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1. 发明授权

US08215947B2 Molding die 有权
标题翻译：成型模具
公开(公告)号：US08215947B2
公开(公告)日：2012-07-10
申请号：US12785979
申请日：2010-05-24
申请人： Takashi Kato , Kazuhisa Fujiwara , Takuya Eto , Takashi Nagata , Tomoyuki Ishiyama
发明人： Takashi Kato , Kazuhisa Fujiwara , Takuya Eto , Takashi Nagata , Tomoyuki Ishiyama
IPC分类号： B29C43/32
CPC分类号： B29C45/4407 , B29C45/2608 , B29C45/33 , B29L2031/3044 , Y10S425/053 , Y10S425/247
摘要： A molding die includes a fixed die, a movable die movable toward and away from the fixed die, a first slide core slidable in sliding engagement with the fixed die, and a second slide core having a presser for pressing the first slide core when the second slide core is held in pressing contact with the first slide core. The fixed die, the movable die, the first slide core, and the second slide core jointly define a cavity for molding a product. The presser includes a reactive force plate for producing reactive forces against the pressure of a molten material introduced into the cavity.
摘要翻译：成形模具包括：固定模具，可朝向和远离固定模具移动的可移动模具;可滑动地与固定模具滑动接合的第一滑动芯部;以及第二滑动芯部，其具有用于在第二滑动芯部滑动芯与第一滑动芯保持压接。固定模具，可动模具，第一滑动芯部和第二滑动芯部共同地限定用于模制产品的空腔。压脚包括反作用力板，用于抵抗引入腔中的熔融材料的压力产生反作用力。

2. 发明申请

US20100303948A1 MOLDING DIE 有权
标题翻译：模具
公开(公告)号：US20100303948A1
公开(公告)日：2010-12-02
申请号：US12785979
申请日：2010-05-24
申请人： Takashi KATO , Kazuhisa Fujiwara , Takuya Eto , Takashi Nagata , Tomoyuki Ishiyama
发明人： Takashi KATO , Kazuhisa Fujiwara , Takuya Eto , Takashi Nagata , Tomoyuki Ishiyama
IPC分类号： B29C43/42
CPC分类号： B29C45/4407 , B29C45/2608 , B29C45/33 , B29L2031/3044 , Y10S425/053 , Y10S425/247
摘要： A molding die includes a fixed die, a movable die movable toward and away from the fixed die, a first slide core slidable in sliding engagement with the fixed die, and a second slide core having a presser for pressing the first slide core when the second slide core is held in pressing contact with the first slide core. The fixed die, the movable die, the first slide core, and the second slide core jointly define a cavity for molding a product. The presser includes a reactive force plate for producing reactive forces against the pressure of a molten material introduced into the cavity.
摘要翻译：成形模具包括：固定模具，可朝向和远离固定模具移动的可移动模具;可滑动地与固定模具滑动接合的第一滑动芯部;以及第二滑动芯部，其具有用于在第二滑动芯部滑动芯与第一滑动芯保持压接。固定模具，可动模具，第一滑动芯部和第二滑动芯部共同地限定用于模制产品的空腔。压脚包括反作用力板，用于抵抗引入腔中的熔融材料的压力产生反作用力。

