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1. 发明授权

US6040620A Lead frame for LOC having a regulating lead to prevent variation in adhesive coverage 失效
标题翻译： LOC的引线框架具有调节引线以防止粘合剂覆盖的变化
公开(公告)号：US6040620A
公开(公告)日：2000-03-21
申请号：US888121
申请日：1997-07-03
申请人： Hiroshi Sugimoto , Shigeo Hagiya , Noriaki Taketani , Takaharu Yonemoto , Osamu Yoshioka
发明人： Hiroshi Sugimoto , Shigeo Hagiya , Noriaki Taketani , Takaharu Yonemoto , Osamu Yoshioka
IPC分类号： H01L23/495
CPC分类号： H01L23/4951 , H01L2924/0002
摘要： A lead frame for LOC is provided which can reduce a variation in coverage of an insulating adhesive, permitting the fixation of a semiconductor chip and wire bonding to be stably performed. In a lead frame for LOC 10 wherein an insulating adhesive for fixing a semiconductor chip is applied to inner leads 11 in their semiconductor chip mounting region, a coverage regulating lead 14 is provided outside the semiconductor chip mounting region and adjacent to inner leads 11a, 11b located at the end of the semiconductor chip mounting region, permitting the insulting adhesive to be homogeneously applied to each of the inner leads 11 without creating any variation in coverage of the adhesive.
摘要翻译：提供了一种用于LOC的引线框架，其可以减少绝缘粘合剂的覆盖范围的变化，从而允许半导体芯片的固定和引线键合被稳定地执行。在用于LOC 10的引线框架中，其中用于固定半导体芯片的绝缘粘合剂被施加到其半导体芯片安装区域中的内部引线11，覆盖调节引线14设置在半导体芯片安装区域的外部并且与内部引线11a，11b相邻位于半导体芯片安装区域的端部，允许绝缘粘合剂均匀地施加到每个内引线11，而不产生粘合剂的覆盖范围的任何变化。

2. 发明授权

US06246106B1 Lead frame 失效
标题翻译：引线架
公开(公告)号：US06246106B1
公开(公告)日：2001-06-12
申请号：US08886976
申请日：1997-07-03
申请人： Hiroshi Sugimoto , Shigeo Hagiya , Noriaki Taketani , Takaharu Yonemoto , Osamu Yoshioka
发明人： Hiroshi Sugimoto , Shigeo Hagiya , Noriaki Taketani , Takaharu Yonemoto , Osamu Yoshioka
IPC分类号： H01L23495
CPC分类号： H01L23/4951 , H01L2924/0002 , H01L2924/00
摘要： A lead frame is provided which enables a coating of an insulating adhesive for fixing a semiconductor chip to be evenly and thickly foamed on inner leads. In a lead frame wherein an insulating adhesive for fixing a semiconductor chip is applied to a semiconductor chip mounting region, inner leads 1 are set to a value of w/s of not more than 1 wherein w represents the lead width and s represents the lead spacing.
摘要翻译：提供了一种引线框架，其能够使用于将半导体芯片固定的绝缘粘合剂的涂层在内引线上均匀且发泡。在半导体芯片安装区域中施加用于固定半导体芯片的绝缘粘合剂的引线框架中，将内引线1设定为不大于1的w / s的值，其中w表示引线宽度，s表示引线间距。

3. 发明授权

US5880522A Stamped lead frame with adhesive layer for fixing to semiconductor device 失效
标题翻译：冲压引线框架，具有用于固定到半导体器件的粘合剂层
公开(公告)号：US5880522A
公开(公告)日：1999-03-09
申请号：US897828
申请日：1997-07-21
申请人： Takaharu Yonemoto , Hiroshi Sugimoto , Shigeo Hagiya , Noriaki Taketani , Osamu Yoshioka
发明人： Takaharu Yonemoto , Hiroshi Sugimoto , Shigeo Hagiya , Noriaki Taketani , Osamu Yoshioka
IPC分类号： B21D28/00 , H01L21/52 , H01L23/495 , H01L23/50
CPC分类号： H01L23/4951 , H01L2224/32245
摘要： A lead frame for LOC is provided which, even when an adhesive is applied to a lead prepared by stamping, can ensure insulation of a semiconductor element mounted from the lead. In applying an adhesive to a predetermined position of an inner lead 1 in a lead frame prepared by stamping to form an adhesive layer 4, the adhesive layer 4 is provided on the droop face of the inner lead 1. The droop face has no burr and a bulged center portion, permitting contact, derived from the burr, between a lead face and a semiconductor element, to be avoided, which ensures satisfactory insulation of the semiconductor element mounted from the lead.
摘要翻译：提供了一种用于LOC的引线框架，即使当将粘合剂施加到通过冲压制备的引线上时，可以确保安装在引线上的半导体元件的绝缘。在通过冲压制成的引线框架中的内引线1的预定位置施加粘合剂以形成粘合剂层4时，粘合剂层4设置在内引线1的下垂面上。下垂面没有毛刺，避免了引线面和半导体元件之间产生从毛刺导出的凸起的中心部分，这确保了安装在引线上的半导体元件的令人满意的绝缘。

