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1. 发明授权

US06390351B1 Apparatus and method of transferring conductive balls and apparatus and method of supplying conductive balls 有权
标题翻译：传导导电球的设备及方法及其导电球的供给方法
公开(公告)号：US06390351B1
公开(公告)日：2002-05-21
申请号：US09692208
申请日：2000-10-20
申请人： Teruaki Kasai , Shinji Sasaguri , Kenichi Takakura , Tadahiko Sakai , Kazuo Arikado
发明人： Teruaki Kasai , Shinji Sasaguri , Kenichi Takakura , Tadahiko Sakai , Kazuo Arikado
IPC分类号： B23K100
CPC分类号： B23K3/0623 , B23K2101/36 , H05K3/3478
摘要： A conductive ball transferring apparatus including: an arranging member having in its top face a plurality of recesses in a predetermined arrangement pattern each capable of receiving one conductive ball therein; a tilting mechanism for tilting the arranging member with respect to a horizontal plane; a speed controller for controlling the moving speeds of the conductive balls that move along the top face of the tilted arranging member in a direction the arranging member has been tilted; and a transferring head for picking up the conductive balls arranged by the arranging member and transferring them onto predetermined positions. With this structure, the moving speeds of the conductive balls are stabilized and the conductive balls are arranged into the recesses quickly without fail, and thereby the transferring head can pick up these conductive balls onto predetermined positions promptly.
摘要翻译：一种导电球传送装置，包括：排列构件，其顶面以预定布置图案形成多个凹部，每个凹槽能够在其中容纳一个导电球; 倾斜机构，用于使排列构件相对于水平面倾斜; 速度控制器，用于控制沿所述倾斜排列构件的顶面沿所述排列构件的方向倾斜的导电球的移动速度; 以及用于拾取由排列构件布置的导电球并将它们转移到预定位置的转印头。利用这种结构，导电球的移动速度稳定，并且导电球快速地排列到凹部中，因此转印头可以迅速地将这些导电球拾取到预定位置。

2. 发明授权

US06237219B1 Method of mounting conductive ball 有权
标题翻译：安装导电球的方法
公开(公告)号：US06237219B1
公开(公告)日：2001-05-29
申请号：US09264160
申请日：1999-03-05
申请人： Kazuo Arikado , Teruaki Kasai , Shinji Sasaguri , Norifumi Eguchi
发明人： Kazuo Arikado , Teruaki Kasai , Shinji Sasaguri , Norifumi Eguchi
IPC分类号： H01R900
CPC分类号： H01L21/67138 , H01L21/4853 , H01L21/67144 , H05K3/3478 , Y10T29/49149 , Y10T29/49829 , Y10T29/53191
摘要： In a mounting apparatus for mounting conductive ball where a conductive ball 2 is picked up by vacuum to a suction hole 31a formed in the bottom of a suction head 31 for mounting on a workpiece, a reference wave form that represents the amount of light detected at a light detector 43b when a suction head 31 is sucking a conductive ball 2 rightly in the normal state is compared with a wave form detected at the light detector 43b when actually mounting the conductive ball; also a reference wave form detected at the light detector 43b when there is no conductive ball 2 at all on the suction head 31 is compared with a wave form detected at the light detector 43b after mounting of the conductive ball is finished. Through the above described processing, errors in the light interruption that stem from a tilted suction head 31 and machining errors during processing of suction holes 31 are eliminated, and the existence, or non-existence, of the conductive ball 2 is detected at a high accuracy level.
摘要翻译：在用于安装导电球的安装装置中，其中导电球2被真空地吸附到形成在用于安装在工件上的吸头31的底部中的吸孔31a，基准波形表示在当吸头31正常地将导电球2吸入正常状态时的光检测器43b与在实际安装导电球时在光检测器43b检测到的波形进行比较; 在吸引头31上根本不存在导电球2的情况下，在光检测器43b处检测到的基准波形与在导电球的安装结束后在光检测器43b检测到的波形进行比较。通过上述处理，消除了由倾斜的吸头31产生的光中断的误差和在吸入孔31的加工过程中的加工误差，并且导电球2的存在或不存在被检测到高精度水平。

