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1. 发明授权

US07963434B2 Micro component removing method 有权
标题翻译：微成分去除法
公开(公告)号：US07963434B2
公开(公告)日：2011-06-21
申请号：US12774881
申请日：2010-05-06
申请人： Keiichi Yamamoto , Masakazu Takesue , Masanao Fujii , Toru Okada
发明人： Keiichi Yamamoto , Masakazu Takesue , Masanao Fujii , Toru Okada
IPC分类号： B23K1/018
CPC分类号： H05K3/303 , H05K3/3494 , H05K13/0486 , H05K2203/0195 , H05K2203/176 , Y02P70/613
摘要： A method and an apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive (15) is provided on the surface (12a) of a micro component (12) opposite to the side of a substrate (11), and the distal end of a component holding pin (13) having cross-section area falling within the surface (12a) of the micro component (12) opposite to the side of the surface (11) is passed through the thermosetting adhesive (15) to abut against the surface (12a) of the micro component (12). Subsequently, solder (16) between the micro component (12) and the substrate (11) is heated to melt and the component holding pin (13) is moved in the direction receding from the substrate (11). Consequently, the micro component (12) is removed from the substrate (11).
摘要翻译：一种用于清除微量部件并且保持在基板上的焊料平整化的方法和装置，而不会对焊接区，基板和外围部件造成热损伤。在与基板（11）侧相对的微型部件（12）的表面（12a）上设置有热固性粘合剂（15），并且部件保持销（13）的前端具有截面积下降在微组件（12）的与表面（11）侧相反的表面（12a）内通过热固性粘合剂（15）以抵靠微组件（12）的表面（12a）。随后，加热微型部件（12）和基板（11）之间的焊料（16）熔化，使部件保持销（13）从基板（11）退出的方向移动。因此，从基板（11）移除微型部件（12）。

2. 发明申请

US20100101848A1 SUBSTRATE UNIT, INFORMATION PROCESSOR AND METHOD OF MANUFACTURING SUBSTRATE UNIT 审中-公开
标题翻译：基板单元，信息处理器及制造基板单元的方法
公开(公告)号：US20100101848A1
公开(公告)日：2010-04-29
申请号：US12499327
申请日：2009-07-08
申请人： Yoshinobu Maeno , Keiichi Yamamoto , Masakazu Takesue
发明人： Yoshinobu Maeno , Keiichi Yamamoto , Masakazu Takesue
IPC分类号： H05K1/18 , H05K3/30
CPC分类号： H05K1/0271 , H05K1/181 , H05K2201/09909 , H05K2201/10734 , H05K2201/2009 , H05K2203/1476 , Y10T29/4913
摘要： A substrate unit includes an electronic component having a plurality of electrodes arranged in a given shape, a circuit substrate having a first face where the electronic component is mounted and the electrodes are jointed and a second face underside of the first face, and a resin-coated portion formed on the second face according to a projected area of the second face to which the given shape is projected.
摘要翻译：基板单元包括具有以给定形状布置的多个电极的电子部件，具有安装电子部件的第一面和电极接合的第一面和第一面的第二面下侧的电路基板，根据给定形状投影的第二面的投影面积，形成在第二面上的涂布部分。