3. 发明授权

US07501711B2 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same 有权
标题翻译：用于半导体封装的环氧树脂组合物和使用其的半导体器件
公开(公告)号：US07501711B2
公开(公告)日：2009-03-10
申请号：US11665967
申请日：2005-10-18
申请人： Takuya Eto , Kazuhiro Ikemura , Eiji Toyoda , Katsuyuki Nakabayashi , Daisuke Tsukahara
发明人： Takuya Eto , Kazuhiro Ikemura , Eiji Toyoda , Katsuyuki Nakabayashi , Daisuke Tsukahara
IPC分类号： H01L23/28
CPC分类号： C08G59/621 , C08L63/00 , H01L23/295 , H01L2924/0002 , Y10T428/31511 , C08L2666/16 , H01L2924/00
摘要： An epoxy resin composition for semiconductor encapsulation which does not contain conductive foreign metallic particles having such a size that they cannot be detected and eliminated by the conventional method for eliminating conductive foreign metallic particles. The epoxy resin composition for semiconductor encapsulation comprises the following components (A) to (D). Conductive foreign metallic particles having a size of 20 μm or more are substantially not contained in the aforementioned epoxy resin composition. (A) An epoxy resin. (B) A phenol resin. (C) A hardening accelerator. (D) An inorganic filler.
摘要翻译：一种用于半导体封装的环氧树脂组合物，其不含有通过用于消除导电性异质金属颗粒的传统方法不能检测和消除的尺寸的导电异物金属颗粒。用于半导体封装的环氧树脂组合物包括以下组分（A）至（D）。在上述环氧树脂组合物中基本上不含有尺寸为20μm以上的导电性异质金属粒子。（A）环氧树脂。（B）酚醛树脂。（C）硬化促进剂。（D）无机填料。

4. 发明申请

US20050154152A1 Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby 失效
标题翻译：用于制造半导体封装用环氧树脂组合物的方法和由此得到的半导体封装用环氧树脂组合物和半导体装置
公开(公告)号：US20050154152A1
公开(公告)日：2005-07-14
申请号：US11000905
申请日：2004-12-02
申请人： Eiji Toyoda , Takeshi Okada , Keisuke Yoshikawa , Takuya Eto , Kazuhiro Ikemura , Shinya Akizuki , Tsuyoshi Ishizaka , Takahiro Uchida , Kei Toyota
发明人： Eiji Toyoda , Takeshi Okada , Keisuke Yoshikawa , Takuya Eto , Kazuhiro Ikemura , Shinya Akizuki , Tsuyoshi Ishizaka , Takahiro Uchida , Kei Toyota
IPC分类号： C08G59/00 , C08G59/18 , C08G59/62 , C08G59/68 , C08L61/04 , C08L61/06 , C08L63/00 , H01L23/29 , H01L23/31 , C08L61/00
CPC分类号： C08L61/06 , C08G59/621 , C08G59/688 , C08L61/04 , C08L63/00 , H01L23/293 , H01L2224/45144 , H01L2224/48091 , C08L2666/22 , C08L2666/16 , H01L2924/00014 , H01L2924/00
摘要： A method for producing an epoxy resin composition for semiconductor encapsulation, which does not cause void generation and the like and is excellent in reliability. A method for producing an epoxy resin composition for semiconductor encapsulation, which contains the following components (A) to (C): (A) an epoxy resin, (B) a phenol resin, and (C) a hardening accelerator, which comprises mixing the whole or a part of the components excluding the component (A) among the components containing the components (A) to (C) in advance under a reduced pressure of from 1.333 to 66.65 kPa and under a heating condition of from 100 to 230° C., and then mixing the component (A) and remaining components with the resulting mixture.
摘要翻译：一种半导体封装用环氧树脂组合物的制造方法，其不产生空穴生成等，可靠性优异。一种半导体封装用环氧树脂组合物的制造方法，其含有以下成分（A）〜（C）：（A）环氧树脂，（B）酚醛树脂，（C）硬化促进剂，预先在1.333〜66.65kPa的减压下和100〜230℃的加热条件下预先含有成分（A）〜（C）的成分中除了成分（A）以外的成分的全部或一部分然后将组分（A）和其余组分与所得混合物混合。

