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1. 发明授权

US07405251B2 Flame retardant compositions 有权
标题翻译：阻燃组合物
公开(公告)号：US07405251B2
公开(公告)日：2008-07-29
申请号：US10512733
申请日：2003-05-15
申请人： David Joseph Romenesko , Randall Gene Schmidt , Atsushi Togashi , Gary Michael Wieber
发明人： David Joseph Romenesko , Randall Gene Schmidt , Atsushi Togashi , Gary Michael Wieber
IPC分类号： C08L83/05 , C08L69/00 , C08L55/02
CPC分类号： C08L101/00 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/44 , C08G77/70 , C08L83/04 , C08L2666/14 , C08L2666/02
摘要： This invention relates to a flame retardant composition comprising: (a) 81 to 99.99 weight percent of a thermoplastic resin, thermoset resin, thermoplastic resin blend, or thermoset resin blend which upon burning forms a char and (b) 0.01-19 weight percent of a silsesquioxane resin having a weight average molecular weight of greater than 300.
摘要翻译：本发明涉及一种阻燃剂组合物，其包含：（a）81至99.99重量％的热塑性树脂，热固性树脂，热塑性树脂共混物或热固树脂共混物，其在燃烧时形成炭，（b）0.01-19重量％重均分子量大于300的倍半硅氧烷树脂。

2. 发明申请

US20070225437A1 Curable Silicone Composition and Cured Product Thereof 有权
标题翻译：可固化硅酮组合物及其固化产品
公开(公告)号：US20070225437A1
公开(公告)日：2007-09-27
申请号：US10578798
申请日：2004-11-04
申请人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki , Atsushi Togashi
发明人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki , Atsushi Togashi
IPC分类号： C08L83/06 , C09D183/06 , C09J183/06
CPC分类号： C09J183/06 , C08L83/00 , C08L83/06
摘要： A curable silicone composition includes: (A) an organopolysiloxane represented by the siloxane unit formula (1) given below and having at least two univalent organic groups that contain epoxy groups and are free of aromatic rings: [R13SiO1/2]a [R22SiO2/2]b [R3SiO3/2]c (where R1, R2, and R3 are univalent organic groups, at least two of which are contain epoxy groups and are free of aromatic rings; more than 20 mole % of R3 are aryl groups; a+b+c & equals; 1; on average, “a” satisfies the following condition: 0≦a≦0.8; on average, “b” satisfies the following condition: 0≦b≦0.8; and, on average satisfies the following condition: 0.2≦c≦1.0); (B) a linear-chain organopolysiloxane having at least two univalent organic groups that contain phenolic hydroxyl groups; and (C) a curing accelerator.
摘要翻译：可固化的有机硅组合物包括：（A）由下式给出的硅氧烷单元式（1）表示的具有至少两个含有环氧基并且不含芳环的一价有机基团的有机聚硅氧烷：[R 1 3 SiO 2 1/2 2 2 2 > 2/2 3 R 1，R 2，R 3和R 3是一价有机基团，其中至少两个含有环氧基并且不含芳环; 大于20摩尔％的R 3是芳基; a + b + c等于1;平均而言，“a”满足以下条件：0 <= a <= 0.8;平均，“b”满足以下条件：0 <= b <= 0.8;平均满足下列条件：0.2 <= c <= 1.0）; （B）具有至少两个含有酚羟基的一价有机基团的直链有机聚硅氧烷; 和（C）固化促进剂。

3. 发明授权

US06300426B1 Silicone composition for forming cured release films 有权
标题翻译：用于形成固化剥离膜的硅氧烷组合物
公开(公告)号：US06300426B1
公开(公告)日：2001-10-09
申请号：US09444357
申请日：1999-11-18
申请人： Taku Koyama , Atsushi Togashi , Takateru Yamada
发明人： Taku Koyama , Atsushi Togashi , Takateru Yamada
IPC分类号： C08L8305
CPC分类号： C09D183/04 , C08L83/00 , C08L2666/28
摘要： This invention relates to a silicone composition comprising: (A) a mixture of (i) a linear trimethylsiloxy-terminated polydiorganosiloxane containing at least 2 alkenyl groups having at least 4 carbon atoms and (ii) optionally a linear dimethylalkenylsiloxy-terminated polydiorganosiloxane, (B) a polyorganohydrogensiloxane, (C) a catalytic quantity of a platinum catalyst, and (D) an inhibitor. The silicone compositions of this invention make it possible to form cured release films with low resistance to peeling when peeling is carried out at high speeds, and with the possibility of controlling the resistance to peeling between low and high values when peeling is carried out at low speeds. The silicone compositions of this invention also are not subject to a decrease in the coefficient of residual adhesion in the adhesive material applied onto a cured release film.
摘要翻译：本发明涉及一种硅氧烷组合物，其包含：（A）（i）含有至少2个具有至少4个碳原子的烯基的直链三甲基甲硅烷氧基封端的聚二有机硅氧烷和（ii）任选的直链二甲基链烯基甲硅烷氧基封端的聚二有机硅氧烷（B ）聚有机氢硅氧烷，（C）催化量的铂催化剂和（D）抑制剂。本发明的硅酮组合物使得可以在高速下进行剥离时形成具有低剥离性的固化的剥离膜，并且当以低的速度进行剥离时可以控制低和高值之间的剥离性速度。本发明的硅酮组合物也不会降低施加到固化的脱模膜上的粘合剂材料中的残留粘合系数。

