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    • 6. 发明授权
    • Semiconductor laser or array formed by layer intermixing
    • 半导体激光器或由层间混合形成的阵列
    • US5708674A
    • 1998-01-13
    • US367554
    • 1995-01-03
    • Kevin J. BeerninkRobert L. ThorntonDavid P. BourThomas L. PaoliJack Walker
    • Kevin J. BeerninkRobert L. ThorntonDavid P. BourThomas L. PaoliJack Walker
    • H01S5/00H01L21/18H01S5/34H01S5/343H01S5/40H01S3/19
    • B82Y20/00H01L21/182H01S5/34H01S5/4043H01S5/3413H01S5/3414H01S5/3432H01S5/34326H01S5/4087
    • A fabrication process and several structures for an index-guided laser diode formed by IILD or for a multiple wavelength laser array containing stacked semi-conductive active layers with quantum wells. The laser wavelength is varied laterally by effectively inactivating quantum wells which have transition wavelengths longer than that desired in the selected portion of the device. The quantum wells are inactivated by intermixing them with the surrounding high band gap semiconductor layers. To accomplish this intermixing without affecting the active layer in nearby regions, a finite source of impurity inducing or promoting intermixing is located in proximity to the quantum well to be intermixed, and the sample is annealed under conditions which allow for lateral patterning of the impurity-induced intermixing. Alternatively, the body is capped over the quantum well to be inactivated with a material which induces vacancies in semi-conductive material during thermal annealing, thus promoting vacancy-enhanced intermixing of the undesired quantum well. The intermixing can also be brought about by patterned annealing or selective laser heating which produces local annealing, or by use of two different caps. For the index-guided laser diode, the flanking index-guiding regions are formed by IILD from a buried impurity source, in which surface conditions are controlled to promote impurity diffusion to the flanking regions but not to the active stripe region between the flanking regions.
    • 用于由IILD或包含具有量子阱的堆叠半导电有源层的多波长激光器阵列形成的折射率引导激光二极管的制造工艺和若干结构。 通过有效地使具有比器件所选部分中所需要的转换波长更长的量子阱来激活激光波长。 量子阱通过将它们与周围的高带隙半导体层混合而失活。 为了实现这种混合而不影响附近区域中的有源层,杂质诱导或促进混合的有限源位于量子阱附近,以便混合,并且样品在允许杂质 - 诱导混合。 或者,通过在热退火期间在半导电材料中引起空位的材料将物体盖在量子阱上以使其失活,从而促进不期望的量子阱的空位增强的混合。 混合还可以通过图案化退火或选择性激光加热产生局部退火,或通过使用两个不同的盖来实现。 对于折射率引导激光二极管,侧翼引导区域由埋藏杂质源的IILD形成,其中控制表面条件以促进杂质扩散到侧翼区域而不是侧向区域之间的有源条纹区域。
    • 10. 发明授权
    • Index guided semiconductor laser biode with shallow selective IILD
    • 具有浅选择性IILD的折射率引导半导体激光生物
    • US5832019A
    • 1998-11-03
    • US345108
    • 1994-11-28
    • Thomas L. PaoliRobert L. ThorntonDavid P. BourDavid W. Treat
    • Thomas L. PaoliRobert L. ThorntonDavid P. BourDavid W. Treat
    • H01S5/00H01S5/20H01S5/22H01S5/34H01S5/343H01S3/18
    • B82Y20/00H01S5/20H01S5/34326H01S5/204H01S5/2059H01S5/22H01S5/3414
    • An index-guided semiconductor laser diode made by impurity-induced layer disordering (IILD) of GaInP and AlGaInP heterostructures. In some embodiments, prior to the IILD, wing regions flanking an active mesa region are etched down close to the active layer so that the selective IILD involves a shallow diffusion only. High-performance, index-guided (AlGa).sub.0.5 In.sub.0.5 P lasers may be fabricated with this technique, analogous to those made in the AlGaAs material system. Also described are several techniques for reducing parasitic leakage current via the IILD regions, which include methods for providing p-n junctions or high band gap materials to reduce the parasitic leakage. In other embodiments, a planar structure is produced but with an ultra-thin upper cladding layer. Only a shallow IILD step is necessary to penetrate below the active region. Excessive out coupling and absorption losses are avoided by choosing materials that will minimize such losses, especially a pure gold metal coating as the p-contact metal.
    • 由GaInP和AlGaInP异质结构的杂质诱导层失调(IILD)制成的折射率引导半导体激光二极管。 在一些实施方案中,在IILD之前,侧翼于活性台面区域的翼区域被蚀刻到接近有源层,使得选择性IILD仅涉及浅扩散。 可以使用与AlGaAs材料系统中制造的那些类似的技术来制造高性能,折射率引导(AlGa)0.5In0.5P激光器。 还描述了用于减少经由IILD区域的寄生漏电流的几种技术,其包括用于提供p-n结或高带隙材料以减少寄生泄漏的方法。 在其他实施例中,制造平面结构,但是具有超薄上包层。 只有浅层的IILD步骤才能渗入活跃区域以下。 通过选择最小化这种损失的材料,特别是作为p-接触金属的纯金金属涂层,可避免过度的偶联和吸收损失。