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    • 4. 发明授权
    • Attenuating phase-shift mask structure and fabrication method
    • 衰减相移掩模结构和制作方法
    • US5503951A
    • 1996-04-02
    • US425667
    • 1995-04-17
    • Steven D. FlandersDavid S. O'Grady
    • Steven D. FlandersDavid S. O'Grady
    • G03F1/32H01L21/027G03F9/00
    • G03F7/2022G03F1/32
    • An attenuating, phase-shift, semiconductor fabrication mask having recessed attenuating and phase-shifting regions that is not susceptible to phase defects in the printing regions of the mask. This desirable result is accomplished by not altering the surface of the fully transmissive regions of the mask and by recessing the attenuating regions of the mask relative to the fully transmissive regions.A method of forming the recessed attenuated phase-shift mask is also included. The process begins by forming recesses in the regions of the mask substrate where phase-shifting is desired and back filling these recessed regions with a selected thickness of attenuating material so that the attenuation effect of the deposited material together with the depth of the recess co-act to shift the light approximately 180.degree. (.pi. radians) from the light transmitted through the adjacent transmissive regions of the mask to create by destructive interference a sharp delineation at the edges of the projected mask image.
    • 具有凹陷衰减和相移区域的衰减相移半导体制造掩模,其对掩模的印刷区域中的相位缺陷不敏感。 这种期望的结果是通过不改变掩模的完全透射区域的表面和通过使掩模的衰减区域相对于完全透射区域凹陷而实现的。 还包括形成凹陷衰减相移掩模的方法。 该过程开始于在掩模基板的区域中形成凹槽,其中需要相移,并且以选定的衰减材料厚度向这些凹陷区域填充这些凹陷区域,使得沉积材料的衰减效应与凹槽的深度共同作用, 用于将光从大约180度(pi弧度)移动通过掩模的相邻透射区域传播的光以通过相消干涉在投影掩模图像的边缘处形成锐利描绘。