3. 发明授权

US08192578B2 Chip pickup apparatus, chip pickup method, chip releasing device and chip releasing method 有权
标题翻译：芯片拾取装置，芯片拾取方法，芯片释放装置和芯片释放方法
公开(公告)号：US08192578B2
公开(公告)日：2012-06-05
申请号：US12089865
申请日：2006-10-13
申请人： Hiroshi Haji , Mitsuru Ozono , Teruaki Kasai , Kazuhiro Noda
发明人： Hiroshi Haji , Mitsuru Ozono , Teruaki Kasai , Kazuhiro Noda
IPC分类号： B32B38/10
CPC分类号： H01L21/67132 , H01L21/67092 , Y10S156/932 , Y10S156/943 , Y10S438/976 , Y10T156/1132 , Y10T156/1179 , Y10T156/1195 , Y10T156/1944 , Y10T156/1983 , Y10T156/1994
摘要： In the pickup apparatus wherein a chip adhered on a sheet is sucked and held by a picking nozzle and then picked up by the nozzle, a sheet push-up member configured by forming flexible elastic material such as rubber in a spherical shape is attached on the abutment supporting surface of the upper surface of a tool, then the push-up surface of the sheet push-up member is followed in a flat surface state along the lower surface of the sheet and abutted thereto in the moving down state of the picking nozzle, and then the push-up surface pushes up the lower surface of the sheet while being deformed in a upwardly protruded curved surface shape in the moving up operation where the picking nozzle moves up together with the chip. Thus, the chip can be released from the sheet from the outer peripheral side of the chip.
摘要翻译：在拾取装置中，附着在片材上的芯片由拾取喷嘴吸引并保持，然后由喷嘴拾起，将通过形成球形的诸如橡胶的柔性弹性材料构成的片状上推构件安装在工具上表面的基台支撑表面，则片材上推构件的上推表面沿着片材的下表面处于平坦表面状态，并且在拾取喷嘴的向下移动状态下与其邻接然后在拾取喷嘴与芯片一起向上移动的上移操作中，上推表面向上推动纸张的下表面，同时以向上突出的曲面形状变形。因此，芯片可以从芯片的外周侧从片材释放。

4. 发明授权

US08614118B2 Component bonding method, component laminating method and bonded component structure 有权
标题翻译：组分粘合方法，组分层压方法和结合组分结构
公开(公告)号：US08614118B2
公开(公告)日：2013-12-24
申请号：US12280615
申请日：2007-02-09
申请人： Hiroshi Haji , Mitsuru Ozono , Teruaki Kasai , Masaru Nonomura
发明人： Hiroshi Haji , Mitsuru Ozono , Teruaki Kasai , Masaru Nonomura
IPC分类号： H01L21/00
CPC分类号： H01L24/83 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/75 , H01L25/0657 , H01L25/50 , H01L2224/29007 , H01L2224/2919 , H01L2224/29298 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83191 , H01L2224/83193 , H01L2224/83855 , H01L2224/83856 , H01L2224/92247 , H01L2225/0651 , H01L2225/06575 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01033 , H01L2924/01057 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： Provided is a component bonding method of bonding a semiconductor component having a thermosetting adhesive layer formed on a lower surface thereof to a circuit board having a resin layer formed on a surface thereof. In the method, wettability is improved by surface modification that performs a plasma treatment on a resin surface of the circuit board, the semiconductor component is held by a component holding nozzle having a heater, the adhesive layer is contacted to the surface-modified resin layer, and the adhesive layer is heated and thermally cured by the heater. Thereby, adhesion between the adhesive layer and the resin surface is improved, and thus the component holding nozzle can be separated from the semiconductor component without wait for completely hardening the adhesive layer. Accordingly, it is possible to improve productivity in the heat pressing process by reducing the time required for the component bonding.
摘要翻译：提供了一种将在其下表面上形成有热固性粘合层的半导体部件与其表面上形成有树脂层的电路板接合的部件接合方法。在该方法中，通过对电路板的树脂表面进行等离子体处理的表面改性来提高润湿性，半导体部件由具有加热器的部件保持喷嘴保持，粘合层与表面改性树脂层接触，并且通过加热器加热并热固化粘合剂层。由此，可以提高粘合剂层与树脂表面之间的粘附性，从而能够使部件保持用喷嘴与半导体部件分离，而不用等待粘合剂层的完全硬化。因此，通过减少部件接合所需的时间，可以提高热压加工的生产率。

