki Kitajima , Yutaka Noda , Seiichi Shimoura , Toru Okada , Masanao Fujii , Kenji Iketaki , Hidehiko Kobayashi , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka
发明人： Masayuki Kitajima , Yutaka Noda , Seiichi Shimoura , Toru Okada , Masanao Fujii , Kenji Iketaki , Hidehiko Kobayashi , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka
IPC分类号： H01L41047
CPC分类号： H01L41/29 , G11B5/5552 , G11B5/5556 , H01L41/0993 , H01L2224/48091 , H01L2224/73265 , H01L2924/01327 , Y10T29/42 , H01L2924/00014 , H01L2924/00
摘要： A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.
摘要翻译：一种键合压电元件和电极的方法，包括以下步骤：在压电元件的接合表面上形成选自Au，Al，Zn，Cu和Sn的材料的第一涂层，并形成在电极的接合表面上第二次涂覆选自Au，Al，Zn，Cu和Sn的材料。第一和第二涂层的材料的组合优选为Au / Au，Au / Al，Zn / Cu或Sn / Cu。该方法还包括使第一和第二涂层彼此紧密接触并在压力下加热它们以在第一和第二涂层之间形成金属键或金属间化合物，从而结合压电元件和电极的步骤。

7. 发明授权

US08153941B2 Method of heating superposed components and heating apparatus therefor 有权
标题翻译：加热叠加部件及其加热装置的方法
公开(公告)号：US08153941B2
公开(公告)日：2012-04-10
申请号：US10199850
申请日：2002-07-19
申请人： Masanao Fujii , Toru Okada , Hidehiko Kobayashi , Seiichi Shimoura
发明人： Masanao Fujii , Toru Okada , Hidehiko Kobayashi , Seiichi Shimoura
IPC分类号： H05B3/10 , H05B3/02
CPC分类号： H01L41/313
摘要： A first plate material is set on a work stage. The first plate material includes first components commonly connected to a first connection member. A second plate material is subsequently set on the work stage. The second plate material includes second components commonly connected to a second connection member. The second components are superposed on the corresponding first components. The first components as well as the second components can be handled as a one-piece component. It leads to an improved productivity. Heat surfaces of a heat block contact the second components. The connection members are prevented from thermal expansion. The constant intervals are reliably maintained between the adjacent first components and the adjacent second components.
摘要翻译：将第一板材放置在工作台上。第一板材包括通常连接到第一连接构件的第一部件。随后将第二板材置于工作台上。第二板材包括通常连接到第二连接构件的第二部件。第二组件叠加在相应的第一组件上。第一组件以及第二组件可以作为单件组件来处理。它可以提高生产率。加热块的热表面与第二部件接触。连接件防止热膨胀。在相邻的第一部件和相邻的第二部件之间可靠地保持恒定间隔。

8. 发明授权

US07356894B2 Method of producing a micro-actuator 失效
标题翻译：微型致动器的制造方法
公开(公告)号：US07356894B2
公开(公告)日：2008-04-15
申请号：US11006340
申请日：2004-12-07
申请人： Masanao Fujii , Toru Okada , Masayuki Kitajima , Hidehiko Kobayashi , Seiichi Shimoura
发明人： Masanao Fujii , Toru Okada , Masayuki Kitajima , Hidehiko Kobayashi , Seiichi Shimoura
IPC分类号： H01L41/22 , H01L41/00
CPC分类号： G11B5/5552 , H01L41/0993 , H01L41/313 , Y10T29/42 , Y10T29/49005 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913
摘要： In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable, and a movable electrode is placed on the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the second adhesive. Next, a third adhesive is applied to an actuator base, a base electrode is placed on the third adhesive, and the third adhesive is semi-cured in the same manner as above. A fourth adhesive is applied to the base electrode, the piezoelectric element is placed on the fourth adhesive, and the fourth adhesive is semi-cured in the same manner as above. Finally, the adhered laminate thus obtained is placed into a heating furnace and heated at a predetermined temperature for a predetermined period of time to thereby fully cure the adhesives.
摘要翻译：在制造微致动器的方法中，将第一粘合剂施加到可动板上，并且可移动的电极和可动电极被放置在第一粘合剂上。将第二粘合剂施加到可动电极上，并将压电元件放置在第二粘合剂上。接下来，将第三粘合剂施加到致动器基座，将基极放置在第三粘合剂上，并且以与上述相同的方式将第三粘合剂半固化。将第四粘合剂施加到基底电极上，将压电元件放置在第四粘合剂上，并且以与上述相同的方式将第四粘合剂半固化。最后，将如此得到的粘合层叠体放入加热炉中并在预定温度下加热预定的时间，从而使粘合剂完全固化。