4. 发明授权

US5789334A Microparticle catalysts for hydrosilylation reactions and thermosetting silicone compositions containing said catalyst 失效
标题翻译：用于氢化硅烷化反应的微粒催化剂和含有所述催化剂的热固性硅氧烷组合物
公开(公告)号：US5789334A
公开(公告)日：1998-08-04
申请号：US706031
申请日：1996-08-30
申请人： Junji Nakanishi , Toshio Saruyama , Atsushi Togashi
发明人： Junji Nakanishi , Toshio Saruyama , Atsushi Togashi
IPC分类号： C08G77/12 , C08G77/20 , C08G77/32 , C08K9/10 , C08L83/04 , C08L83/07 , B01J31/00
CPC分类号： C08K9/10 , C08L83/04 , C08G77/08 , C08G77/12 , C08G77/20 , C08G77/70
摘要： A microparticle catalyst for hydrosilylation reactions which contains microparticles of an average particle diameter of 0.1 to 20 .mu.m made of a metallic catalyst for hydrosilylation reactions; a disiloxane having the general formula (R.sup.1 R.sup.2 ArSi).sub.2 O, wherein, R.sup.1 is an alkenyl group, R.sup.2 is a monovalent hydrocarbon group and Ar is an aryl group; and a resin having a glass transition temperature of 40.degree. to 200.degree. C. and thermosetting silicone composition containing the microparticle catalyst.
摘要翻译：一种用于氢化硅烷化反应的微粒催化剂，其含有由用于氢化硅烷化反应的金属催化剂制成的平均粒径为0.1至20μm的微粒; 具有通式（R1R2ArSi）2O的二硅氧烷，其中R1为烯基，R2为一价烃基，Ar为芳基; 和玻璃化转变温度为40〜200℃的树脂和含有微粒催化剂的热固性硅氧烷组合物。

5. 发明授权

US5529822A Process for forming a laminate 失效
标题翻译：用于形成层压体的方法
公开(公告)号：US5529822A
公开(公告)日：1996-06-25
申请号：US445899
申请日：1995-05-22
申请人： Atsushi Togashi , Takateru Yamada
发明人： Atsushi Togashi , Takateru Yamada
IPC分类号： C08L83/05 , C08L83/07 , C09D183/04 , C09D183/07 , C09J7/02 , B32B9/04
CPC分类号： C09D183/04 , Y10T428/2809 , Y10T428/2817 , Y10T428/2822 , Y10T428/2839 , Y10T428/2848 , Y10T428/2852
摘要： The present invention relates to a process for forming a laminate and the laminate using silicone release coating compositions comprising (A) a mixture of (i) a dimethylsiloxane-methylvinylsiloxane-methylphenylsiloxane copolymer and (ii) a dimethylsiloxane-methylvinylsiloxane copolymer, (B) an organohydrogenpolysiloxane, (C) a platinum catalyst, and (D) an organic solvent. The silicone release coating compositions of the present invention provide small release resistance values both at low and high peeling velocities and do not impair the residual adhesion of tacky substances that have come into contact with the coating.
摘要翻译：本发明涉及用于形成层压体的方法和使用有机硅剥离涂料组合物的层压体，其包含（A）（i）二甲基硅氧烷 - 甲基乙烯基硅氧烷 - 甲基苯基硅氧烷共聚物和（ii）二甲基硅氧烷 - 甲基乙烯基硅氧烷共聚物的混合物，（B）有机氢聚硅氧烷，（C）铂催化剂和（D）有机溶剂。本发明的有机硅剥离涂料组合物在低剥离速度和高剥离速度下提供较小的耐剥离性值，并且不损害与涂层接触的粘性物质的残留粘附性。

