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    • 5. 发明授权
    • Method for producing metal/ceramic bonding circuit board
    • 金属/陶瓷接合电路板的制造方法
    • US06918529B2
    • 2005-07-19
    • US10254750
    • 2002-09-25
    • Nobuyoshi TsukaguchiMasami Kimura
    • Nobuyoshi TsukaguchiMasami Kimura
    • B23K1/00B23K1/19C04B37/02H05K1/03H05K3/06H05K3/24H05K3/26H05K3/38B23K31/02C23F1/00
    • H05K3/26H05K1/0306H05K3/06H05K3/064H05K3/38H05K2201/0355H05K2201/0761H05K2203/0796H05K2203/1184H05K2203/121
    • After copper plates 14 are bonded to both sides of a ceramic substrate 10 via a brazing filler metal 12, UV curing alkali peeling type resists 16 are applied on predetermined portions of the surfaces of the copper plates 14 to etch undesired portions of the copper plates 14 to form a metal circuit portion. While the resists 16 are maintained, undesired portions of the brazing filler metal 12 and a reaction product, which is produced by a reaction of the brazing filler metal 12 with the ceramic substrate 10, are removed (or undesired portions of the brazing filler metal 12 and a reaction product, which is produced by a reaction of the brazing filler metal 12 with the ceramic substrate 10, are removed, and the side portion of the metal circuit portion is etched). Thereafter, the resists 16 are peeled off, and an Ni—P electroless plating 18 is carried out. Thus, in a method for producing a metal/ceramic bonding circuit board, it is possible to easily control the sectional shape of a metal/ceramic bonding circuit board by a smaller number of steps and at low costs, and it is possible to produce a metal/ceramic bonding circuit board which is more reliable with respect to thermal shock resistance and insulation performance.
    • 在铜板14通过钎料12接合到陶瓷基板10的两面之后,将UV固化碱剥离型抗蚀剂16施加到铜板14的表面的预定部分上,以蚀刻铜板14的不期望的部分 以形成金属电路部分。 在保护抗蚀剂16的同时,去除钎料填充金属12的不希望的部分和通过钎焊料12与陶瓷基板10的反应产生的反应产物(或钎焊料12的不期望的部分 并且通过钎焊料12与陶瓷基板10的反应产生的反应产物被除去,金属电路部分的侧部被蚀刻)。 然后,剥离抗蚀剂16,进行Ni-P化学镀层18。 因此,在金属/陶瓷接合电路基板的制造方法中,可以通过较少数量的步骤和低成本容易地控制金属/陶瓷接合电路板的截面形状,并且可以制造 金属/陶瓷接合电路板,其耐热冲击性和绝缘性能更可靠。