专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07708054B2 Heat exchanger 有权
标题翻译：热交换器
公开(公告)号：US07708054B2
公开(公告)日：2010-05-04
申请号：US10566651
申请日：2004-07-30
申请人： Hirohiko Watanabe , Kouta Arino
发明人： Hirohiko Watanabe , Kouta Arino
IPC分类号： F28F9/02 , F28D1/02
CPC分类号： F28F9/0278 , F28D1/05375 , F28D1/05391 , F28D2021/0085 , F28F9/0204 , F28F2255/16 , F28F2280/04
摘要： A heat exchanger includes a heat exchange core including a plurality of heat exchange tubes, a refrigerant inlet header and a refrigerant outlet header arranged toward one end of each heat exchange tube, and a refrigerant inflow header and a refrigerant outflow header arranged toward the other end of each heat exchange tube. The outlet header has an interior divided into two spaces by a flow dividing resistance plate, and some of the heat exchange tubes are joined to the outlet header so as to communicate with the space. The resistance plate has a plurality of refrigerant passing holes formed therein that are different in shape and/or size. The outlet header is provided on the outer surface thereof with identification marks for discriminating the positions of the refrigerant passing holes and representing the shapes and/or sizes of the holes.
摘要翻译：热交换器包括：热交换芯，包括多个热交换管，制冷剂入口集管和朝向每个热交换管的一端设置的制冷剂出口集管;以及制冷剂流入集管和朝向另一端设置的制冷剂流出集管的每个热交换管。出口集管具有通过分流阻力板分成两个空间的内部，并且一些热交换管被连接到出口集管，以便与该空间连通。电阻板具有形成在其中的多个形状和/或尺寸不同的制冷剂通过孔。出口集管在其外表面上设置有用于识别制冷剂通过孔的位置并表示孔的形状和/或尺寸的识别标记。

2. 发明授权

US07670879B2 Manufacturing method of semiconductor module including solid-liquid diffusion joining steps 有权
标题翻译：包括固液扩散接合步骤的半导体模块的制造方法
公开(公告)号：US07670879B2
公开(公告)日：2010-03-02
申请号：US10591723
申请日：2004-03-02
申请人： Kozo Fujimoto , Hirohiko Watanabe , Kazutaka Ikemi , Keiichi Matsumura , Masayoshi Shimoda , Katsumi Taniguchi , Tomoaki Goto
发明人： Kozo Fujimoto , Hirohiko Watanabe , Kazutaka Ikemi , Keiichi Matsumura , Masayoshi Shimoda , Katsumi Taniguchi , Tomoaki Goto
IPC分类号： H01L21/50 , H01L21/44
CPC分类号： H01L24/33 , H01L23/49562 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/83 , H01L24/84 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/32225 , H01L2224/37147 , H01L2224/40095 , H01L2224/40225 , H01L2224/45032 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48699 , H01L2224/73265 , H01L2224/83191 , H01L2224/83801 , H01L2224/83825 , H01L2224/84825 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/157 , H01L2924/15787 , H01L2924/30105 , H01L2924/351 , H01L2924/00014 , H01L2924/01049 , H01L2924/00015 , H01L2924/00012 , H01L2924/00
摘要： The present invention provides a manufacturing method of a semiconductor module which enables the joining at a low temperature within a short time and can obtain more reliable joining portions by performing the joining without using a solder joining medium. The manufacturing method of a semiconductor module includes a first joining step for joining first circuit electrodes which are formed on a circuit board and back-surface-side die electrodes of a semiconductor die, a second joining step for joining the front-surface-side electrodes of the semiconductor die and one ends of lead frames, and a third joining step for joining another ends of the lead frame and second circuit electrodes which are formed on the circuit board, wherein a low-melting-temperature metal layer is formed on one conductive portion of a pair of conductive portions to be joined and, thereafter, the low-melting-temperature metal layer is heated and pressurized thus diffusing the low-melting-temperature metal layer into the pair of conductive portions by solid-liquid diffusion whereby the conductive portions are joined to each other.
摘要翻译：本发明提供一种半导体模块的制造方法，其能够在短时间内在低温下进行接合，并且可以通过在不使用焊料接合介质的情况下进行接合而获得更可靠的接合部。半导体模块的制造方法包括：第一接合步骤，用于接合形成在电路板上的第一电路电极和半导体管芯的背表面侧管芯电极;第二接合步骤，用于将前表面侧电极以及第三接合步骤，用于接合引线框架的另一端和形成在电路板上的第二电路电极，其中低熔点金属层形成在一个导电一部分要接合的导电部分的部分，然后将低熔点金属层加热和加压，从而通过固液扩散将低熔点金属层扩散到一对导电部分中，由此导电部分彼此连接。

