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    • 1. 发明专利
    • Pattern forming method
    • 图案形成方法
    • JP2014062990A
    • 2014-04-10
    • JP2012207413
    • 2012-09-20
    • Tokyo Electron Ltd東京エレクトロン株式会社Tokyo Ohka Kogyo Co Ltd東京応化工業株式会社
    • MURAMATSU MAKOTOKITANO TAKAHIROTOMITA TADATOSHITAUCHI HIROSHIMOTOIKE NAOTONAMITO TOSHIAKIOMORI KATSUMI
    • G03F7/40C08F297/00G03F7/039G03F7/11H01L21/027
    • PROBLEM TO BE SOLVED: To provide a pattern forming method by which a fine pattern with small roughness can be formed.SOLUTION: The pattern forming method includes steps of: forming a resist film by applying a resist composition on a process target body; patterning the resist film by exposure and development; forming a surface modified region on the process target body by using the patterned resist film; removing the patterned resist film; applying a block copolymer containing a first polymer and a second polymer on the process target body; subjecting the block copolymer to phase separation; and removing one of the first polymer and the second polymer of the phase-separated block copolymer. The resist composition comprises: a resin component having a structural unit which shows increase in the polarity by an action of an acid and includes an acid decomposable group having a monocyclic or linear hydrocarbon group; and an acid generator component which generates an acid by exposure.
    • 要解决的问题:提供可以形成粗糙度小的精细图案的图案形成方法。解决方案:图案形成方法包括以下步骤:通过将抗蚀剂组合物涂覆在加工对象体上而形成抗蚀剂膜; 通过曝光和显影图案化抗蚀剂膜; 通过使用图案化的抗蚀剂膜在工艺目标体上形成表面改性区域; 去除图案化的抗蚀剂膜; 将含有第一聚合物和第二聚合物的嵌段共聚物施加到所述工艺靶体上; 对嵌段共聚物进行相分离; 并除去相分离的嵌段共聚物的第一聚合物和第二聚合物之一。 抗蚀剂组合物包括:具有结构单元的树脂组分,其通过酸的作用显示极性增加,并且包括具有单环或直链烃基的酸可分解基团; 以及通过曝光产生酸的酸发生剂组分。
    • 8. 发明专利
    • Substrate processing method
    • 基板处理方法
    • JP2011187928A
    • 2011-09-22
    • JP2010266897
    • 2010-11-30
    • Tokyo Electron Ltd東京エレクトロン株式会社
    • NAKAMURA YASUYUKINIWA TAKAFUMIKUWAHARA YUHEITOMITA TADATOSHI
    • H01L21/027
    • G03F7/0035G03F7/2041G03F7/40H01L21/0206H01L21/0273H01L21/6715
    • PROBLEM TO BE SOLVED: To provide a method of processing a substrate, which reduces variations in line width of the second time resist patterning on a wafer plane without lowering productivity when double patterning is performed. SOLUTION: The method includes first processing steps S12 to S16 of exposing a substrate having a first resist film formed thereon, developing the exposed substrate, and washing the substrate after subjected to the development to form a first resist pattern, and second processing steps S17 to S20 of forming a second resist film on the substrate having the first resist pattern formed thereon, exposing the substrate having the second resist film formed thereon and developing the exposed substrate to form a second resist pattern. Based on first data indicating the relationship between first process conditions under which the substrate is washed in the first processing step S16 and the line width of the second resist pattern, the first process conditions are determined. The substrate is carried out the first processing step S16 under the predetermined first process conditions. COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:提供一种处理基板的方法,其减少了在进行双重图案化时不降低生产率的同时在晶片平面上形成第二时间抗蚀剂图案的线宽的变化。 解决方案:该方法包括:第一处理步骤S12至S16,用于对其上形成有第一抗蚀剂膜的基板进行曝光,显影曝光的基板,以及在进行显影之后洗涤基板以形成第一抗蚀剂图案;以及第二处理 在其上形成有第一抗蚀剂图案的基板上形成第二抗蚀剂膜的步骤S17至S20,使形成在其上的具有第二抗蚀剂膜的基板曝光并显影曝光的基板以形成第二抗蚀剂图案。 基于表示在第一处理步骤S16中洗涤衬底的第一工艺条件与第二抗蚀剂图案的线宽之间的关系的第一数据,确定第一工艺条件。 在预定的第一处理条件下进行基板的第一处理步骤S16。 版权所有(C)2011,JPO&INPIT
