专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09543123B2 Plasma processing apparatus and plasma generation antenna 有权
标题翻译：等离子体处理装置和等离子体生成天线
公开(公告)号：US09543123B2
公开(公告)日：2017-01-10
申请号：US13435552
申请日：2012-03-30
申请人： Taro Ikeda , Tomohito Komatsu , Shigeru Kasai
发明人： Taro Ikeda , Tomohito Komatsu , Shigeru Kasai
IPC分类号： C23C16/00 , C23F1/00 , H01L21/306 , H01J37/32 , C23C16/455 , H05H1/46 , C23C16/511
CPC分类号： H01J37/3222 , C23C16/45565 , C23C16/511 , H01J37/32211 , H01J37/32229 , H01J37/3244 , H01J37/32449 , H05H1/46 , H05H2001/463
摘要： A plasma generation antenna and a plasma processing apparatus can supply a gas and an electromagnetic wave effectively. A plasma processing apparatus 10 includes a processing chamber 100 in which a plasma process is performed; a wavelength shortening plate 480 configured to transmit an electromagnetic wave; and a plasma generation antenna 200 having a shower head 210 provided adjacent to the wavelength shortening plate 480. The shower head 210 is made of a conductor, and has a multiple number of gas holes 215 and a multiple number of slots 220 through which the electromagnetic wave passes. The slots 220 are provided at positions isolated from the gas holes 215.
摘要翻译：等离子体发生天线和等离子体处理装置可以有效地提供气体和电磁波。等离子体处理装置10包括其中执行等离子体处理的处理室100; 构造成透射电磁波的波长缩短板480; 以及等离子体产生天线200，其具有与波长缩短板480相邻设置的淋浴喷头210.喷头210由导体制成，并具有多个气孔215和多个槽220，电磁波通。槽220设置在与气孔215隔开的位置处。

2. 发明申请

US20060160359A1 Vacuum processing apparatus 审中-公开
标题翻译：真空加工设备
公开(公告)号：US20060160359A1
公开(公告)日：2006-07-20
申请号：US10546803
申请日：2004-02-12
申请人： Shigeru Kasai , Susumu Katoh , Tomohito Komatsu , Tetsuya Saito , Sumi Tanaka
发明人： Shigeru Kasai , Susumu Katoh , Tomohito Komatsu , Tetsuya Saito , Sumi Tanaka
IPC分类号： H01L21/44 , C23C16/00
CPC分类号： C23C16/45521 , C23C16/455
摘要： A vacuum processing apparatus is constituted of the following portions: a processing container with the bottom, capable of drawing vacuum; a placement platform installed in the container; a heating portion for heating a substrate on the platform; a processing gas-feeding portion for feeding a processing gas into the container; a partitioning portion surrounding a space between the platform and the bottom of the container and partitioning off the space from a processing space in the container; a purge gas-feeding portion for feeding a purge gas into the space surrounded by the partitioning portion; a purge gas-discharging portion for discharging the purge gas from the space surrounded by the partitioning portion; a control portion for controlling the purge gas-feeding portion and/or the purge gas-discharging portion so as to regulate the pressure in the space surrounded by the partitioning portion; and a temperature-detecting portion penetrating the bottom of the container, inserted in the space surrounded by the partitioning portion, and having the top end in contact with the platform. The partitioning portion has the lower end in surface-contact with the bottom of the container. The control portion regulates the pressure in the space surrounded by the partitioning portion to a pressure higher than that in the processing space in the container.
摘要翻译：真空处理装置由以下部分构成：具有底部的能够抽真空的处理容器; 安装在容器中的放置平台; 用于加热所述平台上的基板的加热部分; 处理气体供给部，用于将处理气体供给到所述容器中; 围绕所述平台和所述容器的底部之间的空间并将所述空间与所述容器中的处理空间分隔开的分隔部分; 净化气体供给部分，用于将净化气体供给到由分隔部分包围的空间中; 净化气体排出部，用于从由分隔部包围的空间排出净化气体; 用于控制净化气体供给部分和/或净化气体排出部分以便调节由分隔部分包围的空间中的压力的控制部分; 以及穿过容器底部的温度检测部分，插入由分隔部分包围的空间中，并且顶端与平台接触。分隔部分的下端与容器的底部表面接触。控制部将由分隔部包围的空间内的压力调整为高于容器内的处理空间的压力。

