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1. 发明申请

US20080101746A1 OPTICAL MODULE 有权
标题翻译：光学模块
公开(公告)号：US20080101746A1
公开(公告)日：2008-05-01
申请号：US11553743
申请日：2006-10-27
申请人： Toru Okada , Masanao Fujii , Yutaka Noda
发明人： Toru Okada , Masanao Fujii , Yutaka Noda
IPC分类号： G02B6/12
CPC分类号： G03B17/00 , H05K3/303 , H05K2201/0305 , H05K2201/09781 , H05K2201/10121 , H05K2201/10727 , H05K2203/0182 , Y02P70/613
摘要： An optical module has a substrate having a substrate surface provided with terminal pads and landing pads, and an optical element package having terminals and mounted on the substrate surface with a gap formed therebetween. The gap between the optical element package and the substrate surface is determined by the landing pads when the optical element package is mounted on the substrate surface. The terminal pads and the landing pads are exposed in a state where the optical element package is mounted on the substrate surface, and the terminal pads are electrically connected to corresponding terminals by solder.
摘要翻译：光学模块具有具有设置有端子焊盘和着陆焊盘的基板表面的基板，以及具有端子的光学元件封装，并且安装在基板表面上，其间形成有间隙。当光学元件封装安装在基板表面上时，光学元件封装和基板表面之间的间隙由着陆焊盘确定。端子焊盘和着陆焊盘在光学元件封装安装在基板表面上的状态下露出，并且端子焊盘通过焊料电连接到相应的端子。

2. 发明授权

US06744183B2 Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method 失效
标题翻译：压电元件与电极的接合方法以及使用该接合方法的压电微型致动器
公开(公告)号：US06744183B2
公开(公告)日：2004-06-01
申请号：US10347708
申请日：2003-01-21
申请人： Masayuki Kitajima , Yutaka Noda , Seiichi Shimoura , Toru Okada , Masanao Fujii , Kenji Iketaki , Hidehiko Kobayashi , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka
发明人： Masayuki Kitajima , Yutaka Noda , Seiichi Shimoura , Toru Okada , Masanao Fujii , Kenji Iketaki , Hidehiko Kobayashi , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka
IPC分类号： H01L41047
CPC分类号： H01L41/29 , G11B5/5552 , G11B5/5556 , H01L41/0993 , H01L2224/48091 , H01L2224/73265 , H01L2924/01327 , Y10T29/42 , H01L2924/00014 , H01L2924/00
摘要： A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.
摘要翻译：一种键合压电元件和电极的方法，包括以下步骤：在压电元件的接合表面上形成选自Au，Al，Zn，Cu和Sn的材料的第一涂层，并形成在电极的接合表面上第二次涂覆选自Au，Al，Zn，Cu和Sn的材料。第一和第二涂层的材料的组合优选为Au / Au，Au / Al，Zn / Cu或Sn / Cu。该方法还包括使第一和第二涂层彼此紧密接触并在压力下加热它们以在第一和第二涂层之间形成金属键或金属间化合物，从而结合压电元件和电极的步骤。

3. 发明授权

US07717317B2 Ball capturing apparatus, solder ball disposing apparatus, ball capturing method, and solder ball disposing method 有权
标题翻译：球捕获装置，焊球配置装置，球捕获方法和焊球配置方法
公开(公告)号：US07717317B2
公开(公告)日：2010-05-18
申请号：US11864600
申请日：2007-09-28
申请人： Masanao Fujii , Toru Okada , Yutaka Noda , Ryoji Matsuyama , Hidehiko Kobayashi , Hisao Tanaka
发明人： Masanao Fujii , Toru Okada , Yutaka Noda , Ryoji Matsuyama , Hidehiko Kobayashi , Hisao Tanaka
IPC分类号： B23K31/02 , B23K37/00
CPC分类号： H01L21/4853 , B23K3/0623 , H01L2224/11334 , H05K3/3478 , H05K2203/0195 , H05K2203/041 , H05K2203/081 , H05K2203/082
摘要： The present invention relates to a ball capturing apparatus and method of capturing one ball from plural balls having the same size, and to a solder ball disposing apparatus and method of disposing a solder ball containing solder in a predetermined position on a circuit board, thereby reliably capturing one ball from the plural balls having the same size. The apparatus includes: a holding member 111 including a holding wall 111a air-tightly closing a space S that holds a plurality of balls B having the same size and in which a hole 1111 larger than a size of one ball and smaller than a size of two balls is formed in an upper part of the holding wall; blowup means 112 for blowing the balls B held in the holding member 111 upward; and capturing means 12 for capturing a ball B blown up by the blowup means 112 and reached the hole.
摘要翻译：本发明涉及一种从具有相同尺寸的多个球捕获一个球的球捕获装置和方法，以及一种焊球设置装置和将含有焊料的焊球放置在电路板上的预定位置的方法，从而可靠地从具有相同尺寸的多个球捕获一个球。该装置包括：保持构件111，其包括保持壁111a，气密地封闭保持具有相同尺寸的多个球B的空间S，并且其中具有比一个球的尺寸大的孔1111，并且小于在保持壁的上部形成有两个球; 用于将保持在保持构件111中的球B向上吹的吹出装置112; 以及捕获装置12，用于捕获由喷射装置112吹起的球B并到达该孔。