3. 发明授权

US06684662B2 Refrigeration system, and condenser for use in decompressing-tube system 失效
标题翻译：制冷系统和冷凝器用于减压管系统
公开(公告)号：US06684662B2
公开(公告)日：2004-02-03
申请号：US10057062
申请日：2002-01-25
申请人： Hideaki Manaka , Hirohiko Watanabe , Ryoichi Hoshino , Yasuhiro Takahashi
发明人： Hideaki Manaka , Hirohiko Watanabe , Ryoichi Hoshino , Yasuhiro Takahashi
IPC分类号： F25B4106
CPC分类号： F28D1/0316 , F25B6/04 , F25B39/04 , F25B41/06 , F25B2339/0445 , F25B2400/13 , F28D1/05391 , F28D2021/0084
摘要： This refrigeration system is an orifice-tube system constituting a refrigeration cycle in which a refrigerant passes through a compressor 1, a condenser 10, an orifice-tube 3, an evaporator 4, and an accumulator 5 in this order and then returns to the compressor 1. The condenser 10 is constituted by the so-called multi-flow type heat exchanger having a plurality of passes P1-P3. The intermediate pass P2 is constituted as a decompression pass for decompressing the refrigerant. After condensing the refrigerant by the first pass P1, the condensed refrigerant is decompressed and evaporated by the decompression pass P2, and then the evaporated refrigerant is re-condensed by the third pass P3. This refrigeration system is excellent in response characteristic to thermal load fluctuations and in refrigeration performance.
摘要翻译：该制冷系统是构成制冷循环的孔管系统，其中制冷剂依次流过压缩机1，冷凝器10，孔管3，蒸发器4和蓄能器5，然后返回到压缩机冷凝器10由具有多个通路P1-P3的所谓多流式热交换器构成。中间通路P2构成为减压制冷剂的减压通路。在通过第一通路P1冷凝制冷剂后，通过减压P2将冷凝的制冷剂减压蒸发，然后蒸发的制冷剂通过第三道次P3再次冷凝。该制冷系统对热负荷波动和制冷性能的响应特性优异。

4. 发明授权

US07400396B2 Fluorescent correalated spectrometric analysis device 有权
标题翻译：荧光相关光谱分析装置
公开(公告)号：US07400396B2
公开(公告)日：2008-07-15
申请号：US10545393
申请日：2004-02-13
申请人： Hirohiko Watanabe , Motoyuki Watanabe , Takayuki Inoue , Tadashi Maruno , Fumio Iwase
发明人： Hirohiko Watanabe , Motoyuki Watanabe , Takayuki Inoue , Tadashi Maruno , Fumio Iwase
IPC分类号： G01J3/30
CPC分类号： G01N21/6456 , G01J3/2803 , G01J3/2823 , G01J3/2889 , G01J3/4406 , G01J2003/2813 , G01J2003/282 , G01N21/645 , G01N2021/6417 , G01N2021/6423 , H04N5/3454 , H04N5/372
摘要： A fluorescence correlation spectroscopy analyzer 1 is equipped with an excitation light illuminating optical system 21, a fluorescence imaging optical system 22, a CCD camera 15, and a data analyzer 16. The excitation light illuminating optical system 21 illuminates excitation light onto a predetermined region of a measured sample S. The fluorescence imaging optical system 22 images the fluorescence generated at the measured sample S onto the photodetection surface of the CCD camera 15. The CCD camera 15 performs photoelectric conversion of the fluorescence made incident onto the photodetection surface in accordance with the respective pixels and outputs the charges generated by the photoelectric conversion as detection signals from an output terminal. The data analyzer 16 inputs the detection signals based on the charges generated at the pixels, and computes autocorrelation functions of the input detection signals according to each pixel.
摘要翻译：荧光相关光谱分析仪1配备有激发光照明光学系统21，荧光成像光学系统22，CCD照相机15和数据分析器16。激发光照射光学系统21将激发光照射到测量样品S的预定区域上。荧光成像光学系统22将在测量样品S处产生的荧光图像到CCD照相机15的光电检测表面上。 CCD摄像机15根据各像素对入射到光检测面上的荧光进行光电转换，并将从光电转换产生的电荷作为检测信号从输出端子输出。数据分析器16基于在像素处产生的电荷输入检测信号，并根据每个像素计算输入检测信号的自相关函数。

