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1. 发明授权

US06237219B1 Method of mounting conductive ball 有权
标题翻译：安装导电球的方法
公开(公告)号：US06237219B1
公开(公告)日：2001-05-29
申请号：US09264160
申请日：1999-03-05
申请人： Kazuo Arikado , Teruaki Kasai , Shinji Sasaguri , Norifumi Eguchi
发明人： Kazuo Arikado , Teruaki Kasai , Shinji Sasaguri , Norifumi Eguchi
IPC分类号： H01R900
CPC分类号： H01L21/67138 , H01L21/4853 , H01L21/67144 , H05K3/3478 , Y10T29/49149 , Y10T29/49829 , Y10T29/53191
摘要： In a mounting apparatus for mounting conductive ball where a conductive ball 2 is picked up by vacuum to a suction hole 31a formed in the bottom of a suction head 31 for mounting on a workpiece, a reference wave form that represents the amount of light detected at a light detector 43b when a suction head 31 is sucking a conductive ball 2 rightly in the normal state is compared with a wave form detected at the light detector 43b when actually mounting the conductive ball; also a reference wave form detected at the light detector 43b when there is no conductive ball 2 at all on the suction head 31 is compared with a wave form detected at the light detector 43b after mounting of the conductive ball is finished. Through the above described processing, errors in the light interruption that stem from a tilted suction head 31 and machining errors during processing of suction holes 31 are eliminated, and the existence, or non-existence, of the conductive ball 2 is detected at a high accuracy level.
摘要翻译：在用于安装导电球的安装装置中，其中导电球2被真空地吸附到形成在用于安装在工件上的吸头31的底部中的吸孔31a，基准波形表示在当吸头31正常地将导电球2吸入正常状态时的光检测器43b与在实际安装导电球时在光检测器43b检测到的波形进行比较; 在吸引头31上根本不存在导电球2的情况下，在光检测器43b处检测到的基准波形与在导电球的安装结束后在光检测器43b检测到的波形进行比较。通过上述处理，消除了由倾斜的吸头31产生的光中断的误差和在吸入孔31的加工过程中的加工误差，并且导电球2的存在或不存在被检测到高精度水平。

2. 发明授权

US06390351B1 Apparatus and method of transferring conductive balls and apparatus and method of supplying conductive balls 有权
标题翻译：传导导电球的设备及方法及其导电球的供给方法
公开(公告)号：US06390351B1
公开(公告)日：2002-05-21
申请号：US09692208
申请日：2000-10-20
申请人： Teruaki Kasai , Shinji Sasaguri , Kenichi Takakura , Tadahiko Sakai , Kazuo Arikado
发明人： Teruaki Kasai , Shinji Sasaguri , Kenichi Takakura , Tadahiko Sakai , Kazuo Arikado
IPC分类号： B23K100
CPC分类号： B23K3/0623 , B23K2101/36 , H05K3/3478
摘要： A conductive ball transferring apparatus including: an arranging member having in its top face a plurality of recesses in a predetermined arrangement pattern each capable of receiving one conductive ball therein; a tilting mechanism for tilting the arranging member with respect to a horizontal plane; a speed controller for controlling the moving speeds of the conductive balls that move along the top face of the tilted arranging member in a direction the arranging member has been tilted; and a transferring head for picking up the conductive balls arranged by the arranging member and transferring them onto predetermined positions. With this structure, the moving speeds of the conductive balls are stabilized and the conductive balls are arranged into the recesses quickly without fail, and thereby the transferring head can pick up these conductive balls onto predetermined positions promptly.
摘要翻译：一种导电球传送装置，包括：排列构件，其顶面以预定布置图案形成多个凹部，每个凹槽能够在其中容纳一个导电球; 倾斜机构，用于使排列构件相对于水平面倾斜; 速度控制器，用于控制沿所述倾斜排列构件的顶面沿所述排列构件的方向倾斜的导电球的移动速度; 以及用于拾取由排列构件布置的导电球并将它们转移到预定位置的转印头。利用这种结构，导电球的移动速度稳定，并且导电球快速地排列到凹部中，因此转印头可以迅速地将这些导电球拾取到预定位置。

3. 发明授权

US6099681A Mounting apparatus for mounting small balls and mounting method thereof 有权
标题翻译：用于安装小球的安装装置及其安装方法
公开(公告)号：US6099681A
公开(公告)日：2000-08-08
申请号：US131819
申请日：1998-08-10
申请人： Kazuo Arikado , Shinichi Nakazato
发明人： Kazuo Arikado , Shinichi Nakazato
IPC分类号： B23K3/06 , H01L21/60 , H05K3/34 , B32B31/00
CPC分类号： B23K3/0623 , H05K3/3478 , B23K2201/42 , H05K2203/041 , H05K2203/082 , H05K2203/163 , H05K3/3489
摘要： When applying a flux 2 kept in a container 16 onto a conductive ball 1, the flux 2 is first applied by a squeegee unit 17 on a bottom 16a of container 16 in the form of layer having a certain predetermined layer thickness. Then, a suction head 20 holding a solder ball 1 is lowered towards the container 16. As soon as a touch sensor 43 detects a touching of the solder ball 1 to the bottom 16a, the suction head 20 is lifted, and the solder ball 1 held to the suction head 20 is transferred onto a workpiece. Thus a solder ball 1 may be transferred onto a workpiece after being applied with a certain specific amount of flux 2 with precision.
摘要翻译：当将保持在容器16中的助焊剂2施加到导电球1上时，首先通过刮板单元17将容器16以具有一定预定层厚度的层的形式施加在容器16的底部16a上。然后，保持焊球1的吸头20朝向容器16降低。一旦触摸传感器43检测到焊球1与底部16a的接触，抽吸头20被提起，并且焊球1 保持在吸头20上的工件被转移到工件上。因此，可以在精确地施加一定量的焊剂2之后将焊球1转印到工件上。

