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    • 1. 发明授权
    • Semiconductor device and method of manufacturing same
    • 半导体装置及其制造方法
    • US07728379B2
    • 2010-06-01
    • US11690428
    • 2007-03-23
    • Takuya KonnoYoshio OzawaTetsuya KaiYasushi NakasakiYuuichiro Mitani
    • Takuya KonnoYoshio OzawaTetsuya KaiYasushi NakasakiYuuichiro Mitani
    • H01L29/788H01L29/792
    • H01L29/7883H01L29/513H01L29/66825
    • A semiconductor device includes: a semiconductor layer; an insulating film provided on the semiconductor layer; and a charge storage layer provided on the insulating film. The semiconductor layer has a channel formation region in its surface portion. The insulating film contains silicon, germanium, and oxygen. The charge storage layer is capable of storing charge supplied from the semiconductor layer through the insulating film. A method of manufacturing a semiconductor device includes: forming a silicon oxide film on a surface of a semiconductor layer; introducing germanium into the silicon oxide film; forming an insulating film containing silicon, germanium, and oxygen by heat treatment under oxidizing atmosphere; and forming a charge storage layer on the insulating film, the charge storage layer being capable of storing charge supplied from the semiconductor layer through the insulating layer.
    • 半导体器件包括:半导体层; 设置在所述半导体层上的绝缘膜; 以及设置在绝缘膜上的电荷存储层。 半导体层在其表面部分具有沟道形成区域。 绝缘膜含有硅,锗和氧。 电荷存储层能够存储从半导体层通过绝缘膜提供的电荷。 制造半导体器件的方法包括:在半导体层的表面上形成氧化硅膜; 将锗引入到氧化硅膜中; 在氧化气氛下通过热处理形成含有硅,锗和氧的绝缘膜; 以及在所述绝缘膜上形成电荷存储层,所述电荷存储层能够将通过所述绝缘层从所述半导体层提供的电荷存储。
    • 2. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
    • 半导体器件及其制造方法
    • US20080073691A1
    • 2008-03-27
    • US11690428
    • 2007-03-23
    • Takuya KonnoYoshio OzawaTetsuya KaiYasushi NakasakiYuuichiro Mitani
    • Takuya KonnoYoshio OzawaTetsuya KaiYasushi NakasakiYuuichiro Mitani
    • H01L29/788H01L21/425
    • H01L29/7883H01L29/513H01L29/66825
    • A semiconductor device includes: a semiconductor layer; an insulating film provided on the semiconductor layer; and a charge storage layer provided on the insulating film. The semiconductor layer has a channel formation region in its surface portion. The insulating film contains silicon, germanium, and oxygen. The charge storage layer is capable of storing charge supplied from the semiconductor layer through the insulating film. A method of manufacturing a semiconductor device includes: forming a silicon oxide film on a surface of a semiconductor layer; introducing germanium into the silicon oxide film; forming an insulating film containing silicon, germanium, and oxygen by heat treatment under oxidizing atmosphere; and forming a charge storage layer on the insulating film, the charge storage layer being capable of storing charge supplied from the semiconductor layer through the insulating layer.
    • 半导体器件包括:半导体层; 设置在所述半导体层上的绝缘膜; 以及设置在绝缘膜上的电荷存储层。 半导体层在其表面部分具有沟道形成区域。 绝缘膜含有硅,锗和氧。 电荷存储层能够存储从半导体层通过绝缘膜提供的电荷。 制造半导体器件的方法包括:在半导体层的表面上形成氧化硅膜; 将锗引入到氧化硅膜中; 在氧化气氛下通过热处理形成含有硅,锗和氧的绝缘膜; 以及在所述绝缘膜上形成电荷存储层,所述电荷存储层能够将通过所述绝缘层从所述半导体层提供的电荷存储。