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1. 发明授权

US07360721B2 Nozzle assembly for a high-pressure cleaning device 有权
标题翻译：用于高压清洗装置的喷嘴组件
公开(公告)号：US07360721B2
公开(公告)日：2008-04-22
申请号：US11145511
申请日：2005-06-02
申请人： Thomas Hofer
发明人： Thomas Hofer
IPC分类号： A62C31/00
CPC分类号： B08B3/026 , B05B1/12
摘要： In order to achieve a particularly simple construction which is, in particular, easy to assemble in the case of a nozzle assembly for a high-pressure cleaning device with a low-pressure nozzle, a high-pressure nozzle arranged in it, a spray lance which bears a sealing pipe connection insertable into the high-pressure nozzle, a bypass surrounding the high-pressure nozzle and leading to the low-pressure nozzle and displacement elements which alter the distance between the sealing pipe connection and the high-pressure nozzle in such a manner that the sealing pipe connection abuts sealingly on the high-pressure nozzle in a high-pressure position and, as a result, interrupts the connection from the spray lance to the bypass whereas, in a low-pressure position, the sealing pipe connection is at a distance from the high-pressure nozzle and, as a result, releases the connection from the spray lance to the bypass, it is suggested that the spray lance bear a pot-shaped housing which surrounds the sealing pipe connection and in which the low-pressure nozzle and the high-pressure nozzle are mounted so as to be freely displaceable and sealed in relation to the inner wall of the housing and that the displacement elements displace the low-pressure nozzle and the high-pressure nozzle in the housing in its longitudinal direction towards the sealing pipe connection and away from it.
摘要翻译：为了实现特别简单的结构，特别是在用于具有低压喷嘴的高压清洁装置的喷嘴组件的情况下容易组装，布置在其中的高压喷嘴，喷枪其具有可插入到高压喷嘴中的密封管连接件，围绕高压喷嘴并通向低压喷嘴的旁路和这样改变密封管连接件与高压喷嘴之间的距离的位移元件密封管连接器在高压位置密封地邻接在高压喷嘴上的方式，从而中断从喷枪到旁路的连接，而在低压位置，密封管连接距离高压喷嘴有一段距离，因此，将喷枪的连接从旁路释放，建议喷枪支撑一个围绕着它的盆形壳体 e密封管连接，其中低压喷嘴和高压喷嘴安装成相对于壳体的内壁自由移动和密封，并且位移元件使低压喷嘴和壳体中的高压喷嘴在其纵向方向上朝向密封管连接并远离其。

2. 发明申请

US20070269927A1 Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body 有权
标题翻译：用于制造具有图案化金属化封装体的光电子器件的方法和用于含塑料体的图案化金属化的方法
公开(公告)号：US20070269927A1
公开(公告)日：2007-11-22
申请号：US11880717
申请日：2007-07-23
申请人： Thomas Hofer , Herbert Brunner , Frank Mollmer , Gunter Waitl , Rainer Sewald , Markus Zeiler
发明人： Thomas Hofer , Herbert Brunner , Frank Mollmer , Gunter Waitl , Rainer Sewald , Markus Zeiler
IPC分类号： H01L21/58 , B27N7/00
CPC分类号： H01L33/60 , B29C45/14639 , B29C45/1671 , B29C2045/0079 , H01L24/48 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01046 , H01L2924/01079 , H01L2924/12041 , H01L2924/12043 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for patterned metallization of a plastic-containing body, which comprises the steps of producing the body via a two-component injection-molding process with at least two plastics, one of which is non-metallizable, and metallizing the body in such a way that a metallized region and a non-metallized region are formed, wherein the non-metallized region is determined by the non-metallizable plastic. A method for the patterned metallization of a plastic-containing body in particular a package body for an optoelectronic device is also provided.
摘要翻译：一种用于含塑料体的图案化金属化的方法，其包括以下步骤：通过具有至少两种塑料的双组分注射成型工艺生产所述主体，其中一种是不可金属化的，并且将所述主体金属化在这种形成金属化区域和非金属化区域的方式，其中非金属化区域由非金属化塑料确定。还提供了一种用于含塑料体的图案化金属化的方法，特别是用于光电子器件的封装体。

