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1. 发明授权

US08389204B2 Method for producing comb-shaped electrode 有权
标题翻译：梳状电极的制造方法
公开(公告)号：US08389204B2
公开(公告)日：2013-03-05
申请号：US13085336
申请日：2011-04-12
申请人： Takahiro Asai , Koichi Misumi , Takashi Ono , Kiyoshi Kanamura , Hirokazu Munakata
发明人： Takahiro Asai , Koichi Misumi , Takashi Ono , Kiyoshi Kanamura , Hirokazu Munakata
IPC分类号： G03F7/26
CPC分类号： H01M4/0457 , C25D3/60 , C25D13/02 , G03F7/023 , G03F7/027 , G03F7/038 , G03F7/0392 , H01M4/0452 , H01M4/13 , H01M4/626 , H01M4/78 , H01M2004/025
摘要： To provide a method for producing a comb-shaped electrode capable of precisely carrying a large amount of active materials on a surface of current collectors with a fine shape. The method for producing comb-shaped electrodes 1a, 1b of the present invention includes a current collector forming step of forming a pair of comb-shaped current collectors 2a, 2b on a surface of a substrate 4, a resist coating step of forming a resist layer 6 on the surface of the substrate 4, and a guide hole forming step of forming guide holes 7a, 7b for forming a positive electrode 1a or a negative electrode 1b, in which a cationic polymerization type resist composition (i), a novolak type resist composition (ii), a chemically-amplified type resist composition (iii), or a radical polymerization type resist composition (iv), is used as a resist composition for forming the resist layer 6.
摘要翻译：提供一种能够在精细形状的集电体的表面上精确地携带大量活性物质的梳状电极的制造方法。本发明的梳状电极1a，1b的制造方法包括在基板4的表面上形成一对梳状集电体2a，2b的集电体形成工序，形成抗蚀剂的抗蚀剂涂布工序以及导向孔形成步骤，形成用于形成阳极聚合型抗蚀剂组合物（i）的酚醛清漆型的正极1a或负极1b的导向孔7a，7b，抗蚀剂组合物（ii），化学增幅型抗蚀剂组合物（iii）或自由基聚合型抗蚀剂组合物（iv））用作形成抗蚀剂层6的抗蚀剂组合物。

2. 发明授权

US08426543B2 Adhesive composition and adhesive film 有权
标题翻译：粘合剂组合物和粘合剂膜
公开(公告)号：US08426543B2
公开(公告)日：2013-04-23
申请号：US12516363
申请日：2007-09-27
申请人： Takahiro Asai , Koichi Misumi , Atsushi Miyanari , Yoshihiro Inao , Akihiko Nakamura
发明人： Takahiro Asai , Koichi Misumi , Atsushi Miyanari , Yoshihiro Inao , Akihiko Nakamura
IPC分类号： C08F20/10
CPC分类号： C09J133/04 , C09J7/381 , C09J125/14 , C09J135/06 , C09J2203/326 , C09J2205/114 , C09J2425/00 , C09J2433/00 , H01L21/6835 , H01L2221/6834 , H01L2924/30105 , Y10T428/2852 , Y10T428/2891
摘要： An adhesive composition of the present invention includes, as a main component, a polymer produced by copolymerization of a monomer composition including: styrene; a (meth)acrylic acid alkyl ester having a chain structure; a (meth)acrylic acid ester having an aliphatic ring; and a (meth)acrylic acid ester having an aromatic ring, wherein: the styrene is contained in a range of 40 to 69 parts by mass; the (meth)acrylic acid alkyl ester having the chain structure is contained in a range of 20 to 30 parts by mass; the (meth)acrylic acid ester having the aliphatic ring is contained in a range of 10 to 25 parts by mass; and the (meth)acrylic acid ester having the aromatic ring is contained in a range of 1 to 5 parts by mass, where the total amount of the above components is 100 parts by mass. This allows for provision of an adhesive composition having high adhesive strength under high-temperature environment, as well as high heat resistance, high alkali resistance, and easiness in stripping from semiconductor wafers and the like even after high-temperature processing.
摘要翻译：作为主要成分，本发明的粘合剂组合物包含通过使包含苯乙烯的单体组合物共聚而制造的聚合物，具有链结构的（甲基）丙烯酸烷基酯; 具有脂肪族环的（甲基）丙烯酸酯; 和具有芳香环的（甲基）丙烯酸酯，其中：所述苯乙烯的含量为40〜69质量份; 具有链结构的（甲基）丙烯酸烷基酯的含量为20〜30质量份; 具有脂肪族环的（甲基）丙烯酸酯的含量为10〜25质量份; 具有芳环的（甲基）丙烯酸酯的含量为1〜5质量份，上述成分的总量为100质量份。这允许在高温环境下提供具有高粘合强度的粘合剂组合物，以及即使在高温处理之后也具有高耐热性，高耐碱性和从半导体晶片等剥离的容易性。

