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1. 发明申请

US20050106042A1 Elastic member for vibration absorption, and refrigerator using the same 审中-公开
标题翻译：用于振动的弹性构件和使用其的冰箱
公开(公告)号：US20050106042A1
公开(公告)日：2005-05-19
申请号：US10936520
申请日：2004-09-09
申请人： Tae Lee , Young Yun , Yong Kim , Dong Lee
发明人： Tae Lee , Young Yun , Yong Kim , Dong Lee
IPC分类号： F04B39/00 , F25D19/00 , F04B23/00
CPC分类号： F04B39/0044
摘要： Disclosed is an elastic member for absorbing vibration with an improved vibration absorbing performance through an improved structure, the elastic member including an hollow shape seating part with a hollow shape, the hollow shape seating part seating the driving device such as a compressor thereon and having an axial direction supporting part supporting compressive load of the driving device, and a hollow shape base having an average radius different from that of the axial direction supporting part supporting the compressive load of the driving device.
摘要翻译：公开了一种弹性构件，其通过改进的结构吸收具有改善的振动吸收性能的振动，弹性构件包括具有中空形状的中空形座部件，中空形座部件将诸如压缩机的驱动装置安置在其上，并具有支撑驱动装置的压缩载荷的轴向支撑部分，以及平均半径不同于支撑驱动装置的压缩载荷的轴向支撑部分的中空形基部。

2. 发明申请

US20060145187A1 Gallium nitride semiconductor and method of manufacturing the same 有权
标题翻译：氮化镓半导体及其制造方法
公开(公告)号：US20060145187A1
公开(公告)日：2006-07-06
申请号：US11302957
申请日：2005-12-13
申请人： Yong Kim , Dong Lee
发明人： Yong Kim , Dong Lee
IPC分类号： H01L31/109 , H01L29/12
CPC分类号： C30B29/406 , H01L21/02381 , H01L21/0243 , H01L21/02439 , H01L21/0254 , H01L21/02658
摘要： The present invention provides to a gallium nitride (GaN) semiconductor and a method of manufacturing the same, capable of reducing crystal defects caused by a difference in lattice parameters, and minimizing internal residual stress. In particular, since a high-quality GaN thin film is formed on a silicon wafer, manufacturing costs can be reduced by securing high-quality wafers with a large diameter at a low price, and applicability to a variety of devices and circuit can also be improved.
摘要翻译：本发明提供一种氮化镓（GaN）半导体及其制造方法，其能够减少由晶格参数的差异引起的晶体缺陷，并使内部残余应力最小化。特别地，由于在硅晶片上形成高质量的GaN薄膜，所以可以通过以较低的价格确保大直径的高品质晶片来降低制造成本，并且适用于各种器件和电路也可以改进。

3. 发明申请

US20050104123A1 High voltage transistor 有权
标题翻译：高压晶体管
公开(公告)号：US20050104123A1
公开(公告)日：2005-05-19
申请号：US10878273
申请日：2004-06-28
申请人： Yong Kim , Dong Lee , Hee Chang
发明人： Yong Kim , Dong Lee , Hee Chang
IPC分类号： H01L21/8247 , H01L27/105 , H01L27/115 , H01L29/78 , H01L29/788 , H01L29/792 , H01L29/94 , H01L31/072
CPC分类号： H01L29/7833 , H01L27/105
摘要： Provided is a high voltage transistor in a flash memory device comprising: a source/drain junction of a DDD structure consisting of a high-concentration impurity region and a low-concentration impurity region surrounding the high-concentration impurity region, the high-concentration impurity region being formed in parallel with a gate electrode at a distance spaced by a location in which a contact hole is formed, and having a rectangular shape whose width is the same as or wider than that of the contact hole and whose length is the same as or narrower than that of an active region through which the gate electrode passes. Accordingly, a current density to pass the gate electrode neighboring the contact hole portion and a current density to pass the gate electrode at a portion where the contact hole cannot be formed become uniform. A uniform and constant saturation current can be obtained regardless of the number of the contact hole.
摘要翻译：提供一种闪速存储器件中的高压晶体管，包括：由高浓度杂质区域和围绕高浓度杂质区域的低浓度杂质区域构成的DDD结构的源极/漏极结，高浓度杂质区域与栅电极平行地形成在与形成接触孔的位置隔开的距离处，并且具有与接触孔的宽度相同或更宽的矩形形状，并且其长度与或比栅电极通过的有源区的窄。因此，与接触孔部相邻的栅电极的电流密度以及在不能形成接触孔的部分通过栅电极的电流密度变得均匀。无论接触孔的数量如何，都可以获得均匀和恒定的饱和电流。

