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1. 发明授权

US06900526B2 Semiconductor device package 有权
标题翻译：半导体器件封装
公开(公告)号：US06900526B2
公开(公告)日：2005-05-31
申请号：US10443002
申请日：2003-05-22
申请人： Takahiro Okada , Hideaki Murata
发明人： Takahiro Okada , Hideaki Murata
IPC分类号： H01L23/02 , H01L23/047 , H01L23/10 , H01S5/022
CPC分类号： H01L23/047 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： A semiconductor device package is comprised of a metal base for receiving a semiconductor device, a metal frame joined at its lower face to the metal base, a seal ring joined at its lower face to an upper face of the metal frame, and a metal lid joined to an upper face of the seal ring. The upper face of the seal ring is formed, at its at least two sides facing each other, into a concavely warped shape as viewed in vertical cross section, and the maximum warpage of the upper face of the seal ring is not more than 0.2% of the length of the side of the upper face.
摘要翻译：半导体器件封装包括用于接收半导体器件的金属基底，在其下表面连接到金属基底的金属框架，在其下表面连接到金属框架的上表面的密封环，以及金属盖连接到密封环的上表面。密封环的上表面在其至少两个彼此面对的侧面上形成为在垂直截面中看到的凹形弯曲形状，并且密封环的上表面的最大翘曲不大于0.2％的上表面的一侧的长度。

2. 发明授权

US06440778B1 Optical semiconductor element package and manufacturing method thereof 有权
标题翻译：光半导体元件封装及其制造方法
公开(公告)号：US06440778B1
公开(公告)日：2002-08-27
申请号：US09613633
申请日：2000-07-11
申请人： Takahiro Okada , Hideaki Murata , Masato Sakata
发明人： Takahiro Okada , Hideaki Murata , Masato Sakata
IPC分类号： H01L2144
CPC分类号： H01L27/14618 , H01L2924/0002 , H01L2924/00
摘要： An optical semiconductor element package including a housing, electric signal input and output wiring boards, and external leads. The housing has a metal frame and a metal bottom plate, for storing optical semiconductor elements. The electric signal input and output wiring boards are arranged in the housing at positions so that the optical semiconductor elements are not existent right above and right below the boards. The external leads are drawn to the outside through the side wall of the metal frame. The wiring boards are connected to the external leads and to the optical semiconductor elements by bonding wires. The input and output of an electric signal between the outside and the optical semiconductor elements are carried out through the bonding wires, the wiring boards and the external leads.
摘要翻译：一种包括壳体，电信号输入和输出线路板以及外部引线的光学半导体元件封装。壳体具有用于存储光学半导体元件的金属框架和金属底板。电信号输入和输出线路板被布置在壳体中的位置，使得光学半导体元件不在板的正上方和右下方。外部引线通过金属框架的侧壁被拉到外部。接线板通过接合线连接到外部引线和光学半导体元件。外部和光学半导体元件之间的电信号的输入和输出通过接合线，接线板和外部引线进行。

3. 发明授权

US06597060B2 Semiconductor device package 有权
公开(公告)号：US06597060B2
公开(公告)日：2003-07-22
申请号：US09794065
申请日：2001-02-28
申请人： Takahiro Okada , Hideaki Murata
发明人： Takahiro Okada , Hideaki Murata
IPC分类号： H01L2302
CPC分类号： H01L23/047 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： A semiconductor device package is comprised of a metal base for receiving a semiconductor device, a metal frame joined at its lower face to the metal base, a seal ring joined at its lower face to an upper face of the metal frame, and a metal lid joined to an upper face of the seal ring. The upper face of the seal ring is formed, at its at least two sides facing each other, into a concavely warped shape as viewed in vertical cross section, and the maximum warpage of the upper face of the seal ring is not more than 0.2% of the length of the side of the upper face.