3. 发明授权

US08916159B2 Selenocysteine mediated hybrid antibody molecules 有权
标题翻译：硒代半胱氨酸介导的杂交抗体分子
公开(公告)号：US08916159B2
公开(公告)日：2014-12-23
申请号：US12570796
申请日：2009-09-30
申请人： Christoph Rader , Thomas Hofer , Terrence Burke, Jr. , Joshua Thomas
发明人： Christoph Rader , Thomas Hofer , Terrence Burke, Jr. , Joshua Thomas
IPC分类号： A61K51/10 , A61K47/48 , B82Y5/00 , A61K39/395
CPC分类号： A61K47/48561 , A61K47/68 , A61K47/6803 , A61K47/6809 , A61K47/6811 , A61K47/6849 , A61K47/6867 , A61K47/6898 , A61K51/10 , B82Y5/00
摘要： The invention provides methods and compositions employing hybrid molecules of a synthetic molecule and antibody or antibody fragment comprising a selenocysteine residue, wherein the synthetic molecule is covalently linked to the antibody or antibody fragment at the selenocysteine residue. The invention also provides a composition comprising a hybrid molecule as described above and a pharmaceutically acceptable carrier. The invention further provides for methods of making the hybrid molecules, and methods of using the hybrid molecule described above to inhibit cell surface receptor binding.
摘要翻译：本发明提供使用合成分子的混合分子和包含硒代半胱氨酸残基的抗体或抗体片段的方法和组合物，其中所述合成分子与硒代半胱氨酸残基处的抗体或抗体片段共价连接。本发明还提供包含如上所述的杂合分子和药学上可接受的载体的组合物。本发明还提供了制备杂合分子的方法，以及使用上述杂合分子抑制细胞表面受体结合的方法。

4. 发明申请

US20100104510A1 SELENOCYSTEINE MEDIATED HYBRID ANTIBODY MOLECULES 有权
标题翻译： SELENOCYSTEIN MEDIATED HYBRID ANTIBODY MOLECULES
公开(公告)号：US20100104510A1
公开(公告)日：2010-04-29
申请号：US12570796
申请日：2009-09-30
申请人： Christoph Rader , Thomas Hofer , Terrence Burke, JR. , Joshua Thomas
发明人： Christoph Rader , Thomas Hofer , Terrence Burke, JR. , Joshua Thomas
IPC分类号： A61K51/00 , A61K39/395 , C12P21/06 , C12N5/071 , A61P35/04 , A61P25/00 , C12N5/02
CPC分类号： A61K47/48561 , A61K47/68 , A61K47/6803 , A61K47/6809 , A61K47/6811 , A61K47/6849 , A61K47/6867 , A61K47/6898 , A61K51/10 , B82Y5/00
摘要： The invention provides methods and compositions employing hybrid molecules of a synthetic molecule and antibody or antibody fragment comprising a selenocysteine residue, wherein the synthetic molecule is covalently linked to the antibody or antibody fragment at the selenocysteine residue. The invention also provides a composition comprising a hybrid molecule as described above and a pharmaceutically acceptable carrier. The invention further provides for methods of making the hybrid molecules, and methods of using the hybrid molecule described above to inhibit cell surface receptor binding.
摘要翻译：本发明提供使用合成分子的混合分子和包含硒代半胱氨酸残基的抗体或抗体片段的方法和组合物，其中所述合成分子与硒代半胱氨酸残基处的抗体或抗体片段共价连接。本发明还提供包含如上所述的杂合分子和药学上可接受的载体的组合物。本发明还提供了制备杂合分子的方法，以及使用上述杂合分子抑制细胞表面受体结合的方法。