3. 发明申请

US20110065858A1 Adhesive composition and adhesive film 审中-公开
标题翻译：粘合剂组合物和粘合剂膜
公开(公告)号：US20110065858A1
公开(公告)日：2011-03-17
申请号：US12924583
申请日：2010-09-29
申请人： Takahiro Asai , Koichi Misumi , Toshiyuki Ogata , Motoki Takahashi , Hirofumi Imai
发明人： Takahiro Asai , Koichi Misumi , Toshiyuki Ogata , Motoki Takahashi , Hirofumi Imai
IPC分类号： C09J133/24
CPC分类号： C09J133/064
摘要： An adhesive composition of the present invention includes a polymer as a main component. The polymer is produced by copolymerization of a monomer composition which includes chain-structured alkyl (meth)acrylate and a monomer containing a maleimide group. This makes it possible to provide an adhesive composition used for forming an adhesive layer in which adhesive strength is kept in a high temperature environment. That is, it becomes possible to provide an adhesive composition that allows forming an adhesive layer which has high adhesive strength in a high temperature environment (particularly at 200° C. to 250° C.).
摘要翻译：本发明的粘合剂组合物包括聚合物作为主要成分。聚合物通过包含链状结构的（甲基）丙烯酸烷基酯和含有马来酰亚胺基团的单体的单体组合物的共聚来制备。这使得可以提供用于形成粘合剂层的粘合剂组合物，其中粘合强度保持在高温环境中。也就是说，可以提供一种粘合剂组合物，其可以在高温环境（特别是在200℃至250℃）下形成具有高粘合强度的粘合剂层。

4. 发明授权

US08901234B2 Adhesive composition 有权
标题翻译：粘合剂组合物
公开(公告)号：US08901234B2
公开(公告)日：2014-12-02
申请号：US12457579
申请日：2009-06-16
申请人： Takahiro Asai , Koichi Misumi , Hirofumi Imai
发明人： Takahiro Asai , Koichi Misumi , Hirofumi Imai
IPC分类号： C08F222/40 , C08L37/00 , C08L39/00 , C09J133/14 , C09J135/06
CPC分类号： C09J133/14 , C09J133/12 , C09J135/06 , Y10T428/2852 , Y10T428/2861 , Y10T428/2887 , Y10T428/2896 , C08F212/08 , C08F220/14 , C08F2222/402
摘要： An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process.
摘要翻译：本发明的粘合剂组合物含有通过使含有具有马来酰亚胺基团的单体的单体组合物共聚而得到的聚合物，并且还含有热聚合抑制剂。结果，可以提供一种粘合剂组合物，其能够在粘合剂层经受高温处理之后形成粘合剂层，其优异地溶解。

5. 发明申请

US20110061800A1 ADHESIVE COMPOSITION, FILM ADHESIVE, AND HEAT TREATMENT METHOD 有权
公开(公告)号：US20110061800A1
公开(公告)日：2011-03-17
申请号：US12950203
申请日：2010-11-19
申请人： Takahiro ASAI , Koichi Misumi , Hirofumi Imai
发明人： Takahiro ASAI , Koichi Misumi , Hirofumi Imai
IPC分类号： B32B38/10
CPC分类号： C09J133/14 , C09J133/12 , C09J135/06 , Y10T428/2852 , Y10T428/2861 , Y10T428/2887 , Y10T428/2896 , C08F212/08 , C08F220/14 , C08F2222/402
摘要： An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process.

