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1. 发明申请

US20070269927A1 Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body 有权
标题翻译：用于制造具有图案化金属化封装体的光电子器件的方法和用于含塑料体的图案化金属化的方法
公开(公告)号：US20070269927A1
公开(公告)日：2007-11-22
申请号：US11880717
申请日：2007-07-23
申请人： Thomas Hofer , Herbert Brunner , Frank Mollmer , Gunter Waitl , Rainer Sewald , Markus Zeiler
发明人： Thomas Hofer , Herbert Brunner , Frank Mollmer , Gunter Waitl , Rainer Sewald , Markus Zeiler
IPC分类号： H01L21/58 , B27N7/00
CPC分类号： H01L33/60 , B29C45/14639 , B29C45/1671 , B29C2045/0079 , H01L24/48 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01046 , H01L2924/01079 , H01L2924/12041 , H01L2924/12043 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for patterned metallization of a plastic-containing body, which comprises the steps of producing the body via a two-component injection-molding process with at least two plastics, one of which is non-metallizable, and metallizing the body in such a way that a metallized region and a non-metallized region are formed, wherein the non-metallized region is determined by the non-metallizable plastic. A method for the patterned metallization of a plastic-containing body in particular a package body for an optoelectronic device is also provided.
摘要翻译：一种用于含塑料体的图案化金属化的方法，其包括以下步骤：通过具有至少两种塑料的双组分注射成型工艺生产所述主体，其中一种是不可金属化的，并且将所述主体金属化在这种形成金属化区域和非金属化区域的方式，其中非金属化区域由非金属化塑料确定。还提供了一种用于含塑料体的图案化金属化的方法，特别是用于光电子器件的封装体。

2. 发明授权

US07247940B2 Optoelectronic device with patterned-metallized package body, method for producing such a device and method for the patterned metallization of a plastic-containing body 有权
标题翻译：具有图案化金属化封装体的光电器件，用于制造这种器件的方法和用于含塑料体的图案化金属化的方法
公开(公告)号：US07247940B2
公开(公告)日：2007-07-24
申请号：US10792538
申请日：2004-03-01
申请人： Thomas Höfer , Herbert Brunner , Frank Möllmer , Günter Waitl , Rainer Sewald , Markus Zeiler
发明人： Thomas Höfer , Herbert Brunner , Frank Möllmer , Günter Waitl , Rainer Sewald , Markus Zeiler
IPC分类号： H01L23/03
CPC分类号： H01L33/62 , H01L33/486 , H01L2224/48091 , H01L2224/48247 , H01L2924/01004 , H01L2924/01046 , H01L2924/01057 , H01L2924/01068 , H01L2924/01079 , H01L2924/12041 , H01L2924/1815 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： An optoelectronic device, comprising a package body (57) and at least one semiconductor chip (50) arranged on the package body (57). The surface of the package body (57) has a metallized subregion (15) and a non-metallized subregion (20). The package body (57) includes at least two different plastics (53, 54), one of the plastics being non-metallizable (54) and this plastic determining the non-metallized subregion (20). A method for producing such components and a method for the patterned metallization of a plastic-containing body are also provided.
摘要翻译：一种光电子器件，包括封装主体（57）和布置在封装主体（57）上的至少一个半导体芯片（50）。封装主体（57）的表面具有金属化子区域（15）和非金属化子区域（20）。包装体（57）包括至少两种不同的塑料（53,54），塑料中的一种是不可金属化的（54），该塑料确定非金属化子区域（20）。还提供了用于制造这种组分的方法和用于含塑料体的图案化金属化的方法。

