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1. 发明授权

US06605531B1 Hole-filling technique using CVD aluminum and PVD aluminum integration 失效
标题翻译：使用CVD铝和PVD铝整合的填孔技术
公开(公告)号：US06605531B1
公开(公告)日：2003-08-12
申请号：US09127010
申请日：1998-07-31
申请人： Ted Guo , Wei Shi , Liang-Yuh Chen
发明人： Ted Guo , Wei Shi , Liang-Yuh Chen
IPC分类号： H01L214763
CPC分类号： H01L21/2855 , H01L21/28556 , H01L21/76882
摘要： The present invention provides a method for filling an aperture on a substrate by depositing a metal film on the substrate of insufficient thickness to fill the sub half-micron aperture and then annealing the substrate in a low pressure chamber at a temperature below a melting point of the deposited metal film. The present invention further provides forming a planarized film over the void-free aperture by physical vapor depositing a metal film over the annealed film.
摘要翻译：本发明提供了一种通过在基板上沉积不足厚度的金属膜来填充基板上的孔的方法，以填充次半微米孔径，然后在低压室内在低于熔点的温度下将基板退火沉积金属膜。本发明还提供了通过在退火膜上物理气相沉积金属膜而在无空隙孔上形成平坦化膜。

2. 发明授权

US09346791B2 Itraconazole analogs and use thereof 有权
标题翻译：伊曲康唑类似物及其用途
公开(公告)号：US09346791B2
公开(公告)日：2016-05-24
申请号：US14343040
申请日：2012-09-07
申请人： Jun O. Liu , Wei Shi , Kalyan Kumar Pasunooti
发明人： Jun O. Liu , Wei Shi , Kalyan Kumar Pasunooti
IPC分类号： C07D405/14 , A61K31/496 , A61K31/506
CPC分类号： C07D405/14 , A61K31/496 , A61K31/506
摘要： Provided herein are Itraconazole analogs. Also provided herein are methods of inhibition of Hedgehog pathway, vascular endothelial growth factor receptor 2 (VEGFR2) glycosylation, angiogenesis and treatment of disease with Itraconazole analogs.
摘要翻译：本文提供伊曲康唑类似物。本文还提供了抑制Hedgehog途径，血管内皮生长因子受体2（VEGFR2）糖基化，血管生成和伊曲康唑类似物治疗疾病的方法。

3. 发明申请

US20130301625A1 AGGREGATION OF INFORMATION UNITS IN A WIRELESS NETWORK 审中-公开
标题翻译：在无线网络中聚合信息单元
公开(公告)号：US20130301625A1
公开(公告)日：2013-11-14
申请号：US13470035
申请日：2012-05-11
申请人： Alexander Thoukydides , Fei Tong , Wei Shi
发明人： Alexander Thoukydides , Fei Tong , Wei Shi
IPC分类号： H04W84/12 , H04W84/02
CPC分类号： H04W28/06
摘要： The present application relates to a method for transmitting information from a wireless access point to one or more wireless stations. The method comprises aggregating a plurality of information units of compatible types, such as MAC protocol data units (MPDUs) or acknowledgements into a single data frame, modulating the single data frame and transmitting the modulated data frame containing the plurality of information units to the one or more wireless stations.
摘要翻译：本申请涉及一种从无线接入点向一个或多个无线站发送信息的方法。该方法包括将多个兼容类型的信息单元（例如MAC协议数据单元（MPDU）或确认）聚合到单个数据帧中，调制单个数据帧并将包含多个信息单元的调制数据帧发送到一个或更多的无线电台。

4. 发明授权

US08129144B2 Papilloma pseudovirus and preparation 失效
标题翻译：乳糜假病毒及其制备
公开(公告)号：US08129144B2
公开(公告)日：2012-03-06
申请号：US11784626
申请日：2007-04-09
申请人： Liang Qiao , Wei Shi , Yujun Huang , Jianzhong Liu
发明人： Liang Qiao , Wei Shi , Yujun Huang , Jianzhong Liu
IPC分类号： C12P21/06
CPC分类号： C12N7/00 , A61K2039/525 , C12N2710/20023 , C12N2710/20061
摘要： The invention involves a papilloma pseudovirus that can induce immune response after oral intake as well as its preparation. It is characterized in that HPV or BPV pseudovirus are made by disrupting HPV-VLP or BPV-VLP, mixing them with plasmids (plasmids or DNA vaccine), and reassembling them into the pseudoviruses (VLPs with plasmids inside). Oral administration of the pseudoviruses will result in delivery to mucosal and systemic lymphoid tissues and induce immune responses for disease prevention and treatment. The pseudovirus induces stronger immune response than DNA vaccines. Additionally, the pseudovirus can be applied in gene therapy by bringing the therapeutic genes into lymphoid tissues in the human body.
摘要翻译：本发明涉及一种乳头状假性假病毒，可在口服摄入后诱导免疫反应及其制备。其特征在于HPV或BPV假病毒通过破坏HPV-VLP或BPV-VLP，与质粒（质粒或DNA疫苗）混合并将其重新组装成假病毒（其中具有质粒的VLP）而制备。假性病毒的口服给药将导致输送到粘膜和系统性淋巴组织，并诱导用于疾病预防和治疗的免疫应答。假DNA病毒诱导比DNA疫苗更强的免疫应答。此外，假病毒可以通过将治疗基因引入人体的淋巴组织来应用于基因治疗。