5. 发明申请

US20070197017A1 Manufacturing method of semiconductor module 有权
标题翻译：半导体模块制造方法
公开(公告)号：US20070197017A1
公开(公告)日：2007-08-23
申请号：US10591723
申请日：2004-03-02
申请人： Kozo Fujimoto , Hirohiko Watanabe , Kazutaka Ikemi , Keiichi Matsumura , Masayoshi Shimoda , Katsumi Taniguchi , Tomoaki Goto
发明人： Kozo Fujimoto , Hirohiko Watanabe , Kazutaka Ikemi , Keiichi Matsumura , Masayoshi Shimoda , Katsumi Taniguchi , Tomoaki Goto
IPC分类号： H01L21/44
CPC分类号： H01L24/33 , H01L23/49562 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/83 , H01L24/84 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/32225 , H01L2224/37147 , H01L2224/40095 , H01L2224/40225 , H01L2224/45032 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48699 , H01L2224/73265 , H01L2224/83191 , H01L2224/83801 , H01L2224/83825 , H01L2224/84825 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/157 , H01L2924/15787 , H01L2924/30105 , H01L2924/351 , H01L2924/00014 , H01L2924/01049 , H01L2924/00015 , H01L2924/00012 , H01L2924/00
摘要： The present invention provides a manufacturing method of a semiconductor module which enables the joining at a low temperature within a short time and can obtain more reliable joining portions by performing the joining without using a solder joining medium. The manufacturing method of a semiconductor module includes a first joining step for joining first circuit electrodes which are formed on a circuit board and back-surface-side die electrodes of a semiconductor die, a second joining step for joining the front-surface-side electrodes of the semiconductor die and one ends of lead frames, and a third joining step for joining another ends of the lead frame and second circuit electrodes which are formed on the circuit board, wherein a low-melting-temperature metal layer is formed on one conductive portion of a pair of conductive portions to be joined and, thereafter, the low-melting-temperature metal layer is heated and pressurized thus diffusing the low-melting-temperature metal layer into the pair of conductive portions by solid-liquid diffusion whereby the conductive portions are joined to each other.
摘要翻译：本发明提供一种半导体模块的制造方法，其能够在短时间内在低温下进行接合，并且可以通过在不使用焊料接合介质的情况下进行接合而获得更可靠的接合部。半导体模块的制造方法包括：第一接合步骤，用于接合形成在电路板上的第一电路电极和半导体管芯的背表面侧管芯电极;第二接合步骤，用于将前表面侧电极以及第三接合步骤，用于接合引线框架的另一端和形成在电路板上的第二电路电极，其中低熔点金属层形成在一个导电一部分要接合的导电部分的部分，然后将低熔点金属层加热和加压，从而通过固液扩散将低熔点金属层扩散到一对导电部分中，由此导电部分彼此连接。

6. 发明申请

US20070144721A1 Heat exchanger 有权
标题翻译：热交换器
公开(公告)号：US20070144721A1
公开(公告)日：2007-06-28
申请号：US10566651
申请日：2004-07-30
申请人： Hirohiko Watanabe , Kouta Arino
发明人： Hirohiko Watanabe , Kouta Arino
IPC分类号： F28F9/02
CPC分类号： F28F9/0278 , F28D1/05375 , F28D1/05391 , F28D2021/0085 , F28F9/0204 , F28F2255/16 , F28F2280/04
摘要： A heat exchanger includes a heat exchange core including a plurality of heat exchange tubes, a refrigerant inlet header and a refrigerant outlet header arranged toward one end of each heat exchange tube, and a refrigerant inflow header and a refrigerant outflow header arranged toward the other end of each heat exchange tube. The outlet header has an interior divided into two spaces by a flow dividing resistance plate, and some of the heat exchange tubes are joined to the outlet header so as to communicate with the space. The resistance plate has a plurality of refrigerant passing holes formed therein that are different in shape and/or size. The outlet header is provided on the outer surface thereof with identification marks for discriminating the positions of the refrigerant passing holes and representing the shapes and/or sizes of the holes.
摘要翻译：热交换器包括：热交换芯，包括多个热交换管，制冷剂入口集管和朝向每个热交换管的一端设置的制冷剂出口集管;以及制冷剂流入集管和朝向另一端设置的制冷剂流出集管的每个热交换管。出口集管具有通过分流阻力板分成两个空间的内部，并且一些热交换管被连接到出口集管，以便与该空间连通。电阻板具有形成在其中的多个形状和/或尺寸不同的制冷剂通过孔。出口集管在其外表面上设置有用于识别制冷剂通过孔的位置并表示孔的形状和/或尺寸的识别标记。

