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1. 发明授权

US06613450B2 Metal/ceramic bonding article 有权
标题翻译：金属/陶瓷粘结物品
公开(公告)号：US06613450B2
公开(公告)日：2003-09-02
申请号：US10108317
申请日：2002-03-27
申请人： Nobuyoshi Tsukaguchi , Jyunji Nakamura , Masahiko Wada , Makoto Namioka , Masami Kimura
发明人： Nobuyoshi Tsukaguchi , Jyunji Nakamura , Masahiko Wada , Makoto Namioka , Masami Kimura
IPC分类号： C04B3702
CPC分类号： C04B37/026 , B23K35/007 , B23K35/286 , B23K35/3006 , B23K2101/34 , B23K2103/10 , B23K2103/12 , B23K2103/18 , B23K2103/52 , B32B18/00 , B32B38/145 , B32B2309/68 , B32B2311/12 , B32B2311/24 , C04B35/01 , C04B35/10 , C04B35/56 , C04B35/565 , C04B35/58 , C04B35/581 , C04B35/584 , C04B37/023 , C04B2235/3232 , C04B2235/402 , C04B2235/404 , C04B2235/405 , C04B2235/407 , C04B2235/408 , C04B2235/428 , C04B2235/96 , C04B2237/121 , C04B2237/125 , C04B2237/402 , C04B2237/407 , C04B2237/50 , C04B2237/708 , H01L2224/291 , H01L2224/32225 , H05K1/0306 , H05K3/38 , Y10T428/12535 , Y10T428/12576 , Y10T428/1259 , H01L2924/014
摘要： There is provided a metal/ceramic bonding article which ensures sufficient thermal shock resistance and has a substrate having a small outside dimension and which has both high reliability and compactness. The metal/ceramic bonding article comprises: a ceramic substrate; and a metal plate bonded to the ceramic substrate via a brazing filler metal, wherein the brazing filler metal protrudes from the bottom face of the metal plate by a length which is longer than 30 &mgr;m and which is 250 &mgr;m or less, or wherein the brazing filler metal protrudes from the bottom face of the metal plate by a length which is 25% or more of the thickness of the metal plate.
摘要翻译：提供了一种确保足够的耐热冲击性的金属/陶瓷粘结物品，并且具有外部尺寸小的基板，并且具有高可靠性和紧凑性。金属/陶瓷接合制品包括：陶瓷基板; 以及金属板，其通过钎料与陶瓷基板接合，其中，所述钎料从所述金属板的底面突出长度大于30μm，长度为250μm以下，或者所述钎焊填充金属从金属板的底面突出金属板厚度的25％以上的长度。

2. 发明授权

US06686030B2 Metal/ceramic circuit board 有权
标题翻译：金属/陶瓷电路板
公开(公告)号：US06686030B2
公开(公告)日：2004-02-03
申请号：US10254724
申请日：2002-09-25
申请人： Nobuyoshi Tsukaguchi , Masami Kimura
发明人： Nobuyoshi Tsukaguchi , Masami Kimura
IPC分类号： H05K102
CPC分类号： H05K3/38 , C04B37/021 , C04B37/026 , C04B2237/121 , C04B2237/125 , C04B2237/127 , C04B2237/128 , C04B2237/366 , C04B2237/402 , C04B2237/407 , C04B2237/706 , H01L23/3735 , H01L2924/0002 , H05K1/0306 , H05K3/06 , H05K3/067 , H05K3/244 , H05K2201/0355 , H05K2201/098 , Y10T428/12535 , Y10T428/12576 , Y10T428/24917 , Y10T428/24926 , H01L2924/00
摘要： There is provided a metal/ceramic circuit board capable of eliminating discrepancy during mounting of parts to improve the reliability of mounting of the parts. The metal/ceramic circuit board has a ceramic substrate 10, and a metal circuit plate (a copper plate 14) bonded to the ceramic substrate 10, the metal circuit plate having a thickness of 0.1 mm to 0.5 mm, and the metal circuit plate having a skirt spreading length (a dimensional difference between the bottom and top portion of the peripheral edge portion of the metal circuit plate) of less than 50 &mgr;m.
摘要翻译：提供了一种金属/陶瓷电路板，其能够在安装零件期间消除差异，以提高部件安装的可靠性。金属/陶瓷电路板具有陶瓷基板10和接合到陶瓷基板10的金属电路板（铜板14），金属电路板的厚度为0.1mm〜0.5mm，金属电路板具有裙部扩展长度（金属电路板的周边部分的底部和顶部之间的尺寸差）小于50um。

