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1. 发明授权

US08059640B2 Multistage switch control circuit 有权
标题翻译：多级开关控制电路
公开(公告)号：US08059640B2
公开(公告)日：2011-11-15
申请号：US12521114
申请日：2007-12-20
申请人： Hitoshi Obara , Masato Sakata
发明人： Hitoshi Obara , Masato Sakata
IPC分类号： H04L12/50
CPC分类号： H04L49/1515 , H04L49/254
摘要： A multistage switch control circuit allows unit switches to be set at a higher speed than conventional multistage switch control circuits. Higher-order half first and second control elements are connected to a first section of a bus to form a first cluster, while lower-order half third and fourth control elements are connected to a second section of the bus to form a second cluster. A bus switch which functions as a cluster formation means is arranged between the first section and the second section of the bus to perform the connection/separation of the first section and the second section. The first to fourth control elements transmit switch control signals to corresponding unit switches, respectively, in each stage.
摘要翻译：多级开关控制电路允许单元开关设置在比传统多级开关控制电路更高的速度。高阶半第一和第二控制元件连接到总线的第一部分以形成第一簇，而低阶半第三和第四控制元件连接到总线的第二部分以形成第二簇。用作集群形成装置的总线开关布置在总线的第一部分和第二部分之间，以执行第一部分和第二部分的连接/分离。第一至第四控制元件分别在每个级中将开关控制信号发送到相应的单元开关。

2. 发明申请

US20100098070A1 MULTISTAGE SWITCH CONTROL CIRCUIT 有权
标题翻译：多级开关控制电路
公开(公告)号：US20100098070A1
公开(公告)日：2010-04-22
申请号：US12521114
申请日：2007-12-20
申请人： Hitoshi Obara , Masato Sakata
发明人： Hitoshi Obara , Masato Sakata
IPC分类号： H04L12/50
CPC分类号： H04L49/1515 , H04L49/254
摘要： A multistage switch control circuit allows unit switches to be set at a higher speed than conventional multistage switch control circuits. Higher-order half first and second control elements are connected to a first section of a bus to form a first cluster, while lower-order half third and fourth control elements are connected to a second section of the bus to form a second cluster. A bus switch which functions as a cluster formation means is arranged between the first section and the second section of the bus to perform the connection/separation of the first section and the second section. The first to fourth control elements transmit switch control signals to corresponding unit switches, respectively, in each stage.
摘要翻译：多级开关控制电路允许单元开关设置在比传统多级开关控制电路更高的速度。高阶半第一和第二控制元件连接到总线的第一部分以形成第一集群，而低阶半部分第三和第四控制元件连接到总线的第二部分以形成第二集群。用作集群形成装置的总线开关布置在总线的第一部分和第二部分之间，以执行第一部分和第二部分的连接/分离。第一至第四控制元件分别在每个级中将开关控制信号发送到相应的单元开关。

3. 发明申请

US20050041934A1 Optical module and method of assembling the optical module 有权
公开(公告)号：US20050041934A1
公开(公告)日：2005-02-24
申请号：US10949280
申请日：2004-09-27
申请人： Satoru Zama , Toshio Mugishima , Kengo Mitose , Yoshikazu Tsuzuki , Masato Sakata
发明人： Satoru Zama , Toshio Mugishima , Kengo Mitose , Yoshikazu Tsuzuki , Masato Sakata
IPC分类号： G02B6/42 , H01S5/022 , G02B6/36
CPC分类号： G02B6/4238 , G02B6/4201 , G02B6/4271 , H01S5/02216 , H01S5/02236 , H01S5/02252 , H01S5/02284
摘要： An optical module equipped with at least one optical component, a package for housing the one optical component, and a joining portion. The joining portion is formed within the package by Sn—Ag solder containing 2.0 to 5.0 wt % Ag and 2.0 to 20.0 wt % Au, or Sn—Zn solder containing 6.0 to 10.0 wt % Zn and 2.0 to 20.0 wt % Au.

4. 发明授权

US5804865A Package for optical semiconductor element and method for manufacturing the same 失效
标题翻译：光半导体元件用封装及其制造方法
公开(公告)号：US5804865A
公开(公告)日：1998-09-08
申请号：US861863
申请日：1997-05-22
申请人： Masato Sakata , Yukio Kazama , Kazuto Ono , Hideaki Murata
发明人： Masato Sakata , Yukio Kazama , Kazuto Ono , Hideaki Murata
IPC分类号： H01L23/02 , G02B6/42 , H01L31/0232 , H01L31/0203
CPC分类号： G02B6/4201 , G02B6/426 , G02B6/4272 , G02B6/424 , G02B6/4245
摘要： A package for optical semiconductor device comprising a metallic frame having a side wall provided with an optical fiber-securing portion for securing an optical fiber to be introduced through the side wall, and a metallic bottom plate for mounting the optical semiconductor device thereon. The metallic frame is provided at a lower portion of the side wall thereof with securing parts for securing the package to a substrate, each securing part outwardly extending in a direction parallel with the metallic bottom plate. The level of bottom face of the metallic bottom plate is made lower than that of the bottom face of the securing parts. The securing parts are integrally formed with the metallic frame.
摘要翻译：一种用于光学半导体器件的封装，包括金属框架，该金属框架具有设置有用于固定通过侧壁引入的光纤的光纤固定部分的侧壁和用于在其上安装光学半导体器件的金属底板。金属框架在其侧壁的下部设置有用于将包装固定到基板的固定部分，每个固定部分沿与金属底板平行的方向向外延伸。金属底板的底面的水平比固定部分的底面低。固定部分与金属框架一体形成。