3. 发明授权

US06184475B2 Lead-free solder composition with Bi, In and Sn 失效
标题翻译：具有Bi，In和Sn的无铅焊料组成
公开(公告)号：US06184475B2
公开(公告)日：2001-02-06
申请号：US08526929
申请日：1995-09-12
申请人： Masayuki Kitajima , Masakazu Takesue , Yasuo Moriya , Yoshinori Nemoto , Yumiko Fukushima
发明人： Masayuki Kitajima , Masakazu Takesue , Yasuo Moriya , Yoshinori Nemoto , Yumiko Fukushima
IPC分类号： A05K116
CPC分类号： B23K35/025 , B23K35/262 , B23K35/264 , B23K35/3613 , B23K35/3615 , B23K35/3616 , B23K35/3618 , H05K3/3463
摘要： A lead-free solder alloy composition contains Sn, Bi and In, with respective contents such that the solder alloy composition provides a liquidus temperature below the heat resistant temperature of a work to be soldered. The alloy contains not more than about 60 wt % Bi; not more than about 50 wt % In; optionally at least one element selected from Ag, Zn, Ge, Ga, Sb, and P; and Sn. Also, lead-free solder powders containing same, and printed circuit boards, electronic components and electronic apparati employing such alloy.
摘要翻译：无铅焊料合金组合物含有Sn，Bi和In，各自的含量使得焊料合金组合物的液相线温度低于要焊接的工件的耐热温度。该合金含有不超过约60重量％的Bi; 不超过约50重量％的In; 可选地，选自Ag，Zn，Ge，Ga，Sb和P中的至少一种元素; 和Sn。另外，含有这种合金的无铅焊料粉末，以及印刷电路板，电子元件和使用这种合金的电子设备。

4. 发明申请

US20100213248A1 MICRO COMPONENT REMOVING METHOD 有权
标题翻译：微元件拆卸方法
公开(公告)号：US20100213248A1
公开(公告)日：2010-08-26
申请号：US12774881
申请日：2010-05-06
申请人： Keiichi YAMAMOTO , Masakazu TAKESUE , Masanao FUJII , Toru OKADA
发明人： Keiichi YAMAMOTO , Masakazu TAKESUE , Masanao FUJII , Toru OKADA
IPC分类号： B23K1/018
CPC分类号： H05K3/303 , H05K3/3494 , H05K13/0486 , H05K2203/0195 , H05K2203/176 , Y02P70/613
摘要： A method and an apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive (15) is provided on the surface (12a) of a micro component (12) opposite to the side of a substrate (11), and the distal end of a component holding pin (13) having cross-section area falling within the surface (12a) of the micro component (12) opposite to the side of the surface (11) is passed through the thermosetting adhesive (15) to abut against the surface (12a) of the micro component (12). Subsequently, solder (16) between the micro component (12) and the substrate (11) is heated to melt and the component holding pin (13) is moved in the direction receding from the substrate (11). Consequently, the micro component (12) is removed from the substrate (11).
摘要翻译：一种用于清除微量部件并且保持在基板上的焊料平整化的方法和装置，而不会对焊接区，基板和外围部件造成热损伤。在与基板（11）侧相对的微型部件（12）的表面（12a）上设置有热固性粘合剂（15），并且部件保持销（13）的前端具有截面积下降在微组件（12）的与表面（11）侧相反的表面（12a）内通过热固性粘合剂（15）以抵靠微组件（12）的表面（12a）。随后，加热微型部件（12）和基板（11）之间的焊料（16）熔化，使部件保持销（13）从基板（11）退出的方向移动。因此，从基板（11）移除微型部件（12）。

5. 发明授权

US06893512B2 Solder alloy and soldered bond 有权
标题翻译：焊接合金和焊接焊接
公开(公告)号：US06893512B2
公开(公告)日：2005-05-17
申请号：US10356546
申请日：2003-02-03
申请人： Masayuki Kitajima , Tadaaki Shono , Masakazu Takesue , Yutaka Noda
发明人： Masayuki Kitajima , Tadaaki Shono , Masakazu Takesue , Yutaka Noda
IPC分类号： B23K35/02 , B23K35/26 , C22C13/00 , H05K3/34
CPC分类号： B23K35/262 , B23K35/025 , B23K2101/36 , H05K3/3463
摘要： A solder alloy having a solderability comparable to that of a conventional Pb—Sn solder alloy without having a detrimental effect on the environment and a soldered bond using the same. A solder alloy consisting of Zn: 4.0-10.0 wt %, In: 1.0 to 15.0 wt %, Al: 0.0020 to 0.0100 wt %, and the balance of Sn and unavoidable impurities. A soldered bond of an electric or electronic device composed of the above solder alloy.
摘要翻译：具有与常规Pb-Sn焊料合金相当的可焊性的焊料合金，而不会对环境产生不利影响，并且使用焊料合金。由Zn：4.0〜10.0重量％，In：1.0〜15.0重量％，Al：0.0020〜0.0100重量％，Sn和不可避免的杂质构成的焊料合金。由上述焊料合金构成的电气或电子设备的焊接结合体。