6. 发明授权

US5153160A Method for preparing microparticles of a thermoplastic resin containing an encapsulated hydrosilylation reaction catalyst 失效
标题翻译：制备含有加氢氢化反应催化剂的热塑性树脂微生物的方法
公开(公告)号：US5153160A
公开(公告)日：1992-10-06
申请号：US703955
申请日：1991-05-22
申请人： Toshio Saruyama , Teruyuki Nakagawa , Toyohiko Yamadera , Atsushi Togashi
发明人： Toshio Saruyama , Teruyuki Nakagawa , Toyohiko Yamadera , Atsushi Togashi
IPC分类号： B01J31/06 , B01J31/28 , C08G77/06 , C08J3/12 , C08K9/08 , C08K9/10 , C08L83/07
CPC分类号： C08J3/122 , C08K9/10 , C08J2383/04
摘要： Microparticles of a hydrosilylation catalyst encapsulated in a thermoplastic resin are prepared by forming a solution containing the hydrosilylation catalyst and a thermoplastic resin with a glass-transition temperature or softening point of 40.degree. to 200.degree. C. dissolved in a solvent, and then spraying this solution as droplets into a hot gas current in order to volatilize the solvent while solidifying said thermoplastic resin during entrainment of the droplets in the gas current.

7. 发明授权

US5017654A Thermosetting organosiloxane composition 失效
标题翻译：热固性有机硅氧烷组合物
公开(公告)号：US5017654A
公开(公告)日：1991-05-21
申请号：US372579
申请日：1989-06-28
申请人： Atsushi Togashi , Toshio Saruyama
发明人： Atsushi Togashi , Toshio Saruyama
IPC分类号： C08K5/54 , C08K9/10 , C08L83/04 , C08L83/05 , C08L83/07
CPC分类号： C08K9/10 , C08L83/04 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/24 , C08G77/44 , C08G77/70
摘要： The combination of a microencapsulated hydrosilylation catalyst selected from the group consisting of metals from the platinum group of the periodic table and compounds of these metals and a known inhibitor for this type of catalyst impart excellent storage stability to organosiloxane compositions that cure by a hydrosilation reaction while enabling these compositions to rapidly cure at temperatures above the softening temperature of the thermoplastic resin used to encapsulate the hydrosilylation catalyst. The curing rate of the composition is faster relative to compositions containing the microencapsulated catalyst without the catalyst inhibitor.

8. 发明授权

US5015716A Particulate material comprising a platinum-containing hydrosilylaton catalyst and a diorganopolysilane 失效
标题翻译：包含含铂氢化硅烷基锡催化剂和二有机聚硅烷的颗粒材料
公开(公告)号：US5015716A
公开(公告)日：1991-05-14
申请号：US370418
申请日：1989-06-22
申请人： Atsushi Togashi , Toshio Saruyama
发明人： Atsushi Togashi , Toshio Saruyama
IPC分类号： B01J31/28 , B01J31/00 , B01J33/00 , C08G77/08 , C08G77/48 , C08G77/60 , C08J3/07 , C08J3/16 , C08K3/10 , C08K9/10 , C08L83/04 , C08L83/05 , C08L83/07
CPC分类号： C08J3/16 , C08J3/07 , C08K9/10 , C08L83/04 , C08G77/12 , C08G77/20 , C08G77/60 , C08J2383/04
摘要： This invention provides particulate catalyst compositions comprising a platinum-containing hydrosilation reaction catalyst and a polydiorganosilane exhibiting a softening point of from 50.degree. to 200.degree. C. The average particle size of the particulate does not exceed 100 micrometers, and the surface layer of the particulate is substantially free of said catalyst. Curable organopolysiloxane compositions containing the present catalyst compositions exhibit excellent storage stability.

