专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07214887B2 Electronic circuit connecting structure, and its connecting method 失效
标题翻译：电子电路连接结构及其连接方法
公开(公告)号：US07214887B2
公开(公告)日：2007-05-08
申请号：US10844695
申请日：2004-05-13
申请人： Takaaki Higashida , Kenichi Yamamoto , Daisuke Suetsugu , Miyuki Nagaoka , Takashi Imanaka , Toshinari Nitta
发明人： Takaaki Higashida , Kenichi Yamamoto , Daisuke Suetsugu , Miyuki Nagaoka , Takashi Imanaka , Toshinari Nitta
IPC分类号： H05K1/16
CPC分类号： H05K3/361 , H01L24/81 , H01L2224/81801 , H01L2924/12042 , H05K3/321 , H05K3/3452 , H05K3/363 , H05K2201/09909 , H05K2201/2036 , H01L2924/00
摘要： A connecting structure includes a circuit board with a first connection land having a plurality of conductor patterns on the surface thereof, a second connection land disposed in a position opposite to the first connection land of the circuit board, and a flexible board including an insulating layer formed so as to surround at least a part of outer periphery of the second connection land. The first connection land and the second connection land are bonded to each other with a bonding member, and the insulating layer is thicker than the total thickness of the second connection land and the first connection land. It is possible to obtain an electronic circuit connecting structure which is free from short-circuit due to running of the bonding member such as solder even with the connecting land greatly reduced in size, and its connecting method.
摘要翻译：连接结构包括电路板，其电路板具有在其表面上具有多个导体图案的第一连接平台，设置在与电路板的第一连接平台相对的位置的第二连接平台，以及包括绝缘层形成为围绕第二连接平台的外周的至少一部分。所述第一连接区域和所述第二连接区域用接合构件彼此接合，并且所述绝缘层比所述第二连接台面和所述第一连接台面的总厚度厚。即使连接区域大大减小，也可以得到由于诸如焊料的接合构件的运行而不会短路的电子电路连接结构及其连接方法。

2. 发明授权

US06762107B2 Capacitor and manufacturing method thereof 失效
标题翻译：电容器及其制造方法
公开(公告)号：US06762107B2
公开(公告)日：2004-07-13
申请号：US10311999
申请日：2002-12-23
申请人： Hisayoshi Watanabe , Takashi Imanaka , Toru Uchida , Osamu Sengoku , Shinsuke Itoi , Munekazu Nishihara , Takaaki Higashida , Daisuke Suetsugu , Kenichi Yamamoto , Jun Katsube , Hirotaka Hisamura
发明人： Hisayoshi Watanabe , Takashi Imanaka , Toru Uchida , Osamu Sengoku , Shinsuke Itoi , Munekazu Nishihara , Takaaki Higashida , Daisuke Suetsugu , Kenichi Yamamoto , Jun Katsube , Hirotaka Hisamura
IPC分类号： H01L2120
CPC分类号： H01G4/005 , H01G4/06 , H01G4/33
摘要： A capacitor (1) using a flexible substrate (2) includes a hole portion (6a) formed in a dielectric (6) to connect an upper electrode (7) to an external leader electrode (4). At least part of the hole portion (6a) extends from its lower end to upper end at an inclination between 0.1 and 20° with respect to a top surface of the external leader electrode (4). Then, an upper end corner of an inclined wall surface of the upper electrode (7), which inclines along the hole portion (6a) of the dielectric (6), has a downward inclination between 0.1 and 20°. A lower end corner of the inclined wall surface of the upper electrode (7), which inclines along the hole portion of the dielectric (6), has an upward inclination between 0.1 and 20°. As a result, stress concentration on the corners of the upper electrode (7) is drastically reduced to prevent the upper electrode (7) from cracking.
摘要翻译：使用柔性基板（2）的电容器（1）包括形成在电介质（6）中的用于将上电极（7）连接到外引导电极（4）的孔部（6a）。孔部分（6a）的至少一部分相对于外部引导电极（4）的顶表面从其下端到上端以0.1和20°之间的倾斜度延伸。然后，沿着电介质（6）的孔部（6a）倾斜的上电极（7）的倾斜壁面的上端角落在0.1〜20°之间。上电极（7）的倾斜壁表面的沿着电介质（6）的孔部倾斜的下端角度具有在0.1和20度之间的向上倾斜。结果，上部电极（7）的角部上的应力集中显着减小，以防止上部电极（7）破裂。