3. 发明申请

US20090139979A1 PLACING TABLE STRUCTURE, METHOD FOR MANUFACTURING PLACING TABLE STRUCTURE AND HEAT TREATMENT APPARATUS 审中-公开
标题翻译：配置表结构，制造配置表结构和热处理设备的方法
公开(公告)号：US20090139979A1
公开(公告)日：2009-06-04
申请号：US12064160
申请日：2006-08-10
申请人： Tomohito Komatsu
发明人： Tomohito Komatsu
IPC分类号： H05B3/68 , H01L21/67 , B05D3/02 , B05D5/00
CPC分类号： C04B41/86 , C04B41/009 , C04B41/5022 , C23C16/4581 , C23C16/4586 , H01L21/68742 , H01L21/68757 , C04B41/4523 , C04B35/00 , C04B35/581
摘要： A mounting table structure capable of preventing cracks in a mounting table made of a ceramic material or at a joint portion between the mounting table and a column for supporting the mounting table. The mounting table structure includes a ceramic mounting table made of a ceramic material for mounting thereon a target object in order to perform a specific heat treatment on the target object in a processing chamber, and a supporting unit for supporting the mounting table. A quartz glass coating layer is formed on a surface of the mounting table while maintaining a compressive stress in a plane direction. As a result, cracks are prevented from occurring in a mounting table made of a ceramic material or at a joint portion between the mounting table and a column for supporting the mounting table.
摘要翻译：一种安装台结构，其能够防止由陶瓷材料制成的安装台或安装台与用于支撑安装台的支柱之间的接合部分处的裂缝。安装台结构包括陶瓷安装台，其由陶瓷材料制成，用于在其上安装目标物体，以便对处理室中的目标物体进行特定热处理;以及支撑单元，用于支撑安装台。在安装台的表面上形成石英玻璃涂层，同时在平面方向上保持压缩应力。结果，防止了在由陶瓷材料制成的安装台中或在安装台和用于支撑安装台的支柱之间的接合部处发生裂纹。

4. 发明授权

US07488374B2 Trapping device, processing system, and method removing impurities 失效
标题翻译：捕集装置，处理系统和除去杂质的方法
公开(公告)号：US07488374B2
公开(公告)日：2009-02-10
申请号：US10562127
申请日：2004-06-22
申请人： Tomohito Komatsu
发明人： Tomohito Komatsu
IPC分类号： B01D53/00
CPC分类号： C23C16/4412 , Y02C20/30 , Y10S55/15
摘要： A trapping device is disclosed which is arranged in a vacuum exhaust system (6) for removing gaseous impurities contained in the exhaust gas flowing through the vacuum exhaust system (6) which has a vacuum pump (36) for vacuum exhausting a processing unit (10) wherein a certain process is conducted on a semiconductor wafer. The trapping device comprises an impurity collecting chamber (50) arranged along the exhaust passage in the vacuum exhaust system (6) and a nozzle means (64) which injects a working fluid that is in a supersonic state due to adiabatic expansion for mixing the fluid with the exhaust gas and lowering the temperature of the exhaust gas to or below the critical points of the impurities within the impurity collecting chamber (50).
摘要翻译：公开了一种捕集装置，其布置在真空排气系统（6）中，用于去除流过真空排气系统（6）的排气中含有的气体杂质，该真空排气系统（6）具有真空泵（36），用于真空排出处理单元），其中在半导体晶片上进行一定的处理。捕集装置包括沿着真空排气系统（6）中的排气通道布置的杂质收集室（50）和喷嘴装置（64），其喷射由于绝热膨胀而处于超音速状态的工作流体，用于混合流体并且将废气的温度降低到或低于杂质收集室（50）内的杂质的临界点。