9. 发明授权

US06903876B2 Display 有权
标题翻译：显示
公开(公告)号：US06903876B2
公开(公告)日：2005-06-07
申请号：US10309575
申请日：2002-12-04
申请人： Toru Okada , Masanao Fujii , Seiichi Shimoura , Shingo Yamaguchi , Haruyasu Watanabe
发明人： Toru Okada , Masanao Fujii , Seiichi Shimoura , Shingo Yamaguchi , Haruyasu Watanabe
IPC分类号： G02B17/08 , G02B27/01 , G02B27/02 , H04N5/64 , G02B27/14
CPC分类号： G02B27/0172 , G02B2027/0178
摘要： A body has a configuration in which a first ellipse has a first and second focal points and a second ellipse having a third and fourth points are arranged such that the second and third focal points coincide. This body is equivalent to an optical system having an optical path in which light gathered to the first focal point passes through the first focal point, and is reflected by a first concave reflecting surface, being a part of the first ellipse, to go through the second focal point, and then reflected by a second concave reflecting surface, being a part of the second ellipse, to be gathered to the fourth focal point.
摘要翻译：主体具有其中第一椭圆具有第一和第二焦点的构造，并且具有第三和第四点的第二椭圆被布置成使得第二和第三焦点重合。本体等效于具有聚光到第一焦点的光通过第一焦点的光路的光学系统，并且被作为第一椭圆的一部分的第一凹面反射面反射，穿过第一椭圆第二焦点，然后被作为第二椭圆的一部分的第二凹面反射面反射，聚集到第四焦点。

10. 发明授权

US06653761B2 Micro-actuator and method of producing the same 失效
公开(公告)号：US06653761B2
公开(公告)日：2003-11-25
申请号：US09822621
申请日：2001-03-30
申请人： Masanao Fujii , Toru Okada , Masayuki Kitajima , Hidehiko Kobayashi , Seiichi Shimoura
发明人： Masanao Fujii , Toru Okada , Masayuki Kitajima , Hidehiko Kobayashi , Seiichi Shimoura
IPC分类号： H01L4108
CPC分类号： G11B5/5552 , H01L41/0993 , H01L41/313 , Y10T29/42 , Y10T29/49005 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913
摘要： In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable electrode is placed on the first adhesive. The movable plate and the movable electrode are clamped between a first stage and a first head, followed by heating for a first predetermined period of time while exerting a first predetermined press load onto the first head to semi-cure the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the second adhesive. The movable plate, the movable electrode and the piezoelectric element are clamped between the first stage and a second head, followed by heating for a second predetermined period of time while exerting a second predetermined press load onto the second head to semi-cure the second adhesive. Next, a third adhesive is applied to an actuator base, a base electrode is placed on the third adhesive, and the third adhesive is semi-cured in the same manner as above. A fourth adhesive is applied to the base electrode, the piezoelectric element is placed on the fourth adhesive, and the fourth adhesive is semi-cured in the same manner as above. Finally, the adhered laminate thus obtained is placed into a heating furnace and heated at a predetermined temperature for a predetermined period of time to thereby fully cure the adhesives.

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