6. 发明申请

US20100178497A1 ADHESIVE COMPOSITION, FILM ADHESIVE, AND PROCESS FOR PRODUCTION OF THE COMPOSITION 审中-公开
标题翻译：胶粘组合物，胶粘剂和组合物的生产方法
公开(公告)号：US20100178497A1
公开(公告)日：2010-07-15
申请号：US12377155
申请日：2007-08-03
申请人： Takahiro Asai , Koichi Misumi , Atsushi Miyanari , Yoshihiro Inao , Akihiko Nakamura , Koji Saito
发明人： Takahiro Asai , Koichi Misumi , Atsushi Miyanari , Yoshihiro Inao , Akihiko Nakamura , Koji Saito
IPC分类号： C08F120/18 , B32B27/36 , B32B27/32
CPC分类号： C09J133/10 , C09J7/381 , C09J125/14 , C09J2425/00 , C09J2433/00 , Y10T428/2891
摘要： Disclosed is an adhesive composition which is mainly composed of a polymer obtained by copolymerizing a monomer composition containing styrene, (meth)acrylic acid ester having a cyclic structure and alkyl (meth)acrylate having a chain structure. The monomer composition may additionally contain a bifunctional monomer, thereby improving heat resistance, adhesive strength under high temperature conditions, and alkali resistance, and easiness in stripping of an adhesive composition that has been processed at a high temperature. Consequently, there can be obtained an adhesive composition which has high heat resistance, adhesion strength under high temperature conditions, and alkali resistance, and which can be easily stripped off after the adhesive composition is processed at a high temperature.
摘要翻译：公开了主要由通过共聚包含苯乙烯的单体组合物，具有环状结构的（甲基）丙烯酸酯和具有链结构的（甲基）丙烯酸烷基酯）而得到的聚合物的粘合剂组合物。单体组合物可以另外含有双官能单体，从而提高耐热性，高温条件下的粘合强度和耐碱性，以及在高温下处理的粘合剂组合物的剥离容易性。因此，可以获得在高温条件下具有高耐热性，粘合强度和耐碱性的粘合剂组合物，并且在粘合剂组合物在高温下加工后可以容易地剥离。