3. 发明申请

US20060202349A1 Circuit substrate and its manufacturing method 审中-公开
公开(公告)号：US20060202349A1
公开(公告)日：2006-09-14
申请号：US11429062
申请日：2006-05-08
申请人： Takaaki Higashida , Takafumi Okuma , Daisuke Suetsugu , Seiji Nakashima , Kenichi Yamamoto , Munekazu Nishihara , Kenichi Sato
发明人： Takaaki Higashida , Takafumi Okuma , Daisuke Suetsugu , Seiji Nakashima , Kenichi Yamamoto , Munekazu Nishihara , Kenichi Sato
IPC分类号： H01L23/52
CPC分类号： H05K1/186 , H01L23/5387 , H01L23/5389 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/12043 , H01L2924/14 , H01L2924/19105 , H01L2924/19106 , H04R17/00 , H05K1/056 , H05K1/16 , H05K1/189 , H05K3/0058 , H05K3/4611 , H05K3/4691 , H05K2201/0317 , H05K2201/09036 , H05K2201/0999 , H05K2201/10037 , H05K2201/10083 , H01L2924/00
摘要： A circuit substrate has a flexible thin film, electric wires supported on the film, and an electronic component supported on the film and positioned between the wires so that the wires and the component are electrically connected serially. Also, a thickness of the component is less than that of the electric wires.

4. 发明授权

US07084512B2 Circuit substrate and its manufacturing method 有权
标题翻译：电路基板及其制造方法
公开(公告)号：US07084512B2
公开(公告)日：2006-08-01
申请号：US10300028
申请日：2002-11-20
申请人： Takaaki Higashida , Takafumi Okuma , Daisuke Suetsugu , Seiji Nakashima , Kenichi Yamamoto , Munekazu Nishihara , Kenichi Sato
发明人： Takaaki Higashida , Takafumi Okuma , Daisuke Suetsugu , Seiji Nakashima , Kenichi Yamamoto , Munekazu Nishihara , Kenichi Sato
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H05K1/186 , H01L23/5387 , H01L23/5389 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/12043 , H01L2924/14 , H01L2924/19105 , H01L2924/19106 , H04R17/00 , H05K1/056 , H05K1/16 , H05K1/189 , H05K3/0058 , H05K3/4611 , H05K3/4691 , H05K2201/0317 , H05K2201/09036 , H05K2201/0999 , H05K2201/10037 , H05K2201/10083 , H01L2924/00
摘要： A circuit substrate has a flexible thin film, electric wires supported on the film, and an electronic component supported on the film and positioned between the wires so that the wires and the component are electrically connected serially. Also, a thickness of the component is less than that of the electric wires.
摘要翻译：电路基板具有柔性薄膜，支撑在薄膜上的电线以及支撑在薄膜上并定位在导线之间的电子部件，使得导线和部件串联电连接。此外，部件的厚度小于电线的厚度。

5. 发明授权

US09219214B2 Thermoelectric conversion element and producing method thereof 有权
标题翻译：热电转换元件及其制造方法
公开(公告)号：US09219214B2
公开(公告)日：2015-12-22
申请号：US13978221
申请日：2012-01-23
申请人： Kaori Toyoda , Takaaki Higashida , Yoshihisa Ohido , Takashi Kubo
发明人： Kaori Toyoda , Takaaki Higashida , Yoshihisa Ohido , Takashi Kubo
IPC分类号： H01L35/04 , H01L35/32 , H01L35/16 , H01L35/34
CPC分类号： H01L35/04 , H01L35/16 , H01L35/32 , H01L35/34
摘要： The invention provides a thermoelectric conversion element having a lot of pn junction pairs per unit area and having a thermoelectric material chip which is hardly broken, and a producing method thereof. In the thermoelectric conversion element of the invention, plural substrates in each of which a film-shaped thermoelectric material is formed in a surface thereof are disposed. As a result, because the number of pn junction pairs per unit area is increased, a high output can be obtained. Because the thermoelectric material is formed into the film shape, reliability degradation caused by a breakage of the thermoelectric material can be prevented, even in the thermoelectric material having many pn junction pairs per unit area, namely, a sectional area is small.
摘要翻译：本发明提供一种热电转换元件及其制造方法，该热电转换元件每单位面积具有大量pn结对，并且具有几乎不破损的热电材料芯片。在本发明的热电转换元件中，设置有在其表面形成有膜状的热电材料的多个基板。结果，由于每单位面积的pn结对的数量增加，所以可以获得高的输出。由于热电材料形成为膜状，所以即使在每单位面积具有多个pn结对的热电材料即截面积小的情况下，也能够防止热电材料破损引起的可靠性降低。