6. 发明授权

US06521176B2 Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy 失效
标题翻译：无铅焊料合金和使用这种无铅焊料合金的电气和电子设备的制造过程
公开(公告)号：US06521176B2
公开(公告)日：2003-02-18
申请号：US09728120
申请日：2000-12-04
申请人： Masayuki Kitajima , Masakazu Takesue , Yasuo Moriya , Yoshinori Nemoto , Yumiko Fukushima
发明人： Masayuki Kitajima , Masakazu Takesue , Yasuo Moriya , Yoshinori Nemoto , Yumiko Fukushima
IPC分类号： C22C1302
CPC分类号： B23K35/025 , B23K35/262 , B23K35/264 , B23K35/3613 , B23K35/3615 , B23K35/3616 , B23K35/3618 , H05K3/3463
摘要： A lead-free solder alloy composition containing Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.
摘要翻译：含有Sn，Ag和Bi的无铅焊料合金组合物，各自的浓度设定为使得无铅焊料合金的熔融温度低于要焊接的工件的预定耐热温度。

7. 发明授权

US06361626B1 Solder alloy and soldered bond 有权
标题翻译：焊接合金和焊接焊接
公开(公告)号：US06361626B1
公开(公告)日：2002-03-26
申请号：US09839371
申请日：2001-04-23
申请人： Masayuki Kitajima , Hitoshi Homma , Masakazu Takesue , Tadaaki Shono , Yutaka Noda
发明人： Masayuki Kitajima , Hitoshi Homma , Masakazu Takesue , Tadaaki Shono , Yutaka Noda
IPC分类号： C22C1300
CPC分类号： C22C13/00 , B23K35/262 , C22C13/02
摘要： A Pb-free solder alloy and a soldered bond using the same, in which the solder alloy has no harmful environmental effect but has a solderability comparable to that of the conventional Pb—Sn solder alloy. The solder alloy of the present invention either consists of Zn: 3.0-14.0 wt %, Al: 0.0020-0.0080 wt %, and the balance of Sn and unavoidable impurities or consists of Zn: 3.0-14.0 wt %, Bi: 3.0-6.0 wt %, Al: 0.0020-0.0100 wt %, and the balance of Sn and unavoidable impurities. The soldered bond of the present invention consists of either of the present inventive solder alloys.
摘要翻译：无铅焊料合金和使用其的焊接焊料，其中焊料合金没有有害的环境效应，但具有与常规Pb-Sn焊料合金相当的可焊性。本发明的焊料合金由Zn：3.0〜14.0重量％，Al：0.0020〜0.0080重量％，余量由Sn和不可避免的杂质构成，Zn：3.0〜14.0重量％，Bi：3.0-6.0 wt％，Al：0.0020-0.0100wt％，余量为Sn和不可避免的杂质。本发明的焊接键由本发明的焊料合金中的任一种组成。

8. 发明授权

US06344690B1 Semiconductor device with gold bumps, and method and apparatus of producing the same 失效
标题翻译：具有金凸块的半导体装置及其制造方法和装置
公开(公告)号：US06344690B1
公开(公告)日：2002-02-05
申请号：US09691142
申请日：2000-10-19
申请人： Masayuki Kitajima , Masakazu Takesue , Yoshitaka Muraoka
发明人： Masayuki Kitajima , Masakazu Takesue , Yoshitaka Muraoka
IPC分类号： H01L2348
CPC分类号： H01L24/13 , B23K1/0016 , B23K35/26 , B23K35/262 , B23K35/3013 , B23K2101/36 , H01L21/6835 , H01L24/11 , H01L24/16 , H01L24/742 , H01L24/81 , H01L2224/0401 , H01L2224/05124 , H01L2224/0558 , H01L2224/056 , H01L2224/05624 , H01L2224/05644 , H01L2224/11003 , H01L2224/11334 , H01L2224/11822 , H01L2224/1184 , H01L2224/11901 , H01L2224/1308 , H01L2224/13083 , H01L2224/131 , H01L2224/13144 , H01L2224/13147 , H01L2224/1358 , H01L2224/13582 , H01L2224/136 , H01L2224/13605 , H01L2224/13609 , H01L2224/13613 , H01L2224/13618 , H01L2224/13655 , H01L2224/13671 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/742 , H01L2224/75 , H01L2224/7501 , H01L2224/7515 , H01L2224/7565 , H01L2224/75745 , H01L2224/81011 , H01L2224/81801 , H01L2224/83192 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H05K3/3436 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2224/29099
摘要： A semiconductor device comprises a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements connected together.
摘要翻译：半导体器件包括具有电极的半导体元件和附接到电极的金属凸块。金属凸块包括铜芯和覆盖芯的金表面层。此外，金属凸块可以包括连接在一起的金突起元件和焊料凸块元件。