4. 发明授权

US06268646B1 Lead frame for lead on chip 失效
标题翻译：芯片引线框架
公开(公告)号：US06268646B1
公开(公告)日：2001-07-31
申请号：US08917916
申请日：1997-08-27
申请人： Hiroshi Sugimoto , Shigeo Hagiya , Noriaki Taketani , Takaharu Yonemoto , Osamu Yoshioka
发明人： Hiroshi Sugimoto , Shigeo Hagiya , Noriaki Taketani , Takaharu Yonemoto , Osamu Yoshioka
IPC分类号： H01L2350
CPC分类号： H01L23/4951 , H01L24/48 , H01L2224/05639 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2924/00014 , H01L2924/07802 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/85399
摘要： A lead frame for LOC to which a semiconductor chip is fixed within a semiconductor chip-mounting region. In addition to applying insulative adhesives to the conventional portions or spots which are on the bottom surfaces of the leading edges of respective inner leads for wire bonding to the pads for the semiconductor ship, the insulative adhesives are applied to other portions of the inner leads in the vicinity of the semiconductor chip-mounting region. Accordingly, the area for bonding the semiconductor chip can be enlarged resulting in improvements in the stability of adhesion between the leads and the semiconductor chip, and in the stabilities of wire bonding and resin molding.
摘要翻译：半导体芯片安装区域内固定有半导体芯片的LOC引线框架。除了将绝缘粘合剂施加到用于与半导体船的焊盘引线接合的各内引线的前缘的底表面上的常规部分或点之外，绝缘粘合剂被施加到内引线的其它部分半导体芯片安装区域附近。因此，可以扩大用于接合半导体芯片的区域，从而提高引线与半导体芯片之间的粘附稳定性，以及引线接合和树脂成型的稳定性。

5. 发明授权

US6002167A Semiconductor device having lead on chip structure 失效
标题翻译：具有芯片结构的半导体器件
公开(公告)号：US6002167A
公开(公告)日：1999-12-14
申请号：US710658
申请日：1996-09-20
申请人： Kazuhisa Hatano , Tatsuya Ohtaka , Takaharu Yonemoto , Osamu Yoshioka , Gen Murakami
发明人： Kazuhisa Hatano , Tatsuya Ohtaka , Takaharu Yonemoto , Osamu Yoshioka , Gen Murakami
IPC分类号： H01L23/495 , H01L25/10 , H01L23/48 , H01L23/52
CPC分类号： H01L23/4951 , H01L25/105 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2225/1029 , H01L2225/1041 , H01L2225/1058 , H01L24/48 , H01L2924/00014 , H01L2924/07802 , H01L2924/181
摘要： A semiconductor device has a semi-conductor chip 1 having bonding pads 2 thereon, conductive leads 4, each of which comprises an inner lead 41 and an outer lead 42, insulating adhesive tapes 3 by which each of the inner leads 41 of the leads 4 is stuck to the surface 1a of the semiconductor chip 1, bonding wires 6 by which each of the leads 4 is electrically connected to each corresponding bonding pad 2. The semiconductor chip 1, bonding pad 2, adhesive tapes 3, inner leads 41, and bonding wires 6 are molded by a molding resin 5. The boundary of the inner lead 41 and the cuter lead 42 of the lead 4 is bent in S-shape so that there is a step between inner lead 41 and the upper side portion 42a of the outer lead 42 in a certain depth. Then the outer lead 42 protrude out of the molding resin and extend in J-shape. The surface 4a of the upper side portion 42a of the outer lead 42 is higher than the top of the looped bonding wire 6.
摘要翻译：半导体器件具有在其上具有接合焊盘2的半导体芯片1，导电引线4，每个导体4包括内引线41和外引线42，绝缘胶带3，引线4的每个内引线41 粘附到半导体芯片1的表面1a，每个引线4与每个相应的焊盘2电连接的接合线6.半导体芯片1，焊盘2，胶带3，内引线41和接合线6由模制树脂5模制。引线4的内引线41和切割引线42的边界被弯曲成S形，使得在内引线41和上侧部分42a之间形成一个台阶外引线42在一定深度。然后，外引线42突出成型树脂，并以J形延伸。外引线42的上侧部分42a的表面4a高于环状接合线6的顶部。