6. 发明申请

US20120228602A1 ORGANIC EL DEVICE AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：有机EL器件及其制造方法
公开(公告)号：US20120228602A1
公开(公告)日：2012-09-13
申请号：US13510413
申请日：2010-11-09
申请人： Shuhei Nakatani , Takaaki Higashida
发明人： Shuhei Nakatani , Takaaki Higashida
IPC分类号： H01L51/52 , H01L51/56
CPC分类号： H01L51/5088 , H01L27/3246 , H01L2227/323 , H01L2251/5315 , H01L2251/568
摘要： Disclosed is an organic EL device which comprises: a pixel electrode that is arranged on a substrate; a hole injection layer that is arranged on the pixel electrode and has a photocatalytic function; an organic functional layer that is formed on the hole injection layer by a coating method; a bank made of a fluorine-containing resin and defines the region where the organic functional layer is arranged; and a counter electrode that is arranged so as to cover the bank and the organic functional layer. Due to the photocatalytic function of the hole injection layer, the bank residuals can be removed by low-energy ultraviolet light that has a longer wavelength (300-400 nm) than conventional high-energy ultraviolet light that has a short wavelength (254 nm or 172 nm).
摘要翻译：公开了一种有机EL器件，其包括：设置在基板上的像素电极; 空穴注入层，其设置在像素电极上并具有光催化功能; 通过涂布法在空穴注入层上形成的有机功能层; 由含氟树脂制成的堤，限定了布置有机功能层的区域; 以及布置成覆盖堤和有机功能层的对电极。由于空穴注入层的光催化功能，可以通过具有比具有短波长的常规高能紫外光（254nm或更小）的较长波长（300-400nm）的低能量紫外光去除堤残余物 172nm）。

7. 发明授权

US07036221B2 Method of manufacturing a semiconductor element-mounting board 失效
标题翻译：制造半导体元件安装板的方法
公开(公告)号：US07036221B2
公开(公告)日：2006-05-02
申请号：US10781759
申请日：2004-02-20
申请人： Takaaki Higashida , Koichi Kumagai , Takahiro Matsuo
发明人： Takaaki Higashida , Koichi Kumagai , Takahiro Matsuo
IPC分类号： H01K3/22
CPC分类号： H01L21/486 , H01L23/49827 , H01L2224/05567 , H01L2224/05573 , H01L2224/05624 , H01L2224/16 , H01L2224/73204 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15311 , Y10T29/49128 , Y10T29/49146 , Y10T29/49156 , Y10T29/49158 , H01L2924/00014
摘要： A method of manufacturing a semiconductor mounting board includes providing a base member and linear conductive members formed of metallic wires. The conductive members are constructed so that they extend linearly between a semiconductor element-mounting face and a circuit board-mounting face of a base member, and are integrally molded within the base member. For this purpose, a resin material for forming the base member is injected into a mold wherein the conductive members are linearly arranged beforehand.
摘要翻译：一种半导体安装板的制造方法，其特征在于，具备由金属线构成的基材和线状的导电性构件。导电构件被构造成使得它们在半导体元件安装面和基底构件的电路板安装面之间线性地延伸，并且一体地模制在基底构件内。为此，将用于形成基材的树脂材料注射到其中导电构件预先线性排列的模具中。

8. 发明授权

US06875378B1 Optical disk molding apparatus and method 失效
标题翻译：光盘成型装置及方法
公开(公告)号：US06875378B1
公开(公告)日：2005-04-05
申请号：US09936164
申请日：2000-03-10
申请人： Takaaki Higashida , Shinji Kadoriku , Hiroshi Yutani , Yoshio Maruyama , Tokiharu Nakagawa , Kazuo Inoue , Yoshihiro Kawasaki
发明人： Takaaki Higashida , Shinji Kadoriku , Hiroshi Yutani , Yoshio Maruyama , Tokiharu Nakagawa , Kazuo Inoue , Yoshihiro Kawasaki
IPC分类号： B29C45/26 , B29D17/00 , B28B13/06 , B29C45/40 , B29C45/43 , G11B7/26
CPC分类号： B29C45/263 , B29C45/43 , Y10S425/102
摘要： An optical disk molding apparatus and method are provided which prevent data formed on a molded object from being damaged and prevent quality deterioration of the molded object. There are provided a mold moving device, a first gas supply device, and a controller, whereby a first release space part is formed by opening molds from a mold clamp state by a movement distance not damaging a data transferred face of the optical disk, and a gas is supplied to the first release space part at a point in time when the first release space part is formed, thereby totally separating the optical disk and a stamper from each other. No damage is caused to a data transferred face at the point in time when the first release space part is formed. Since separation between the optical disk and the stamper is performed via pressure of the gas after the first release space part is formed, data is prevented from being damaged over the data transferred face of the optical disk in its entirety.
摘要翻译：提供了一种防止模制物体上形成的数据被损坏并防止模制品的质量恶化的光盘成型装置和方法。提供了一种模具移动装置，第一气体供应装置和控制器，由此通过以下方式形成第一释放空间部分：通过以不影响光盘的数据传送面的移动距离从模具夹紧状态打开模具，以及在形成第一释放空间部分的时间点向第一释放空间部分供应气体，从而将光盘和压模完全分离。在形成第一释放空间部分的时间点对数据传送面没有造成伤害。由于在形成第一释放空间部分之后通过气体的压力在光盘和压模之间进行分离，所以防止数据在光盘的数据传送面全部被损坏。