4. 发明授权

US5804865A Package for optical semiconductor element and method for manufacturing the same 失效
标题翻译：光半导体元件用封装及其制造方法
公开(公告)号：US5804865A
公开(公告)日：1998-09-08
申请号：US861863
申请日：1997-05-22
申请人： Masato Sakata , Yukio Kazama , Kazuto Ono , Hideaki Murata
发明人： Masato Sakata , Yukio Kazama , Kazuto Ono , Hideaki Murata
IPC分类号： H01L23/02 , G02B6/42 , H01L31/0232 , H01L31/0203
CPC分类号： G02B6/4201 , G02B6/426 , G02B6/4272 , G02B6/424 , G02B6/4245
摘要： A package for optical semiconductor device comprising a metallic frame having a side wall provided with an optical fiber-securing portion for securing an optical fiber to be introduced through the side wall, and a metallic bottom plate for mounting the optical semiconductor device thereon. The metallic frame is provided at a lower portion of the side wall thereof with securing parts for securing the package to a substrate, each securing part outwardly extending in a direction parallel with the metallic bottom plate. The level of bottom face of the metallic bottom plate is made lower than that of the bottom face of the securing parts. The securing parts are integrally formed with the metallic frame.
摘要翻译：一种用于光学半导体器件的封装，包括金属框架，该金属框架具有设置有用于固定通过侧壁引入的光纤的光纤固定部分的侧壁和用于在其上安装光学半导体器件的金属底板。金属框架在其侧壁的下部设置有用于将包装固定到基板的固定部分，每个固定部分沿与金属底板平行的方向向外延伸。金属底板的底面的水平比固定部分的底面低。固定部分与金属框架一体形成。

5. 发明授权

US6123464A Optical module package and method for manufacturing the same 失效
标题翻译：光模块封装及其制造方法
公开(公告)号：US6123464A
公开(公告)日：2000-09-26
申请号：US247364
申请日：1999-02-10
申请人： Hideaki Murata , Takeshi Aikiyo , Kazuto Ono , Masato Sakata , Yukio Kazama
发明人： Hideaki Murata , Takeshi Aikiyo , Kazuto Ono , Masato Sakata , Yukio Kazama
IPC分类号： G02B6/42 , H01S5/02 , H01S5/022 , H01S5/024 , G02B6/36
CPC分类号： H01S5/024 , G02B6/4255 , G02B6/4265 , G02B6/4272 , H01S5/02216 , H01S5/0222 , H01S5/02272 , H01S5/02476
摘要： A method of manufacturing an optical module package, which comprises the steps of, attaching a first member to a frame by means of silver-brazing to obtain a frame structure, applying an Au plating to the frame structure applied with the silver-brazing, and soldering a second member to the frame structure applied with the Au plating, wherein the method further comprises the steps of subjecting the frame structure to a high temperature dehydrogenation treatment of heating the frame structure in an non-oxidizing atmosphere at a temperature of 340.degree. C. or more for 10 minutes or more after the silver-brazing step and before the Au plating step, and subjecting the frame structure to a low temperature dehydrogenation treatment of heating the frame structure in an non-oxidizing atmosphere at a temperature ranging from 240.degree. C. to 260.degree. C. for 5 minutes or more after the soldering step.
摘要翻译：一种制造光学模块封装的方法，包括以下步骤：通过银钎焊将第一构件附接到框架以获得框架结构，将Au镀层施加到施加有银钎焊的框架结构;以及将第二构件焊接到施加有Au镀层的框架结构，其中该方法还包括以下步骤：在340℃的非氧化性气氛中对框架结构进行高温脱氢处理以加热框架结构在银钎焊步骤之后和在Au镀覆步骤之前10分钟或更长时间，并且在框架结构进行低温脱氢处理，在非氧化气氛中在240℃的温度范围内对框架结构进行加热在焊接步骤之后，在260℃下加热5分钟以上。

6. 发明授权

US5111023A Method of treating gold plating film 失效
标题翻译：黄金镀膜方法
公开(公告)号：US5111023A
公开(公告)日：1992-05-05
申请号：US557105
申请日：1990-07-25
申请人： Kinya Horibe , Tomio Hirano , Minoru Ikeda , Hideaki Murata
发明人： Kinya Horibe , Tomio Hirano , Minoru Ikeda , Hideaki Murata
IPC分类号： C23C26/02 , C25D5/50 , H01H1/023
CPC分类号： C23C26/02 , C25D5/50 , H01H1/023
摘要： To remove pores and lattice defects in gold film plated on a substrate, the gold plating film is irradiated with a first laser beam to bring at least the surface of the film into almost melted condition, and then cooled in air. Further, it is preferable to anneal the melted gold surface by a second laser beam weaker than the first laser beam before air cooling, thus reducing the thickness of the gold film and therefore the material cost of electric contacts, for instance.

