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    • 8. 发明授权
    • Nitride-based semiconductor light emitting device
    • 基于氮化物的半导体发光器件
    • US08174035B2
    • 2012-05-08
    • US12836090
    • 2010-07-14
    • Takamichi SumitomoMasaki UenoTakashi KyonoYohei EnyaYusuke Yoshizumi
    • Takamichi SumitomoMasaki UenoTakashi KyonoYohei EnyaYusuke Yoshizumi
    • H01L33/00
    • H01L33/16B82Y20/00H01L33/0075H01L33/14H01L33/32H01L33/40H01S5/0421H01S5/3202H01S5/343H01S5/34333
    • An object is to provide a nitride-based semiconductor light emitting device capable of preventing a Schottky barrier from being formed at an interface between a contact layer and an electrode. LD 1 is provided as a nitride-based semiconductor light emitting device provided with a GaN substrate 3, a hexagonal GaN-based semiconductor region 5 provided on a primary surface S1 of the GaN substrate 3 and including a light emitting layer 11, and a p-electrode 21 provided on the GaN-based semiconductor region 5 and comprised of metal. The GaN-based semiconductor region 5 includes a contact layer 17 involving strain, the contact layer 17 is in contact with the p-electrode, the primary surface S1 extends along a reference plane S5 inclined at a predetermined inclination angle θ from a plane perpendicular to the c-axis direction of the GaN substrate 3, and the inclination angle θ is either in the range of more than 40° and less than 90° or in the range of not less than 150° and less than 180°. The GaN-based semiconductor region 5 is lattice-matched with the GaN substrate 3.
    • 目的是提供一种能够防止在接触层和电极之间的界面处形成肖特基势垒的氮化物系半导体发光元件。 提供LD1作为氮化物系半导体发光器件,其具备设置在GaN衬底3的主表面S1上且包括发光层11的GaN衬底3,六方晶系GaN基半导体区域5和p - 电极21,其设置在GaN基半导体区域5上并且由金属构成。 GaN基半导体区域5包括涉及应变的接触层17,接触层17与p电极接触,主表面S1沿着以预定倾斜角度倾斜的参考平面S5延伸; 从垂直于GaN衬底3的c轴方向的平面以及倾斜角度; 在大于40°且小于90°的范围内或在不小于150°且小于180°的范围内。 GaN基半导体区域5与GaN衬底3晶格匹配。
    • 9. 发明授权
    • Method of fabricating quantum well structure
    • 量子阱结构的制作方法
    • US07955881B2
    • 2011-06-07
    • US12500074
    • 2009-07-09
    • Katsushi AkitaTakamichi SumitomoYohei EnyaTakashi KyonoMasaki Ueno
    • Katsushi AkitaTakamichi SumitomoYohei EnyaTakashi KyonoMasaki Ueno
    • H01L21/00
    • H01L21/0262H01L21/0242H01L21/02458H01L21/0254H01L33/007H01L33/06
    • In the method of fabricating a quantum well structure which includes a well layer and a barrier layer, the well layer is grown at a first temperature on a sapphire substrate. The well layer comprises a group III nitride semiconductor which contains indium as a constituent. An intermediate layer is grown on the InGaN well layer while monotonically increasing the sapphire substrate temperature from the first temperature. The group III nitride semiconductor of the intermediate layer has a band gap energy larger than the band gap energy of the InGaN well layer, and a thickness of the intermediate layer is greater than 1 nm and less than 3 nm in thickness. The barrier layer is grown on the intermediate layer at a second temperature higher than the first temperature. The barrier layer comprising a group III nitride semiconductor and the group III nitride semiconductor of the barrier layer has a band gap energy larger than the band gap energy of the well layer.
    • 在制造包括阱层和势垒层的量子阱结构的方法中,阱层在蓝宝石衬底的第一温度下生长。 阱层包含含有铟作为成分的III族氮化物半导体。 在InGaN阱层上生长中间层,同时使蓝宝石衬底温度从第一温度单调增加。 中间层的III族氮化物半导体的带隙能量大于InGaN阱层的带隙能量,中间层的厚度大于1nm且小于3nm。 阻挡层在高于第一温度的第二温度下在中间层上生长。 包含III族氮化物半导体的阻挡层和势垒层的III族氮化物半导体的带隙能量大于阱层的带隙能量。