5. 发明授权

US6123464A Optical module package and method for manufacturing the same 失效
标题翻译：光模块封装及其制造方法
公开(公告)号：US6123464A
公开(公告)日：2000-09-26
申请号：US247364
申请日：1999-02-10
申请人： Hideaki Murata , Takeshi Aikiyo , Kazuto Ono , Masato Sakata , Yukio Kazama
发明人： Hideaki Murata , Takeshi Aikiyo , Kazuto Ono , Masato Sakata , Yukio Kazama
IPC分类号： G02B6/42 , H01S5/02 , H01S5/022 , H01S5/024 , G02B6/36
CPC分类号： H01S5/024 , G02B6/4255 , G02B6/4265 , G02B6/4272 , H01S5/02216 , H01S5/0222 , H01S5/02272 , H01S5/02476
摘要： A method of manufacturing an optical module package, which comprises the steps of, attaching a first member to a frame by means of silver-brazing to obtain a frame structure, applying an Au plating to the frame structure applied with the silver-brazing, and soldering a second member to the frame structure applied with the Au plating, wherein the method further comprises the steps of subjecting the frame structure to a high temperature dehydrogenation treatment of heating the frame structure in an non-oxidizing atmosphere at a temperature of 340.degree. C. or more for 10 minutes or more after the silver-brazing step and before the Au plating step, and subjecting the frame structure to a low temperature dehydrogenation treatment of heating the frame structure in an non-oxidizing atmosphere at a temperature ranging from 240.degree. C. to 260.degree. C. for 5 minutes or more after the soldering step.
摘要翻译：一种制造光学模块封装的方法，包括以下步骤：通过银钎焊将第一构件附接到框架以获得框架结构，将Au镀层施加到施加有银钎焊的框架结构;以及将第二构件焊接到施加有Au镀层的框架结构，其中该方法还包括以下步骤：在340℃的非氧化性气氛中对框架结构进行高温脱氢处理以加热框架结构在银钎焊步骤之后和在Au镀覆步骤之前10分钟或更长时间，并且在框架结构进行低温脱氢处理，在非氧化气氛中在240℃的温度范围内对框架结构进行加热在焊接步骤之后，在260℃下加热5分钟以上。

6. 发明授权

US4341260A Method of producing amorphous metal tapes 失效
标题翻译：无定形金属带的生产方法
公开(公告)号：US4341260A
公开(公告)日：1982-07-27
申请号：US144864
申请日：1980-04-29
申请人： Toyoaki Ishibachi , Masato Sakata
发明人： Toyoaki Ishibachi , Masato Sakata
IPC分类号： B22D11/06 , C22C45/04
CPC分类号： B22D11/0611 , C22C45/04
摘要： A method is disclosed for the production of amorphous metal tapes by rolling and cooling a molten metal stream between the contact faces of one roll and one metal belt. Tapes having controlled dimensions may be obtained.
摘要翻译：公开了通过在一个辊和一个金属带的接触面之间轧制和冷却熔融金属流来生产非晶态金属带的方法。可以获得具有受控尺寸的胶带。

7. 发明授权

US06963676B2 Optical module and method of assembling the optical module 有权
标题翻译：光模块及其组装方法
公开(公告)号：US06963676B2
公开(公告)日：2005-11-08
申请号：US10949280
申请日：2004-09-27
申请人： Satoru Zama , Toshio Mugishima , Kengo Mitose , Yoshikazu Tsuzuki , Masato Sakata
发明人： Satoru Zama , Toshio Mugishima , Kengo Mitose , Yoshikazu Tsuzuki , Masato Sakata
IPC分类号： G02B6/42 , H01S5/022 , G02B6/12 , G02B6/36
CPC分类号： G02B6/4238 , G02B6/4201 , G02B6/4271 , H01S5/02216 , H01S5/02236 , H01S5/02252 , H01S5/02284
摘要： An optical module equipped with at least one optical component, a package for housing the one optical component, and a joining portion. The joining portion is formed within the package by Sn—Ag solder containing 2.0 to 5.0 wt % Ag and 2.0 to 20.0 wt % Au, or Sn—Zn solder containing 6.0 to 10.0 wt % Zn and 2.0 to 20.0 wt % Au.
摘要翻译：配备有至少一个光学部件的光学模块，用于容纳该光学部件的封装以及接合部。通过含有2.0〜5.0重量％的Ag和2.0〜20.0重量％Au的Sn-Ag焊料或含有6.0〜10.0重量％的Zn和2.0〜20.0重量％的Au的Sn-Zn焊料，在封装体内形成接合部。