5. 发明授权

US07632374B2 Method and apparatus for picking up semiconductor chip and suction and exfoliation tool used therefor 有权
标题翻译：拾取用于其的半导体芯片和抽吸和剥离工具的方法和装置
公开(公告)号：US07632374B2
公开(公告)日：2009-12-15
申请号：US10620184
申请日：2003-07-15
申请人： Mitsuru Ozono , Teruaki Kasai
发明人： Mitsuru Ozono , Teruaki Kasai
IPC分类号： B32B38/10
CPC分类号： H01L21/67132 , H01L21/6838 , Y10S438/976 , Y10T156/1132 , Y10T156/1944
摘要： In an adhesive sheet exfoliation process in a pick-up operation for a thin-type chip 6 adhered to the adhesive sheet 5, a suction exfoliation tool 22 provided at its adhesion surface 22a with plural suction grooves 22b is abutted against the lower surface of the adhesive sheet 5. Then, air within the suction grooves 22b are vacuum-sucked to bend and deform the adhesive sheet 5 together with the chip 6 thereby to exfoliate the adhesive sheet 5 from the lower surface of the chip 6 due to such bending deformation. Thus, it is possible to realize the picking-up operation with high productivity without causing a problem such as breakage or crack.
摘要翻译：在粘附到粘合片5上的薄型芯片6的拾取操作中的粘合片剥离处理中，在其具有多个抽吸槽22b的粘合表面22a上设置的吸附剥离工具22抵靠在然后，吸引槽22b内的空气被真空吸附，使得粘合片5与芯片6一起弯曲变形，从而由于这种弯曲变形而使粘合片5从芯片6的下表面剥离。因此，可以以高生产率实现拾取操作，而不会引起诸如断裂或破裂的问题。

6. 发明授权

US5601229A Conductive metal ball attaching apparatus and method, and bump forming method 失效
标题翻译：导电金属球附着装置及方法及凸块形成方法
公开(公告)号：US5601229A
公开(公告)日：1997-02-11
申请号：US562959
申请日：1995-11-27
申请人： Siniti Nakazato , Teruaki Kasai
发明人： Siniti Nakazato , Teruaki Kasai
IPC分类号： B23K3/06 , B23K3/08 , H01L21/48 , H01L21/60 , H01L21/66 , H01L21/68 , H05K1/02 , H05K3/34 , B23K1/00 , B23K3/00
CPC分类号： B23K3/0623 , B23K3/082 , H01L21/4853 , H01L21/6835 , H01L24/11 , H05K3/3478 , B23K2201/40 , H01L22/12 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01079 , H01L2924/014 , H05K1/0269 , H05K2203/041 , H05K2203/082 , H05K2203/163 , H05K3/3489
摘要： In a solder ball attaching apparatus, a pickup head is lowered and raised just above a solder ball feed section so as to pick up a large number of solder balls. The pickup head then moves to a position just above a flux feed section where the pickup head is lowered and raised so as to flux the solder balls. Further, the pickup head moves to a position just above a workpiece where the pickup head is lowered and raised so as to attach the solder balls onto electrodes of the workpiece. Alongside a transfer path of the pickup head are arranged first and second line light sources, a light-emitting element and a light-receiving element for monitoring presence or absence of a solder ball pickup error, dislodging of the solder ball and a solder ball attaching error.
摘要翻译：在焊球附着装置中，拾取头下降并刚刚在焊球进给部分上升，以便拾取大量的焊球。拾取头然后移动到拾取头下降并升高的磁通馈送部分正上方的位置，以便焊接焊球。此外，拾取头移动到正好在工件上方的拾取头下降并升高的位置，以将焊球附着到工件的电极上。除了拾取头的传送路径之外，配置有第一和第二线光源，发光元件和用于监测焊球拾取误差的存在或不存在的光接收元件，焊球的移动和焊球附着错误。

