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1. 发明申请

US20110065858A1 Adhesive composition and adhesive film 审中-公开
标题翻译：粘合剂组合物和粘合剂膜
公开(公告)号：US20110065858A1
公开(公告)日：2011-03-17
申请号：US12924583
申请日：2010-09-29
申请人： Takahiro Asai , Koichi Misumi , Toshiyuki Ogata , Motoki Takahashi , Hirofumi Imai
发明人： Takahiro Asai , Koichi Misumi , Toshiyuki Ogata , Motoki Takahashi , Hirofumi Imai
IPC分类号： C09J133/24
CPC分类号： C09J133/064
摘要： An adhesive composition of the present invention includes a polymer as a main component. The polymer is produced by copolymerization of a monomer composition which includes chain-structured alkyl (meth)acrylate and a monomer containing a maleimide group. This makes it possible to provide an adhesive composition used for forming an adhesive layer in which adhesive strength is kept in a high temperature environment. That is, it becomes possible to provide an adhesive composition that allows forming an adhesive layer which has high adhesive strength in a high temperature environment (particularly at 200° C. to 250° C.).
摘要翻译：本发明的粘合剂组合物包括聚合物作为主要成分。聚合物通过包含链状结构的（甲基）丙烯酸烷基酯和含有马来酰亚胺基团的单体的单体组合物的共聚来制备。这使得可以提供用于形成粘合剂层的粘合剂组合物，其中粘合强度保持在高温环境中。也就是说，可以提供一种粘合剂组合物，其可以在高温环境（特别是在200℃至250℃）下形成具有高粘合强度的粘合剂层。

2. 发明授权

US08901235B2 Adhesive composition, film adhesive, and heat treatment method 有权
标题翻译：粘合剂组合物，薄膜粘合剂和热处理方法
公开(公告)号：US08901235B2
公开(公告)日：2014-12-02
申请号：US12960819
申请日：2010-12-06
申请人： Takahiro Asai , Koichi Misumi , Hirofumi Imai
发明人： Takahiro Asai , Koichi Misumi , Hirofumi Imai
IPC分类号： C08F222/40 , C08L37/00 , C08L39/00 , C09J133/14 , C09J135/06
CPC分类号： C09J133/14 , C09J133/12 , C09J135/06 , Y10T428/2852 , Y10T428/2861 , Y10T428/2887 , Y10T428/2896 , C08F212/08 , C08F220/14 , C08F2222/402
摘要： An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process.
摘要翻译：本发明的粘合剂组合物含有通过使含有具有马来酰亚胺基团的单体的单体组合物共聚而得到的聚合物，并且还含有热聚合抑制剂。结果，可以提供一种粘合剂组合物，其可以在粘合剂层经受高温处理之后形成粘合剂层，其优异地溶解。

3. 发明授权

US08877884B2 Adhesive composition, film adhesive, and method for producing the adhesive composition 有权
标题翻译：粘合剂组合物，薄膜粘合剂和粘合剂组合物的制造方法
公开(公告)号：US08877884B2
公开(公告)日：2014-11-04
申请号：US12458259
申请日：2009-07-07
申请人： Motoki Takahashi , Hirofumi Imai , Takahiro Asai , Koichi Misumi , Toshiyuki Ogata
发明人： Motoki Takahashi , Hirofumi Imai , Takahiro Asai , Koichi Misumi , Toshiyuki Ogata
IPC分类号： C08F212/08 , C09J7/02 , C09J125/04 , C09J133/04 , C09J135/00 , C08F6/10 , C08F6/12 , C09J125/14 , C08F220/12 , C08J3/09 , C09J133/24 , C09J125/08 , C09J135/06 , C07B63/00 , C08F6/00 , C08F220/14 , C08F220/18 , C08F222/40
CPC分类号： C09J7/02 , C07B63/00 , C08F6/001 , C08F6/10 , C08F6/12 , C08F212/08 , C08F220/12 , C08F220/14 , C08F2220/1825 , C08F2222/402 , C08J3/095 , C08J2325/08 , C08J2325/14 , C09J7/20 , C09J125/04 , C09J125/08 , C09J125/14 , C09J133/04 , C09J133/24 , C09J135/00 , C09J135/06 , C09J2425/00 , C09J2433/00 , C08F2220/1875 , C08L25/14
摘要： An adhesive composition is disclosed which includes a polymer prepared by copolymerizing a monomer containing a polymerizable group, the polymer including a low-molecular-weight component having a molecular weight equivalent to 1% or less of the weight-average molecular weight of the polymer, the low-molecular-weight component is contained in a range of not less than 0 weight % to less than 0.3 weight % of the total weight of the polymer. This allows provision of an adhesive composition having great adhesive strength in a high-temperature environment, especially at temperatures from 140° C. to 200° C., as well as high heat resistance and favorable crack resistance.
摘要翻译：公开了一种粘合剂组合物，其包括通过共聚含有可聚合基团的单体制备的聚合物，所述聚合物包括分子量等于聚合物的重均分子量的1％或更低的低分子量组分，低分子量成分的含量为聚合物总重量的0重量％〜小于0.3重量％。这允许提供在高温环境下，特别是在140℃至200℃的温度下具有很大粘附强度的粘合剂组合物，以及高耐热性和良好的抗裂性。