6. 发明授权

US4215049A Antitumorigenic lactone derivative 失效
标题翻译：抗发炎内酯衍生物
公开(公告)号：US4215049A
公开(公告)日：1980-07-29
申请号：US874945
申请日：1978-02-03
申请人： Takeyoshi Takahashi , Hirozumi Eto , Osamu Yoshioka
发明人： Takeyoshi Takahashi , Hirozumi Eto , Osamu Yoshioka
IPC分类号： A61K36/28 , C07D307/93
CPC分类号： C07D307/93
摘要： There are disclosed novel compounds which are extracted with an organic solvent from Eupatorium sachalinense belonging to the genus Eupatorium and isolated by normal separating and refining procedures, the compounds being expressed by the general formula: ##STR1## where R is ##STR2## a pale yellowish oily substance having an optical rotation of [.alpha.].sub.D.sup.24 -121.degree. (C=O.75, ethanol), a molecular weight of 420 estimated from peak value in mass spectrum measurement (theoretical value: 420), a molecular formula of C.sub.22 H.sub.28 O.sub.8, an end absorption at 210 mm (.epsilon.:14800) in ultraviolet absorption spectrum, peaks in infrared absorption spectrum by liquid film method at the frequencies (cm.sup.-1) of 3400, 2920, 2845, 1760, 1740, 1705, 1658, 1440, 1370, 1325, 1220-1280, 1180, 1133, 1107, 1070, 1020, 970, 881, 840, 819, 788, 758, 710, 662, 630, 607 and 582, assignments of respective protons in NMR spectrum (.delta.,CDCl.sub.3) at C.sub.6 --H=5.96 (1H, dd, J=11,2), C.sub.4 --CH.sub.3 =1.80 (3H, d, J=1), C.sub.10 --CH.sub.3 =1.84 (3H, s), C.sub.3' --H=6.90 (1H, t, J=5.5), C.sub.4' --H=4.37 (2H, d, J=5.5), C.sub.5' --H=4.31 (2H, s), exo CH.sub.2 =5.79,6.33 (1H, d, J=2), COCH.sub.3 = 2.12 (3H, s); ##STR3## or [III] hydrogen; and a process for the preparation of these compounds. These compounds are found to have not only inhibitive effects, even in a low concentration, against experimental cancer cells (HeLa) but also considerable life prolonging effects in in vitro experiments on mice inoculated with Ehrlich ascites, suggesting similar effects on malignant tumors in humans.
摘要翻译：公开了由有机溶剂提取的新颖化合物，该有机溶剂由属于Eupatorium属的Eupatorium sachalinense提取，并通过正常的分离和精制方法分离，化合物由以下通式表示：其中R为[I] 具有旋光度为ΔD24-121°（C = 0.75，乙醇）的淡黄色油状物质，根据质谱测定中的峰值估计的分子量为420（理论值：420），分子式的C22H28O8，在紫外吸收光谱中在210mm（ε：14800）下的端部吸收，在3400,2920,2845,1760,1740,1705,1658的频率（cm-1）下通过液膜法在红外吸收光谱中的峰值，1440,1370,1325,1220-1280,1180,1133,1107,1070,1020,970,881,840,819,788,758,710,662,630,607和582，NMR光谱中各个质子的分配（1H，dd，J = 11,2），C 4 -CH 3 = 1.80（3H，d，J = 1），C 10 -CH 3 = 1.84（3H， s），C3'-H = 6.90（1H，t，J = 5.5），C4'-H = 4.37（2H，d，J = 5.5），C5'-H = 4.31（2H，s） 5.79,6.33（1H，d，J = 2），COCH 3 = 2.12（3H，s）; [II]或[III]氢; 以及这些化合物的制备方法。发现这些化合物对于实验性癌细胞（HeLa）具有不仅具有低浓度的抑制作用，而且在接种Ehrlich腹水的小鼠的体外实验中具有相当大的寿命延长效应，表明对人类恶性肿瘤具有相似的作用。