7. 发明申请

US20090279995A1 CHIP PICKUP APPARATUS, CHIP PICKUP METHOD, CHIP RELEASING DEVICE AND CHIP RELEASING METHOD 有权
标题翻译：芯片拾取装置，芯片取样方法，芯片释放装置和芯片释放方法
公开(公告)号：US20090279995A1
公开(公告)日：2009-11-12
申请号：US12089865
申请日：2006-10-13
申请人： Hiroshi Haji , Mitsuru Ozono , Teruaki Kasai , Kazuhiro Noda
发明人： Hiroshi Haji , Mitsuru Ozono , Teruaki Kasai , Kazuhiro Noda
IPC分类号： H01L21/67 , H01L21/52
CPC分类号： H01L21/67132 , H01L21/67092 , Y10S156/932 , Y10S156/943 , Y10S438/976 , Y10T156/1132 , Y10T156/1179 , Y10T156/1195 , Y10T156/1944 , Y10T156/1983 , Y10T156/1994
摘要： An object of the invention is to provide a chip pickup apparatus, a chip pickup method, a chip releasing device and a chip releasing method in each of which chips can be picked up at a high speed without being damaged.In the pickup apparatus wherein a chip 6 adhered on a sheet 5 is sucked and held by a picking nozzle 20 and then picked up by the nozzle, a sheet push-up member 24 configured by forming flexible elastic material such as rubber in a spherical shape is attached on the abutment supporting surface of the upper surface of a tool 20, then the push-up surface of the sheet push-up member 24 is followed in a flat surface state along the lower surface of the sheet 5 and abutted thereto in the moving down state of the picking nozzle 20, and then the push-up surface pushes up the lower surface of the sheet 5 while being deformed in a upwardly protruded curved surface shape in the moving up operation where the picking nozzle 20 moves up together with the chip 6. Thus, the chip 6 can be released from the sheet 5 from the outer peripheral side of the chip.
摘要翻译：本发明的目的是提供一种芯片拾取装置，芯片拾取方法，芯片释放装置和芯片释放方法，其中每个芯片可以高速拾取而不被损坏。在粘贴在片材5上的芯片6被拾取喷嘴20吸引并被喷嘴拾取的拾取装置中，通过形成诸如橡胶的柔性弹性材料为球形的片状上推构件24，被附着在工具20的上表面的基台支撑面上，然后沿着片材5的下表面沿着平面状态跟随片上推构件24的上推表面，并与其邻接在拾取喷嘴20的向下移动状态下，上推面向上推动片材5的下表面，同时在拾取喷嘴20与上述突出的曲面形状一起向上突出的曲面形状中变形，因此，芯片6可以从片材5从芯片的外周侧释放。

8. 发明申请

US20090202333A1 ELECTRONIC COMPONENT PICKUP METHOD, ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT MOUNTING APPARATUS 审中-公开
标题翻译：电子元件拾取方法，电子元件安装方法和电子元件安装设备
公开(公告)号：US20090202333A1
公开(公告)日：2009-08-13
申请号：US11576386
申请日：2005-10-04
申请人： Mitsuru Ozono , Hiroshi Haji , Teruaki Kasai
发明人： Mitsuru Ozono , Hiroshi Haji , Teruaki Kasai
IPC分类号： H01L21/673 , H01L21/677 , H01L21/67
CPC分类号： H01L21/67144 , H01L21/67132
摘要： This invention intends to provide an electronic component pick-up method, an electronic component loading method and an electronic component loading apparatus which arecapable of executing a pick-up operation of an electronic component adhesively held on a carrier stably and with high productivity.In an electronic component pick-up method for picking up a chip 6 adhesively held by an adhesive layer 5a on a sheet 5, as the adhesive layer 5a, an adhesive containing a compound generating a nitrogen gas by application of ultraviolet rays is employed. In the pick-up operation, with a light applying unit 8 being located beneath the chip 6 to be picked up, ultraviolet rays is applied to the adhesive layer 5a located on the rear side of the chip 6 from the lower side of the sheet 5, and the chip 6 is picked up by bringing the holding tool 20 into contact with the upper surface of the chip 6 in a state where the nitrogen gas generated from the adhesive layer 5a has created a gaseous layer G between a bonding boundary between the rear surface of the chip 6 and the adhesive layer 5a.
摘要翻译：本发明旨在提供一种电子部件拾取方法，电子部件装载方法和电子部件装载装置，其能够以高生产率稳定地执行粘附在载体上的电子部件的拾取操作。在用于拾取由片材5上的粘合剂层5a粘附的芯片6的电子元件拾取方法中，作为粘合剂层5a，采用含有通过施加紫外线产生氮气的化合物的粘合剂。在拾取操作中，通过将光拾取单元8位于待拾取的芯片6下方，将紫外线从片材5的下侧施加到位于芯片6的后侧的粘合剂层5a ，并且通过使夹持工具20与粘合剂层5a产生的氮气在后面的粘合边界之间产生气态G的状态下使保持工具20与芯片6的上表面接触来拾取芯片6。芯片6和粘合剂层5a的表面。