4. 发明授权

US07824111B2 Optical module 有权
标题翻译：光模块
公开(公告)号：US07824111B2
公开(公告)日：2010-11-02
申请号：US11553743
申请日：2006-10-27
申请人： Toru Okada , Masanao Fujii , Yutaka Noda
发明人： Toru Okada , Masanao Fujii , Yutaka Noda
IPC分类号： G02B6/42 , H04B10/14 , H01S5/022
CPC分类号： G03B17/00 , H05K3/303 , H05K2201/0305 , H05K2201/09781 , H05K2201/10121 , H05K2201/10727 , H05K2203/0182 , Y02P70/613
摘要： An optical module has a substrate having a substrate surface provided with terminal pads and landing pads, and an optical element package having terminals and mounted on the substrate surface with a gap formed therebetween. The gap between the optical element package and the substrate surface is determined by the landing pads when the optical element package is mounted on the substrate surface. The terminal pads and the landing pads are exposed in a state where the optical element package is mounted on the substrate surface, and the terminal pads are electrically connected to corresponding terminals by solder.
摘要翻译：光学模块具有具有设置有端子焊盘和着陆焊盘的基板表面的基板，以及具有端子的光学元件封装，并且安装在基板表面上，其间形成有间隙。当光学元件封装安装在基板表面上时，光学元件封装和基板表面之间的间隙由着陆焊盘确定。端子焊盘和着陆焊盘在光学元件封装安装在基板表面上的状态下露出，并且端子焊盘通过焊料电连接到相应的端子。

5. 发明申请

US20060169750A1 Soldering method and apparatus 审中-公开
标题翻译：焊接方法和装置
公开(公告)号：US20060169750A1
公开(公告)日：2006-08-03
申请号：US11139789
申请日：2005-05-31
申请人： Hisao Tanaka , Masanao Fujii , Toru Okada , Susumu Iida , Hirokazu Yamanishi , Yutaka Noda
发明人： Hisao Tanaka , Masanao Fujii , Toru Okada , Susumu Iida , Hirokazu Yamanishi , Yutaka Noda
IPC分类号： B23K1/005
CPC分类号： H05K3/3478 , B23K1/206 , B23K3/0623 , H05K3/3442 , H05K2201/0382 , H05K2201/10727 , H05K2203/0195 , H05K2203/041 , H05K2203/0465 , Y02P70/613
摘要： There are provided a solder ball deforming step of mechanically deforming a ball to break an oxide film of a surface thereof and to expose a nonoxide surface and a solder melting step of heating and melting the deformed solder ball through energy irradiation in a state where the deformed solder ball is mounted on joint units of a loaded work. The solder ball deforming step mechanically deforms the solder ball to form at least two orthogonal contact surfaces in contact with the joint surfaces of the joint units.
摘要翻译：提供了一种使球体机械变形以破坏其表面的氧化膜并且暴露非氧化物表面的焊球变形步骤和通过能量照射在变形的状态下加热和熔化变形的焊球的焊料熔化步骤焊球安装在负载工作的接头单元上。焊球变形步骤使焊锡球机械地变形以形成与接头单元的接合表面接触的至少两个正交的接触表面。

6. 发明授权

US06541898B2 Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method 失效
公开(公告)号：US06541898B2
公开(公告)日：2003-04-01
申请号：US09822636
申请日：2001-03-30
申请人： Masayuki Kitajima , Yutaka Noda , Seiichi Shimoura , Toru Okada , Masanao Fujii , Kenji Iketaki , Hidehiko Kobayashi , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka
发明人： Masayuki Kitajima , Yutaka Noda , Seiichi Shimoura , Toru Okada , Masanao Fujii , Kenji Iketaki , Hidehiko Kobayashi , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka
IPC分类号： H01L41047
CPC分类号： H01L41/29 , G11B5/5552 , G11B5/5556 , H01L41/0993 , H01L2224/48091 , H01L2224/73265 , H01L2924/01327 , Y10T29/42 , H01L2924/00014 , H01L2924/00
摘要： A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.