7. 发明申请

US20100069593A1 ADHESIVE COMPOSITION AND ADHESIVE FILM 有权
标题翻译：胶粘组合物和粘合膜
公开(公告)号：US20100069593A1
公开(公告)日：2010-03-18
申请号：US12516363
申请日：2007-09-27
申请人： Takahiro Asai , Koichi Misumi , Atsushi Miyanari , Yoshihiro Inao , Akihiko Nakamura
发明人： Takahiro Asai , Koichi Misumi , Atsushi Miyanari , Yoshihiro Inao , Akihiko Nakamura
IPC分类号： C08F18/02
CPC分类号： C09J133/04 , C09J7/381 , C09J125/14 , C09J135/06 , C09J2203/326 , C09J2205/114 , C09J2425/00 , C09J2433/00 , H01L21/6835 , H01L2221/6834 , H01L2924/30105 , Y10T428/2852 , Y10T428/2891
摘要： An adhesive composition of the present invention includes, as a main component, a polymer produced by copolymerization of a monomer composition including: styrene; a (meth)acrylic acid alkyl ester having a chain structure; a (meth)acrylic acid ester having an aliphatic ring; and a (meth)acrylic acid ester having an aromatic ring, wherein: the styrene is contained in a range of 40 to 69 parts by mass; the (meth)acrylic acid alkyl ester having the chain structure is contained in a range of 20 to 30 parts by mass; the (meth)acrylic acid ester having the aliphatic ring is contained in a range of 10 to 25 parts by mass; and the (meth)acrylic acid ester having the aromatic ring is contained in a range of 1 to 5 parts by mass, where the total amount of the above components is 100 parts by mass. This allows for provision of an adhesive composition having high adhesive strength under high-temperature environment, as well as high heat resistance, high alkali resistance, and easiness in stripping from semiconductor wafers and the like even after high-temperature processing.
摘要翻译：作为主要成分，本发明的粘合剂组合物包含通过使包含苯乙烯的单体组合物共聚而制造的聚合物，具有链结构的（甲基）丙烯酸烷基酯; 具有脂肪族环的（甲基）丙烯酸酯; 和具有芳香环的（甲基）丙烯酸酯，其中：所述苯乙烯的含量为40〜69质量份; 具有链结构的（甲基）丙烯酸烷基酯的含量为20〜30质量份; 具有脂肪族环的（甲基）丙烯酸酯的含量为10〜25质量份; 具有芳环的（甲基）丙烯酸酯的含量为1〜5质量份，上述成分的总量为100质量份。这允许在高温环境下提供具有高粘合强度的粘合剂组合物，以及即使在高温处理之后也具有高耐热性，高耐碱性和从半导体晶片等剥离的容易性。

8. 发明申请

US20100068453A1 METHOD FOR PRODUCING PROCESSED GLASS SUBSTRATE 审中-公开
标题翻译：生产加工玻璃基板的方法
公开(公告)号：US20100068453A1
公开(公告)日：2010-03-18
申请号：US12558850
申请日：2009-09-14
申请人： Hirofumi IMAI , Koichi Misumi , Takahiro Asai
发明人： Hirofumi IMAI , Koichi Misumi , Takahiro Asai
IPC分类号： B32B3/24 , C03C19/00 , C03C15/00 , G03F7/20
CPC分类号： G03F7/2022 , C03C15/00 , C03C19/00 , C03C2218/34 , Y10T428/24273
摘要： A processed substrate of the present invention includes a translucent substrate having a plurality of through-holes, in each of which there is a gap from 0 to 5 μm between (a) a straight line which passes through a central point of an opening plane of the each of the plurality of through-holes and which is perpendicular to the opening plane and (b) a straight line which passes through a central point of the other opening plane of the each of the plurality of through-holes and which is perpendicular to the other opening plane, thereby making it possible to provide (i) a processed substrate having through-holes in each of which central axes are aligned, which can be easily produced with high productivity, and (ii) a production method thereof. Further, a production method of the present invention of a processed glass substrate includes: (a) forming photosensitive resin layers on surfaces of a glass substrate; (b) forming a through-hole in the glass substrate; and (c) immersing the glass substrate in acid, with the photosensitive resin layers remaining on the both surfaces. Accordingly, it is unnecessary to perform smoothing the surfaces of the glass substrate after the step (c), thereby successfully producing a processed glass substrate having a through-hole with high productivity.
摘要翻译：本发明的处理衬底包括具有多个通孔的透光性衬底，每个通孔在（a）穿过开口平面的中心点的直线之间存在0至5μm的间隙所述多个通孔中的每一个并且垂直于所述开口平面，并且（b）直线，其穿过所述多个通孔中的每一个的另一开口平面的中心点并且垂直于从而能够提供（i）具有通孔的处理基板，其中每个中心轴对准，其可以容易地以高生产率生产，和（ii）其制造方法。此外，本发明的加工玻璃基板的制造方法包括：（a）在玻璃基板的表面上形成感光性树脂层; （b）在玻璃基板中形成通孔; 和（c）将玻璃基板浸入酸中，其中感光性树脂层保留在两面上。因此，不需要在步骤（c）之后对玻璃基板的表面进行平滑化，从而以高生产率成功制造具有通孔的加工玻璃基板。