9. 发明申请

US20090035892A1 Component Bonding Method, Component Laminating Method And Bonded Component Structure 有权
标题翻译：组分粘合方法，组分层压方法和粘结组分结构
公开(公告)号：US20090035892A1
公开(公告)日：2009-02-05
申请号：US12280615
申请日：2007-02-09
申请人： Hiroshi Haji , Mitsuru Ozono , Teruaki Kasai , Masaru Nonomura
发明人： Hiroshi Haji , Mitsuru Ozono , Teruaki Kasai , Masaru Nonomura
IPC分类号： H01L21/00
CPC分类号： H01L24/83 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/75 , H01L25/0657 , H01L25/50 , H01L2224/29007 , H01L2224/2919 , H01L2224/29298 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83191 , H01L2224/83193 , H01L2224/83855 , H01L2224/83856 , H01L2224/92247 , H01L2225/0651 , H01L2225/06575 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01033 , H01L2924/01057 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： It is an object of the invention to provide a component bonding method and a component laminating method that can improve productivity in the heat pressing process.Provided is a component bonding method of bonding a semiconductor component (13) having a thermosetting adhesive layer (13a) formed on a lower surface thereof to a circuit board (5) having a resin layer formed on a surface thereof. In the method, wettability is improved by surface modification that performs a plasma treatment on a resin surface (5a) of the circuit board (5), the semiconductor component (13) is held by a component holding nozzle (12) having a heater, the adhesive layer (13c) is contacted to the surface-modified resin layer, and the adhesive layer (13c) is heated and thermally cured by the heater. Thereby, adhesion between the adhesive layer (13c) and the resin surface (5a) is improved, and thus the component holding nozzle (12) can be separated from the semiconductor component (13) without wait for completely hardening the adhesive layer (13c). Accordingly, it is possible to improve productivity in the heat pressing process by reducing the time required for the component bonding.
摘要翻译：本发明的目的是提供一种能够提高热压工序的生产率的部件接合方法和部件层压方法。提供了一种将其下表面上具有热固性粘合剂层（13a）的半导体组件（13）接合到其表面上形成有树脂层的电路板（5）的部件接合方法。在该方法中，通过对电路板（5）的树脂表面（5a）进行等离子体处理的表面改性改善了润湿性，半导体部件（13）由具有加热器的部件保持喷嘴（12）保持，粘合层（13c）与表面改性树脂层接触，粘合剂层（13c）被加热器加热固化。由此，提高了粘合剂层（13c）与树脂表面（5a）之间的粘附性，从而能够使部件保持喷嘴（12）与半导体部件（13）分离，而不必等待粘合剂层（13c）的完全硬化，。因此，通过减少部件接合所需的时间，可以提高热压加工的生产率。

10. 发明申请

US20090000109A1 Electronic Component Pickup Method, Electronic Component Mounting Method and Electronic Component Mounting Apparatus 审中-公开
标题翻译：电子部件拾取方法，电子部件安装方法和电子部件安装装置
公开(公告)号：US20090000109A1
公开(公告)日：2009-01-01
申请号：US11576362
申请日：2005-10-04
申请人： Mitsuru Ozono , Hiroshi Haji , Teruaki Kasai
发明人： Mitsuru Ozono , Hiroshi Haji , Teruaki Kasai
IPC分类号： B23P19/00
CPC分类号： H01L21/67144 , H01L21/67132 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53091 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183
摘要： To provide an electronic component pickup method, an electronic component mounting method and an electronic component mounting device capable of stably picking up, with high productivity, an electronic component adhered and held to a carrier.An electronic component pickup method for picking up a chip 6 adhered and held to a sheet 5 with an adhesive layer 5a by way of a support tool 20 uses an adhesive containing a compound that generates a gas by radiation of light. In the pickup operation, the support tool 20 is brought into contact with the top surface of the chip 6 and a light radiating part 8 is positioned below the chip 6. Then ultraviolet light is radiated from the bottom surface of the sheet 5 onto the adhesive layer 5a positioned on the rear surface of the chip 6. When a nitrogen gas generated from the adhesive layer 5a has formed a gas layer G at the adhesive interface between the rear surface of the chip 6 and the adhesive layer 5a, the support tool 20 is lifted to pick up the chip 6.
摘要翻译：为了提供电子部件拾取方法，电子部件安装方法和电子部件安装装置，能够以高生产率稳定地拾取附着并保持在载体上的电子部件。用于通过支撑工具20拾取用粘合剂层5a粘附并保持在片材5上的芯片6的电子部件拾取方法使用含有通过辐射产生气体的化合物的粘合剂。在拾取操作中，支撑工具20与芯片6的顶表面接触，并且光辐射部分8位于芯片6的下方。然后紫外线从片材5的底表面辐射到粘合剂位于芯片6的后表面上的层5a。当从粘合剂层5a产生的氮气在芯片6的后表面和粘合剂层5a之间的粘合界面处形成气体层G时，支撑工具20 被提起拿起芯片6。

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