5. 发明申请

US20080136048A1 Epoxy Resin Composition for Semiconductor Encapsulation and Semiconductor Device Using the Same 有权
标题翻译：用于半导体封装的环氧树脂组合物和使用其的半导体器件
公开(公告)号：US20080136048A1
公开(公告)日：2008-06-12
申请号：US11665967
申请日：2005-10-18
申请人： Takuya Eto , Kazuhiro Ikemura , Eiji Toyoda , Katsuyuki Nakabayashi , Daisuke Tsukahara
发明人： Takuya Eto , Kazuhiro Ikemura , Eiji Toyoda , Katsuyuki Nakabayashi , Daisuke Tsukahara
IPC分类号： H01L23/29 , C08G67/00 , C09K3/00
CPC分类号： C08G59/621 , C08L63/00 , H01L23/295 , H01L2924/0002 , Y10T428/31511 , C08L2666/16 , H01L2924/00
摘要： An epoxy resin composition for semiconductor encapsulation which does not contain conductive foreign metallic particles having such a size that they cannot be detected and eliminated by the conventional method for eliminating conductive foreign metallic particles. The epoxy resin composition for semiconductor encapsulation comprises the following components (A) to (D). Conductive foreign metallic particles having a size of 20 μM or more are substantially not contained in the aforementioned epoxy resin composition.(A) An epoxy resin.(B) A phenol resin.(C) A hardening accelerator.(D) An inorganic filler.
摘要翻译：一种用于半导体封装的环氧树脂组合物，其不含有通过用于消除导电性异质金属颗粒的传统方法不能检测和消除的尺寸的导电异物金属颗粒。用于半导体封装的环氧树脂组合物包括以下组分（A）至（D）。在上述环氧树脂组合物中基本上不含有尺寸为20μm以上的导电性异质金属粒子。（A）环氧树脂。（B）酚醛树脂。（C）硬化促进剂。（D）无机填料。

6. 发明授权

US07359663B2 Image forming apparatus 有权
标题翻译：图像形成装置
公开(公告)号：US07359663B2
公开(公告)日：2008-04-15
申请号：US11326732
申请日：2006-01-05
申请人： Hiroshi Inui , Takuya Eto
发明人： Hiroshi Inui , Takuya Eto
IPC分类号： G03G15/01
CPC分类号： G03G15/0131 , G03G15/1615 , G03G2215/0119 , G03G2215/0132 , G03G2215/0154
摘要： An image forming apparatus has a plurality of developing units for developing toner images of different colors, an intermediate transfer belt for transferring the toner images of the respective colors onto a surface of the belt or onto a recording sheet transported over the belt surface, a first or drive roller for driving the belt while the belt is wound around the first roller, a second or driven roller and a tension roller, which is driven along with the driving of the belt driven by the first roller. The image forming apparatus satisfies a relation defined by the following equation: D2=N·D1 where D1 is a belt-inclusive outer diameter of the first roller where the belt is wound, including the thickness t of the belt, D2 is an outer diameter of the second roller, and N=n or 1/n where n is a positive integer.
摘要翻译：图像形成装置具有用于显影不同颜色的调色剂图像的多个显影单元，用于将各种颜色的调色剂图像转印到带的表面上或传送到带表面上的记录片材上的中间转印带，第一或用于驱动带的驱动辊，同时带缠绕在第一辊上，第二或从动辊和张紧辊，其随着由第一辊驱动的带的驱动而被驱动。图像形成装置满足由以下等式定义的关系：<？in-line-formula description =“In-line formula”end =“lead”？> D2 = N.D1 <？in-line-formula description =“ 其中D 1是缠绕带的第一辊的包含皮带的外径，包括带的厚度t，D 2是第二辊的外径，N = n或1 / n，其中n是正整数。

7. 发明申请

US20070019998A1 Image forming apparatus 有权
标题翻译：图像形成装置
公开(公告)号：US20070019998A1
公开(公告)日：2007-01-25
申请号：US11326732
申请日：2006-01-05
申请人： Hiroshi Inui , Takuya Eto
发明人： Hiroshi Inui , Takuya Eto
IPC分类号： G03G15/01
CPC分类号： G03G15/0131 , G03G15/1615 , G03G2215/0119 , G03G2215/0132 , G03G2215/0154
摘要： An image forming apparatus has a plurality of developing units for developing toner images of different colors, an intermediate transfer belt for transferring the toner images of the respective colors onto a surface of the belt or onto a recording sheet transported over the belt surface, a first or drive roller for driving the belt while the belt is wound around the first roller, a second or driven roller and a tension roller, which is driven along with the driving of the belt driven by the first roller. The image forming apparatus satisfies a relation defined by the following equation: D2=N·D1 where D1 is a belt-inclusive outer diameter of the first roller where the belt is wound, including the thickness t of the belt, D2 is an outer diameter of the second roller, and N=n or 1/n where n is a positive integer.
摘要翻译：图像形成装置具有用于显影不同颜色的调色剂图像的多个显影单元，用于将各种颜色的调色剂图像转印到带的表面上或传送到带表面上的记录片材上的中间转印带，第一或用于驱动带的驱动辊，同时带缠绕在第一辊上，第二或从动辊和张紧辊，其随着由第一辊驱动的带的驱动而被驱动。图像形成装置满足由以下等式定义的关系：<？in-line-formula description =“In-line formula”end =“lead”？> D2 = N.D1 <？in-line-formula description =“ 其中D1是缠绕带的第一辊的包含皮带的外径，包括带的厚度t，D2是第二辊的外径，以及 N = n或1 / n，其中n是正整数。