4. 发明申请

US20080080165A1 Surface light source device using light emitting diodes 有权
标题翻译：使用发光二极管的表面光源装置
公开(公告)号：US20080080165A1
公开(公告)日：2008-04-03
申请号：US11896818
申请日：2007-09-06
申请人： Yong Kim , Min Lee , Dong Lee
发明人： Yong Kim , Min Lee , Dong Lee
IPC分类号： F21V9/16
CPC分类号： F21V3/04 , C09K11/7734 , C09K11/7737 , C09K11/7794 , F21V9/30 , F21Y2115/10 , G02B5/20
摘要： A surface light source device using light emitting diodes, the device including: a housing having a top opening to emit light; a light emitting diode board disposed on an inner bottom surface of the housing, the board on which a plurality of light emitting diodes are arranged; and a color conversion laminate formed by depositing a plurality of phosphor-mixed resin layers containing phosphors, the layers disposed at a top of the opening of the housing and providing light having different wavelengths.
摘要翻译：一种使用发光二极管的表面光源装置，该装置包括：壳体，其具有用于发光的顶部开口; 设置在所述壳体的内底面上的发光二极管板，配置有多个发光二极管的基板; 以及通过沉积包含荧光体的多个荧光体混合树脂层形成的颜色转换层压体，所述荧光体混合树脂层设置在壳体的开口的顶部并提供具有不同波长的光。

5. 发明申请

US20070155033A1 Method of manufacturing light emitting diode package 审中-公开
标题翻译：制造发光二极管封装的方法
公开(公告)号：US20070155033A1
公开(公告)日：2007-07-05
申请号：US11649914
申请日：2007-01-05
申请人： Yong Kim , Seog Choi , Yong Kim , Sang Shin
发明人： Yong Kim , Seog Choi , Yong Kim , Sang Shin
IPC分类号： H01L21/00
CPC分类号： B29C41/12 , B29C41/20 , B29C41/36 , B29C41/50 , B29L2011/00 , H01L33/52 , H01L2224/48091 , H01L2924/00014
摘要： A method of manufacturing an LED package. The method includes dispensing a transparent resilient resin on an LED package body and overturning an entire structure to form an LED lens integrally provided to the LED package body. This prevents extra processes and costs incurring from forming intermediate layers and obviates degradation in reliability and light extraction efficiency due to additional interfaces.
摘要翻译：一种制造LED封装的方法。该方法包括将透明弹性树脂分配在LED封装主体上并翻转整个结构以形成一体地提供到LED封装体的LED透镜。这防止了由于附加界面而形成中间层而导致额外的工艺和成本，并且消除了可靠性和光提取效率的降低。