    • 9. 发明专利
    • Substrate processing method, program and computer storage medium
    • 基板处理方法,程序和计算机存储介质
    • JP2014168001A
    • 2014-09-11
    • JP2013039666
    • 2013-02-28
    • Tokyo Electron Ltd東京エレクトロン株式会社
    • MURAMATSU MAKOTOKITANO TAKAHIROTOMITA TADATOSHITAUCHI HIROSHIOKADA SOICHIRO
    • H01L21/027
    • H01L21/0337B82Y40/00G03F7/0002
    • PROBLEM TO BE SOLVED: To adjust the size of a pattern formed of a hydrophilic polymer and a hydrophobic polymer, in substrate processing using a block copolymer containing a hydrophilic polymer and a hydrophobic polymer.SOLUTION: In a substrate processing method, a resist pattern is formed on a wafer (step S3), and a block copolymer is coated on a substrate on which the resist pattern has been formed (step S4). Then, the substrate on which the block copolymer has been coated is subjected to heat treatment to phase separate the block copolymer into a hydrophilic polymer and a hydrophobic polymer. In the heat treatment for the phase separation of a polymer, the concentration of a solvent of a block copolymer contained in the block copolymer coated on a wafer is adjusted to a predetermined concentration.
    • 要解决的问题:调节由亲水性聚合物和疏水性聚合物形成的图案的尺寸,在使用含有亲水性聚合物和疏水性聚合物的嵌段共聚物进行基板处理时。 形成在晶片上(步骤S3),并且在已经形成抗蚀剂图案的基板上涂布嵌段共聚物(步骤S4)。 然后,将其上已经涂覆有嵌段共聚物的基材进行热处理,以将嵌段共聚物相分离成亲水性聚合物和疏水性聚合物。 在用于相分离聚合物的热处理中,将包含在涂覆在晶片上的嵌段共聚物中的嵌段共聚物的溶剂浓度调节至预定浓度。
    • 10. 发明专利
    • Substrate treatment method, program and computer storage medium
    • 基板处理方法,程序和计算机存储介质
    • JP2014146740A
    • 2014-08-14
    • JP2013015301
    • 2013-01-30
    • Tokyo Electron Ltd東京エレクトロン株式会社
    • MURAMATSU MAKOTOKITANO TAKAHIROTOMITA TADATOSHITAUCHI HIROSHIOKADA SOICHIRO
    • H01L21/027
    • H01L21/0337
    • PROBLEM TO BE SOLVED: To arrange a hydrophilic polymer and a hydrophobic polymer into a desired pattern by appropriately forming a guide on a substrate in a substrate treatment method using a block copolymer containing the hydrophilic polymer and the hydrophobic polymer.SOLUTION: An antireflection film 402 is formed on a first resist film 401 that is soluble with an alkali solution and deprotected, both films being formed on an upper surface of a neutral layer 400 on a wafer W; and a resist pattern is formed in a second resist film 403 formed on the antireflection film 402. Then a predetermined pattern is formed in the neutral layer 400 by using the resist pattern of the second resist film 403 as a mask. Then the first resist film 401 is removed by use of an alkali solution. A black copolymer is applied on the wafer W after the first resist film 401 is removed; and the black copolymer is separated into phases of the hydrophilic polymer and the hydrophobic polymer.
    • 要解决的问题:通过使用含有亲水性聚合物和疏水性聚合物的嵌段共聚物的基板处理方法,通过在基板上适当地形成引导体,将亲水性聚合物和疏水性聚合物配置成所需图案。溶胶:抗反射膜402 形成在可溶于碱溶液并脱保护的第一抗蚀剂膜401上,两个膜形成在晶片W上的中性层400的上表面上; 并且在形成在防反射膜402上的第二抗蚀剂膜403中形成抗蚀剂图案。然后通过使用第二抗蚀剂膜403的抗蚀剂图案作为掩模在中性层400中形成预定图案。 然后通过使用碱溶液除去第一抗蚀膜401。 在去除第一抗蚀剂膜401之后,在晶片W上施加黑色共聚物; 并将黑色共聚物分离成亲水性聚合物和疏水性聚合物的相。