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    • 3. 发明申请
    • METHOD FOR MANUFACTURING THIN FILM TRANSISTOR SUBSTRATE
    • 制造薄膜晶体管基板的方法
    • US20120108018A1
    • 2012-05-03
    • US13383220
    • 2010-03-16
    • Tohru OkabeHirohiko NishikiYoshimasa ChikamaTakeshi Hara
    • Tohru OkabeHirohiko NishikiYoshimasa ChikamaTakeshi Hara
    • H01L21/336
    • H01L29/7869G02F1/1368H01L27/1225H01L27/124H01L27/1248H01L29/42384
    • A method for manufacturing a thin film transistor substrate includes a step of forming a gate electrode (11a) and a first interconnect on a substrate (10), a step of forming a gate insulating film (12a) having a contact hole at a position overlapping the first interconnect, a step of forming a source electrode (13a) and a drain electrode (13b) overlapping the gate electrode (11a) and separated apart from each other, and a second interconnect connected via the contact hole to the first interconnect, a step of successively forming an oxide semiconductor film (14) and a second insulating film (15), and thereafter, patterning the second insulating film (15) to form an interlayer insulating film (15a), and a step of reducing the resistance of the oxide semiconductor film (14) exposed through the interlayer insulating film (15a) to form a pixel electrode (14b).
    • 制造薄膜晶体管基板的方法包括在基板(10)上形成栅极(11a)和第一布线的步骤,在重叠的位置形成具有接触孔的栅极绝缘膜(12a)的步骤 所述第一互连,形成与所述栅电极(11a)重叠并分离的源电极(13a)和漏电极(13b)的步骤,以及经由所述接触孔与所述第一互连件连接的第二互连件, 连续地形成氧化物半导体膜(14)和第二绝缘膜(15)的步骤,然后对第二绝缘膜(15)进行图案化以形成层间绝缘膜(15a),并且降低 氧化物半导体膜(14)通过层间绝缘膜(15a)露出以形成像素电极(14b)。
    • 4. 发明授权
    • Method for manufacturing thin film transistor substrate
    • 薄膜晶体管基板的制造方法
    • US08481373B2
    • 2013-07-09
    • US13383220
    • 2010-03-16
    • Tohru OkabeHirohiko NishikiYoshimasa ChikamaTakeshi Hara
    • Tohru OkabeHirohiko NishikiYoshimasa ChikamaTakeshi Hara
    • H01L21/336
    • H01L29/7869G02F1/1368H01L27/1225H01L27/124H01L27/1248H01L29/42384
    • A method for manufacturing a thin film transistor substrate includes a step of forming a gate electrode (11a) and a first interconnect on a substrate (10), a step of forming a gate insulating film (12a) having a contact hole at a position overlapping the first interconnect, a step of forming a source electrode (13a) and a drain electrode (13b) overlapping the gate electrode (11a) and separated apart from each other, and a second interconnect connected via the contact hole to the first interconnect, a step of successively forming an oxide semiconductor film (14) and a second insulating film (15), and thereafter, patterning the second insulating film (15) to form an interlayer insulating film (15a), and a step of reducing the resistance of the oxide semiconductor film (14) exposed through the interlayer insulating film (15a) to form a pixel electrode (14b).
    • 制造薄膜晶体管基板的方法包括在基板(10)上形成栅极(11a)和第一布线的步骤,在重叠的位置形成具有接触孔的栅极绝缘膜(12a)的步骤 所述第一互连,形成与所述栅电极(11a)重叠并分离的源电极(13a)和漏电极(13b)的步骤,以及经由所述接触孔与所述第一互连件连接的第二互连件, 连续地形成氧化物半导体膜(14)和第二绝缘膜(15)的步骤,然后对第二绝缘膜(15)进行图案化以形成层间绝缘膜(15a),并且降低 氧化物半导体膜(14)通过层间绝缘膜(15a)露出以形成像素电极(14b)。