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1. 发明申请

US20090230171A1 DEVICE FOR MOUNTING ELECTRIC COMPONENT 有权
标题翻译：用于安装电气部件的装置
公开(公告)号：US20090230171A1
公开(公告)日：2009-09-17
申请号：US12466977
申请日：2009-05-15
申请人： Takashi Matsumura , Hisashi Ando , Shiyuki Kanisawa , Yasuhiro Suga , Noriaki Kudo
发明人： Takashi Matsumura , Hisashi Ando , Shiyuki Kanisawa , Yasuhiro Suga , Noriaki Kudo
IPC分类号： B23K37/00
CPC分类号： B30B5/02 , B30B15/065 , H01L24/29 , H01L24/75 , H01L24/83 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/32225 , H01L2224/73204 , H01L2224/75251 , H01L2224/75252 , H01L2224/75315 , H01L2224/7598 , H01L2224/83101 , H01L2224/83855 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H05K3/323 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199
摘要： A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of the IC chip is pressed against the wiring board with a predetermined pressure, and a side region of the IC chip is pressed with a pressure smaller than the pressure applied to the top region of the IC chip. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion of a thermocompression bonding head. The anisotropic conductive adhesive film contains a binding resin having melting viscosity of 1.0×102 mPa·s or more and 1.0×105 mPa·s or less.
摘要翻译：提供了一种安装方法和安装装置，其可以通过使用粘合剂来安装具有高可靠性的电气部件。安装方法包括通过使用各向异性导电粘合剂膜将IC芯片热压接合到布线板上。在热压接期间，IC芯片的顶部区域以预定的压力压在布线板上，并且IC芯片的侧面区域以比被施加到IC芯片的顶部区域的压力更小的压力被按压。橡胶硬度为40以上且80以下的弹性体用于热压接头的压接部。各向异性导电粘合膜含有熔融粘度为1.0×10 2 mPa·s以上且1.0×10 5 mPa·s以下的粘结树脂。

2. 发明授权

US07556190B2 Method and device for mounting electric component 有权
标题翻译：安装电气元件的方法和装置
公开(公告)号：US07556190B2
公开(公告)日：2009-07-07
申请号：US11327784
申请日：2006-01-06
申请人： Takashi Matsumura , Hisashi Ando , Shiyuki Kanisawa , Yasuhiro Suga , Noriaki Kudo
发明人： Takashi Matsumura , Hisashi Ando , Shiyuki Kanisawa , Yasuhiro Suga , Noriaki Kudo
IPC分类号： B23K31/02 , B29C65/02
CPC分类号： B30B5/02 , B30B15/065 , H01L24/29 , H01L24/75 , H01L24/83 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/32225 , H01L2224/73204 , H01L2224/75251 , H01L2224/75252 , H01L2224/75315 , H01L2224/7598 , H01L2224/83101 , H01L2224/83855 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H05K3/323 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199
摘要： A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of the IC chip is pressed against the wiring board with a predetermined pressure, and a side region of the IC chip is pressed with a pressure smaller than the pressure applied to the top region of the IC chip. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion of a thermocompression bonding head. The anisotropic conductive adhesive film contains a binding resin having melting viscosity of 1.0×102 mPa·s or more and 1.0×105 mPa·s or less.
摘要翻译：提供了一种安装方法和安装装置，其可以通过使用粘合剂来安装具有高可靠性的电气部件。安装方法包括通过使用各向异性导电粘合剂膜将IC芯片热压接合到布线板上。在热压接期间，IC芯片的顶部区域以预定的压力压在布线板上，并且IC芯片的侧面区域以比被施加到IC芯片的顶部区域的压力更小的压力被按压。橡胶硬度为40以上且80以下的弹性体用于热压接头的压接部。各向异性导电粘合膜含有熔融粘度为1.0×10 2 mPa·s以上且1.0×10 5 mPa·s以下的粘结树脂。