3. 发明授权

US06918529B2 Method for producing metal/ceramic bonding circuit board 有权
标题翻译：金属/陶瓷接合电路板的制造方法
公开(公告)号：US06918529B2
公开(公告)日：2005-07-19
申请号：US10254750
申请日：2002-09-25
申请人： Nobuyoshi Tsukaguchi , Masami Kimura
发明人： Nobuyoshi Tsukaguchi , Masami Kimura
IPC分类号： B23K1/00 , B23K1/19 , C04B37/02 , H05K1/03 , H05K3/06 , H05K3/24 , H05K3/26 , H05K3/38 , B23K31/02 , C23F1/00
CPC分类号： H05K3/26 , H05K1/0306 , H05K3/06 , H05K3/064 , H05K3/38 , H05K2201/0355 , H05K2201/0761 , H05K2203/0796 , H05K2203/1184 , H05K2203/121
摘要： After copper plates 14 are bonded to both sides of a ceramic substrate 10 via a brazing filler metal 12, UV curing alkali peeling type resists 16 are applied on predetermined portions of the surfaces of the copper plates 14 to etch undesired portions of the copper plates 14 to form a metal circuit portion. While the resists 16 are maintained, undesired portions of the brazing filler metal 12 and a reaction product, which is produced by a reaction of the brazing filler metal 12 with the ceramic substrate 10, are removed (or undesired portions of the brazing filler metal 12 and a reaction product, which is produced by a reaction of the brazing filler metal 12 with the ceramic substrate 10, are removed, and the side portion of the metal circuit portion is etched). Thereafter, the resists 16 are peeled off, and an Ni—P electroless plating 18 is carried out. Thus, in a method for producing a metal/ceramic bonding circuit board, it is possible to easily control the sectional shape of a metal/ceramic bonding circuit board by a smaller number of steps and at low costs, and it is possible to produce a metal/ceramic bonding circuit board which is more reliable with respect to thermal shock resistance and insulation performance.
摘要翻译：在铜板14通过钎料12接合到陶瓷基板10的两面之后，将UV固化碱剥离型抗蚀剂16施加到铜板14的表面的预定部分上，以蚀刻铜板14的不期望的部分以形成金属电路部分。在保护抗蚀剂16的同时，去除钎料填充金属12的不希望的部分和通过钎焊料12与陶瓷基板10的反应产生的反应产物（或钎焊料12的不期望的部分并且通过钎焊料12与陶瓷基板10的反应产生的反应产物被除去，金属电路部分的侧部被蚀刻）。然后，剥离抗蚀剂16，进行Ni-P化学镀层18。因此，在金属/陶瓷接合电路基板的制造方法中，可以通过较少数量的步骤和低成本容易地控制金属/陶瓷接合电路板的截面形状，并且可以制造金属/陶瓷接合电路板，其耐热冲击性和绝缘性能更可靠。

4. 发明授权

US06936337B2 Metal/ceramic circuit board 有权
标题翻译：金属/陶瓷电路板
公开(公告)号：US06936337B2
公开(公告)日：2005-08-30
申请号：US10713390
申请日：2003-11-14
申请人： Nobuyoshi Tsukaguchi , Masami Kimura
发明人： Nobuyoshi Tsukaguchi , Masami Kimura
IPC分类号： H01L23/373 , H05K1/03 , H05K3/06 , H05K3/24 , H05K3/38 , H05K1/02
CPC分类号： H01L23/3735 , H01L2924/0002 , H05K1/0306 , H05K3/06 , H05K3/244 , H05K3/38 , H05K2201/0355 , H05K2201/098 , Y10T428/12576 , Y10T428/24917 , Y10T428/24926 , H01L2924/00
摘要： There is provided a metal/ceramic circuit board capable of eliminating discrepancy during mounting of parts to improve the reliability of mounting of the parts. The metal/ceramic circuit board has a ceramic substrate 10, and a metal circuit plate (a copper plate 14) bonded to the ceramic substrate 10, the metal circuit plate having a thickness which is more than 0.25 mm and which is less than 0.3 mm, and the metal circuit plate having a skirt spreading length (a dimensional difference between the bottom and top portion of the peripheral edge portion of the metal circuit plate) of less than 50 μm.
摘要翻译：提供了一种金属/陶瓷电路板，其能够在安装零件期间消除差异，以提高部件安装的可靠性。金属/陶瓷电路板具有陶瓷基板10和与陶瓷基板10接合的金属电路板（铜板14），金属电路板的厚度大于0.25mm且小于0.3mm ，并且金属电路板具有小于50μm的裙部扩展长度（金属电路板的周边边缘部分的底部和顶部之间的尺寸差）。