9. 发明授权

US08901235B2 Adhesive composition, film adhesive, and heat treatment method 有权
标题翻译：粘合剂组合物，薄膜粘合剂和热处理方法
公开(公告)号：US08901235B2
公开(公告)日：2014-12-02
申请号：US12960819
申请日：2010-12-06
申请人： Takahiro Asai , Koichi Misumi , Hirofumi Imai
发明人： Takahiro Asai , Koichi Misumi , Hirofumi Imai
IPC分类号： C08F222/40 , C08L37/00 , C08L39/00 , C09J133/14 , C09J135/06
CPC分类号： C09J133/14 , C09J133/12 , C09J135/06 , Y10T428/2852 , Y10T428/2861 , Y10T428/2887 , Y10T428/2896 , C08F212/08 , C08F220/14 , C08F2222/402
摘要： An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process.
摘要翻译：本发明的粘合剂组合物含有通过使含有具有马来酰亚胺基团的单体的单体组合物共聚而得到的聚合物，并且还含有热聚合抑制剂。结果，可以提供一种粘合剂组合物，其可以在粘合剂层经受高温处理之后形成粘合剂层，其优异地溶解。

10. 发明授权

US08877884B2 Adhesive composition, film adhesive, and method for producing the adhesive composition 有权
标题翻译：粘合剂组合物，薄膜粘合剂和粘合剂组合物的制造方法
公开(公告)号：US08877884B2
公开(公告)日：2014-11-04
申请号：US12458259
申请日：2009-07-07
申请人： Motoki Takahashi , Hirofumi Imai , Takahiro Asai , Koichi Misumi , Toshiyuki Ogata
发明人： Motoki Takahashi , Hirofumi Imai , Takahiro Asai , Koichi Misumi , Toshiyuki Ogata
IPC分类号： C08F212/08 , C09J7/02 , C09J125/04 , C09J133/04 , C09J135/00 , C08F6/10 , C08F6/12 , C09J125/14 , C08F220/12 , C08J3/09 , C09J133/24 , C09J125/08 , C09J135/06 , C07B63/00 , C08F6/00 , C08F220/14 , C08F220/18 , C08F222/40
CPC分类号： C09J7/02 , C07B63/00 , C08F6/001 , C08F6/10 , C08F6/12 , C08F212/08 , C08F220/12 , C08F220/14 , C08F2220/1825 , C08F2222/402 , C08J3/095 , C08J2325/08 , C08J2325/14 , C09J7/20 , C09J125/04 , C09J125/08 , C09J125/14 , C09J133/04 , C09J133/24 , C09J135/00 , C09J135/06 , C09J2425/00 , C09J2433/00 , C08F2220/1875 , C08L25/14
摘要： An adhesive composition is disclosed which includes a polymer prepared by copolymerizing a monomer containing a polymerizable group, the polymer including a low-molecular-weight component having a molecular weight equivalent to 1% or less of the weight-average molecular weight of the polymer, the low-molecular-weight component is contained in a range of not less than 0 weight % to less than 0.3 weight % of the total weight of the polymer. This allows provision of an adhesive composition having great adhesive strength in a high-temperature environment, especially at temperatures from 140° C. to 200° C., as well as high heat resistance and favorable crack resistance.
摘要翻译：公开了一种粘合剂组合物，其包括通过共聚含有可聚合基团的单体制备的聚合物，所述聚合物包括分子量等于聚合物的重均分子量的1％或更低的低分子量组分，低分子量成分的含量为聚合物总重量的0重量％〜小于0.3重量％。这允许提供在高温环境下，特别是在140℃至200℃的温度下具有很大粘附强度的粘合剂组合物，以及高耐热性和良好的抗裂性。

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