6. 发明申请

US20060121815A1 Method of manufacturing barrier ribs for pdp by capillary molding of paste and paste compositions therefor 失效
标题翻译：通过毛细管成型用于制造pdp隔壁的糊剂和糊剂组合物的方法
公开(公告)号：US20060121815A1
公开(公告)日：2006-06-08
申请号：US10521196
申请日：2003-07-15
申请人： Yong Kim , Yong Kim , Sung Cho
发明人： Yong Kim , Yong Kim , Sung Cho
IPC分类号： H01J9/24
CPC分类号： H01J9/242 , H01J11/12 , H01J11/36
摘要： Disclosed is a method of manufacturing rear plate barrier ribs for Plasma Display Panel (PDP), which includes the steps of: forming barrier ribs by infiltrating the barrier rib forming paste into grooves of a mold by using the capillary phenomenon, and then sintering the paste. This method causes rare environmental pollution, enables to make barrier ribs having fine and complex shapes and reduces material costs required for the barrier rib. Thus, the method may improve quality of PDP and reduce manufacture costs of the rear plate.
摘要翻译：公开了一种制造等离子体显示面板（PDP）的后板阻挡肋的方法，其包括以下步骤：通过使用毛细管现象将隔壁形成膏渗透到模具的凹槽中，然后烧结浆料。这种方法造成罕见的环境污染，能够形成具有精细和复杂形状的隔肋，并且减少隔壁所需的材料成本。因此，该方法可以提高PDP的质量并降低后板的制造成本。

7. 发明申请

US20070063214A1 Light emitting diode package and method for manufacturing the same 审中-公开
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US20070063214A1
公开(公告)日：2007-03-22
申请号：US11524278
申请日：2006-09-21
申请人： Yong Kim , Seog Choi , Chang Lim , Yong Kim
发明人： Yong Kim , Seog Choi , Chang Lim , Yong Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/507 , H01L33/58
摘要： The invention relates to a light emitting diode package that can prevent deterioration of phosphor and a method of manufacturing the same. The light emitting diode package includes a package body having a recessed part, a light emitting diode chip mounted on a floor surface of the recessed part and a lens structure disposed on an upper surface of the package body, apart from the light emitting diode chip. Phosphor is dispersed in at least a part of the lens structure.
摘要翻译：本发明涉及能够防止荧光体劣化的发光二极管封装及其制造方法。发光二极管封装包括具有凹部的封装主体，安装在凹部的地板表面上的发光二极管芯片和设置在封装体的上表面上的透镜结构，与发光二极管芯片分开。荧光体分散在透镜结构的至少一部分中。

8. 发明申请

US20050156522A1 Method of manufacturing barrier ribs for pdp by etching of thick film using water-based solution and compositions therefor 审中-公开
标题翻译：通过使用水溶液蚀刻厚膜及其组合物来制造pdp隔壁的方法
公开(公告)号：US20050156522A1
公开(公告)日：2005-07-21
申请号：US10510036
申请日：2002-04-08
申请人： Yong Kim , Jin Hwang , Yong Kim
发明人： Yong Kim , Jin Hwang , Yong Kim
IPC分类号： H01J9/24 , H01J11/12 , H01J11/36 , H01J17/49
CPC分类号： H01J9/242 , H01J11/12 , H01J11/36 , H01J2211/366
摘要： Disclosed is a method of manufacturing barrier ribs for a Plasma Display Panel (PDP), which includes the steps of forming a thick film (or, “green tape”) for barrier ribs on a glass or metal substrate by using composition for forming the barrier ribs, which contains water soluble components and solvent soluble components together a binder; forming a protective pattern film partially soluble or insoluble to the water based solution on the thick film; etching the thick film into a barrier rib shape by using solution or mixed solution containing ceramic powder as an etching accelerator, and sintering the etched thick film. This method causes rare environmental pollution, enables to make barrier ribs having fine and complex shapes and reduces material costs required for the barrier rib. Thus, the method may improve quality of DPD and reduce manufacture costs of the rear plate.
摘要翻译：公开了一种制造用于等离子体显示面板（PDP）的隔壁的方法，其包括以下步骤：通过使用用于形成屏障的组合物在玻璃或金属基板上形成用于隔壁的厚膜（或“生胶条”）肋骨，其含有水溶性成分和溶剂可溶性成分在一起的粘合剂; 在厚膜上形成部分溶解或不溶于水基溶液的保护性图案膜; 通过使用含有陶瓷粉末作为蚀刻加速剂的溶液或混合溶液将厚膜蚀刻成隔壁形状，并烧结蚀刻的厚膜。这种方法造成罕见的环境污染，能够形成具有精细和复杂形状的隔肋，并且减少隔壁所需的材料成本。因此，该方法可以提高DPD的质量并降低后板的制造成本。