3. 发明授权

US07718451B2 Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body 有权
标题翻译：用于制造具有图案化金属化封装体的光电子器件的方法和用于含塑料体的图案化金属化的方法
公开(公告)号：US07718451B2
公开(公告)日：2010-05-18
申请号：US11880717
申请日：2007-07-23
申请人： Thomas Höfer , Herbert Brunner , Frank Möllmer , Günter Waitl , Rainer Sewald , Markus Zeiler
发明人： Thomas Höfer , Herbert Brunner , Frank Möllmer , Günter Waitl , Rainer Sewald , Markus Zeiler
IPC分类号： H01L21/00
CPC分类号： H01L33/60 , B29C45/14639 , B29C45/1671 , B29C2045/0079 , H01L24/48 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01046 , H01L2924/01079 , H01L2924/12041 , H01L2924/12043 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for patterned metallization of a plastic-containing body, which comprises the steps of producing the body via a two-component injection-molding process with at least two plastics, one of which is non-metallizable, and metallizing the body in such a way that a metallized region and a non-metallized region are formed, wherein the non-metallized region is determined by the non-metallizable plastic. A method for the patterned metallization of a plastic-containing body in particular a package body for an optoelectronic device is also provided.
摘要翻译：一种用于含塑料体的图案化金属化的方法，其包括以下步骤：通过具有至少两种塑料的双组分注射成型工艺生产所述主体，其中一种是不可金属化的，并且将所述主体金属化在这种形成金属化区域和非金属化区域的方式，其中非金属化区域由非金属化塑料确定。还提供了一种用于含塑料体的图案化金属化的方法，特别是用于光电子器件的封装体。

4. 发明申请

US20070253667A1 Optoelectronic Component with Multi-Part Housing Body 有权
标题翻译：多部件壳体的光电元件
公开(公告)号：US20070253667A1
公开(公告)日：2007-11-01
申请号：US10593794
申请日：2005-03-09
申请人： Herbert Brunner , Matthias Winter , Markus Zeiler , Georg Bogner , Thomas Hofer
发明人： Herbert Brunner , Matthias Winter , Markus Zeiler , Georg Bogner , Thomas Hofer
IPC分类号： H01L31/0203
CPC分类号： H01L33/60 , H01L31/0203 , H01L31/02325 , H01L33/486 , H01L33/54 , H01L2924/0002 , H01S5/02228 , H01S5/02244 , H01S5/02292 , H01L2924/00
摘要： An optoelectronic component (1) is proposed that comprises a housing body (2) and at least one semiconductor chip (8) disposed thereon, said housing body having a base part (13) comprising a connector body (16), on which a connecting conductor material (6, 7) is disposed, and said housing body having a reflector part (14) comprising a reflector body (23), on which a reflector material (9) is disposed, wherein said connector body and said reflector body are preformed separately from each other and said reflector body is disposed on said connector body in the form of a reflector top.
摘要翻译：提出了一种光电子部件（1），其包括壳体（2）和设置在其上的至少一个半导体芯片（8），所述壳体具有包括连接器主体（16）的基部（13）导体材料（6,7）设置，并且所述壳体具有包括反射体（23）的反射器部分（14），反射器材料（9）设置在所述反射器部分上，其中所述连接器主体和所述反射器主体被预成型彼此分开，并且所述反射器主体以反射器顶部的形式设置在所述连接器主体上。

5. 发明授权

US07446347B2 Optoelectronic component and method for the production thereof, module and device comprising a module of this type 有权
标题翻译：光电元件及其制造方法，包括这种模块的模块和装置
公开(公告)号：US07446347B2
公开(公告)日：2008-11-04
申请号：US10362614
申请日：2001-08-22
申请人： Georg Bogner , Herbert Brunner , Wolfgang Lex , Gunter Waitl
发明人： Georg Bogner , Herbert Brunner , Wolfgang Lex , Gunter Waitl
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L25/13 , H01L25/167 , H01L2224/48091 , H01L2924/01055 , H01L2924/01068 , H01L2924/12041 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to an optoelectronic component, having a semiconductor chip (1) which is mounted on a flexible chip support (6), in which conductor tracks (3, 5) for electrically connecting the semiconductor chip (1) are embodied on a first main face, and on which a housing frame (7) is disposed that is filled with a radiation-permeable medium, in particular a filler compound. A display device, an illumination or backlighting device, and a method for producing components of the invention are also disclosed.
摘要翻译：本发明涉及一种光电子元件，其具有安装在柔性芯片支撑件（6）上的半导体芯片（1），其中用于电连接半导体芯片（1）的导体轨道（3,5）体现在第一主面，并且在其上设置有填充有辐射透过介质，特别是填充剂化合物的壳体框架（7）。本发明还公开了一种显示装置，照明或背光装置及其制造方法。