9. 发明授权

US07282270B2 Curable organopolysiloxane composition and a semiconductor device made with the use of this composition 有权
标题翻译：可固化的有机聚硅氧烷组合物和使用该组合物制成的半导体器件
公开(公告)号：US07282270B2
公开(公告)日：2007-10-16
申请号：US10530693
申请日：2003-09-08
申请人： Yoshitsugu Morita , Tomoko Kato , Atsushi Togashi , Hiroji Enami
发明人： Yoshitsugu Morita , Tomoko Kato , Atsushi Togashi , Hiroji Enami
IPC分类号： B32B9/04
CPC分类号： C08K5/5419 , C08G77/12 , C08G77/20 , C08G77/70 , C08K5/56 , C08L83/04 , C08L2205/02 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/1301 , H01L2924/181 , H01L2924/3025 , Y10T428/31663 , C08L83/00 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A curable organopolysiloxane composition includes: (A) a straight-chain organopolysiloxane having per molecule at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group; (B) a branched-chain organopolysiloxane with siloxane units represented by the following general formula: RSiO3/2, where R is a substituted or unsubstituted monovalent hydrocarbon group, and having per molecule at least one silicon-bonded alkenyl group and at least one silicon-bonded aryl group; (C) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; and a semiconductor device with a semiconductor element coated with a cured body of the aforementioned composition.
摘要翻译：可固化的有机聚硅氧烷组合物包括：（A）每分子具有至少两个硅键合的烯基和至少一个与硅键合的芳基的直链有机聚硅氧烷; （B）具有由以下通式表示的硅氧烷单元的支链有机聚硅氧烷：其中R是取代或未取代的单价烃基，并且每分子具有至少一个硅 - 键合的烯基和至少一个与硅键合的芳基; （C）在一个分子中具有至少两个与硅键合的氢原子的有机聚硅氧烷; 和（D）氢化硅烷化催化剂; 以及具有涂覆有上述组成的固化体的半导体元件的半导体器件。

10. 发明申请

US20060252890A1 Flame retardant compositions 有权
标题翻译：阻燃组合物
公开(公告)号：US20060252890A1
公开(公告)日：2006-11-09
申请号：US10512733
申请日：2003-05-15
申请人： David Romenesko , Randall Schmidt , Atsushi Togashi , Gary Wieber
发明人： David Romenesko , Randall Schmidt , Atsushi Togashi , Gary Wieber
IPC分类号： C08L83/00
CPC分类号： C08L101/00 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/44 , C08G77/70 , C08L83/04 , C08L2666/14 , C08L2666/02
摘要： This invention relates to a flame retardant composition comprising: (a) 81 to 99.99 weight percent of a thermoplastic resin, thermoset resin, thermoplastic resin blend, or thermoset resin blend which upon burning forms a char and (b) 0.01-19 weight percent of a silsesquioxane resin having a weight average molecular weight of greater than 300 and having the average molecular formula: (R3SiO1/2)a (R2SiO2/2)b (RSiO3/2)c (SiO4/2)d(RO1/2)e (OH1/2)f wherein each R is hydrogen, an alkyl group, an alkenyl group, or an aryl group having from 6 to 12 carbon atoms, a and b are zero or positive numbers and the value of a+b is greater than zero, c is a positive number, d, e and f are zero or positive numbers with the provisos that the copolymer comprises at least 40 mole percent of RSiO3/2 units, the copolymer comprises less than 10 mole percent SiO4/2 units, greater than 30 mole percent of the silicon-bonded R groups are silicon-bonded aryl groups, greater than 0.5 mole percent of the silicon-bonded R groups are silicon-bonded hydrogen atoms, the content of silicon-bonded hydroxyl groups is equal to or less than 2 weight percent, and the content of silicon-bonded alkoxy groups where the alkoxy group is methoxy or ethoxy is equal to or less than 5 weight percent.
摘要翻译：本发明涉及一种阻燃剂组合物，其包含：（a）81至99.99重量％的热塑性树脂，热固性树脂，热塑性树脂共混物或热固树脂共混物，其在燃烧时形成炭，（b）0.01-19重量％重均分子量大于300且具有以下平均分子式的倍半硅氧烷树脂：（R 3 3 SiO 1/2）（R 2 SiO 2/2/2）b（RS 3 O 3/2））C（N 2）（SiO 2/2/2）2（SiO 2/2）（OH 1/2）其中每个R是氢，烷基，烯基或具有6至12个碳原子的芳基，a和b 是零或正数，a + b的值大于零，c是正数，d，e和f是零或正数，条件是共聚物包含至少40摩尔％的RSiO 3/2个单元，共聚物包括较少超过10摩尔％的SiO 2/2/2单位，大于30摩尔％的与硅键合的R基团是硅键合的芳基，大于0.5摩尔％的与硅键合的R基团是硅键合的氢原子的含量等于或小于2重量％，烷氧基为甲氧基或乙氧基的硅键合烷氧基的含量等于或小于5重量％。

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