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    • 5. 发明授权
    • Method of forming a semiconductor thin film on a plastic substrate
    • 在塑料基板上形成半导体薄膜的方法
    • US06376290B1
    • 2002-04-23
    • US09116119
    • 1998-07-16
    • Dharam Pal GosainJonathan WestwaterMiyako NakagoeSetsuo UsuiKazumasa Nomoto
    • Dharam Pal GosainJonathan WestwaterMiyako NakagoeSetsuo UsuiKazumasa Nomoto
    • H01L2100
    • H01L29/66765H01L29/78603
    • A method is provided for forming a semiconductor thin film which is free from damage to the film with radiation of a pulse laser beam with the optimum energy value for perfect polycrystallization. For forming an amorphous silicon thin film, a surface of a plastic substrate as a base and insulating layers are each radiated with a pulse laser beam for removing volatile contaminants like a resist as a pretreatment. Damage to the film caused by a gas emitted from the base substrate and the insulating layers resulting from volatile contaminants is thus prevented. A protective layer including a gas barrier layer and a refractory buffer layer is formed on the substrate. Gas penetration from the substrate to the amorphous silicon film is thereby prevented. Conduction of heat produced by energy beam radiation to the substrate is prevented as well. It is possible to increase energy intensity of energy beam radiated for polycrystallization of the amorphous silicon film to the optimal value for perfect polycrystallization.
    • 提供了一种用于形成半导体薄膜的方法,该半导体薄膜不会损坏具有用于完美多晶化的最佳能量值的脉冲激光束的辐射。 为了形成非晶硅薄膜,以用作去除挥发性污染物如抗蚀剂的脉冲激光束作为基底和绝缘层的塑料基板的表面各自辐射,作为预处理。 因此防止了由基底衬底发出的气体和由挥发性污染物引起的绝缘层引起的膜损伤。 在基板上形成包括阻气层和难熔缓冲层的保护层。 从而防止了从基板到非晶硅膜的气体渗透。 也可以防止能量束辐射产生的热量传导到基板上。 可以将非晶硅膜的多晶化辐射的能量束的能量强度提高到完美多晶化的最佳值。