8. 发明授权

US06225953B1 Method of manufacturing an antenna device for portable telephone 失效
标题翻译：制造便携式电话天线装置的方法
公开(公告)号：US06225953B1
公开(公告)日：2001-05-01
申请号：US09380443
申请日：1999-09-02
申请人： Yoshikazu Kamei , Masayuki Nakamura , Masato Sakata
发明人： Yoshikazu Kamei , Masayuki Nakamura , Masato Sakata
IPC分类号： H01Q124
CPC分类号： H01Q11/08 , B29C45/14065 , B29C45/1671 , B29L2031/3456 , H01Q1/244 , H01Q1/362
摘要： An antenna device (A3) for a portable telephone includes a whip antenna (1) having a larger-diameter portion (52) formed near its upper end by means of forming. The guide ring (7) consisting essentially of a synthetic resin fits on the whip antenna (1), such that the guide ring (7) abuts against the larger-diameter portion (52) to rest at a position below the larger-diameter portion. The whip antenna (1) and the guide ring (7) are coated with a coating layer (19) consisting essentially of a synthetic resin. The coating layer (19) has a main portion (54) coating the whip antenna (1) below the guide ring (7), and a joint portion (56) coating the guide ring (7) and the larger-diameter portion (52). A helical antenna (25) is arranged such that it is electrically connected to a metal terminal (62) and is mechanically connected to the whip antenna (1) through the joint portion (56) and the metal terminal (62). The helical antenna (25) is coated with a block (31) consisting essentially of a synthetic resin.
摘要翻译：用于便携式电话的天线装置（A3）包括具有通过成形在其上端附近形成的较大直径部分（52）的鞭状天线（1）。基本上由合成树脂组成的导向环（7）装配在鞭状天线（1）上，使得导向环（7）抵靠大直径部分（52）抵靠在较大直径部分。鞭状天线（1）和引导环（7）涂覆有主要由合成树脂组成的涂层（19）。涂层（19）具有在引导环（7）下方涂覆鞭状天线（1）的主要部分（54）和涂覆引导环（7）和大直径部分（52）的接合部分）。螺旋天线（25）被布置成使得其电连接到金属端子（62），并且通过接合部分（56）和金属端子（62）机械连接到鞭状天线（1）。螺旋天线（25）涂覆有基本上由合成树脂组成的块（31）。

9. 发明授权

US6123552A IC socket 失效
标题翻译： IC插座
公开(公告)号：US6123552A
公开(公告)日：2000-09-26
申请号：US155304
申请日：1998-09-23
申请人： Masato Sakata , Satoru Zama , Hitoshi Yuzawa , Kazuto Ono
发明人： Masato Sakata , Satoru Zama , Hitoshi Yuzawa , Kazuto Ono
IPC分类号： H05K7/10 , H01R12/00
CPC分类号： H05K7/1069 , H05K7/1061
摘要： There is provided an IC socket having a plurality of contact pins 1. The plural contact pins 1 are arranged in a matrix form so that the pitch thereof at one end agrees with the electrode pitch of a semiconductor device 13 to be mounted and the pitch at the other end agrees with the pitch of the electrical connection terminals of an external connection body to be connected.
摘要翻译： PCT No.PCT / JP98 / 00349 Sec。 371日期：1998年9月23日 102（e）1998年9月23日PCT PCT 1998年1月28日PCT公布。出版物WO98 / 33248 日期1998年7月30日提供了具有多个接触针1的IC插座。多个接触针1以矩阵形式布置，使得其一端的间距与半导体器件13的电极间距一致另一端的节距与要连接的外部连接体的电连接端子的间距一致。

10. 发明授权

US06440778B1 Optical semiconductor element package and manufacturing method thereof 有权
标题翻译：光半导体元件封装及其制造方法
公开(公告)号：US06440778B1
公开(公告)日：2002-08-27
申请号：US09613633
申请日：2000-07-11
申请人： Takahiro Okada , Hideaki Murata , Masato Sakata
发明人： Takahiro Okada , Hideaki Murata , Masato Sakata
IPC分类号： H01L2144
CPC分类号： H01L27/14618 , H01L2924/0002 , H01L2924/00
摘要： An optical semiconductor element package including a housing, electric signal input and output wiring boards, and external leads. The housing has a metal frame and a metal bottom plate, for storing optical semiconductor elements. The electric signal input and output wiring boards are arranged in the housing at positions so that the optical semiconductor elements are not existent right above and right below the boards. The external leads are drawn to the outside through the side wall of the metal frame. The wiring boards are connected to the external leads and to the optical semiconductor elements by bonding wires. The input and output of an electric signal between the outside and the optical semiconductor elements are carried out through the bonding wires, the wiring boards and the external leads.
摘要翻译：一种包括壳体，电信号输入和输出线路板以及外部引线的光学半导体元件封装。壳体具有用于存储光学半导体元件的金属框架和金属底板。电信号输入和输出线路板被布置在壳体中的位置，使得光学半导体元件不在板的正上方和右下方。外部引线通过金属框架的侧壁被拉到外部。接线板通过接合线连接到外部引线和光学半导体元件。外部和光学半导体元件之间的电信号的输入和输出通过接合线，接线板和外部引线进行。

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