8. 发明申请

US20100193972A1 SPHERICAL SINTERED FERRITE PARTICLES, RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION COMPRISING THEM AND SEMICONDUCTOR DEVICES PRODUCED BY USING THE SAME 审中-公开
标题翻译：球形烧结粉末颗粒，用于包含其使用它们的半导体器件的半导体封装的树脂组合物
公开(公告)号：US20100193972A1
公开(公告)日：2010-08-05
申请号：US12303856
申请日：2006-06-06
申请人： Kazumi Yamamoto , Masaharu Abe , Shigehisa Yamamoto , Kazushi Nishimoto , Tomohiro Dote , Kazumasa Igarashi , Kazuhiro Ikemura , Takuya Eto , Masataka Tada , Katsumi Okayama , Kaoru Kato
发明人： Kazumi Yamamoto , Masaharu Abe , Shigehisa Yamamoto , Kazushi Nishimoto , Tomohiro Dote , Kazumasa Igarashi , Kazuhiro Ikemura , Takuya Eto , Masataka Tada , Katsumi Okayama , Kaoru Kato
IPC分类号： H01L23/29 , C08K3/10 , C08K3/36
CPC分类号： C01G49/0018 , C01G49/0063 , C01G49/0072 , C01P2002/32 , C01P2002/50 , C01P2004/32 , C01P2004/51 , C01P2004/53 , C01P2004/61 , C01P2006/12 , C01P2006/14 , C01P2006/22 , C01P2006/42 , C01P2006/80 , C04B35/2625 , C04B35/265 , C04B35/6263 , C04B35/62655 , C04B35/62675 , C04B35/62685 , C04B35/62695 , C04B2235/3206 , C04B2235/3262 , C04B2235/3279 , C04B2235/3281 , C04B2235/3284 , C04B2235/528 , C04B2235/5409 , C04B2235/5436 , C04B2235/5445 , C04B2235/5472 , C04B2235/763 , C04B2235/79 , C08G59/621 , C08L63/00 , C09C1/24 , H01L23/295 , H01L23/3107 , H01L23/3128 , H01L23/552 , H01L24/45 , H01L24/48 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/48247 , H01L2224/48465 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01079 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , Y10T428/2982 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A resin composition for semiconductor encapsulation having good moldability, of which the cured product has effective electromagnetic wave shieldability, is provided. A resin composition for semiconductor encapsulation, containing spherical sintered ferrite particles having the following properties (a) to (c) : (a) the soluble ion content of the particles is at most 5 ppm; (b) the mean particle size of the particles is from 10 to 50 μm; (c) the crystal structure of the particles by X-ray diffractiometry is a spinel structure.
摘要翻译：提供了具有良好成型性的半导体封装用树脂组合物，其固化物具有有效的电磁波屏蔽性。一种半导体封装用树脂组合物，含有具有以下特性（a）〜（c）的球状烧结铁氧体颗粒：（a）颗粒的可溶性离子含量为5ppm以下，（b）颗粒的平均粒度为10〜50μm; （c）通过X射线衍射法测定的颗粒的晶体结构是尖晶石结构。