3. 发明申请

US20060113356A1 Method and device for mounting electric component 有权
标题翻译：安装电气元件的方法和装置
公开(公告)号：US20060113356A1
公开(公告)日：2006-06-01
申请号：US11327784
申请日：2006-01-06
申请人： Takashi Matsumura , Hisashi Ando , Shiyuki Kanisawa , Yasuhiro Suga , Noriaki Kudo
发明人： Takashi Matsumura , Hisashi Ando , Shiyuki Kanisawa , Yasuhiro Suga , Noriaki Kudo
IPC分类号： A47J36/02
CPC分类号： B30B5/02 , B30B15/065 , H01L24/29 , H01L24/75 , H01L24/83 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/32225 , H01L2224/73204 , H01L2224/75251 , H01L2224/75252 , H01L2224/75315 , H01L2224/7598 , H01L2224/83101 , H01L2224/83855 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H05K3/323 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199
摘要： A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of the IC chip is pressed against the wiring board with a predetermined pressure, and a side region of the IC chip is pressed with a pressure smaller than the pressure applied to the top region of the IC chip. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion of a thermocompression bonding head. The anisotropic conductive adhesive film contains a binding resin having melting viscosity of 1.0×102 mPa·s or more and 1.0×105 mPa·s or less.
摘要翻译：提供了一种安装方法和安装装置，其可以通过使用粘合剂来安装具有高可靠性的电气部件。安装方法包括通过使用各向异性导电粘合剂膜将IC芯片热压接合到布线板上。在热压接期间，IC芯片的顶部区域以预定的压力压在布线板上，并且IC芯片的侧面区域以比被施加到IC芯片的顶部区域的压力更小的压力被按压。橡胶硬度为40以上且80以下的弹性体用于热压接头的压接部。各向异性导电粘合剂膜含有熔融粘度为1.0×10 -2 mPa·s以上且1.0×10 5 mPa·s以下的粘合树脂。

4. 发明授权

US07703657B2 Device for mounting electric component 有权
标题翻译：电气元件安装装置
公开(公告)号：US07703657B2
公开(公告)日：2010-04-27
申请号：US12466977
申请日：2009-05-15
申请人： Takashi Matsumura , Hisashi Ando , Shiyuki Kanisawa , Yasuhiro Suga , Noriaki Kudo
发明人： Takashi Matsumura , Hisashi Ando , Shiyuki Kanisawa , Yasuhiro Suga , Noriaki Kudo
IPC分类号： B23K37/00
CPC分类号： B30B5/02 , B30B15/065 , H01L24/29 , H01L24/75 , H01L24/83 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/32225 , H01L2224/73204 , H01L2224/75251 , H01L2224/75252 , H01L2224/75315 , H01L2224/7598 , H01L2224/83101 , H01L2224/83855 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H05K3/323 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199
摘要： A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of the IC chip is pressed against the wiring board with a predetermined pressure, and a side region of the IC chip is pressed with a pressure smaller than the pressure applied to the top region of the IC chip. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion of a thermocompression bonding head. The anistropic conductive adhesive film contains a binding resin having melting viscosity of 1.0×102 mPa·s or more and 1.0×105 mPa·s or less.
摘要翻译：提供了一种安装方法和安装装置，其可以通过使用粘合剂来安装具有高可靠性的电气部件。安装方法包括通过使用各向异性导电粘合剂膜将IC芯片热压接合到布线板上。在热压接期间，IC芯片的顶部区域以预定的压力压在布线板上，并且IC芯片的侧面区域以比被施加到IC芯片的顶部区域的压力更小的压力被按压。橡胶硬度为40以上且80以下的弹性体用于热压接头的压接部。无纺布导电性粘合膜含有熔融粘度为1.0×10 2 mPa·s以上且1.0×10 5 mPa·s以下的粘结树脂。

5. 发明授权

US5576913A Magnetic head for hard disk having reading core and trailing core 失效
标题翻译：具有读取核心和尾随核心的硬盘磁头
公开(公告)号：US5576913A
公开(公告)日：1996-11-19
申请号：US361562
申请日：1994-12-22
申请人： Noriaki Kudo , Hiroshi Sampei , Masashi Sato
发明人： Noriaki Kudo , Hiroshi Sampei , Masashi Sato
IPC分类号： G11B21/21 , G11B5/60
CPC分类号： G11B5/6005
摘要： In a magnetic head having composed of a reading core and a trailing core, not only an air bearing surface of the reading core is formed so as to be a single air bearing surface, but also the operation of forming a track width and chamfering portions is performed on a common surface with the reading core and the trailing core bonded to each other.
摘要翻译：在由读取芯和后芯组成的磁头中，不仅形成读取磁芯的空气轴承表面以形成单个空气轴承表面，而且形成轨道宽度和倒角部分的操作是在共同的表面上执行，读取芯和拖尾芯彼此粘合。

6. 发明授权

US07098267B2 Polyamic acid varnish composition and a flexible printed board 有权
标题翻译：聚酰胺酸清漆组合物和柔性印刷板
公开(公告)号：US07098267B2
公开(公告)日：2006-08-29
申请号：US10929416
申请日：2004-08-31
申请人： Noriaki Kudo , Minoru Nagashima
发明人： Noriaki Kudo , Minoru Nagashima
IPC分类号： C08L77/00
CPC分类号： H05K1/0346 , C08K5/3462 , C09D179/08 , Y10T428/31681 , Y10T428/31721 , C08L79/08
摘要： A polyamic acid varnish composition, which is composed of a polyamic acid obtained by the addition polymerization of an diamine and an aromatic acid dianhydride, contains as an additive a specific imidazolyl-diaminoazine.
摘要翻译：由通过二胺和芳族酸二酐的加聚获得的聚酰胺酸组成的聚酰胺酸清漆组合物含有特定的咪唑基 - 二氨基嗪作为添加剂。

7. 发明授权

US5266618A Flame-retardant resin composition 失效
标题翻译：阻燃树脂组合物
公开(公告)号：US5266618A
公开(公告)日：1993-11-30
申请号：US890089
申请日：1992-05-28
申请人： Jun Watanabe , Noriaki Kudo
发明人： Jun Watanabe , Noriaki Kudo
IPC分类号： C08K3/38 , C08K5/52 , C08L69/00 , C08J5/10
CPC分类号： C08K5/52 , C08K3/38 , C08L69/00
摘要： A flame-retardant resin composition comprising the following components (A), (B), (C) and (D): (A) 100 parts by weight of a thermoplastic resin comprising 1 a polycarbonate resin, or 2 a polycarbonate resin and a non-polycarbonate resin, (B) from 0.1 to 40 parts by weight of a phosphorus compound, (C) from 0.001 to 40 parts by weight of a boron compound, and (D) from 0.01 to 5 parts by weight of a polyorganosiloxane and/or from 0.001 to 5 parts by weight of a fluorine resin.

8. 发明申请

US20070193770A1 Flexible flat cable 有权
标题翻译：柔性扁平电缆
公开(公告)号：US20070193770A1
公开(公告)日：2007-08-23
申请号：US11569490
申请日：2005-04-21
申请人： Yoshifumi Ueno , Hiroshi Takamatsu , Noriaki Kudo
发明人： Yoshifumi Ueno , Hiroshi Takamatsu , Noriaki Kudo
IPC分类号： H01B7/08
CPC分类号： H01B7/0861
摘要： The FFC (50) comprises multiple conductors (51) with widths of 0.3 (±0.03)mm arranged in a parallel manner with a pitch of 0.5 (±0.05)mm, the first insular material (52) and the second insular material (53) sandwiching these conductors (51) from both sides, shield material (54), and the reinforcement board (55). The first insular material (52) is porous PET possessing a 34 μm thick porous layer (62) and the shield material (54) is a polymer-based shield material possessing a shield layer made of a polymer-based conductive layer (69) equal to or less than 20 μm thick that is a prescribed resin formed including air with uniformly dispersed conductive particles. Due to this, the FFC (50) maintains the shield effect without damaging the electrical characteristics and also, along with being compatible with existing connecters, can combine with the electrical traits by existing processes and furthermore is capable of being established with any number of wires, any length of cable, and any alignment of wiring.
摘要翻译： FFC（50）包括宽度为0.3（±0.03）mm的多个导体（51），平行方式以0.5（±0.05）mm的间距布置，第一岛状材料（52）和第二岛状材料（53））从两侧夹持这些导体（51），屏蔽材料（54）和加强板（55）。第一岛状材料（52）是具有34μm厚的多孔层（62）的多孔PET，并且屏蔽材料（54）是具有由聚合物基导电层（69）制成的屏蔽层的聚合物基屏蔽材料至少为20μm的厚度，其是形成包括具有均匀分散的导电颗粒的空气的规定树脂。因此，FFC（50）保护屏蔽效果而不损害电气特性，并且与现有连接器兼容，可以通过现有工艺与电气特性相结合，并且还可以建立任何数量的电线，任何长度的电缆，以及任何布线对齐。