7. 发明授权

US06247529B1 Refrigerant tube for a heat exchanger 失效
标题翻译：用于热交换器的制冷剂管
公开(公告)号：US06247529B1
公开(公告)日：2001-06-19
申请号：US09338851
申请日：1999-06-25
申请人： Fumio Shimizu , Hiroyasu Shimanuki , Hirohiko Watanabe , Yuichi Furukawa , Yuji Yamamoto , Arif Mujib Khan , Qun Liu , Thaddeus Waskiewicz
发明人： Fumio Shimizu , Hiroyasu Shimanuki , Hirohiko Watanabe , Yuichi Furukawa , Yuji Yamamoto , Arif Mujib Khan , Qun Liu , Thaddeus Waskiewicz
IPC分类号： F28F100
CPC分类号： F28F3/048 , F28F1/022 , F28F2250/04
摘要： A refrigerant tube for a heat exchanger, comprising: a generally flat tube 10 having generally flat upper and lower walls 12/14; a plurality of reinforcing walls 16 connected between the upper and lower walls 12/14, the reinforcing walls extending along and generally parallel with a longitudinal axis A—A of the tube and being spaced apart from one another by a predetermined distance; and a plurality of communication holes 18 distributed along the length of each reinforcing wall 16, thereby defining a plurality of discrete wall portions 20 along each reinforcing wall 16, each of the discrete wall portions 20 being disposed between adjacent communication holes 18 and having an upstream edge 22 and a downstream edge 24 thereof, the communication holes 18 and discrete wall portions 20 having lengths L1 and L2, respectively, as measured along the longitudinal axis A—A, the communication holes 18 being spaced apart along each reinforcing wall 16 by a pitch P. Each communication hole 18 in each reinforcing wall is disposed between the upstream and downstream edges 22/24 of a laterally adjacent discrete wall portion 20 of each adjacent reinforcing wall, such that a wall overlap ratio Wr, defined as [P−2L1]/P, is greater than 0, and preferably 0.4≦Wr≦0.6.
摘要翻译：一种用于热交换器的制冷剂管，包括：大致平坦的管10，其具有大致平坦的上壁12壁和下壁14; 多个加强壁16，其连接在上壁12/14和下壁12之间，加强壁沿管子的纵向轴线A-A延伸并且大致平行于彼此隔开预定距离; 以及沿着每个加强壁16的长度分布的多个连通孔18，从而沿着每个加强壁16限定多个离散的壁部分20，每个离散的壁部分20设置在相邻的连通孔18之间并且具有上游边缘22和其下游边缘24，连通孔18和离散壁部分20分别具有沿着纵向轴线AA测量的长度L1和L2，连通孔18沿着每个加强壁16间隔开间距P 每个加强壁中的每个连通孔18设置在每个相邻的加强壁的横向相邻的离散壁部分20的上游边缘22/24侧和下游边缘22/24之间，使得壁重叠率Wr被定义为[P-2L1] / P大于0，优选为0.4 <= Wr <= 0.6。

8. 发明申请

US20070152025A1 Electronic part mounting method 审中-公开
标题翻译：电子零件安装方式
公开(公告)号：US20070152025A1
公开(公告)日：2007-07-05
申请号：US10591724
申请日：2004-03-02
申请人： Kozo Fujimoto , Kazutaka Ikemi , Hirohiko Watanabe , Keiichi Matsumura , Masayoshi Shimoda , Katsumi Taniguchi , Tomoaki Goto
发明人： Kozo Fujimoto , Kazutaka Ikemi , Hirohiko Watanabe , Keiichi Matsumura , Masayoshi Shimoda , Katsumi Taniguchi , Tomoaki Goto
IPC分类号： B23K31/02
CPC分类号： H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/13099 , H01L2224/13147 , H01L2224/16 , H01L2224/81193 , H01L2224/81204 , H01L2224/81825 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/01322 , H01L2924/014 , H01L2924/07811 , H05K3/328 , H05K2203/0278 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The present invention provides an electronic part mounting method which enables joining of electrodes at a low temperature and within a short time, can obtain the high reliability and, further, enables joining at a fine pitch. In an electronic part mounting method which joins circuit electrodes which are formed over a circuit board and die electrodes which are formed over the electronic parts thus mounting the electronic parts on the circuit board, a low-melting-point metal layer is preliminarily formed over the circuit electrode and/or the die electrode and, thereafter, the circuit electrode and the die electrode are arranged to face each other and are heated and pressurized for melting low-melting-point metal thus diffusing the low-melting-point metal into the circuit electrode and the die electrode by solid-liquid diffusion.
摘要翻译：本发明提供一种能够在低温和短时间内接合电极的电子部件安装方法，可以获得高可靠性，并且还能够以细间距进行接合。在电子部件安装方法中，将形成在电路板上的电路电极和形成在电子部件上的电极部分上的电极部件连接起来，从而将电子部件安装在电路板上，将低熔点金属层预先形成在电路电极和/或管芯电极，然后将电路电极和管芯电极配置成彼此面对并被加热和加压以熔化低熔点金属，从而将低熔点金属扩散到电路中电极和芯片电极通过固液扩散。

