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    • 1. 发明授权
    • Process for etching
    • 蚀刻工艺
    • US5110408A
    • 1992-05-05
    • US658254
    • 1991-02-20
    • Takashi FujiiHironobu KawaharaKazuo TakataMasaharu NishiumiNoriaki Yamamoto
    • Takashi FujiiHironobu KawaharaKazuo TakataMasaharu NishiumiNoriaki Yamamoto
    • H01L21/302H01L21/28H01L21/3065H01L21/308H01L21/3213
    • H01L21/3065H01L21/30655H01L21/3085H01L21/32136H01L21/32137H01L21/32139
    • The present invention relates to the etching of a gate film, a tungsten film, a silicon film, etc. In the present invention, use is made of an etching gas comprising a mixture composed of a reductive fluoride gas, a hydrocarbon gas and a halogen gas having a larger atomic diameter than a material to be etched, or a mixture composed of a reductive fluoride gas and a Cl-containing hydrocarbon gas, and the process comprises the step of conducting anisotropic etching of a material to be etched with an etching gas (a reductive fluoride gas), the step of forming a protective film by a depositing gas (a hydrocarbon gas), and the step of removing excess deposits formed as the protective film by means of a gas reactive with the protective film (a halogen gas or a Cl-containing hydrogen gas), wherein anisotropic etching is conducted by forming a protective film on a side wall while removing excess deposits formed as the protective film, thus enabling the anisotropic etching to be conducted with good accuracy.
    • 本发明涉及栅极膜,钨膜,硅膜等的蚀刻。在本发明中,使用包括由还原氟化物气体,烃气体和卤素组成的混合物的蚀刻气体 具有比待蚀刻材料更大的原子直径的气体或由还原性氟化物气体和含Cl的烃气体组成的混合物,该方法包括用蚀刻气体进行各向异性腐蚀蚀刻的步骤 (还原氟化物气体),通过沉积气体(烃气体)形成保护膜的步骤,以及通过与保护膜反应的气体(卤素气体)除去形成为保护膜的多余的沉积物的步骤 或含Cl的氢气),其中通过在侧壁上形成保护膜进行各向异性蚀刻,同时除去形成为保护膜的多余的沉积物,从而能够进行各向异性蚀刻 准确度好
    • 6. 发明授权
    • Etching method and etching equipment
    • 蚀刻方法和蚀刻设备
    • US08288287B2
    • 2012-10-16
    • US12054095
    • 2008-03-24
    • Kazuo TakataYutaka KudouSatoshi Tani
    • Kazuo TakataYutaka KudouSatoshi Tani
    • H01L21/302
    • H01L21/3065H01L21/76898
    • The invention provides an etching method for realizing trench etching without causing any damages to the side walls of the trench while maintaining a high-etching rate. The plasma etching method relates to forming a groove or a hole by forming a silicon trench to a silicon substrate or a silicon substrate having a silicon oxide dielectric layer via a mixed gas plasma containing a mixed gas of SF6 and O2 or a mixed gas of SF6, O2 and SiF4 and having added thereto a gas containing hydrogen within the range of 5 to 16% (percent concentration) of the total gas flow rate of the mixed gas.
    • 本发明提供一种用于实现沟槽蚀刻的蚀刻方法,而不会在保持高蚀刻速率的同时对沟槽的侧壁造成任何损坏。 等离子体蚀刻方法涉及通过在硅衬底或具有氧化硅电介质层的硅衬底上形成硅沟槽来形成沟槽或孔,该混合气体等离子体包含SF6和O2的混合气体或SF6的混合气体 ,O 2和SiF 4,并且向其中加入含有氢气的气体在混合气体的总气体流量的5至16%(浓度百分比)的范围内。