7. 发明授权

US06777052B2 Plastic container containing albumin solution 有权
标题翻译：含白蛋白溶液的塑料容器
公开(公告)号：US06777052B2
公开(公告)日：2004-08-17
申请号：US10106185
申请日：2002-03-27
申请人： Toshiya Kai , Hideaki Murata , Makoto Sato
发明人： Toshiya Kai , Hideaki Murata , Makoto Sato
IPC分类号： B29D2200
CPC分类号： A61L2/26 , A61J1/00 , A61L2/0023 , A61L2/07 , A61L2/18 , A61L2202/182 , Y10T428/1352 , Y10T428/1379 , Y10T428/1383 , Y10T428/139 , Y10T428/1393 , Y10T428/1397
摘要： The present invention provides a plastic container containing albumin solution and a packaged plastic container containing an albumin solution. The plastic container containing an albumin solution having an albumin concentration of 1 to 500 mg/ml, has at least one inlet/outlet for a liquid, and has a water vapor permeability of 1.5 g/m2/day·1013.25 hPa or less when the vapor permeability is measured at a pressure of 1013.25 hPa per surface area of 1 m2 for 24 hours at a temperature of 25° C. and at a relative humidity of 60%. The plastic container containing an albumin solution can be packaged with an outer packaging material to provide the packaged plastic container.
摘要翻译：本发明提供一种含有白蛋白溶液的塑料容器和含有白蛋白溶液的包装塑料容器。含有白蛋白浓度为1〜500mg / ml的白蛋白溶液的塑料容器具有至少一个液体的入口/出口，水蒸汽透过度为1.5g / m 2 /天.10.13.25hPa或在25℃的温度和60％的相对湿度下，在1013.25hPa的表面积为1m 2的压力下测量24小时时的蒸汽渗透性较小。含有白蛋白溶液的塑料容器可以用外包装材料包装以提供包装的塑料容器。

8. 发明授权

US5966832A Apparatus for drying wet porous bodies under subcritical temperatures and pressures 有权
标题翻译：用于在亚临界温度和压力下干燥湿多孔体的装置
公开(公告)号：US5966832A
公开(公告)日：1999-10-19
申请号：US257884
申请日：1999-02-25
申请人： Fikret Kirkbir , Satyabrata Raychaudhuri , Douglas Meyers , Hideaki Murata
发明人： Fikret Kirkbir , Satyabrata Raychaudhuri , Douglas Meyers , Hideaki Murata
IPC分类号： F26B5/16 , F26B7/00 , F26B21/00 , F26B21/14 , F26B25/00 , F26B21/06
CPC分类号： F26B25/006 , F26B21/14 , F26B7/00
摘要： An improved apparatus, and related method of operation, is described for rapidly drying large monoliths of glass, ceramic and/or composite material, under subcritical conditions, while minimizing the risk of cracking the monolith during the drying process. The apparatus incorporates a pressure chamber for carrying the monolith to be dried, with no significant limitation on the size of the monolith relative to the size of the chamber. The monolith is initially immersed in a suitable drying solvent, and the temperature of the pressure chamber is raised to a predetermined value below the solvent's critical temperature, which raises the pressure to a predetermined value, likewise below the solvent's critical pressure. At a selected time during the drying process the pressure chamber is connected to a diffusion chamber, to draw away and condense solvent vapor. This drawing away of solvent vapor continues until the monolith is dry, at which time the pressure chamber is purged with an inert gas and then depressurized in a controlled manner. The apparatus thereby is configured to dry the monolith at an even lower subcritical pressure than previous apparatus of this kind, leading to increased safety and reduced operating expenses.
摘要翻译：描述了一种改进的装置和相关的操作方法，用于在亚临界条件下快速干燥玻璃，陶瓷和/或复合材料的大型整料，同时最小化在干燥过程中破裂整料的风险。该装置包括用于承载要干燥的整料的压力室，相对于室的大小对整体体的尺寸没有明显的限制。将整料首先浸入合适的干燥溶剂中，并将压力室的温度升高到低于溶剂临界温度的预定值，将该压力提高到预定值，同样低于溶剂的临界压力。在干燥过程中的选定时间，压力室连接到扩散室，以抽出并冷凝溶剂蒸汽。继续抽出溶剂蒸汽直到整料干燥，此时用惰性气体吹扫压力室，然后以受控的方式进行减压。因此，该装置被配置成以比这种类型的先前装置更低的亚临界压力干燥整料，从而增加了安全性并降低了操作费用。