5. 发明申请

US20080246105A1 Detector System and Detector Subassembly 有权
标题翻译：检测器系统和检测器子组件
公开(公告)号：US20080246105A1
公开(公告)日：2008-10-09
申请号：US12064759
申请日：2006-08-17
申请人： Thomas Hofer , Werner Kuhlmann
发明人： Thomas Hofer , Werner Kuhlmann
IPC分类号： H01L31/00 , H01L23/52
CPC分类号： H01L31/02162 , B82Y20/00 , H01L24/48 , H01L24/49 , H01L24/73 , H01L27/14618 , H01L31/035236 , H01L31/105 , H01L2224/29339 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49171 , H01L2224/73265 , H01L2224/83851 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12041 , H01L2924/12043 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
摘要： A detector system (100) with a microelectronic semiconductor chip (20) and a separate optoelectronic detector chip (10) is specified, wherein the detector chip is positioned on the semiconductor chip. A detector subassembly with such a detector system is also specified.
摘要翻译：具有微电子半导体芯片（20）和独立光电检测器芯片（10）的检测器系统（100）被规定，其中检测器芯片位于半导体芯片上。还规定了具有这种检测器系统的检测器子组件。

6. 发明申请

US20070253667A1 Optoelectronic Component with Multi-Part Housing Body 有权
标题翻译：多部件壳体的光电元件
公开(公告)号：US20070253667A1
公开(公告)日：2007-11-01
申请号：US10593794
申请日：2005-03-09
申请人： Herbert Brunner , Matthias Winter , Markus Zeiler , Georg Bogner , Thomas Hofer
发明人： Herbert Brunner , Matthias Winter , Markus Zeiler , Georg Bogner , Thomas Hofer
IPC分类号： H01L31/0203
CPC分类号： H01L33/60 , H01L31/0203 , H01L31/02325 , H01L33/486 , H01L33/54 , H01L2924/0002 , H01S5/02228 , H01S5/02244 , H01S5/02292 , H01L2924/00
摘要： An optoelectronic component (1) is proposed that comprises a housing body (2) and at least one semiconductor chip (8) disposed thereon, said housing body having a base part (13) comprising a connector body (16), on which a connecting conductor material (6, 7) is disposed, and said housing body having a reflector part (14) comprising a reflector body (23), on which a reflector material (9) is disposed, wherein said connector body and said reflector body are preformed separately from each other and said reflector body is disposed on said connector body in the form of a reflector top.
摘要翻译：提出了一种光电子部件（1），其包括壳体（2）和设置在其上的至少一个半导体芯片（8），所述壳体具有包括连接器主体（16）的基部（13）导体材料（6,7）设置，并且所述壳体具有包括反射体（23）的反射器部分（14），反射器材料（9）设置在所述反射器部分上，其中所述连接器主体和所述反射器主体被预成型彼此分开，并且所述反射器主体以反射器顶部的形式设置在所述连接器主体上。

7. 发明授权

US06759457B2 Unique compositions having utility in rubber applications 失效
标题翻译：独特的组合物可用于橡胶应用
公开(公告)号：US06759457B2
公开(公告)日：2004-07-06
申请号：US10078470
申请日：2002-02-21
申请人： Edmee Files , Thomas Hofer
发明人： Edmee Files , Thomas Hofer
IPC分类号： C08K534
CPC分类号： C08K5/42 , C08K5/3437 , C08L15/005
摘要： A composition including 8-hydroxyquinaldine and an N-acyl taurate is useful in compounding elastomer compositions. Compositions are described containing elastomers such as rubbers, metal oxides, plasticizers, fillers, antidioxants and curing agents. Rubber compositions of the invention have utility in a wide variety of applications.
摘要翻译：包含8-羟基喹哪啶和N-酰基牛磺酸盐的组合物可用于配混弹性体组合物。描述了包含弹性体如橡胶，金属氧化物，增塑剂，填料，抗氧化剂和固化剂的组合物。本发明的橡胶组合物在各种应用中具有实用性。