4. 发明授权

US08124685B2 Adhesive composition and film adhesive 有权
标题翻译：粘合剂组合物和胶粘剂
公开(公告)号：US08124685B2
公开(公告)日：2012-02-28
申请号：US12683688
申请日：2010-01-07
申请人： Hirofumi Imai , Koki Tamura , Koichi Misumi , Takahiro Asai
发明人： Hirofumi Imai , Koki Tamura , Koichi Misumi , Takahiro Asai
IPC分类号： C08L37/00
CPC分类号： C09J133/14 , Y10T428/2891
摘要： An adhesive composition of the present invention is an adhesive composition including a polymer obtained by copolymerizing a monomer composition containing a (meth)acrylic acid ester and a monomer having a maleimide group, the (meth)acrylic acid ester has a structure represented by General Formula (1): wherein R1 is a hydrogen atom or a methyl group, and R2 is a C4 to C20 alkyl group, and the (meth)acrylic acid ester is contained in the monomer composition by 10 to 50 parts by mass where an amount of the monomer composition is 100 parts by mass. With the arrangement, it is possible to provide an adhesive agent and a film adhesive each of which can be suitably used in high temperature processing.
摘要翻译：本发明的粘合剂组合物是包含通过共聚包含（甲基）丙烯酸酯的单体组合物和具有马来酰亚胺基团的单体而获得的聚合物的粘合剂组合物，所述（甲基）丙烯酸酯具有由通式（1）表示：其中，R1为氢原子或甲基，R2为C4〜C20烷基，单体组合物含有（甲基）丙烯酸酯10〜50质量份，单体组成为100质量份。通过这种布置，可以提供粘合剂和薄膜粘合剂，它们都可以适用于高温加工。

5. 发明申请

US20100186895A1 Adhesive composition, film adhesive, and heat treatment method 审中-公开
标题翻译：粘合剂组合物，薄膜粘合剂和热处理方法
公开(公告)号：US20100186895A1
公开(公告)日：2010-07-29
申请号：US12662120
申请日：2010-03-31
申请人： Takahiro Asai , Koichi Misumi , Hirofumi Imai
发明人： Takahiro Asai , Koichi Misumi , Hirofumi Imai
IPC分类号： B32B37/06
CPC分类号： C09J133/14 , C09J133/12 , C09J135/06 , Y10T428/2852 , Y10T428/2861 , Y10T428/2887 , Y10T428/2896 , C08F212/08 , C08F220/14 , C08F2222/402
摘要： An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process.
摘要翻译：本发明的粘合剂组合物含有通过使含有具有马来酰亚胺基团的单体的单体组合物共聚而得到的聚合物，并且还含有热聚合抑制剂。结果，可以提供一种粘合剂组合物，其可以在粘合剂层经受高温处理之后形成粘合剂层，其优异地溶解。