9. 发明授权

US08414960B2 Ink composition for organic electroluminescent device and production method thereof 有权
标题翻译：有机电致发光器件的油墨组合物及其制备方法
公开(公告)号：US08414960B2
公开(公告)日：2013-04-09
申请号：US12412418
申请日：2009-03-27
申请人： Takaaki Higashida , Kazuhiro Nishikawa
发明人： Takaaki Higashida , Kazuhiro Nishikawa
IPC分类号： B05D5/06
CPC分类号： C09D11/50
摘要： A production method of an ink composition for organic EL devices comprises preparing a composition containing a polymer organic EL material and an organic solvent; and applying an electric field to the composition. Preferably, a composition containing a polymer organic EL material prepared by a coupling reaction between a halogenated aromatic compound and an aromatic boron compound in the presence of palladium catalyst or nickel catalyst, an organic solvent, and an aromatic carboxylic acid contained in an amount of 0.01-1 wt % based on the total amount of the organic solvent and aromatic carboxylic acid is prepared.
摘要翻译：用于有机EL器件的油墨组合物的制备方法包括制备含有聚合物有机EL材料和有机溶剂的组合物; 以及向组合物施加电场。优选地，在钯催化剂或镍催化剂，有机溶剂和芳族羧酸的存在下，通过卤代芳族化合物和芳族硼化合物之间的偶联反应制备的含有聚合物有机EL材料的组合物，其含量为0.01 基于有机溶剂和芳族羧酸的总量制备-1重量％。

10. 发明授权

US08237359B2 Display apparatus 有权
标题翻译：显示装置
公开(公告)号：US08237359B2
公开(公告)日：2012-08-07
申请号：US12490673
申请日：2009-06-24
申请人： Takaaki Higashida , Yoshie Iwane , Hisao Nagai , Kazuhiro Nishikawa , Hiroshi Hayata
发明人： Takaaki Higashida , Yoshie Iwane , Hisao Nagai , Kazuhiro Nishikawa , Hiroshi Hayata
IPC分类号： H01J1/62
CPC分类号： H01L27/3253 , G09G3/3225 , G09G2300/023 , G09G2300/0426 , G09G2300/0443 , G09G2300/0452 , H01L27/3211
摘要： There is provided a display apparatus configured by stacking a drive circuit substrate and a light-emitting substrate. Electrodes of the substrates are accurately aligned to be electrically connected to each other. A display apparatus is configured by stacking a drive circuit substrate having a drive circuit and a light-emitting substrate having a light-emitting unit including a pixel electrode to cause the drive circuit substrate and the light-emitting substrate to face each other, wherein on a stacked plane between the drive circuit substrate and the light-emitting substrate, an intermediate electrode connected to the light-emitting unit of the light-emitting substrate and a connection electrode connected to the drive circuit and the drive circuit substrate are electrically connected to each other, and the intermediate electrode is elongated in a direction parallel to or perpendicular to a longitudinal direction of the pixel electrode on the stacked plane.
摘要翻译：提供了一种通过堆叠驱动电路基板和发光基板而构成的显示装置。基板的电极被精确对准以彼此电连接。显示装置通过堆叠具有驱动电路的驱动电路基板和具有包括像素电极的发光单元的发光基板来使驱动电路基板和发光基板彼此面对，其中，在驱动电路基板和发光基板之间的层叠平面，连接到发光基板的发光单元的中间电极和连接到驱动电路和驱动电路基板的连接电极电连接到每个另一方面，并且中间电极在与堆叠平面上的像素电极的纵向方向平行或垂直的方向上伸长。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式