7. 发明授权

US07691662B2 Optical module producing method and apparatus 有权
标题翻译：光模块的制造方法和装置
公开(公告)号：US07691662B2
公开(公告)日：2010-04-06
申请号：US11703699
申请日：2007-02-08
申请人： Toru Okada , Masanao Fujii , Yutaka Noda
发明人： Toru Okada , Masanao Fujii , Yutaka Noda
IPC分类号： H01L21/00
CPC分类号： H05K3/303 , H01L27/14643 , H01L27/14683 , H01L27/148 , H01L31/0203 , H05K3/3494 , H05K2201/09781 , H05K2201/10121 , H05K2201/10727 , H05K2203/0195 , H05K2203/082 , H05K2203/111 , Y02P70/613
摘要： An optical module is produced by coating, with respect to a substrate having a substrate surface provided with terminal pads and landing pads a solder material on the terminal pads, mounting an optical element package having terminals and a flat top surface on the substrate using the landing pads so that the top surface becomes approximately parallel to the substrate surface and a gap is formed between a bottom surface of the optical element package and the substrate surface, preheating the terminal pads simultaneously as the mounting, and electrically connecting the terminal pads to corresponding terminals of the optical element package by melting the solder material and thereafter hardening the solder material.
摘要翻译：通过涂覆相对于具有设置有端子焊盘和着陆焊盘的衬底的衬底的衬底，通过涂覆在端子焊盘上的焊料材料，使用着陆层将具有端子的光学元件封装和平坦顶表面安装在衬底上来制造光学模块衬垫，使得顶表面变得大致平行于衬底表面，并且在光学元件封装的底表面和衬底表面之间形成间隙，同时预热端子焊盘作为安装，并且将端子焊盘电连接到相应的端子通过熔化焊料材料，然后硬化焊料材料。

8. 发明申请

US20080102544A1 Optical module producing method and apparatus 有权
标题翻译：光模块的制造方法和装置
公开(公告)号：US20080102544A1
公开(公告)日：2008-05-01
申请号：US11703699
申请日：2007-02-08
申请人： Toru Okada , Masanao Fujii , Yutaka Noda
发明人： Toru Okada , Masanao Fujii , Yutaka Noda
IPC分类号： H01L21/00
CPC分类号： H05K3/303 , H01L27/14643 , H01L27/14683 , H01L27/148 , H01L31/0203 , H05K3/3494 , H05K2201/09781 , H05K2201/10121 , H05K2201/10727 , H05K2203/0195 , H05K2203/082 , H05K2203/111 , Y02P70/613
摘要： An optical module is produced by coating, with respect to a substrate having a substrate surface provided with terminal pads and landing pads a solder material on the terminal pads, mounting an optical element package having terminals and a flat top surface on the substrate using the landing pads so that the top surface becomes approximately parallel to the substrate surface and a gap is formed between a bottom surface of the optical element package and the substrate surface, preheating the terminal pads simultaneously as the mounting, and electrically connecting the terminal pads to corresponding terminals of the optical element package by melting the solder material and thereafter hardening the solder material.
摘要翻译：通过涂覆相对于具有设置有端子焊盘和着陆焊盘的衬底的衬底的衬底，通过涂覆在端子焊盘上的焊料材料，使用着陆层将具有端子的光学元件封装和平坦顶表面安装在衬底上来制造光学模块衬垫，使得顶表面变得大致平行于衬底表面，并且在光学元件封装的底表面和衬底表面之间形成间隙，同时预热端子焊盘作为安装，并将端子焊盘电连接到相应的端子通过熔化焊料材料，然后硬化焊料材料。