6. 发明申请

US20100159191A1 PROCESSED SUBSTRATE AND METHOD FOR MANUFACTURING SAME 审中-公开
标题翻译：处理基板及其制造方法
公开(公告)号：US20100159191A1
公开(公告)日：2010-06-24
申请号：US12638082
申请日：2009-12-15
申请人： Hirofumi IMAI , Koki Tamura , Koichi Misumi , Takahiro Asai
发明人： Hirofumi IMAI , Koki Tamura , Koichi Misumi , Takahiro Asai
IPC分类号： B32B3/10 , G03F7/20
CPC分类号： G03F7/20 , H01L21/6836 , H01L2221/6834 , Y10T428/24273
摘要： The present invention provides (i) a processed substrate having a through-hole whose openings on respective surfaces of the processed substrate are matched to each other in size, and (ii) a method for easily manufacturing the processed substrate with high efficiency. A processed substrate 1 of the present invention is a processed substrate 1 including a light transmissive substrate having a plurality of through-holes, each of which plurality of the through-holes has a larger opening diameter and a smaller opening, wherein the larger opening diameter is larger in size than the smaller opening diameter by a difference of 5% or less of a size of the larger diameter. As such, a through-hole 6 whose opening on the respective surfaces are matched to each other in size can be provided.
摘要翻译：本发明提供（i）具有贯通孔的处理基板，其处理后基板的各表面的开口尺寸彼此匹配，（ii）高效率地制造被处理基板的方法。本发明的处理基板1是具有多个通孔的透光基板的处理基板1，其中多个通孔具有较大的开口直径和较小的开口，其中较大的开口直径尺寸比较小的开口直径大5％以下的大直径的尺寸。因此，可以提供其各个表面上的开口尺寸彼此匹配的通孔6。

7. 发明申请

US20100086799A1 Removal method, adhesive agent for substrate, and laminate including substrate 审中-公开
标题翻译：去除方法，基材用粘合剂和包括基材的层压体
公开(公告)号：US20100086799A1
公开(公告)日：2010-04-08
申请号：US12588037
申请日：2009-10-01
申请人： Takahiro Asai , Koichi Misumi , Hirofumi Imai
发明人： Takahiro Asai , Koichi Misumi , Hirofumi Imai
IPC分类号： B32B9/04 , B29C63/00 , B32B23/04
CPC分类号： B32B9/04 , B32B3/266 , B32B7/06 , B32B7/12 , B32B27/06 , B32B37/12 , B32B43/006 , B32B2255/00 , B32B2255/26 , B32B2255/28 , B32B2307/748 , B32B2457/14 , C09J5/00 , C09J2205/302 , H01L21/6835 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/1111 , Y10T428/31504 , Y10T428/31971
摘要： The removal method of the present invention includes: providing a support plate and a substrate being combined to each other via a first adhesive layer and a second adhesive layer, the second adhesive layer being an adhesive layer which is dissolvable in a solvent quicker than the first adhesive layer or an adhesive layer which is dissolvable in a solvent different from a solvent to which the first adhesive layer is dissolvable, and the second adhesive layer being between the support plate and the first adhesive layer; and removing the support plate from the substrate by dissolving the second adhesive layer. Further, the removal method of the present invention includes, after the step of removing, dissolving the first adhesive layer. This removes the support plate from the wafer in a quick and easy way.
摘要翻译：本发明的去除方法包括：提供通过第一粘合层和第二粘合剂层彼此组合的支撑板和基底，第二粘合剂层是可溶于比第一粘合剂层更快的溶剂的粘合剂层粘合剂层或可溶于不同于第一粘合剂层可溶解的溶剂的溶剂中的粘合剂层，并且第二粘合剂层位于支撑板和第一粘合剂层之间; 并且通过溶解第二粘合剂层从基板移除支撑板。此外，本发明的除去方法在除去溶解第一粘合剂层的步骤之后包括。这样可以快速方便地将支撑板从晶片上移除。

