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    • 3. 发明授权
    • Low refractive index polymers as underlayers for silicon-containing photoresists
    • 低折射率聚合物作为含硅光致抗蚀剂的底层
    • US07439302B2
    • 2008-10-21
    • US11195566
    • 2005-08-02
    • Wu-Song HuangSean D. BurnsMahmoud Khojasteh
    • Wu-Song HuangSean D. BurnsMahmoud Khojasteh
    • G03F7/11C08F8/14C08F8/32
    • G03F7/091G03F7/094Y10S438/952
    • A new underlayer composition that exhibits high etch resistance and improved optical properties is disclosed. The underlayer composition comprises a vinyl or acrylate polymer, such as a methacrylate polymer, the polymer comprising at least one substituted or unsubstituted naphthalene or naphthol moiety, including mixtures thereof. Examples of the polymer of this invention include: where each R1 is independently selected from an organic moiety or a halogen; each A is independently a single bond or an organic moiety; R2 is hydrogen or a methyl group; and each X, Y and Z is an integer of 0 to 7, and Y+Z is 7 or less. The organic moiety mentioned above may be a substituted or unsubstituted hydrocarbon selected from the group consisting of a linear or branched alkyl, halogenated linear or branched alkyl, aryl, halogenated aryl, cyclic alkyl, and halogenated cyclic alkyl, and any combination thereof. The compositions are suitable for use as a planarizing underlayer in a multilayer lithographic process, including a trilayer lithographic process.
    • 公开了具有高耐蚀刻性和改善的光学性能的新型底层组合物。 底层组合物包含乙烯基或丙烯酸酯聚合物,例如甲基丙烯酸酯聚合物,该聚合物包含至少一个取代或未取代的萘或萘酚部分,包括其混合物。 本发明的聚合物的实例包括:其中每个R 1独立地选自有机部分或卤素; 每个A独立地是单键或有机部分; R 2是氢或甲基; X,Y,Z为0〜7的整数,Y + Z为7以下。 上述有机部分可以是选自直链或支链烷基,卤代直链或支链烷基,芳基,卤代芳基,环状烷基和卤代环状烷基的取代或未取代的烃及其任何组合。 该组合物适合用作多层光刻工艺中的平坦化底层,包括三层光刻工艺。
    • 7. 发明授权
    • Tone inversion with partial underlayer etch for semiconductor device formation
    • 用于半导体器件形成的部分底层蚀刻的色调反演
    • US08470711B2
    • 2013-06-25
    • US12952248
    • 2010-11-23
    • John C. ArnoldSean D. BurnsMatthew E. ColburnSteven J. HolmesYunpeng Yin
    • John C. ArnoldSean D. BurnsMatthew E. ColburnSteven J. HolmesYunpeng Yin
    • H01L21/44
    • H01L23/00H01L21/0337H01L21/31144H01L21/76816H01L2924/0002H01L2924/00
    • A method for tone inversion for integrated circuit fabrication includes providing a substrate with an underlayer on top of the substrate; creating a first pattern, the first pattern being partially etched into a portion of the underlayer such that a remaining portion of the underlayer is protected and forms a second pattern, and such that the first pattern does not expose the substrate located underneath the underlayer; covering the first pattern with a layer of image reverse material (IRM); and etching the second pattern into the substrate. A structure for tone inversion for integrated circuit fabrication includes a substrate; a partially etched underlayer comprising a first pattern located over the substrate, the first pattern being partially etched into a portion of the underlayer such that a remaining portion of the underlayer is protected and forms a second pattern, and such that the first pattern does not expose the substrate located underneath the underlayer; and an image reversal material (IRM) layer located over the partially etched underlayer.
    • 用于集成电路制造的色调反转的方法包括:在衬底的顶部上提供具有底层的衬底; 产生第一图案,所述第一图案被部分地蚀刻到所述底层的一部分中,使得所述底层的剩余部分被保护并形成第二图案,并且使得所述第一图案不暴露位于所述底层下方的所述基板; 用一层图像反向材料(IRM)覆盖第一个图案; 并将第二图案刻蚀成衬底。 用于集成电路制造的色调反转的结构包括:衬底; 部分蚀刻的底层包括位于所述衬底上方的第一图案,所述第一图案被部分蚀刻到所述底层的一部分中,使得所述底层的剩余部分被保护并形成第二图案,并且使得所述第一图案不暴露 底层位于底层下方; 以及位于部分蚀刻的底层上方的图像反转材料(IRM)层。
    • 9. 发明授权
    • Substrate planarization with imprint materials and processes
    • 基板平面化与压印材料和工艺
    • US08084185B2
    • 2011-12-27
    • US12350250
    • 2009-01-08
    • Sean D. BurnsColin J. BrodskyRyan L. Burns
    • Sean D. BurnsColin J. BrodskyRyan L. Burns
    • G03F7/00G03F7/004G03F7/26G03F7/40
    • G03F7/027G03F7/094G03F7/168
    • The present invention relates to planarization materials and methods of using the same for substrate planarization in photolithography. A planarization layer of a planarization composition is formed on a substrate. The planarization composition contains at least one aromatic monomer and at least one non-aromatic monomer. A substantially flat surface is brought into contact with the planarization layer. The planarization layer is cured by exposing to a first radiation or by baking. The substantially flat surface is then removed. A photoresist layer is formed on the planarization layer. The photoresist layer is exposed to a second radiation followed by development to form a relief image in the photoresist layer. The relief image is then transferred into the substrate.
    • 本发明涉及平面化材料及其在光刻中用于衬底平面化的方法。 在基板上形成平坦化组合物的平坦化层。 平坦化组合物含有至少一种芳族单体和至少一种非芳族单体。 基本平坦的表面与平坦化层接触。 平坦化层通过暴露于第一辐射或通过烘烤而固化。 然后去除基本平坦的表面。 在平坦化层上形成光致抗蚀剂层。 将光致抗蚀剂层暴露于第二辐射,随后显影以在光致抗蚀剂层中形成浮雕图像。 然后将浮雕图像转移到基底中。