9. 发明申请

US20110141705A1 PRINTED WIRING BOARD AND ELECTRONIC APPARATUS 审中-公开
标题翻译：印刷线路板和电子设备
公开(公告)号：US20110141705A1
公开(公告)日：2011-06-16
申请号：US12961650
申请日：2010-12-07
申请人： Masakazu TAKESUE , Keiichi YAMAMOTO
发明人： Masakazu TAKESUE , Keiichi YAMAMOTO
IPC分类号： H05K5/00 , H05K1/11
CPC分类号： G06F1/183 , G06F1/1658 , H01L2224/16227 , H01L2924/15153 , H05K1/111 , H05K1/183 , H05K3/3436 , H05K2201/09709 , Y02P70/611
摘要： A printed wiring board supports an electronic component thereon. The printed wiring board includes an opening which is recessed from a surface of the printed wiring board. The opening has a dimension which houses the electronic component therein. A plurality of pads is disposed on a bottom surface of the opening. The plurality of pads has a skew arrangement in a grid pattern with respect to inner edges of the opening.
摘要翻译：印刷电路板在其上支撑电子部件。印刷布线板包括从印刷线路板的表面凹陷的开口。开口具有容纳电子部件的尺寸。多个垫片设置在开口的底表面上。多个焊盘相对于开口的内边缘具有格栅图案的偏斜布置。

10. 发明授权

US07753251B2 Micro component removing apparatus 有权
标题翻译：微元件去除装置
公开(公告)号：US07753251B2
公开(公告)日：2010-07-13
申请号：US11966410
申请日：2007-12-28
申请人： Keiichi Yamamoto , Masakazu Takesue , Masanao Fujii , Toru Okada
发明人： Keiichi Yamamoto , Masakazu Takesue , Masanao Fujii , Toru Okada
IPC分类号： B23K37/00
CPC分类号： H05K3/303 , H05K3/3494 , H05K13/0486 , H05K2203/0195 , H05K2203/176 , Y02P70/613
摘要： A method and a apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive (15) is provided on the surface (12a) of a micro component (12) opposite to the side of a substrate (11), and the distal end of a component holding pin (13) having cross-section area falling within the surface (12a) of the micro component (12) opposite to the side of the surface (11) is passed through the thermosetting adhesive (15) to abut against the surface (12a) of the micro component (12). Subsequently, solder (16) between the micro component (12) and the substrate (11) is heated to melt and the component holding pin (13) is moved in the direction receding from the substrate (11). Consequently, the micro component (12) is removed from the substrate (11).
摘要翻译：一种用于清除微量部件并且保持在衬底上的焊料平整化的方法和装置，而不会对焊盘，衬底和周边部件造成热损伤。在与基板（11）侧相对的微型部件（12）的表面（12a）上设置有热固性粘合剂（15），并且部件保持销（13）的前端具有截面积下降在微组件（12）的与表面（11）侧相反的表面（12a）内通过热固性粘合剂（15）以抵靠微组件（12）的表面（12a）。随后，加热微型部件（12）和基板（11）之间的焊料（16）熔化，使部件保持销（13）从基板（11）退出的方向移动。因此，从基板（11）移除微型部件（12）。

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