8. 发明授权

US06736333B2 Rotor nozzle, in particular, for a high-pressure cleaning device 失效
标题翻译：转子喷嘴，特别是高压清洗装置
公开(公告)号：US06736333B2
公开(公告)日：2004-05-18
申请号：US10377081
申请日：2003-02-28
申请人： Juergen Binder , Thomas Hofer
发明人： Juergen Binder , Thomas Hofer
IPC分类号： B05B300
CPC分类号： B05B1/1645 , B05B3/0463
摘要： The invention provides a rotor nozzle, comprising a casing and a rotor body arranged therein. The rotor body has a flow-through channel and a spherical bearing part in a step bearing surrounding an exit opening of the casing. An end part closes the casing and has several selectively closable passages arranged therein which open from an inlet side into the interior of the casing or into flow channels in the casing leading to additional outlets. The end part widens in steps from the interior to the inlet side, and is inserted into a stepped receiving opening. A seal is provided between the end part and the inner wall of the receiving opening. An outlet for a passage of the end part is arranged in the area of at least one step and a flow channel begins in the casing in the area of this step.
摘要翻译：本发明提供了一种转子喷嘴，其包括壳体和布置在其中的转子体。转子体在包围壳体的出口的阶梯式轴承中具有流通通道和球形轴承部分。端部封闭壳体并且具有布置在其中的几个可选择地关闭的通道，其从入口侧进入壳体的内部或者进入壳体中的流动通道，从而导致另外的出口。端部从内部到入口侧逐渐变宽，并且被插入阶梯式接收开口中。在接收开口的端部和内壁之间设置有密封件。用于通过端部的通道的出口布置在至少一个台阶的区域中，并且流动通道在该步骤的区域中在壳体中开始。

9. 发明授权

US08030685B2 Detector system and detector subassembly 有权
标题翻译：检测器系统和检测器组件
公开(公告)号：US08030685B2
公开(公告)日：2011-10-04
申请号：US12064759
申请日：2006-08-17
申请人： Thomas Hofer , Werner Kuhlmann
发明人： Thomas Hofer , Werner Kuhlmann
IPC分类号： H01L31/102
CPC分类号： H01L31/02162 , B82Y20/00 , H01L24/48 , H01L24/49 , H01L24/73 , H01L27/14618 , H01L31/035236 , H01L31/105 , H01L2224/29339 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49171 , H01L2224/73265 , H01L2224/83851 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12041 , H01L2924/12043 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
摘要： A detector system with a microelectronic semiconductor chip and a separate optoelectronic detector chip is specified, wherein the detector chip is positioned on the semiconductor chip. A detector subassembly with such a detector system is also specified.
摘要翻译：规定了具有微电子半导体芯片和单独的光电检测器芯片的检测器系统，其中检测器芯片位于半导体芯片上。还规定了具有这种检测器系统的检测器子组件。

10. 发明授权

US07109590B2 Semiconductor component comprising a surface metallization 有权
标题翻译：半导体部件包括表面金属化
公开(公告)号：US07109590B2
公开(公告)日：2006-09-19
申请号：US10296405
申请日：2001-05-10
申请人： Herbert Brunner , Thomas Hofer , Harald Jager
发明人： Herbert Brunner , Thomas Hofer , Harald Jager
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L23/49805 , H01L24/48 , H01L24/73 , H01L2224/05599 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2224/48464 , H01L2224/73265 , H01L2224/854 , H01L2924/00014 , H01L2924/12041 , H01L2924/12043 , H01L2924/181 , H05K1/0271 , H05K3/3442 , H05K2201/09181 , H05K2201/09381 , H05K2201/09472 , H05K2201/10727 , Y02P70/613 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： The invention relates to a semiconductor component comprising surface metallization and having at least one semiconductor body (3) and a package base body (2) on whose surface conductor path structures (7) are formed by means of surface metallization. A subregion of the conductor path structure (7) constitutes the solder connections of the semiconductor component. The solder connections (1) are combined to form rows, the individual rows of solder connections being arranged at a very small, predetermined spacing from one another.
摘要翻译：本发明涉及包括表面金属化并且具有至少一个半导体本体（3）和封装基体（2）的半导体部件，其表面上通过表面金属化形成导体路径结构（7）。导体路径结构（7）的一个子区域构成半导体元件的焊料连接。焊接连接（1）被组合以形成行，各行焊接连接以彼此非常小的预定间隔布置。

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