7. 发明授权

US08809478B2 Silicon-containing curable composition, cured product of the silicon-containing curable composition and lead frame substrate formed of the silicon-containing curable composition 有权
标题翻译：含硅可固化组合物，含硅可固化组合物的固化产物和由含硅可固化组合物形成的引线框架基材
公开(公告)号：US08809478B2
公开(公告)日：2014-08-19
申请号：US13700370
申请日：2011-06-06
申请人： Masako Saito , Ichiro Hiratsuka , Masahiro Wada , Ryota Chiba , Takuya Kanazawa , Osamu Yoshioka , Takehito Tsukamoto , Junko Toda
发明人： Masako Saito , Ichiro Hiratsuka , Masahiro Wada , Ryota Chiba , Takuya Kanazawa , Osamu Yoshioka , Takehito Tsukamoto , Junko Toda
IPC分类号： C08G77/08 , C08L83/04 , H01L23/057 , H01L23/498 , C08L83/06 , C08K5/14 , C08K5/549 , H01L33/56 , C08K5/5425 , C08K5/00 , C08G77/20 , C08G77/12
CPC分类号： C08L83/06 , C08G77/12 , C08G77/20 , C08K5/0025 , C08K5/14 , C08K5/5425 , C08K5/549 , C08L83/04 , H01L23/057 , H01L23/49861 , H01L33/56 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A curable composition includes: 100 parts by mass of a silicon-containing polymer having a Mw of 3,000 to 100,000 obtainable by hydrolysis-condensation of an organosilane mixture including R1SiX3, R2SiX3, R3R4SiX2 and R5SiX3, the total of R2SiX3 and R3R4SiX2 being 5 to 60 mol %, optionally a prepolymer, optionally a cyclic siloxane compound, 0.0001 to 10 parts by mass of an organic peroxide and optionally a metal catalyst, and 10 to 1,500 parts by mass of a filler, wherein R1 is a C2-6 alkenyl group, R2 is a C1-6 alkyl group, R3 and R4 are each a C1-6 alkyl group, R5 is a phenyl group optionally substituted with a C1-6 alkyl group, and X is a C1-6 alkoxy group, one or more of R2 to R4 is a methyl group, f represents a number of 2 to 10, g represents a number of 0 to 8, and n represents 1 or 2.
摘要翻译：可固化组合物包括：通过包括R1SiX3，R2SiX3，R3R4SiX2和R5SiX3的有机硅烷混合物的水解缩合得到的Mw为3,000〜100,000的含硅聚合物100质量份，R2SiX3和R3R4SiX2的合计为5〜60 mol％，任选的预聚物，任选的环状硅氧烷化合物，0.0001-10质量份有机过氧化物和任选的金属催化剂，以及10-1500质量份填料，其中R1是C2-6链烯基， R2是C1-6烷基，R3和R4各自是C1-6烷基，R5是任选被C 1-6烷基取代的苯基，X是C 1-6烷氧基，一个或多个 R 2〜R 4为甲基，f表示2〜10的数，g表示0〜8的数，n表示1或2。

8. 发明授权

US5206606A Control circuit for signal level 失效
标题翻译：信号电平控制电路
公开(公告)号：US5206606A
公开(公告)日：1993-04-27
申请号：US860991
申请日：1992-03-31
申请人： Futao Yamaguchi , Takeshi Ikeda , Osamu Yoshioka
发明人： Futao Yamaguchi , Takeshi Ikeda , Osamu Yoshioka
IPC分类号： H03G1/04 , H03G3/20 , H04N5/53
CPC分类号： H03G3/3036 , H03G1/04 , H04N5/53
摘要： In a signal level control circuit a gain of a current obtained by converting an input signal is controlled by an external control signal in order to automatically control the level of the input signal. The potential of a resistor with a temperature characteristic is set by a voltage determined by the product of an external reference current and an internal resistance so that the temperature characteristic of a current output through the resistor with the temperature characteristic can be removed.
摘要翻译：在信号电平控制电路中，通过外部控制信号控制通过转换输入信号获得的电流的增益，以便自动控制输入信号的电平。具有温度特性的电阻器的电位通过由外部参考电流和内部电阻的乘积确定的电压来设定，使得可以去除通过具有温度特性的电阻器输出的电流的温度特性。