9. 发明授权

US08786867B2 Inspection device and inspection method for boiler furnace water wall tubes 有权
标题翻译：锅炉炉水壁管检查装置及检验方法
公开(公告)号：US08786867B2
公开(公告)日：2014-07-22
申请号：US13129503
申请日：2009-07-09
申请人： Hirotoshi Matsumoto , Keiji Ida , Hideaki Murata , Kai Zhang
发明人： Hirotoshi Matsumoto , Keiji Ida , Hideaki Murata , Kai Zhang
IPC分类号： G01B11/24 , G01B11/14 , G01N21/00 , G01N21/86
CPC分类号： G01B11/06 , F22B37/005 , G01N21/952
摘要： An inspection device and an inspection method for boiler furnace water wall tubes. The inspection device includes a scanner including columns placed upright and fixed by magnets onto the surfaces of multiple water wall tubes extending in the up-down direction on the inner wall surfaces of the boiler furnace, a support frame fixed to the columns to support a displacement sensor producing laser light to be irradiated onto the surface of a water wall tube, and a moving mechanism for moving the displacement sensor in the axial direction of the water wall tube relative to the support frame. A signal processing unit calculates the amount of reduced wall thickness of the water wall tube from a difference between the cross-sectional surface shape of the water wall tube based on a signal from the displacement sensor and a reference shape without reduction in wall thickness.
摘要翻译：锅炉炉水壁管检查装置及检验方法。检查装置包括扫描器，其包括直立放置并由磁铁固定在多个水壁管的表面上的柱，所述多个水壁管在锅炉炉的内壁表面上沿上下方向延伸，支撑框架固定到柱以支撑位移产生要照射在水壁管表面的激光的传感器，以及用于相对于支撑框架沿位于水壁管的轴向方向移动位移传感器的移动机构。信号处理单元根据来自位移传感器的信号与基准形状之间的水壁管的截面形状之间的差来计算水壁管的壁厚减少量，而不会减小壁厚。

10. 发明申请

US20110279828A1 INSPECTION DEVICE AND INSPECTION METHOD FOR BOILER FURNACE WATER WALL TUBES 有权
标题翻译：锅炉炉壁管检查装置及检验方法
公开(公告)号：US20110279828A1
公开(公告)日：2011-11-17
申请号：US13129503
申请日：2009-07-09
申请人： Hirotoshi Matsumoto , Keiji Ida , Hideaki Murata , Kai Zhang
发明人： Hirotoshi Matsumoto , Keiji Ida , Hideaki Murata , Kai Zhang
IPC分类号： G01B11/06
CPC分类号： G01B11/06 , F22B37/005 , G01N21/952
摘要： There are provided an inspection device and an inspection method for boiler furnace water wall tubes, which can inspect reduced wall thickness conditions of multiple water wall tubes, extending in an up-down direction along inner wall surfaces of a boiler furnace and arranged adjacent to each other, accurately and efficiently over a wide range based on surface shapes of the water wall tubes measured by a laser displacement sensor. A scanner 14 including columns 20 placed upright and fixed by magnets onto the surfaces of multiple water wall tubes 4 extending the up-down direction on the inner wall surfaces of the boiler furnace, a support frame 28 fixed to the columns 20 to support a displacement sensor 12 producing laser light to be irradiated onto the surface of a water wall tube 4, and a moving mechanism 31 for moving the displacement sensor 12 in the axial direction of the water wall tube 4 relative to the support frame 28. A signal processing unit 16 is also provided for calculating the amount of reduced wall thickness of the water wall tube 4 from a difference between the cross-sectional surface shape of the water wall tube 4 based on a signal from the displacement sensor 12 and a reference shape without reduction in wall thickness in order to evaluate a reduced wall thickness condition.
摘要翻译：提供了一种用于锅炉炉水壁管的检查装置和检查方法，其可以检查多个水壁管的壁厚条件，沿着锅炉炉的内壁表面沿上下方向延伸并且布置在每个其他，基于由激光位移传感器测量的水壁管的表面形状在宽范围内准确和有效。扫描仪14，其包括直立放置并由磁铁固定在多个水壁管4的表面上的柱20，该多个水壁管4在锅炉炉的内壁表面上沿着上下方向延伸，支撑框架28固定在立柱20上以支撑位移产生要照射在水壁管4的表面上的激光的传感器12;以及移动机构31，用于使位移传感器12相对于支撑框架28在水壁管4的轴向上移动。信号处理单元图16还用于根据来自位移传感器12的信号和水平管壁4的横截面形状之间的差异与基准形状来计算水壁管4的壁厚减小量以评估壁厚条件的降低。

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