5. 发明授权

US06858151B2 Metal/ceramic bonding article and method for producing same 失效
标题翻译：金属/陶瓷粘合物及其制造方法
公开(公告)号：US06858151B2
公开(公告)日：2005-02-22
申请号：US10254686
申请日：2002-09-25
申请人： Nobuyoshi Tsukaguchi , Takayuki Takahashi , Yukihiro Kitamura , Masami Kimura
发明人： Nobuyoshi Tsukaguchi , Takayuki Takahashi , Yukihiro Kitamura , Masami Kimura
IPC分类号： C04B37/00 , C04B37/02 , H01L23/12 , H01L23/14 , H05K1/03 , H05K1/09 , H05K1/16 , H01L21/302
CPC分类号： B32B18/00 , B32B2311/04 , B32B2311/12 , B32B2311/22 , C04B37/021 , C04B2235/656 , C04B2235/658 , C04B2235/96 , C04B2237/32 , C04B2237/343 , C04B2237/40 , C04B2237/405 , C04B2237/407 , C04B2237/408 , C04B2237/704 , C04B2237/706 , H05K1/0306 , H05K1/09 , H05K1/167 , H05K2201/0355 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T428/12535 , Y10T428/12611 , Y10T428/12861 , Y10T428/12882 , Y10T428/12944 , Y10T428/24917 , Y10T428/24926
摘要： There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: bonding a metal plate 12 of an alloy containing copper and nickel directly to at least one side of a ceramic substrate 10; applying a resist 14 on a predetermined portion of the metal plate 12 to remove an undesired portion of the metal plate 12 by etching; and removing the resist 14 to form a pattern having a predetermined shape of the alloy on the ceramic substrate 10. According to this method, it is possible to reduce the displacement failure of parts to improve productivity and to prevent bonding failure during the mounting of a semiconductor device or the like thereon.
摘要翻译：提供了一种用于制造金属/陶瓷接合制品的方法，所述方法包括以下步骤：将包含铜和镍的合金的金属板12直接接合到陶瓷基板10的至少一侧; 在金属板12的预定部分上施加抗蚀剂14以通过蚀刻去除金属板12的不希望的部分; 并且去除抗蚀剂14以在陶瓷基板10上形成具有预定形状的合金的图案。根据该方法，可以减少部件的位移故障以提高生产率并防止在安装中的接合故障半导体器件等。

6. 发明授权

US06780520B2 Metal/ceramic bonding article and method for producing same 失效
标题翻译：金属/陶瓷粘合物及其制造方法
公开(公告)号：US06780520B2
公开(公告)日：2004-08-24
申请号：US10352294
申请日：2003-01-27
申请人： Nobuyoshi Tsukaguchi , Takayuki Takahashi , Yukihiro Kitamura , Masami Kimura
发明人： Nobuyoshi Tsukaguchi , Takayuki Takahashi , Yukihiro Kitamura , Masami Kimura
IPC分类号： B32B1500
CPC分类号： B32B18/00 , B32B2311/04 , B32B2311/12 , B32B2311/22 , C04B37/021 , C04B2235/656 , C04B2235/658 , C04B2235/96 , C04B2237/32 , C04B2237/343 , C04B2237/40 , C04B2237/405 , C04B2237/407 , C04B2237/408 , C04B2237/704 , C04B2237/706 , H05K1/0306 , H05K1/09 , H05K1/167 , H05K2201/0355 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T428/12535 , Y10T428/12611 , Y10T428/12861 , Y10T428/12882 , Y10T428/12944 , Y10T428/24917 , Y10T428/24926
摘要： There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: bonding a metal plate 12 of an alloy containing copper and nickel directly to at least one side of a ceramic substrate 10; applying a resist 14 on a predetermined portion of the metal plate 12 to remove an undesired portion of the metal plate 12 by etching; and removing the resist 14 to form a pattern having a predetermined shape of the alloy on the ceramic substrate 10. According to this method, it is possible to reduce the displacement failure of parts to improve productivity and to prevent bonding failure during the mounting of a semiconductor device or the like thereon.
摘要翻译：提供了一种用于制造金属/陶瓷接合制品的方法，所述方法包括以下步骤：将包含铜和镍的合金的金属板12直接接合到陶瓷基板10的至少一侧; 在金属板12的预定部分上施加抗蚀剂14以通过蚀刻去除金属板12的不希望的部分; 并且去除抗蚀剂14以在陶瓷基板10上形成具有预定形状的合金的图案。根据该方法，可以减少部件的位移故障以提高生产率并防止在安装中的接合故障半导体器件等。

