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    • 8. 发明授权
    • Method of preventing pinhole defects through co-polymerization
    • 通过共聚防止针孔缺陷的方法
    • US07632631B2
    • 2009-12-15
    • US11029813
    • 2005-01-05
    • Steven A. ScheerColin J. Brodsky
    • Steven A. ScheerColin J. Brodsky
    • G03F7/00
    • G03F7/168G03F7/091G03F7/11Y10S430/136
    • A method is provided for forming a stable thin film on a substrate. The method includes depositing a co-polymer composition having a first component and a second component onto a substrate to form a stable film having a first thickness. The first component has first dielectric properties not enabling the first component by itself to produce the stable film having the first thickness. However, the second component has second dielectric properties which impart stability to the film at the first thickness. In a preferred embodiment, the second component includes a leaving group, and the method further includes first thermal processing the film to cause a solvent but not the leaving group to be removed from the film, after which second thermal processing is performed to at least substantially remove the leaving group from the film. As a result, the film is reduced to a second thickness smaller than the first thickness, and the film remains stable during both the first and the second thermal processing.
    • 提供了在基板上形成稳定的薄膜的方法。 该方法包括将具有第一组分和第二组分的共聚物组合物沉积到基底上以形成具有第一厚度的稳定膜。 第一组分具有不能使第一组分本身产生具有第一厚度的稳定膜的第一介电性质。 然而,第二组分具有赋予第一厚度的薄膜稳定性的第二介电特性。 在优选的实施方案中,第二组分包括离去基团,并且该方法还包括首先热处理膜以引起溶剂而不是离开基团从膜中除去,之后进行第二热处理至少基本上 从电影中删除离开组。 结果,膜被还原成小于第一厚度的第二厚度,并且在第一和第二热处理期间膜保持稳定。