5. 发明授权

US08203104B2 Mounting table structure and heat treatment apparatus 有权
标题翻译：安装台结构和热处理设备
公开(公告)号：US08203104B2
公开(公告)日：2012-06-19
申请号：US12336207
申请日：2008-12-16
申请人： Tomohito Komatsu
发明人： Tomohito Komatsu
IPC分类号： H05B3/06 , H05B3/68
CPC分类号： H01L21/67103 , C23C16/4581 , C23C16/48 , H01L21/324 , H05B3/143
摘要： Provided is a mounting table structure having a replaceable heating plate by removably arranging the heating plate in a heating plate accommodating chamber. A mounting table structure is provided with a mounting table, which is arranged inside a processing chamber and mounts thereon a target object, for performing specified heat treatment to the target object, and a hollow supporting column which supports the mounting table by making the mounting table stand on a bottom portion of the processing chamber. The mounting table is provided with a heating plate having a heater composed of an electric heat source embedded in a heat-resistant material, and a heating plate accommodating chamber composed of a heat-resistant and corrosion-resistant material for removably receiving the heating plate. The heating plate accommodating container includes a container body having an opening, and a cover portion attached to the container body. Thus, the heating plate is permitted to be replaced.
摘要翻译：提供了一种安装台结构，其具有可更换的加热板，通过将加热板可拆卸地布置在加热板容纳室中。安装台结构设置有安装台，该安装台布置在处理室内部并安装在其上的目标物体，用于对目标物体进行特定的热处理;以及中空支撑柱，其通过制造安装台来支撑安装台站立在处理室的底部。安装台设置有加热板，该加热板具有由嵌入耐热材料的电热源构成的加热器，以及由用于可拆卸地接收加热板的耐热耐腐蚀材料构成的加热板容纳室。加热板容纳容器包括具有开口的容器主体和附接到容器主体的盖部。因此，允许更换加热板。

6. 发明授权

US08334481B2 Mounting table structure, and processing apparatus 有权
标题翻译：安装台结构和加工设备
公开(公告)号：US08334481B2
公开(公告)日：2012-12-18
申请号：US12505282
申请日：2009-07-17
申请人： Tomohito Komatsu , Hirohiko Yamamoto , Daisuke Toriya
发明人： Tomohito Komatsu , Hirohiko Yamamoto , Daisuke Toriya
IPC分类号： F27B5/14 , F27D11/02 , H05B3/03 , H05B3/08
CPC分类号： H01L21/67103 , C23C16/4586
摘要： A mounting table body made of ceramic includes power-receiving conductor portions and buried therein. A surface of mounting table body is formed with a recessed connection hole and a connection terminal electrically jointed to the power-receiving conductor portion and exposed into the connection hole, the connection terminal being made of a high-melting-point metal, an alloy thereof or a compound thereof. A power-feeding line member provided with a power-feeding connector portion is inserted at its leading end portion into the connection hole to feed electricity to the power-receiving conductor portion. A stress relaxing member is interposed between the connection terminal and the power-feeding connector portion. The stress relaxing member and the connection terminal are jointed together by a brazing material. The stress relaxing member is made of a metal free from cobalt and nickel or an alloy thereof.
摘要翻译：由陶瓷制成的安装台体包括受电导体部分并埋入其中。安装台体的表面形成有凹入的连接孔和电连接到受电导体部分并暴露于连接孔中的连接端子，连接端子由高熔点金属制成，其合金或其化合物。设置有供电连接器部分的馈电线构件在其前端部插入到连接孔中，以将电力馈送到电力接收导体部分。在连接端子和供电连接器部分之间设置应力缓和部件。应力缓和构件和连接端子通过钎焊材料接合在一起。应力松弛部件由不含钴，镍或其合金的金属制成。