7. 发明授权

US07159757B2 Metal/ceramic bonding article and method for producing same 失效
标题翻译：金属/陶瓷粘合物及其制造方法
公开(公告)号：US07159757B2
公开(公告)日：2007-01-09
申请号：US10668967
申请日：2003-09-23
申请人： Takayuki Takahashi , Nobuyoshi Tsukaguchi
发明人： Takayuki Takahashi , Nobuyoshi Tsukaguchi
IPC分类号： B23K31/02
CPC分类号： C04B37/021 , C04B2235/6562 , C04B2235/6567 , C04B2235/6581 , C04B2235/9623 , C04B2237/343 , C04B2237/348 , C04B2237/365 , C04B2237/366 , C04B2237/368 , C04B2237/407 , C04B2237/66 , C04B2237/704 , C04B2237/706 , C04B2237/86
摘要： After a metal member of an alloy containing copper and nickel is arranged on at least one side of a ceramic substrate, the metal member and the ceramic substrate are heated in an atmosphere of an inert gas or in vacuo at a temperature between solidus and liquidus lines of the alloy to bond the metal member directly to the ceramic substrate.
摘要翻译：在含有铜和镍的合金的金属构件设置在陶瓷基板的至少一侧上之后，金属构件和陶瓷基板在惰性气体气氛中或在固相和液相线之间的温度下真空加热的合金将金属构件直接结合到陶瓷基板。

8. 发明授权

US07128844B2 Metal/ceramic circuit board and method for producing same 有权
标题翻译：金属/陶瓷电路板及其制造方法
公开(公告)号：US07128844B2
公开(公告)日：2006-10-31
申请号：US10855182
申请日：2004-05-27
申请人： Nobuyoshi Tsukaguchi , Michihiro Kosaka
发明人： Nobuyoshi Tsukaguchi , Michihiro Kosaka
IPC分类号： H01L21/302
CPC分类号： H05K1/0265 , C04B37/026 , C04B2237/121 , C04B2237/126 , C04B2237/128 , C04B2237/366 , C04B2237/402 , C04B2237/64 , C04B2237/704 , C04B2237/706 , C23F1/20 , H01L21/4867 , H01L23/3735 , H01L2924/0002 , H05K1/0306 , H05K1/09 , H05K3/067 , H05K2201/098 , H01L2924/00
摘要： A metal layer 12 of aluminum or an aluminum alloy is formed on at least one side of a ceramic substrate 10, and a resist 14 having a predetermined shape is formed on the metal layer 12. Then, an etchant of a mixed solution prepared by mixing ferric chloride with water without adding any acids is used for etching and removing an undesired portion of the metal layer 12 to form a metal circuit 12 on the at least one side of the ceramic substrate 10.
摘要翻译：在陶瓷基板10的至少一侧形成铝或铝合金的金属层12，在金属层12上形成具有规定形状的抗蚀剂14。然后，使用通过在不添加酸的情况下将氯化铁与水混合而制备的混合溶液的蚀刻剂用于蚀刻和去除不期望的部分金属层12，以在陶瓷基板10的至少一侧上形成金属电路12 。

9. 发明申请

US20050175773A1 Metal/ceramic bonding member and method for producing same 审中-公开
标题翻译：金属/陶瓷结合部件及其制造方法
公开(公告)号：US20050175773A1
公开(公告)日：2005-08-11
申请号：US11046614
申请日：2005-01-28
申请人： Nobuyoshi Tsukaguchi , Ken Iyoda
发明人： Nobuyoshi Tsukaguchi , Ken Iyoda
IPC分类号： B23K1/19 , B23K1/20 , C23C18/16 , C23C18/18 , C23C18/32 , H01L21/48 , H01L23/12 , H01L23/373 , H05K1/03 , H05K1/09 , H05K3/24 , B05D3/02
CPC分类号： H01L23/3735 , C23C18/1608 , C23C18/1696 , C23C18/1831 , C23C18/32 , H01L21/4846 , H01L2924/0002 , H05K1/0306 , H05K1/09 , H05K3/24 , H05K3/243 , H05K2201/0355 , H05K2203/072 , H05K2203/0793 , H01L2924/00
摘要： In a method for producing a metal/ceramic bonding member wherein an electroless nickel alloy plating layer 18 is formed on a predetermined portion of the surface of an aluminum plate 12 which is bonded to at least one side of a ceramic substrate 10 and which is formed so as to have a predetermined circuit pattern, an alkali peeling type resist 16 having a predetermined shape is applied on the surface of the aluminum plate 12 before forming the electroless nickel alloy plating layer 18, and then, a portion of the surface of the aluminum plate 12, on which the resist 16 is not applied, is activated with an acidic zinc immersion solution containing a fluoride or silicofluoride. Then, after the electroless nickel alloy plating layer 18 is formed, the resist 16 is removed with an alkali.
摘要翻译：在金属/陶瓷接合部件的制造方法中，在铝板12的与陶瓷基板10的至少一侧接合并形成的金属/陶瓷接合部件的表面的规定部分上形成有化学镀镍合金镀层18，为了具有预定的电路图案，在形成无电镀镍合金镀层18之前，在铝板12的表面上施加具有预定形状的碱剥离型抗蚀剂16，然后将铝的一部分表面未施加抗蚀剂16的板12用含有氟化物或氟化硅的酸性锌浸渍溶液活化。然后，在形成化学镀镍合金镀层18之后，用碱除去抗蚀剂16。

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