6. 发明申请

US20080265266A1 Housing for an Optoelectronic Component, Optoelectronic Component and Method for the Production of an Optoelectronic Component 有权
标题翻译：光电元件的壳体，光电元件的制造和光电子元件的制造方法
公开(公告)号：US20080265266A1
公开(公告)日：2008-10-30
申请号：US11575705
申请日：2005-09-20
申请人： Georg Bogner , Herbert Brunner , Michael Hiegler , Gunter Waitl
发明人： Georg Bogner , Herbert Brunner , Michael Hiegler , Gunter Waitl
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L33/486 , H01L2224/48091 , H01L2224/48247 , H01L2924/1815 , H01L2924/00014
摘要： A housing for an optoelectronic component which includes a carrier with a chip mounting surface is disclosed. An optical element which is produced separately from the carrier is applied to the carrier. The chip mounting surface and the optical element define a parting plane, the parting plane between carrier and optical element being arranged in the plane of the chip mounting surface. Also disclosed is an optoelectronic component having a housing of this type and a method for producing an optoelectronic component of this type.
摘要翻译：公开了一种用于光电子部件的壳体，其包括具有芯片安装表面的载体。与载体分开制造的光学元件被施加到载体上。芯片安装表面和光学元件限定了分离平面，载体和光学元件之间的分离平面布置在芯片安装表面的平面内。还公开了具有这种类型的壳体的光电子部件和这种类型的光电子部件的制造方法。

7. 发明授权

US07435997B2 Component comprising a large number of light-emitting-diode chips 有权
标题翻译：包含大量发光二极管芯片的部件
公开(公告)号：US07435997B2
公开(公告)日：2008-10-14
申请号：US10362554
申请日：2001-08-22
申请人： Karlheinz Arndt , Georg Bogner , Herbert Brunner , Gunter Waitl
发明人： Karlheinz Arndt , Georg Bogner , Herbert Brunner , Gunter Waitl
IPC分类号： H01L21/00
CPC分类号： H01L33/486 , H01L25/0753 , H01L33/60 , H01L2924/0002 , H01L2924/00
摘要： A device (1) with a number of light emitting diode chips (5) in a reflector (3) is formed in such a way that the direct line of sight between the light emitting diode chips (5) is interrupted by a partition (11). This improves the efficiency of the device (1) substantially.
摘要翻译：在反射器（3）中具有多个发光二极管芯片（5）的装置（1）形成为使得发光二极管芯片（5）之间的直接视线被隔板（11）中断）。这实质上提高了装置（1）的效率。

