会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明申请
    • SEMICONDUCTOR FILM, METHOD FOR MANUFACTURING THE SAME, AND POWER STORAGE DEVICE
    • 半导体膜,其制造方法和电力存储装置
    • US20120135302A1
    • 2012-05-31
    • US13301020
    • 2011-11-21
    • Tomokazu YokoiTakayuki InoueMakoto Furuno
    • Tomokazu YokoiTakayuki InoueMakoto Furuno
    • H01M4/13H01L21/28H01M4/02H01L29/02
    • H01L29/12H01M4/0428H01M4/134H01M4/366H01M4/386
    • Provided are a semiconductor film including silicon microstructures formed at high density, and a manufacturing method thereof. Further, provided are a semiconductor film including silicon microstructures whose density is controlled, and a manufacturing method thereof Furthermore, a power storage device with improved charge-discharge capacity is provided. A manufacturing method in which a semiconductor film with a silicon layer including silicon structures is formed over a substrate with a metal surface is used. The thickness of a silicide layer formed by reaction between the metal and the silicon is controlled, so that the grain sizes of silicide grains formed at an interface between the silicide layer and the silicon layer are controlled and the shapes of the silicon structures are controlled. Such a semiconductor film can be applied to an electrode of a power storage device.
    • 提供了包括以高密度形成的硅微结构的半导体膜及其制造方法。 此外,提供了包括其密度被控制的硅微结构的半导体膜及其制造方法。此外,提供了具有改善的充放电容量的蓄电装置。 使用其中在具有金属表面的基板上形成具有包括硅结构的硅层的半导体膜的制造方法。 控制由金属与硅之间的反应形成的硅化物层的厚度,从而控制在硅化物层和硅层之间的界面处形成的硅化物晶粒的晶粒尺寸,并且控制硅结构的形状。 这样的半导体膜可以应用于蓄电装置的电极。
    • 2. 发明授权
    • Semiconductor film, method for manufacturing the same, and power storage device
    • 半导体膜及其制造方法以及蓄电装置
    • US08455044B2
    • 2013-06-04
    • US13301020
    • 2011-11-21
    • Tomokazu YokoiTakayuki InoueMakoto Furuno
    • Tomokazu YokoiTakayuki InoueMakoto Furuno
    • B05D5/12
    • H01L29/12H01M4/0428H01M4/134H01M4/366H01M4/386
    • Provided are a semiconductor film including silicon microstructures formed at high density, and a manufacturing method thereof. Further, provided are a semiconductor film including silicon microstructures whose density is controlled, and a manufacturing method thereof. Furthermore, a power storage device with improved charge-discharge capacity is provided. A manufacturing method in which a semiconductor film with a silicon layer including silicon structures is formed over a substrate with a metal surface is used. The thickness of a silicide layer formed by reaction between the metal and the silicon is controlled, so that the grain sizes of silicide grains formed at an interface between the silicide layer and the silicon layer are controlled and the shapes of the silicon structures are controlled. Such a semiconductor film can be applied to an electrode of a power storage device.
    • 提供了包括以高密度形成的硅微结构的半导体膜及其制造方法。 此外,提供了包括其密度被控制的硅微结构的半导体膜及其制造方法。 此外,提供了具有改善的充放电容量的蓄电装置。 使用其中在具有金属表面的基板上形成具有包括硅结构的硅层的半导体膜的制造方法。 控制由金属与硅之间的反应形成的硅化物层的厚度,从而控制在硅化物层和硅层之间的界面处形成的硅化物晶粒的晶粒尺寸,并且控制硅结构的形状。 这样的半导体膜可以应用于蓄电装置的电极。
    • 3. 发明授权
    • Vehicle seat
    • 车座
    • US09162594B2
    • 2015-10-20
    • US13811507
    • 2011-07-21
    • Takamasa AdachiHiroyuki KakuTakayuki InoueYutaka KizawaAkimitsu Kurihara
    • Takamasa AdachiHiroyuki KakuTakayuki InoueYutaka KizawaAkimitsu Kurihara
    • B60N2/42B60N2/427
    • B60N2/4228B60N2/42745
    • Provided is a vehicle seat by which an impact of rear end collision is reduced and of which peripheral structure of a side frame is simplified. A vehicle seat includes: a seat back frame which includes side portions positioned at the sides thereof, a pressure receiving member which is jointed to the seat back frame through joint members and supports an occupant, and an impact reduction member which is disposed on at least one of the side portions to engage with the joint member and to move by a predetermined amount of impact load applied to the pressure receiving member so that the pressure receiving member is caused to move rearward; in which the side portion includes a convex portion protruding in the movement range of the impact reduction member, and the impact reduction member abuts against the convex portion so that the movement of the impact reduction member is prevented.
    • 提供了一种车辆座椅,通过该座椅,后端碰撞的冲击降低,并且侧框架的外围结构被简化。 车辆座椅包括:座椅靠背框架,其包括位于其侧面的侧部;压力接收构件,其通过接合构件接合到座椅靠背框架并且支撑乘员;以及减震构件,其至少设置在至少 与接合构件接合并以施加到压力接收构件的预定量的冲击载荷移动的侧部中的一个,使得压力接收构件向后移动; 其中所述侧部包括在所述冲击减少构件的移动范围内突出的凸部,并且所述冲击减小构件抵靠所述凸部,从而防止所述减震构件的移动。
    • 4. 发明授权
    • Defect evaluation method for semiconductor
    • 半导体缺陷评估方法
    • US08625085B2
    • 2014-01-07
    • US13407943
    • 2012-02-29
    • Ryosuke WatanabeMasashi TsubukuTakayuki Inoue
    • Ryosuke WatanabeMasashi TsubukuTakayuki Inoue
    • G01N21/00
    • H01L22/14H01L22/12
    • Even in the case of a sample exhibiting low photoresponse, such as a wide bandgap semiconductor, a measurement method which enables highly accurate CPM measurement is provided. When CPM measurement is performed, photoexcited carriers which are generated by light irradiation of a sample exhibiting low photoresponse such as a wide bandgap semiconductor are instantly removed by application of positive bias voltage to a third electrode which is provided in the sample in addition to two electrodes used for measurement. When the photoexcited carriers are removed, even in the case of the sample exhibiting low photoresponse, the controllability of a photocurrent value is improved and CPM measurement can be performed accurately.
    • 即使在具有低光响应的样品(例如宽带隙半导体)的情况下,也提供了能够进行高度精确的CPM测量的测量方法。 当进行CPM测量时,通过向除了两个电极之外的样品中提供的第三电极施加正偏置电压,立即除去通过光照射出具有低光响应的样品(例如宽带隙半导体)产生的光激发载流子 用于测量。 当除去光激发载体时,即使在样品表现出较低的光响应的情况下,光电流值的可控性得到改善,也可以精确地进行CPM测量。