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    • 7. 发明授权
    • Epoxy group-containing silicone resin and compositions based thereon
    • 含环氧基的硅氧烷树脂及其组合物
    • US5952439A
    • 1999-09-14
    • US226539
    • 1994-04-12
    • Yoshitsugu MoritaJunji NakanishiKen TanakaToshio Saruyama
    • Yoshitsugu MoritaJunji NakanishiKen TanakaToshio Saruyama
    • C08G59/32C08G77/14C08L61/06C08L63/00C08L79/08C08L83/06C08L101/00C08G77/00C08L283/00
    • C08L61/06C08G59/3254C08G77/14C08L101/00C08L79/08C08L83/06C08L63/00
    • There is disclosed a curable resin composition that has an excellent fluidity prior to curing and that cures to form a molding resin that is flexible, highly moisture resistant, and strongly resistant to heat shock, said composition comprising(A) 100 weight parts of a curable resin; and(B) 0.1 to 500 weight parts of an epoxy group-containing silicone resin that has the general formula(R.sup.1 SiO.sub.3/2).sub.a (R.sup.2 R.sup.3 SiO.sub.2/2).sub.b (SiO.sub.4/2).sub.cwherein R.sup.1, R.sup.2 and R.sup.3 each represents a group selected from the group consisting of an epoxy group-containing organic group and a monovalent hydrocarbon group with the proviso that said epoxy group-containing organic groups comprise 0.1 to 40 mole percent of the total silicon-bonded organic groups in said silicone resin (B), a is a positive number, b is zero or a positive number, c is zero or a positive number, b/a has a value of zero to 10, c/(a+b+c) has a value of zero to 0.3 and said silicone resin (B) has a glass-transition temperature of -90.degree. C. to 150.degree. C.
    • 公开了一种固化性树脂组合物,其在固化前具有优异的流动性,并且可固化形成柔性,高度防潮并且耐热冲击性强的模制树脂,所述组合物包含(A)100重量份的可固化 树脂; 和(B)0.1〜500重量份具有通式(R1SiO3 / 2)a(R2R3SiO2 / 2)b(SiO4 / 2)c的含环氧基的有机硅树脂,其中R1,R2和R3各自表示基团 选自含有环氧基的有机基团和一价烃基,条件是所述含环氧基的有机基团包含所述有机硅树脂(B)中的总硅键合有机基团的0.1至40摩尔% ,a为正数,b为零或正数,c为零或正数,b / a的值为零至10,c /(a + b + c)的值为零至0.3 所述有机硅树脂(B)的玻璃化转变温度为-90℃〜150℃。