5. 发明授权

US08049236B2 Non-global solder mask LED assembly 有权
标题翻译：非全局焊接面罩LED组件
公开(公告)号：US08049236B2
公开(公告)日：2011-11-01
申请号：US12239494
申请日：2008-09-26
申请人： Wei Shi , Alex Shaikevitch
发明人： Wei Shi , Alex Shaikevitch
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/54 , H01L33/60 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49175 , H05K1/0274 , H05K3/28 , H05K2201/0989 , H05K2201/10106 , H05K2201/2054 , H01L2924/00 , H01L2924/00014
摘要： A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.
摘要翻译：用于LED组件的基板可以具有形成在其中的多个杯。至少一杯可以在另一杯内形成。例如，杯可以相对于彼此共轴。衬底的加工表面可以增强LED组件的反射率。透明和/或非全局焊接掩模可以增强LED组件的反射率。透明环可以增强LED组件的反射率。通过提高LED组件的反射率，可以提高LED组件的亮度。较亮的LED组件可用于手电筒，显示屏和一般照明等应用中。

6. 发明授权

US07972881B2 Method for cooling light-emitting diode 有权
标题翻译：冷却发光二极管的方法
公开(公告)号：US07972881B2
公开(公告)日：2011-07-05
申请号：US12700556
申请日：2010-02-04
申请人： Wei Shi
发明人： Wei Shi
IPC分类号： H01L21/00
CPC分类号： H01L33/644 , H01L25/0753 , H01L33/38 , H01L33/507 , H01L33/58 , H01L33/62 , H01L33/642 , H01L2924/0002 , H01L2924/00
摘要： A heat spreader for an LED can include a thermally conductive and optically transparent member. The bottom side of the heat spreader can be configured to attach to a light emitting side of the LED. The top and/or bottom surface of the heat spreader can have a phosphor layer formed thereon. The heat spreader can be configured to conduct heat from the LED to a package. The heat spreader can be configured to conduct heat from the phosphors to the package. By facilitating the removal of heat from the LED and phosphors, more current can be used to drive the LED. The use of more current facilitates the construction of a brighter LED, which can be used in applications such as flashlights, displays, and general illumination. By facilitating the removal of heat from the phosphors, desired colors can be better provided.
摘要翻译：用于LED的散热器可以包括导热和光学透明构件。散热器的底侧可以被配置为附着到LED的发光侧。散热器的顶表面和/或底表面可以在其上形成荧光体层。散热器可以被配置为将热量从LED传导到包装。散热器可以被配置为将热量从磷光体传导到封装。通过促进从LED和磷光体去除热量，可以使用更多的电流来驱动LED。使用更多的电流有助于构建更亮的LED，其可以用于诸如手电筒，显示器和一般照明的应用中。通过促进从磷光体去除热量，可以更好地提供所需的颜色。

7. 发明申请

US20110012157A1 TRANSPARENT HEAT SPREADER FOR LEDS 有权
标题翻译： LED透明散热片
公开(公告)号：US20110012157A1
公开(公告)日：2011-01-20
申请号：US12893422
申请日：2010-09-29
申请人： Wei Shi
发明人： Wei Shi
IPC分类号： H01L33/64
CPC分类号： H01L33/644 , H01L25/0753 , H01L33/38 , H01L33/507 , H01L33/58 , H01L33/62 , H01L33/642 , H01L2924/0002 , H01L2924/00
摘要： A heat spreader for an LED can include a thermally conductive and optically transparent member. The bottom side of the heat spreader can be configured to attach to a light emitting side of the LED. The top and/or bottom surface of the heat spreader can have a phosphor layer formed thereon. The heat spreader can be configured to conduct heat from the LED to a package. The heat spreader can be configured to conduct heat from the phosphors to the package. By facilitating the removal of heat from the LED and phosphors, more current can be used to drive the LED. The use of more current facilitates the construction of a brighter LED, which can be used in applications such as flashlights, displays, and general illumination. By facilitating the removal of heat from the phosphors, desired colors can be better provided.
摘要翻译：用于LED的散热器可以包括导热和光学透明构件。散热器的底侧可以被配置为附着到LED的发光侧。散热器的顶表面和/或底表面可以在其上形成荧光体层。散热器可以被配置为将热量从LED传导到包装。散热器可以被配置为将热量从磷光体传导到封装。通过促进从LED和磷光体去除热量，可以使用更多的电流来驱动LED。使用更多的电流有助于构建更亮的LED，其可以用于诸如手电筒，显示器和一般照明的应用中。通过促进从磷光体去除热量，可以更好地提供所需的颜色。