8. 发明授权

US07696590B2 Diode housing 有权
标题翻译：二极管外壳
公开(公告)号：US07696590B2
公开(公告)日：2010-04-13
申请号：US12055863
申请日：2008-03-26
申请人： Gunter Waitl , Herbert Brunner
发明人： Gunter Waitl , Herbert Brunner
IPC分类号： H01L31/02 , H01L21/50
CPC分类号： H01L33/486 , H01L24/45 , H01L31/0203 , H01L33/62 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/01019 , H01L2924/01058 , H01L2924/01079 , H01L2924/12041 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要： A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes a cavity extending inwards from the top of the housing. The conductor portions include respective areas that are exposed at the bottom of the cavity. The semiconductor chip is bonded to one of the exposed areas and a wire bonds the chip to the second exposed area. The conductor portions also terminate in exposed electrodes, which allow for electrical connection of the chip with external devices. A window is formed in the cavity and the walls of the housing that form the cavity may be made of a reflective material. The electrodes remain unexposed to the window but for any residual areas about the chip and bonding wire within the first and second exposed areas. By minimizing the area of the conductor exposed to the window, delamination brought about by the different thermal expansions of the window and conductor are minimized and/or eliminated. Likewise, with a reflective housing covering the base of the cavity that accommodates the window, internal radiation reflection is increased over that which was achieved with an exposed conductor.
摘要翻译：设置容纳半导体芯片的壳体。外壳和芯片可用于发送和/或接收辐射。外壳的热门应用可能在发光二极管中。壳体包括被冲压成两个电隔离部分的导体条。壳体还包括从壳体的顶部向内延伸的腔体。导体部分包括暴露在空腔底部的相应区域。半导体芯片被接合到一个暴露区域，并且引线将芯片连接到第二暴露区域。导体部分也终止在暴露的电极中，这允许芯片与外部装置的电连接。在空腔中形成窗口，并且形成空腔的壳体的壁可以由反射材料制成。电极保持未暴露于窗口，但是对于芯片周围的任何残留区域以及在第一和第二暴露区域内的接合线。通过使暴露于窗户的导体的面积最小化，窗口和导体的不同热膨胀引起的分层被最小化和/或消除。类似地，通过覆盖容纳窗口的空腔的基部的反射壳体，内部辐射反射增加超过用暴露的导体实现的内部辐射反射。

9. 发明申请

US20050245018A1 Optoelectronic component 有权
标题翻译：光电元件
公开(公告)号：US20050245018A1
公开(公告)日：2005-11-03
申请号：US10494160
申请日：2002-10-28
申请人： Georg Bogner , Herbert Brunner , Gertrud Krauter , Gunter Waitl
发明人： Georg Bogner , Herbert Brunner , Gertrud Krauter , Gunter Waitl
IPC分类号： H01L33/48 , H01L33/60 , H01L21/8238
CPC分类号： H01L33/486 , H01L33/483 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： Optoelectronic component, having a housing body (2), an optoelectronic semiconductor chip (3) arranged in a recess (6) of the housing body, and having electrical terminals (1A, 1B), the semiconductor chip being electrically conductively connected to the electrical terminals of the leadframe. The housing body (2) is formed from an encapsulation material, with a filler which has a high degree of reflection in a wavelength range from the UV range.
摘要翻译：具有壳体（2）的光电子部件，布置在壳体的凹部（6）中的光电子半导体芯片（3），并且具有电端子（1A，1B），所述半导体芯片导电地连接到引线框的电气端子。壳体（2）由封装材料形成，其中填充物在从UV范围的波长范围内具有高反射度。

10. 发明申请

US20050116238A1 Optoelectronic semiconductor component 有权
标题翻译：光电半导体元件
公开(公告)号：US20050116238A1
公开(公告)日：2005-06-02
申请号：US11002959
申请日：2004-12-02
申请人： Karlheinz Arndt , Herbert Brunner , Franz Schellhorn , Gunter Waitl
发明人： Karlheinz Arndt , Herbert Brunner , Franz Schellhorn , Gunter Waitl
IPC分类号： H01L31/02 , H01L31/0203 , H01L31/0232 , H01L31/024 , H01L33/48 , H01L33/60 , H01L33/64 , H01L27/15
CPC分类号： H01L33/486 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/024 , H01L33/60 , H01L33/642 , H01L33/647 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.
摘要翻译：辐射发射和/或辐射接收半导体部件，其中辐射发射和/或辐射接收半导体芯片固定在引线框架的芯片载体部分上。芯片载体部分在其中固定半导体芯片的区域中形成槽，其中槽的内表面被设计成使得其构成用于由半导体芯片发射和/或接收的辐射的反射器。

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