4. 发明授权

US5443200A Bonding apparatus and bonding method 失效
标题翻译：接合装置和接合方法
公开(公告)号：US5443200A
公开(公告)日：1995-08-22
申请号：US216402
申请日：1994-03-23
申请人： Kazuo Arikado
发明人： Kazuo Arikado
IPC分类号： B23K20/00
CPC分类号： H01L24/85 , B23K20/005 , H01L24/78 , H01L2224/05554 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/49175 , H01L2224/73215 , H01L2224/78268 , H01L2224/78301 , H01L2224/78308 , H01L2224/85045 , H01L2224/85205 , H01L2224/859 , H01L24/45 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082
摘要： An apparatus for bonding such as wire bonding or inner lead bonding comprises a holding unit for holding an object to be bonded, a supporting unit for mounting thereto the holding unit, a driving unit for moving upwardly and downwardly the supporting unit, and a drive control circuit for controlling the driving unit in accordance with stored information about operations of the supporting member. The bonding apparatus includes a control unit for changing a gain characteristic of the drive control circuit from a high gain characteristic to a low gain characteristic while the holding unit is caused to descend before this holding unit is contacted onto a bonding surface.
摘要翻译：诸如引线接合或内部引线接合的接合装置包括用于保持被接合物体的保持单元，用于安装到保持单元的支撑单元，用于向上和向下移动支撑单元的驱动单元，以及驱动控制电路，用于根据关于支撑构件的操作的存储信息来控制驱动单元。接合装置包括控制单元，用于在保持单元在接合表面之前使保持单元下降时，将驱动控制电路的增益特性从高增益特性改变为低增益特性。

5. 发明授权

US6041996A Method of pressure bonding a bumped electronic part and an apparatus for pressure bonding a bumped electronic part 失效
标题翻译：凸起的电子部件的压接方法和用于压接凸起的电子部件的装置
公开(公告)号：US6041996A
公开(公告)日：2000-03-28
申请号：US975543
申请日：1997-11-20
申请人： Kazuo Arikado
发明人： Kazuo Arikado
IPC分类号： B23K20/02 , B23K37/047 , B23K31/02 , B23K31/12 , B21D39/00
CPC分类号： B23K20/02 , B23K37/047 , B23K2201/40 , H01L2224/75 , H01L2224/75743
摘要： A method of pressure bonding a bumped electronic part using: a tilting mechanism which tiltably supports a suction tool for sucking a bumped electronic part; and locking means for inhibiting a tilting operation of the tilting mechanism. The method includes: a suction step of sucking the bumped electronic part to the suction tool; a step of detecting the position of the bumped electronic part which is sucked to the suction tool, and positioning the bumped electronic part with respect to a substrate, under a state where the tilting operation is inhibited; and a pressure bonding step of pressure bonding bumps of the bumped electronic part which is sucked to the suction tool, to the substrate under a state where the tilting operation is enabled. According to this arrangement, the tilting mechanism is not accidentally swung during the positioning operation, and hence the mounting accuracy is prevented from being impaired.
摘要翻译：一种用于使用以下方式压接凸起的电子部件的方法：倾斜机构，其倾斜地支撑吸引凸起的电子部件的吸引工具; 以及用于禁止倾斜机构的倾斜操作的锁定装置。该方法包括：将凸起的电子部件吸入吸引工具的抽吸步骤; 在倾斜操作被禁止的状态下，检测被吸引到吸引工具的凸起的电子部件的位置并相对于基板定位凸起的电子部件的步骤; 以及在能够进行倾斜操作的状态下，将被吸引到吸引工具的凸起的电子部件的凸块的压接结合到基板的压接工序。根据该结构，倾斜机构在定位运转时不会意外摆动，防止了安装精度的损害。

6. 发明授权

US07047632B2 Method of mounting electronic components 失效
标题翻译：安装电子元器件的方法
公开(公告)号：US07047632B2
公开(公告)日：2006-05-23
申请号：US10267853
申请日：2002-10-10
申请人： Kazuo Arikado
发明人： Kazuo Arikado
IPC分类号： H05K3/30
CPC分类号： H01L21/67144 , H01L21/6838 , H01L24/75 , Y10T29/49117 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49137
摘要： An electronic component mounting apparatus removes an electronic component supplied to a part feeder in face-up status and mounts it to a board. A flip-chip supplied from a first holding table is removed and flipped over by a take-out head and then delivered to a mounting head, which mounts the component on the board. A die supplied from a second holding table is picked up directly and mounted to the board by the mounting head. This structure allows a single mounting apparatus to perform both die bonding and flip-chip bonding.
摘要翻译：电子部件安装装置以面朝上的状态去除供给部件供给部的电子部件，并将其安装在基板上。从第一保持台提供的倒装芯片由取出头移除并翻转，然后被输送到将元件安装在板上的安装头。从第二保持台提供的模具被直接拾取并通过安装头安装到板上。这种结构允许单个安装设备执行管芯接合和倒装芯片接合。

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