9. 发明授权

US06446715B2 Flat heat exchange tubes 失效
标题翻译：扁平换热管
公开(公告)号：US06446715B2
公开(公告)日：2002-09-10
申请号：US09748015
申请日：2000-12-27
申请人： Hirohiko Watanabe , Ryouichi Hoshino , Hiroyasu Simanuki , Takashi Tamura
发明人： Hirohiko Watanabe , Ryouichi Hoshino , Hiroyasu Simanuki , Takashi Tamura
IPC分类号： F28F312
CPC分类号： F28D1/0316 , F28F3/04
摘要： A flat heat exchange tube comprises an upper wall, a lower wall, right and left side walls interconnecting right and left side edges of the upper and lower walls, and a plurality of reinforcing walls connected between the upper and lower walls, extending longitudinally of the tube and spaced apart from one another. The tube has parallel fluid passages formed inside thereof and extending forward or rearward. Each of the reinforcing walls has a plurality of communication holes arranged at a spacing longitudinally thereof for holding the parallel fluid passages in communication with one another therethrough. The upper surface of the lower wall is provided at a portion thereof forming each of the fluid passages with a plurality of turbulence producing portions extending over the entire width of the fluid passage and arranged at a spacing longitudinally of the passage.
摘要翻译：扁平的热交换管包括上壁，下壁，互连上壁和下壁的左右侧边缘的左右侧壁，以及连接在上壁和下壁之间的多个加强壁，并彼此间隔开。管具有在其内部形成并且向前或向后延伸的平行流体通道。每个加强壁具有多个沿其长度方向布置的连通孔，用于保持彼此连通的平行流体通道。下壁的上表面在其形成每个流体通道的部分处设置有多个湍流产生部分，其在流体通道的整个宽度上延伸并且沿通道的纵向布置。

10. 发明授权

US06370909B2 Condenser and air conditioning refrigeration system using the same 失效
标题翻译：冷凝器和空调制冷系统使用相同
公开(公告)号：US06370909B2
公开(公告)日：2002-04-16
申请号：US09883529
申请日：2001-06-18
申请人： Hirohiko Watanabe , Ryoichi Hoshino , Yasuhiro Takahashi
发明人： Hirohiko Watanabe , Ryoichi Hoshino , Yasuhiro Takahashi
IPC分类号： F25B3904
CPC分类号： F28F27/02 , F25B39/04 , F25B2339/0445 , F25B2341/0662 , F28D1/0316 , F28D1/0417 , F28F9/028
摘要： A condenser includes a refrigerant inlet, a refrigerant outlet, a core portion having a refrigerant passage for introducing refrigerant from the refrigerant inlet to the refrigerant outlet while condensing the refrigerant, and decompressing means provided at a part of the refrigerant passage, the decompressing means decompressing a refrigerant pressure. The refrigerant passage located at an upstream side of the decompressing means condensates at least a part of high-pressure gaseous refrigerant into a liquified refrigerant. The decompressing means decompresses the liquified refrigerant into a low-pressure gaseous refrigerant. The refrigerant passage located at a downstream side of the decompressing means re-condensates the low-pressure gaseous refrigerant.
摘要翻译：冷凝器包括制冷剂入口，制冷剂出口，具有用于将制冷剂从制冷剂入口引导到制冷剂出口并将制冷剂冷凝的制冷剂通道的芯部和设置在制冷剂通道的一部分处的减压装置，减压装置制冷剂压力。位于减压装置的上游侧的制冷剂通路将至少一部分高压气态制冷剂冷凝成液化制冷剂。减压装置将液化制冷剂减压成低压气态制冷剂。位于减压装置的下游侧的制冷剂通路使低压气态制冷剂再凝结。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式