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1. 发明申请

US20050106042A1 Elastic member for vibration absorption, and refrigerator using the same 审中-公开
标题翻译：用于振动的弹性构件和使用其的冰箱
公开(公告)号：US20050106042A1
公开(公告)日：2005-05-19
申请号：US10936520
申请日：2004-09-09
申请人： Tae Lee , Young Yun , Yong Kim , Dong Lee
发明人： Tae Lee , Young Yun , Yong Kim , Dong Lee
IPC分类号： F04B39/00 , F25D19/00 , F04B23/00
CPC分类号： F04B39/0044
摘要： Disclosed is an elastic member for absorbing vibration with an improved vibration absorbing performance through an improved structure, the elastic member including an hollow shape seating part with a hollow shape, the hollow shape seating part seating the driving device such as a compressor thereon and having an axial direction supporting part supporting compressive load of the driving device, and a hollow shape base having an average radius different from that of the axial direction supporting part supporting the compressive load of the driving device.
摘要翻译：公开了一种弹性构件，其通过改进的结构吸收具有改善的振动吸收性能的振动，弹性构件包括具有中空形状的中空形座部件，中空形座部件将诸如压缩机的驱动装置安置在其上，并具有支撑驱动装置的压缩载荷的轴向支撑部分，以及平均半径不同于支撑驱动装置的压缩载荷的轴向支撑部分的中空形基部。

2. 发明申请

US20050217307A1 Refrigerator 有权
标题翻译：冰箱
公开(公告)号：US20050217307A1
公开(公告)日：2005-10-06
申请号：US10815700
申请日：2004-04-02
申请人： Moo Kim , Sang Seo , Dong Lee , Young Yun
发明人： Moo Kim , Sang Seo , