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1. 发明授权

US07332800B2 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US07332800B2
公开(公告)日：2008-02-19
申请号：US10860073
申请日：2004-06-04
申请人： Takashi Kikuchi , Ryosuke Kimoto , Hiroshi Kawakubo , Takashi Miwa , Chikako Imura , Takafumi Nishita , Hiroshi Koyama , Masanori Shibamoto , Masaru Kawakami
发明人： Takashi Kikuchi , Ryosuke Kimoto , Hiroshi Kawakubo , Takashi Miwa , Chikako Imura , Takafumi Nishita , Hiroshi Koyama , Masanori Shibamoto , Masaru Kawakami
IPC分类号： H01L23/02
CPC分类号： H01L23/3128 , H01L21/563 , H01L24/28 , H01L25/105 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83102 , H01L2224/92125 , H01L2225/1023 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/1433 , H01L2924/15151 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/1532 , H01L2924/3511 , H01L2924/00012 , H01L2924/00
摘要： For high density packaging of a semiconductor device, the semiconductor device has a multi-layer substrate, a first-stage chip connected electrically to the multi-layer substrate, other package substrates stacked in three stages on the multi-layer substrate and each connected to an underlying wiring substrate through solder balls, second-, third- and fourth-stage chips electrically connected respectively to the other package substrates, and solder balls provided on the bottom multi-layer substrate. The number of wiring layers in the bottom multi-layer substrate which has a logic chip is larger than that in the package substrates which have memory chips, whereby the semiconductor device can have a wiring layer not used for distribution of wires to the solder balls and wiring lines in the wiring layer can be used for the mounting of another semiconductor element or a passive component to attain high density packaging of the semiconductor device as a stacked type package.
摘要翻译：对于半导体器件的高密度封装，半导体器件具有多层衬底，与多层衬底电连接的第一级芯片，在多层衬底上分层堆叠的其它封装衬底，并且每个衬底连接到通过焊球，第二级，第三级和第四级芯片分别与其他封装衬底电连接的底层布线衬底以及设置在底部多层衬底上的焊球。具有逻辑芯片的底部多层基板中的布线层数大于具有存储芯片的封装基板中的布线层的数量，由此半导体器件可以具有不用于将焊丝分布到焊球的布线层，布线层中的布线可用于安装另一半导体元件或无源元件，以实现作为堆叠型封装的半导体器件的高密度封装。

2. 发明申请

US20050040509A1 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US20050040509A1
公开(公告)日：2005-02-24
申请号：US10860073
申请日：2004-06-04
申请人： Takashi Kikuchi , Ryosuke Kimoto , Hiroshi Kawakubo , Takashi Miwa , Chikako Imura , Takafumi Nishita , Hiroshi Koyama , Masanori Shibamoto , Masaru Kawakami
发明人： Takashi Kikuchi , Ryosuke Kimoto , Hiroshi Kawakubo , Takashi Miwa , Chikako Imura , Takafumi Nishita , Hiroshi Koyama , Masanori Shibamoto , Masaru Kawakami
IPC分类号： H01L23/12 , H01L21/56 , H01L23/31 , H01L25/10 , H05K1/00 , H01L21/48 , H01L23/02
CPC分类号： H01L23/3128 , H01L21/563 , H01L24/28 , H01L25/105 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83102 , H01L2224/92125 , H01L2225/1023 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/1433 , H01L2924/15151 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/1532 , H01L2924/3511 , H01L2924/00012 , H01L2924/00
摘要： For high density packaging of a semiconductor device, the semiconductor device has a multi-layer substrate, a first-stage chip connected electrically to the multi-layer substrate, other package substrates stacked in three stages on the multi-layer substrate and each connected to an underlying wiring substrate through solder balls, second-, third- and fourth-stage chips electrically connected respectively to the other package substrates, and solder balls provided on the bottom multi-layer substrate. The number of wiring layers in the bottom multi-layer substrate which has a logic chip is larger than that in the package substrates which have memory chips, whereby the semiconductor device can have a wiring layer not used for distribution of wires to the solder balls and wiring lines in the wiring layer can be used for the mounting of another semiconductor element or a passive component to attain high density packaging of the semiconductor device as a stacked type package.
摘要翻译：对于半导体器件的高密度封装，半导体器件具有多层衬底，与多层衬底电连接的第一级芯片，在多层衬底上分层堆叠的其它封装衬底，并且每个衬底连接到通过焊球，第二级，第三级和第四级芯片分别与其他封装衬底电连接的底层布线衬底以及设置在底部多层衬底上的焊球。具有逻辑芯片的底部多层基板中的布线层数大于具有存储芯片的封装基板中的布线层的数量，由此半导体器件可以具有不用于将焊丝分布到焊球的布线层，布线层中的布线可用于安装另一半导体元件或无源元件，以实现作为堆叠型封装的半导体器件的高密度封装。

3. 发明授权

US06723583B2 Method of manufacturing a semiconductor device using a mold 有权
标题翻译：使用模具制造半导体器件的方法
公开(公告)号：US06723583B2
公开(公告)日：2004-04-20
申请号：US10453606
申请日：2003-06-04
申请人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
发明人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
IPC分类号： H01L2144
CPC分类号： H01L23/564 , H01L21/561 , H01L21/565 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2223/5442 , H01L2223/54473 , H01L2224/16 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/92 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01L2924/1433 , H01L2924/15151 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/30105 , H01L2924/351 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2224/92247 , H01L2924/00 , H01L2924/00012
摘要： The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.
摘要翻译：将其上安装有多个半导体芯片的带状基板的背面真空吸附到模具的下半模，并且在该状态下，多个半导体芯片同时用树脂密封以形成密封构件。此后，带状基板和密封构件从模具中释放并切割成多个半导体器件。由此获得的半导体器件的安装可靠性得到改善。

4. 发明授权

US07015069B2 Method of manufacturing a semiconductor device and a semiconductor device 有权
公开(公告)号：US07015069B2
公开(公告)日：2006-03-21
申请号：US11047660
申请日：2005-02-02
申请人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
发明人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
IPC分类号： H01L21/44
CPC分类号： H01L23/564 , H01L21/561 , H01L21/565 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2223/5442 , H01L2223/54473 , H01L2224/16 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/92 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01L2924/1433 , H01L2924/15151 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/30105 , H01L2924/351 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2224/92247 , H01L2924/00 , H01L2924/00012
摘要： The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.

5. 发明申请

US20050127535A1 Method of manufacturing a semiconductor device and a semiconductor device 有权
标题翻译：制造半导体器件和半导体器件的方法
公开(公告)号：US20050127535A1
公开(公告)日：2005-06-16
申请号：US11047660
申请日：2005-02-02
申请人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
发明人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
IPC分类号： B29C45/14 , H01L21/56 , H01L23/00 , H01L23/12 , H01L23/31 , H01L23/498 , H01L23/28
CPC分类号： H01L23/564 , H01L21/561 , H01L21/565 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2223/5442 , H01L2223/54473 , H01L2224/16 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/92 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01L2924/1433 , H01L2924/15151 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/30105 , H01L2924/351 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2224/92247 , H01L2924/00 , H01L2924/00012
摘要： The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.
摘要翻译：将其上安装有多个半导体芯片的带状基板的背面真空吸附到模具的下半模，并且在该状态下，多个半导体芯片同时用树脂密封以形成密封构件。此后，带状基板和密封构件从模具中释放并切割成多个半导体器件。由此获得的半导体器件的安装可靠性得到改善。

6. 发明授权

US06872597B2 Method of manufacturing a semiconductor device and a semiconductor device 有权
公开(公告)号：US06872597B2
公开(公告)日：2005-03-29
申请号：US10784276
申请日：2004-02-24
申请人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
发明人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
IPC分类号： B29C45/14 , H01L21/56 , H01L23/00 , H01L23/12 , H01L23/31 , H01L23/498 , H01L21/44
CPC分类号： H01L23/564 , H01L21/561 , H01L21/565 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2223/5442 , H01L2223/54473 , H01L2224/16 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/92 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01L2924/1433 , H01L2924/15151 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/30105 , H01L2924/351 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2224/92247 , H01L2924/00 , H01L2924/00012
摘要： The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.

7. 发明授权

US06596561B2 Method of manufacturing a semiconductor device using reinforcing patterns for ensuring mechanical strength during manufacture 有权
标题翻译：使用加强图案制造半导体器件的方法，用于确保制造期间的机械强度
公开(公告)号：US06596561B2
公开(公告)日：2003-07-22
申请号：US09987532
申请日：2001-11-15
申请人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
发明人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
IPC分类号： H01L2144
CPC分类号： H01L23/564 , H01L21/561 , H01L21/565 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2223/5442 , H01L2223/54473 , H01L2224/16 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/92 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01L2924/1433 , H01L2924/15151 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/30105 , H01L2924/351 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2224/92247 , H01L2924/00 , H01L2924/00012
摘要： The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.
摘要翻译：将其上安装有多个半导体芯片的带状基板的背面真空吸附到模具的下半模，并且在该状态下，多个半导体芯片同时用树脂密封以形成密封构件。此后，带状基板和密封构件从模具中释放并切割成多个半导体器件。由此获得的半导体器件的安装可靠性得到改善。

8. 发明授权

US08414133B2 Projection display device having an operation section for displacing a lens 有权
标题翻译：投影显示装置具有用于移动透镜的操作部
公开(公告)号：US08414133B2
公开(公告)日：2013-04-09
申请号：US13551034
申请日：2012-07-17
申请人： Takaharu Adachi , Shinichi Okuno , Ryuhei Amano , Takashi Ikeda , Takashi Miwa
发明人： Takaharu Adachi , Shinichi Okuno , Ryuhei Amano , Takashi Ikeda , Takashi Miwa
IPC分类号： G03B21/28 , G03B3/00
CPC分类号： G03B21/28
摘要： A projection display device comprises a projection lens section to which light modulated by a light modulating element is entered, a mirror section for reflecting the light emitted from the projection lens section to reflect to the projection lens section side and directing the light to a projection plane, and an operation section for displacing a lens in the projection lens section. The operation section is disposed in a region in which the operation section does not hinder an optical path of the light that has been passed through a projection port provided in a main body cabinet.
摘要翻译：投影显示装置包括投影透镜部分，由光调制元件调制的光进入该投影透镜部分，用于反射从投影透镜部分发射的光以反射到投影透镜部分侧并将光引导到投影平面的反射镜部分以及用于移动投影透镜部中的透镜的操作部。操作部设置在操作部不妨碍通过设置在主体机壳中的突出口的光的光路的区域。

9. 发明授权

US08084869B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08084869B2
公开(公告)日：2011-12-27
申请号：US12478837
申请日：2009-06-05
申请人： Takashi Miwa , Michiaki Sugiyama , Kazumasa Yanagisawa
发明人： Takashi Miwa , Michiaki Sugiyama , Kazumasa Yanagisawa
IPC分类号： H01L23/29
CPC分类号： H01L23/49838 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/81 , H01L25/0657 , H01L25/105 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/056 , H01L2224/13144 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48105 , H01L2224/48227 , H01L2224/48229 , H01L2224/73204 , H01L2224/73253 , H01L2224/81203 , H01L2224/81801 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H05K1/112 , H05K3/4652 , H05K2201/09227 , H05K2201/099 , H05K2201/10734 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A technique permitting the reduction in size of a semiconductor device is provided. In a BGA type semiconductor device with a semiconductor chip flip-chip-bonded onto a wiring substrate, bump electrodes of the semiconductor chip are coupled to lands formed at an upper surface of the wiring substrate. The lands at the upper surface of the wiring substrate are coupled electrically to solder balls formed on a lower surface of the wiring substrate. Therefore, the lands include first type lands with lead-out lines coupled thereto and second type lands with lead-out lines not coupled thereto but with vias formed just thereunder. The lands are arrayed in six or more rows at equal pitches in an advancing direction of the rows. However, a row-to-row pitch is not made an equal pitch. In land rows which are likely to cause a short-circuit, the pitch between adjacent rows is made large, while in land rows which are difficult to cause a short-circuit, the pitch between adjacent rows is made small. By so doing, both prevention of a short-circuit and improvement of the layout density of lands are attained at a time.
摘要翻译：提供了允许半导体器件的尺寸减小的技术。在具有倒装芯片接合在布线基板上的半导体芯片的BGA型半导体器件中，半导体芯片的突起电极被耦合到在布线基板的上表面上形成的焊盘。布线基板的上表面的焊盘电连接到形成在布线基板的下表面上的焊球。因此，焊盘包括具有与其耦合的引出线的第一类型的焊盘和没有耦合到其上的导出线，但是具有刚好形成的通孔的第二类型的焊盘。焊盘沿着行的前进方向以等间距排列成六行或更多行。然而，行到行间距不是相等的音高。在可能导致短路的陆地列中，相邻行之间的间距变大，而在难以引起短路的陆地行中，相邻行之间的间距变小。通过这样做，一次可以实现防止短路的改善和布局密度的提高。

10. 发明授权

US08084003B2 Ozone detecting device 有权
标题翻译：臭氧检测装置
公开(公告)号：US08084003B2
公开(公告)日：2011-12-27
申请号：US12444845
申请日：2007-10-17
申请人： Takashi Miwa , Yasuko Maruo , Jiro Nakamura , Tatsuya Kunioka , Seizo Sakata
发明人： Takashi Miwa , Yasuko Maruo , Jiro Nakamura , Tatsuya Kunioka , Seizo Sakata
IPC分类号： G01N33/52
CPC分类号： G01N31/224 , G01N21/783 , Y10T436/206664
摘要： A vessel (102) containing a detector solution (101) is prepared. The detector solution (101) is an aqueous solution prepared by dissolving a detector component containing a dye which changes its color when reacting with ozone gas, a humectant, and an ultraviolet absorber having a hydrophilic group. A prepared sheet-like carrier (103) is dipped in the detector solution (101) for, e.g., 30 sec, thereby forming an impregnated sheet (104) by impregnating the sheet-like carrier (103) with the detector solution (101). The impregnated sheet (104) is then dried by evaporating the solvent (medium) such as water contained in the impregnated sheet (104), thereby forming a sheet-like ozone detecting device (105).
摘要翻译：制备容纳检测器溶液（101）的容器（102）。检测器溶液（101）是通过将含有与臭氧气体，湿润剂和具有亲水基团的紫外线吸收剂反应而变色的染料的检测剂成分溶解而成的水溶液。将准备的片状载体（103）浸渍在检测器溶液（101）中，例如30秒，由此通过用检测器溶液（101）浸渍片状载体（103）形成浸渍片材（104）。然后通过蒸发包含在浸渍片材（104）中的水的溶剂（介质）干燥浸渍的片材（104），从而形成片状臭氧检测装置（105）。

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