9. 发明授权

US06467141B2 Method of assembling micro-actuator 失效
标题翻译：组合微致动器的方法
公开(公告)号：US06467141B2
公开(公告)日：2002-10-22
申请号：US09820553
申请日：2001-03-29
申请人： Toru Okada , Kenji Iketaki , Hidehiko Kobayashi , Yutaka Noda , Masayuki Kitajima , Seiichi Shimoura , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka , Masanao Fujii
发明人： Toru Okada , Kenji Iketaki , Hidehiko Kobayashi , Yutaka Noda , Masayuki Kitajima , Seiichi Shimoura , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka , Masanao Fujii
IPC分类号： H04R1710
CPC分类号： G11B5/5552 , H01L41/313 , Y10T29/42 , Y10T29/49025 , Y10T29/49055
摘要： A method of assembling a micro-actuator is provided in which a base frame having a plurality of actuator bases is placed on a stage, a first adhesive is applied to each of the actuator bases, and a base electrode frame having a plurality of base electrodes is placed on the first adhesive. The first adhesive is semi-cured by heating and pressing. A second adhesive is applied to each of the base electrodes, and a plurality of piezoelectric elements are placed on the second adhesive. The second adhesive is semi-cured by heating and pressing. A third adhesive is,applied to the piezoelectric elements, and a movable electrode frame having a plurality of movable electrodes is placed on the third adhesive. The third adhesive is semi-cured by heating and pressing. Next, a fourth adhesive is applied to each of the movable electrodes, and a hinge plate frame having a plurality of hinge plates is placed on the fourth adhesive. The fourth adhesive is semi-cured by heating and pressing. Finally, the adhered laminate thus obtained is placed in a heating furnace, and is heated at a predetermined temperature for a predetermined period of time, whereby each of the adhesives is fully cured.
摘要翻译：提供了一种组装微致动器的方法，其中具有多个致动器基座的基架被放置在台架上，第一粘合剂被施加到每个致动器基座，以及具有多个基极的基极框架被放置在第一粘合剂上。第一粘合剂通过加热和压制半固化。将第二粘合剂施加到每个基底电极上，并且将多个压电元件放置在第二粘合剂上。第二粘合剂通过加热和压制半固化。将第三粘合剂施加到压电元件，并且具有多个可移动电极的可动电极框架放置在第三粘合剂上。第三粘合剂通过加热和压制半固化。接下来，将第四粘合剂施加到每个可移动电极，并且具有多个铰链板的铰链板框架放置在第四粘合剂上。第四粘合剂通过加热和加压半固化。最后，将如此获得的粘合层压材料放置在加热炉中，并在预定温度下加热预定的时间，从而使各种粘合剂完全固化。

10. 发明授权

US07963434B2 Micro component removing method 有权
标题翻译：微成分去除法
公开(公告)号：US07963434B2
公开(公告)日：2011-06-21
申请号：US12774881
申请日：2010-05-06
申请人： Keiichi Yamamoto , Masakazu Takesue , Masanao Fujii , Toru Okada
发明人： Keiichi Yamamoto , Masakazu Takesue , Masanao Fujii , Toru Okada
IPC分类号： B23K1/018
CPC分类号： H05K3/303 , H05K3/3494 , H05K13/0486 , H05K2203/0195 , H05K2203/176 , Y02P70/613
摘要： A method and an apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive (15) is provided on the surface (12a) of a micro component (12) opposite to the side of a substrate (11), and the distal end of a component holding pin (13) having cross-section area falling within the surface (12a) of the micro component (12) opposite to the side of the surface (11) is passed through the thermosetting adhesive (15) to abut against the surface (12a) of the micro component (12). Subsequently, solder (16) between the micro component (12) and the substrate (11) is heated to melt and the component holding pin (13) is moved in the direction receding from the substrate (11). Consequently, the micro component (12) is removed from the substrate (11).
摘要翻译：一种用于清除微量部件并且保持在基板上的焊料平整化的方法和装置，而不会对焊接区，基板和外围部件造成热损伤。在与基板（11）侧相对的微型部件（12）的表面（12a）上设置有热固性粘合剂（15），并且部件保持销（13）的前端具有截面积下降在微组件（12）的与表面（11）侧相反的表面（12a）内通过热固性粘合剂（15）以抵靠微组件（12）的表面（12a）。随后，加热微型部件（12）和基板（11）之间的焊料（16）熔化，使部件保持销（13）从基板（11）退出的方向移动。因此，从基板（11）移除微型部件（12）。

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