9. 发明授权

US07268191B2 Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby 失效
标题翻译：用于制造半导体封装用环氧树脂组合物的方法和由此得到的半导体封装用环氧树脂组合物和半导体装置
公开(公告)号：US07268191B2
公开(公告)日：2007-09-11
申请号：US11000905
申请日：2004-12-02
申请人： Eiji Toyoda , Takeshi Okada , Keisuke Yoshikawa , Takuya Eto , Kazuhiro Ikemura , Shinya Akizuki , Tsuyoshi Ishizaka , Takahiro Uchida , Kei Toyota
发明人： Eiji Toyoda , Takeshi Okada , Keisuke Yoshikawa , Takuya Eto , Kazuhiro Ikemura , Shinya Akizuki , Tsuyoshi Ishizaka , Takahiro Uchida , Kei Toyota
IPC分类号： C08L63/00 , C08L63/02 , C08L63/04 , H01L23/29
CPC分类号： C08L61/06 , C08G59/621 , C08G59/688 , C08L61/04 , C08L63/00 , H01L23/293 , H01L2224/45144 , H01L2224/48091 , C08L2666/22 , C08L2666/16 , H01L2924/00014 , H01L2924/00
摘要： A method for producing an epoxy resin composition for semiconductor encapsulation, which does not cause void generation and the like and is excellent in reliability. A method for producing an epoxy resin composition for semiconductor encapsulation, which contains the following components (A) to (C): (A) an epoxy resin, (B) a phenol resin, and (C) a hardening accelerator, which comprises mixing the whole or a part of the components excluding the component (A) among the components containing the components (A) to (C) in advance under a reduced pressure of from 1.333 to 66.65 kPa and under a heating condition of from 100 to 230° C., and then mixing the component (A) and remaining components with the resulting mixture.
摘要翻译：一种半导体封装用环氧树脂组合物的制造方法，其不产生空穴生成等，可靠性优异。一种半导体封装用环氧树脂组合物的制造方法，其含有以下成分（A）〜（C）：（A）环氧树脂，（B）酚醛树脂，（C）硬化促进剂，预先在1.333〜66.65kPa的减压下和100〜230℃的加热条件下预先含有成分（A）〜（C）的成分中除了成分（A）以外的成分的全部或一部分然后将组分（A）和其余组分与所得混合物混合。

10. 发明授权

US07265167B2 Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same 有权
标题翻译：用于半导体封装的环氧树脂组合物和使用其的半导体器件
公开(公告)号：US07265167B2
公开(公告)日：2007-09-04
申请号：US10703494
申请日：2003-11-10
申请人： Shinya Akizuki , Kazuhiro Ikemura , Hisataka Ito , Takahiro Uchida , Takuya Eto , Tsutomu Nishioka , Katsumi Shimada
发明人： Shinya Akizuki , Kazuhiro Ikemura , Hisataka Ito , Takahiro Uchida , Takuya Eto , Tsutomu Nishioka , Katsumi Shimada
IPC分类号： C08K3/36 , C08L63/00 , C08L63/02 , H01L23/29
CPC分类号： H01L23/295 , C08G59/621 , C08K3/04 , C08K3/36 , C08K9/02 , H01L2224/13 , H01L2224/16 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2224/0401
摘要： An epoxy resin composition for semiconductor encapsulation capable of giving semiconductor devices of high reliability that do not cause short circuits even in pitch reduction in the interconnection electrode distance or the conductor wire distance therein as well as a semiconductor device using the same. The epoxy resin composition for semiconductor encapsulation, which comprises the following components (A) to (C): (A) an epoxy resin, (B) a phenolic resin, and (C) an inorganic filler for preventing semiconductors from short-circuiting in a step of semiconductor encapsulation.
摘要翻译：一种用于半导体封装的环氧树脂组合物，其能够提供即使在互连电极距离或导体线距离的间距减小中也不会引起短路的高可靠性的半导体器件以及使用该半导体器件的半导体器件。用于半导体封装的环氧树脂组合物，其包含以下组分（A）至（C）：（A）环氧树脂，（B）酚醛树脂，和（C）用于防止半导体短路的无机填料半导体封装的一个步骤。

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