9. 发明授权

US4195018A 3-[(S)-1'-Phenylethylamino]propylaminobleomycin, non-toxic salt thereof, and method for producing same 失效
标题翻译： 3 - [（S）-1'-苯乙基氨基]丙基氨基倍巴青霉素，其无毒盐及其制备方法
公开(公告)号：US4195018A
公开(公告)日：1980-03-25
申请号：US915805
申请日：1978-06-15
申请人： Tomohisa Takita , Akio Fujii , Takeyo Fukuoka , Yasuhiko Muraoka , Osamu Yoshioka , Hamao Umezawa
发明人： Tomohisa Takita , Akio Fujii , Takeyo Fukuoka , Yasuhiko Muraoka , Osamu Yoshioka , Hamao Umezawa
IPC分类号： C07K9/00 , C07C103/52 , A61K37/10
CPC分类号： C07K9/003 , Y10S930/19 , Y10S930/27
摘要： Novel 3-[(S)-1'-phenylethylamino]propylaminobleomycin obtained by reacting a reactive derivative of the carboxyl group of bleomycinic acid with N-[(S)-1'-phenylethyl]-1,3-diaminopropane, a non-toxic salt of said novel bleomycin, and a method for producing the novel bleomycin. Because of much reduction in the side effect causing pulmonary fibrosis, the novel bleomycin is more useful than a commercial bleomycin complex which gives rise to said undesirable side effect.
摘要翻译：通过使博来霉素酸的羧基的活性衍生物与N - [（S）-1'-苯基乙基] -1,3-二氨基丙烷反应而得到的新型3 - [（S）-1'-苯基乙基氨基] 所述新型博莱霉素的有毒盐，以及生产新型博来霉素的方法。由于引起肺纤维化的副作用大大减少，新博莱霉素比商业博来霉素复合物更有用，这引起了不希望的副作用。

10. 发明申请

US20130075154A1 SILICON-CONTAINING CURABLE COMPOSITION, CURED PRODUCT OF THE SILICON-CONTAINING CURABLE COMPOSITION AND LEAD FRAME SUBSTRATE FORMED OF THE SILICON-CONTAINING CURABLE COMPOSITION 有权
标题翻译：含硅可固化组合物，含硅固化组合物的固化产物和含硅固化组合物的引线框架基板
公开(公告)号：US20130075154A1
公开(公告)日：2013-03-28
申请号：US13700370
申请日：2011-06-06
申请人： Masako Saito , Ichiro Hiratsuka , Masahiro Wada , Ryota Chiba , Takuya Kanazawa , Osamu Yoshioka , Takehito Tsukamoto , Junko Toda
发明人： Masako Saito , Ichiro Hiratsuka , Masahiro Wada , Ryota Chiba , Takuya Kanazawa , Osamu Yoshioka , Takehito Tsukamoto , Junko Toda
IPC分类号： C08L83/06 , H01L23/057
CPC分类号： C08L83/06 , C08G77/12 , C08G77/20 , C08K5/0025 , C08K5/14 , C08K5/5425 , C08K5/549 , C08L83/04 , H01L23/057 , H01L23/49861 , H01L33/56 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A curable composition includes: 100 parts by mass of a silicon-containing polymer having a Mw of 3,000 to 100,000 obtainable by hydrolysis-condensation of an organosilane mixture including R1SiX3, R2SiX3, R3R4SiX2 and R5SiX3, the total of R2SiX3 and R3R4SiX2 being 5 to 60 mol %, optionally a prepolymer, optionally a cyclic siloxane compound, 0.0001 to 10 parts by mass of an organic peroxide and optionally a metal catalyst, and 10 to 1,500 parts by mass of a filler, wherein R1 is a C2-6 alkenyl group, R2 is a C1-6 alkyl group, R3 and R4 are each a C1-6 alkyl group, R5 is a phenyl group optionally substituted with a C1-6 alkyl group, and X is a C1-6 alkoxy group, one or more of R2 to R4 is a methyl group, f represents a number of 2 to 10, g represents a number of 0 to 8, and n represents 1 or 2.
摘要翻译：可固化组合物包括：通过包括R1SiX3，R2SiX3，R3R4SiX2和R5SiX3的有机硅烷混合物的水解缩合得到的Mw为3,000〜100,000的含硅聚合物100质量份，R2SiX3和R3R4SiX2的合计为5〜60 mol％，任选的预聚物，任选的环状硅氧烷化合物，0.0001-10质量份有机过氧化物和任选的金属催化剂，以及10-1500质量份填料，其中R1是C2-6链烯基， R2是C1-6烷基，R3和R4各自是C1-6烷基，R5是任选被C 1-6烷基取代的苯基，X是C 1-6烷氧基，一个或多个 R 2〜R 4为甲基，f表示2〜10的数，g表示0〜8的数，n表示1或2。

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