9. 发明申请

US20060270078A1 Method of fabricating light emitting diode package 有权
标题翻译：制造发光二极管封装的方法
公开(公告)号：US20060270078A1
公开(公告)日：2006-11-30
申请号：US11439189
申请日：2006-05-24
申请人： Yong Kim , Seog Choi , Hyoung Kim , Yong Kim
发明人： Yong Kim , Seog Choi , Hyoung Kim , Yong Kim
IPC分类号： H01L21/00
CPC分类号： H01L33/52 , H01L2224/48091 , H01L2224/48227 , Y10S438/974 , H01L2924/00014
摘要： The invention relates to an LED package and proposes a method of fabricating an LED package including steps of providing a package substrate having a mounting area of an LED and a metal pattern to be connected with the LED, and plasma-treating the package substrate to reform at least a predetermined surface area of the package substrate where a resin-molded part will be formed. The method also includes mounting the LED on the mounting area on the substrate package and electrically connecting the LED with the metal pattern, and forming the resin-molded part in the mounting area of the LED to seal the LED package.
摘要翻译：本发明涉及一种LED封装，并提出了一种制造LED封装的方法，包括以下步骤：提供具有LED的安装区域和与LED连接的金属图案的封装基板，以及等离子体处理封装基板以改造至少形成将形成树脂成型部件的封装基板的预定表面积。该方法还包括将LED安装在基板封装上的安装区域上，并将LED与金属图形电连接，并在LED的安装区域中形成树脂模制部件以密封LED封装。

10. 发明申请

US20050233763A1 Dual connection device for memory mediums and mobile communication terminals with the same 有权
标题翻译：用于存储介质的双连接设备和具有相同功能的移动通信终端
公开(公告)号：US20050233763A1
公开(公告)日：2005-10-20
申请号：US11050802
申请日：2005-02-07
申请人： Yong Kim , Yong Kim
发明人： Yong Kim , Yong Kim
IPC分类号： H04B1/38 , G06K7/00 , H04M1/00 , H04M1/02
CPC分类号： H04B1/3816 , G06K7/0021 , G06K7/0034 , H04M1/026
摘要： A dual connection device for memory mediums has a body portion electrically connected with a mobile communication terminal, a first receiving portion formed to the body portion for receiving therein a first memory medium, a second receiving portion formed to the body portion as to be arranged piled up to the first receiving portion for receiving therein a second memory medium, a first connection terminal installed in the first receiving portion so as to be electrically connected with a terminal of the first memory medium, and a second connection terminal installed in the second receiving portion so as to be electrically connected with a terminal of the second memory medium. Since a plurality of memory mediums are connected with a terminal mobile communication terminal by the connection device, it is possible to make the mobile communication terminal have a slim and compact size, accomplish a simplified assembly process, and obtain increased productivity and cost reduction due to simplification of assembly process.
摘要翻译：用于存储介质的双连接装置具有与移动通信终端电连接的主体部分，形成在主体部分上用于在其中容纳第一存储介质的第一接收部分，形成在主体部分上的第二接收部分，以布置成堆直到第一接收部分用于在其中接收第二存储介质;第一连接端子，安装在第一接收部分中以便与第一存储介质的端子电连接，第二连接端子安装在第二接收部分中以便与第二存储介质的端子电连接。由于多个存储介质通过连接装置与终端移动通信终端连接，所以可以使移动通信终端具有纤细且紧凑的尺寸，实现简化的组装过程，并且由于装配过程简化。

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