9. 发明授权

US5736487A Aniline derivatives having herbicidal activity, their preparation and their use 失效
标题翻译：具有除草活性的苯胺衍生物及其制备及其应用
公开(公告)号：US5736487A
公开(公告)日：1998-04-07
申请号：US813174
申请日：1997-03-07
申请人： Soji Sugai , Hiroyuki Komai , Noriaki Kudo , Kazuo Sato , Toyokuni Honma , Junji Kadotani , Kiyoshi Koi , Mitsuru Ito
发明人： Soji Sugai , Hiroyuki Komai , Noriaki Kudo , Kazuo Sato , Toyokuni Honma , Junji Kadotani , Kiyoshi Koi , Mitsuru Ito
IPC分类号： A01N43/74 , A01N47/20 , C07D263/56 , C07D277/64 , A01N43/76 , A01N43/78
CPC分类号： C07D263/56 , A01N43/74 , A01N47/20 , C07D277/64
摘要： Compounds of formula (I): ##STR1## (wherein: R.sup.1 is optionally substituted alkyl, cycloalkyl, optionally substituted alkoxy, or optionally substituted alkylthio; R.sup.2 is hydrogen, optionally substituted alkyl, cycloalkyl, optionally substituted alkenyl, optionally substituted alkynyl or a group of formula --YR.sup.7 ; R.sup.3 is optionally substituted alkyl, cycloalkyl, optionally substituted alkoxy group, optionally substituted alkenyl, optionally substituted alkynyl, halogen, nitro or a group of formula --COR.sup.8, wherein R.sup.8 is hydrogen, alkyl, cycloalkyl or alkoxy; R.sup.4 and R.sup.5 are each hydrogen atom or alkyl; R.sup.6 is optionally substituted alkyl, cycloalkyl, optionally substituted alkoxy group, optionally substituted alkenyl, optionally substituted alkynyl, halogen, nitro, or a group of formula --COR.sup.8, as defined above; A, Q and X are each oxygen or sulfur; Y is a group of formula --CO--, --COO--, --CH.sub.2 O--, --CH.sub.2 S--, --CH.sub.2 CH.sub.2 O--, --CH.sub.2 CH.sub.2 S--, --CH.sub.2 CO--, --CH.sub.2 COO--, --CH(Me)COO--, --CH.sub.2 CH.sub.2 CO--, --CH.sub.2 OCO--, CH.sub.2 OCOO-- and --CH.sub.2 CH.sub.2 OCO--; R.sup.7 is optionally substituted alkyl group, cycloalkyl, optionally substituted alkenyl, optionally substituted alkynyl, optionally substituted aryl, optionally substituted aralkyl, or an optionally substituted heterocycle; and m and n are each an integer from 0 to 4; and herbicidally acceptable addition salts thereof) are useful as herbicides.
摘要翻译：式（I）化合物：其中：R 1为任选取代的烷基，环烷基，任选取代的烷氧基或任选取代的烷硫基; R 2为氢，任选取代的烷基，环烷基，任选取代的烯基，任选取代的炔基或式-YR 7的基团; R 3是任选取代的烷基，环烷基，任选取代的烷氧基，任选取代的烯基，任选取代的炔基，卤素，硝基或式-COR 8的基团，其中R 8是氢，烷基，环烷基或烷氧基 R 4和R 5各自为氢原子或烷基; R 6为任选取代的烷基，环烷基，任选取代的烷氧基，任选取代的烯基，任选取代的炔基，卤素，硝基或如上定义的式-COR 8基团; Q和X各自是氧或硫; Y是式-CO-，-COO-，-CH2O-，-CH2S-，-CH2CH2O-，-CH2CH2S-，-CH2CO-，-CH2COO-，-CH（ Me）COO - ， - CH 2 CH 2 CO - ， - CH 2 OCO - ，CH 2 OOO-和-CH 2 CH 2OCO-; R 7是任选取代的烷基，环烷基，任选取代的烯基，任选取代的炔基，任选取代的芳基，任选取代的芳烷基或任选取代的杂环; m和n分别为0〜4的整数。和除草剂可接受的加成盐）可用作除草剂。

10. 发明授权

US06835442B2 Flexible printed wiring board 失效
标题翻译：柔性印刷线路板
公开(公告)号：US06835442B2
公开(公告)日：2004-12-28
申请号：US10221442
申请日：2002-09-12
申请人： Noriaki Kudo , Asaei Takabayashi , Akitoshi Suzuki , Shin Fukuda
发明人： Noriaki Kudo , Asaei Takabayashi , Akitoshi Suzuki , Shin Fukuda
IPC分类号： B32B1500
CPC分类号： H05K3/384 , H05K1/0346 , H05K2201/0154 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , Y10S428/901 , Y10S428/935 , Y10T428/12438 , Y10T428/12569 , Y10T428/12611 , Y10T428/12903 , Y10T428/24917 , Y10T428/31681 , Y10T428/31721
摘要： A flexible printed board contains an unroughened electrodeposited copper foil, a zinc-based metallic layer provided thereon in an amount of 0.25 to 0.40 mg/dm2, and a polyimide resin layer formed through the imidation of a polyamic acid layer provided on the zinc-based metallic layer.
摘要翻译：柔性印刷电路板包含非增韧的电沉积铜箔，其上设置有0.25至0.40mg / dm 2的锌基金属层，以及通过酰亚胺化形成的聚酰亚胺树脂层锌基金属层。

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