8. 发明授权

US08901234B2 Adhesive composition 有权
标题翻译：粘合剂组合物
公开(公告)号：US08901234B2
公开(公告)日：2014-12-02
申请号：US12457579
申请日：2009-06-16
申请人： Takahiro Asai , Koichi Misumi , Hirofumi Imai
发明人： Takahiro Asai , Koichi Misumi , Hirofumi Imai
IPC分类号： C08F222/40 , C08L37/00 , C08L39/00 , C09J133/14 , C09J135/06
CPC分类号： C09J133/14 , C09J133/12 , C09J135/06 , Y10T428/2852 , Y10T428/2861 , Y10T428/2887 , Y10T428/2896 , C08F212/08 , C08F220/14 , C08F2222/402
摘要： An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process.
摘要翻译：本发明的粘合剂组合物含有通过使含有具有马来酰亚胺基团的单体的单体组合物共聚而得到的聚合物，并且还含有热聚合抑制剂。结果，可以提供一种粘合剂组合物，其能够在粘合剂层经受高温处理之后形成粘合剂层，其优异地溶解。

9. 发明申请

US20110061800A1 ADHESIVE COMPOSITION, FILM ADHESIVE, AND HEAT TREATMENT METHOD 有权
公开(公告)号：US20110061800A1
公开(公告)日：2011-03-17
申请号：US12950203
申请日：2010-11-19
申请人： Takahiro ASAI , Koichi Misumi , Hirofumi Imai
发明人： Takahiro ASAI , Koichi Misumi , Hirofumi Imai
IPC分类号： B32B38/10
CPC分类号： C09J133/14 , C09J133/12 , C09J135/06 , Y10T428/2852 , Y10T428/2861 , Y10T428/2887 , Y10T428/2896 , C08F212/08 , C08F220/14 , C08F2222/402
摘要： An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process.

10. 发明申请

US20100068453A1 METHOD FOR PRODUCING PROCESSED GLASS SUBSTRATE 审中-公开
标题翻译：生产加工玻璃基板的方法
公开(公告)号：US20100068453A1
公开(公告)日：2010-03-18
申请号：US12558850
申请日：2009-09-14
申请人： Hirofumi IMAI , Koichi Misumi , Takahiro Asai
发明人： Hirofumi IMAI , Koichi Misumi , Takahiro Asai
IPC分类号： B32B3/24 , C03C19/00 , C03C15/00 , G03F7/20
CPC分类号： G03F7/2022 , C03C15/00 , C03C19/00 , C03C2218/34 , Y10T428/24273
摘要： A processed substrate of the present invention includes a translucent substrate having a plurality of through-holes, in each of which there is a gap from 0 to 5 μm between (a) a straight line which passes through a central point of an opening plane of the each of the plurality of through-holes and which is perpendicular to the opening plane and (b) a straight line which passes through a central point of the other opening plane of the each of the plurality of through-holes and which is perpendicular to the other opening plane, thereby making it possible to provide (i) a processed substrate having through-holes in each of which central axes are aligned, which can be easily produced with high productivity, and (ii) a production method thereof. Further, a production method of the present invention of a processed glass substrate includes: (a) forming photosensitive resin layers on surfaces of a glass substrate; (b) forming a through-hole in the glass substrate; and (c) immersing the glass substrate in acid, with the photosensitive resin layers remaining on the both surfaces. Accordingly, it is unnecessary to perform smoothing the surfaces of the glass substrate after the step (c), thereby successfully producing a processed glass substrate having a through-hole with high productivity.
摘要翻译：本发明的处理衬底包括具有多个通孔的透光性衬底，每个通孔在（a）穿过开口平面的中心点的直线之间存在0至5μm的间隙所述多个通孔中的每一个并且垂直于所述开口平面，并且（b）直线，其穿过所述多个通孔中的每一个的另一开口平面的中心点并且垂直于从而能够提供（i）具有通孔的处理基板，其中每个中心轴对准，其可以容易地以高生产率生产，和（ii）其制造方法。此外，本发明的加工玻璃基板的制造方法包括：（a）在玻璃基板的表面上形成感光性树脂层; （b）在玻璃基板中形成通孔; 和（c）将玻璃基板浸入酸中，其中感光性树脂层保留在两面上。因此，不需要在步骤（c）之后对玻璃基板的表面进行平滑化，从而以高生产率成功制造具有通孔的加工玻璃基板。

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