8. 发明申请

US20100246138A1 METHOD, APPARATUS, AND SYSTEM FOR THIN DIE THIN THERMAL INTERFACE MATERIAL IN INTEGRATED CIRCUIT PACKAGES 审中-公开
标题翻译：集成电路封装薄膜热绝缘材料的方法，装置和系统
公开(公告)号：US20100246138A1
公开(公告)日：2010-09-30
申请号：US12813277
申请日：2010-06-10
申请人： Wei Shi , Daoqiang Lu , Edward A. Zarbock
发明人： Wei Shi , Daoqiang Lu , Edward A. Zarbock
IPC分类号： H05K7/20
CPC分类号： H01L21/50 , H01L23/3735 , H01L23/3736 , H01L2224/16225 , H01L2224/73253 , Y10T29/49144
摘要： Some embodiments of the invention include a thermal interface between a heat spreader and a die. The thermal interface may include a main layer of a single material or a combination of multiple materials. The thermal interface may include one or more additional layers covering one or more surfaces of the main layer. The thermal interface may be bonded to the die and the heat spreader at a low temperature, with flux or without flux. Other embodiments are described and claimed.
摘要翻译：本发明的一些实施例包括散热器和模具之间的热界面。热界面可以包括单一材料的主层或多种材料的组合。热界面可以包括覆盖主层的一个或多个表面的一个或多个附加层。热界面可以在低温下与焊剂和散热器结合，焊剂或无焊剂。描述和要求保护其他实施例。

9. 发明申请

US20100240905A1 Novel Curcumin and Tetrahydrocurcumin Derivatives 有权
标题翻译：新型姜黄素和四氢姜黄素衍生物
公开(公告)号：US20100240905A1
公开(公告)日：2010-09-23
申请号：US12445356
申请日：2007-10-12
申请人： Krishnaswami Raja , Probal Banerjee , Andrew Auerbach , Wei Shi , William L'Amoreaux
发明人： Krishnaswami Raja , Probal Banerjee , Andrew Auerbach , Wei Shi , William L'Amoreaux
IPC分类号： C07D249/04 , C07C69/52 , C07C229/02 , C07C49/213
CPC分类号： C07C229/12 , A61K8/37 , A61K8/39 , A61K8/496 , A61K8/8147 , A61K2800/522 , A61K2800/56 , A61Q19/02 , C07C49/248 , C07C49/255 , C07C69/52 , C07C69/602 , C07C247/04 , C07D249/04
摘要： The invention relates to novel curcumin and tetrahydrocurcumin derivatives, which have been modified at one phenolic group to incorporate more-reactive groups. The curcumin and tetrahydrocurcumin derivatives are in the form of monomers, dimmers, and polymers.
摘要翻译：本发明涉及新的姜黄素和四氢姜黄素衍生物，它们已经在一个酚基团被修饰以引入更多的反应性基团。姜黄素和四氢姜黄素衍生物是单体，二聚体和聚合物的形式。

10. 发明申请

US20100136725A1 THERMAL MANAGEMENT FOR LED 有权
标题翻译： LED热管理
公开(公告)号：US20100136725A1
公开(公告)日：2010-06-03
申请号：US12701366
申请日：2010-02-05
申请人： Wei Shi
发明人： Wei Shi
IPC分类号： H01L33/00
CPC分类号： F21V29/713 , F21K9/00 , H01L24/32 , H01L33/385 , H01L33/483 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2924/12041 , H01L2924/15747 , H01L2924/00
摘要： A method and system for removing heat from an LED facilitates the fabrication of LEDs having enhanced brightness. A thermally conductive interposer can be attached to the top of the LED. Heat can flow through the top of the LED and into the interposer. The interposer can carry the heat away from the LED. Light can exit the LED though an at least partially transparent substrate of the LED. By removing heat from an LED, the use of more current through the LED is facilitated, thus resulting in a brighter LED.
摘要翻译：用于从LED去除热量的方法和系统有助于制造具有增强的亮度的LED。导热插入件可以连接到LED的顶部。热量可以流过LED的顶部并进入插入器。插入器可以将热量从LED中散发出来。光可以通过LED的至少部分透明的基板离开LED。通过从LED去除热量，便于使用通过LED的更多电流，从而产生更亮的LED。

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