7. 外观设计

USD601521S1 Heater for manufacturing semiconductor 有权
公开(公告)号：USD601521S1
公开(公告)日：2009-10-06
申请号：US29278403
申请日：2007-03-28
申请人： Tomohito Komatsu
设计人： Tomohito Komatsu

8. 外观设计

USD589471S1 Heater for manufacturing semiconductor 有权
标题翻译：加热器制造半导体
公开(公告)号：USD589471S1
公开(公告)日：2009-03-31
申请号：US29278401
申请日：2007-03-28
申请人： Tomohito Komatsu
设计人： Tomohito Komatsu

9. 发明申请

US20120031889A1 MOUNTING TABLE STRUCTURE AND PROCESSING APPARATUS 审中-公开
标题翻译：安装台结构和加工设备
公开(公告)号：US20120031889A1
公开(公告)日：2012-02-09
申请号：US13259822
申请日：2010-03-18
申请人： Tomohito Komatsu
发明人： Tomohito Komatsu
IPC分类号： H05B3/00
CPC分类号： C23C16/46 , C23C16/4586 , H01J37/32091 , H01J2237/2001 , H01L21/67103 , H01L21/67109 , H01L21/67248 , H05B3/22 , H05B2203/037
摘要： Provided is a mounting table structure on which a target object is mounted to perform a heat treatment on the target object in a processing chamber and which heats the mounted target object. Outermost peripheral feed lines are connected to a plurality of positions different in the circumferential direction of an outermost peripheral resistance heating heater for heating an outermost peripheral heating zone of a mounting table body, thereby dividing the outermost peripheral resistance heating heater into a plurality of heater sections. A heater control unit can individually control electrical states (for example, voltage application states, zero potential states, and floating states) of the respective outermost peripheral feed lines. The power supply state of each of the heater sections can be changed by a simple configuration.
摘要翻译：提供了一种安装台结构，其上安装有目标物体，以对处理室中的目标物体进行热处理，并加热所安装的目标物体。最外周供电线连接到用于加热安装台主体的最外周加热区的最外周电阻加热加热器的圆周方向上不同的多个位置，从而将最外周电阻加热器分成多个加热器部分。加热器控制单元可以单独控制各个最外围进料管线的电气状态（例如，电压施加状态，零电位状态和浮动状态）。可以通过简单的配置来改变每个加热器部分的电源状态。

10. 发明授权

US08055125B2 Substrate stage mechanism and substrate processing apparatus 失效
标题翻译：基板台机构和基板加工装置
公开(公告)号：US08055125B2
公开(公告)日：2011-11-08
申请号：US11995611
申请日：2006-07-11
申请人： Tomohito Komatsu
发明人： Tomohito Komatsu
IPC分类号： F26B19/00
CPC分类号： C23C16/4586 , C23C16/46 , H01L21/67103 , H01L21/68792
摘要： A substrate stage mechanism (10) configured to place a substrate (W) thereon inside a process container of a substrate processing apparatus (100) and having a substrate heating function for heating the substrate (W) includes a substrate table (11) including a base body (11a) configured to place the substrate (W) thereon and a heating element (13) provided to the base body (11a) and configured to heat the substrate (W); a support member (12) having an upper end connected to the substrate table (11) and a lower end attached to the process container; and a heating device (17) configured to heat the support member (12).
摘要翻译：一种基板台机构（10），其构造为将基板（W）放置在基板处理装置（100）的处理容器内并具有用于加热基板（W）的基板加热功能的基板台机构（10）包括：基板台（11）配置为将基板（W）放置在其上的基体（11a）和设置在基体（11a）上并构造为加热基板（W）的加热元件（13）支撑构件（12），其具有连接到衬底台（11）的上端和附接到处理容器的下端; 以及被配置为加热所述支撑构件（12）的加热装置（17）。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式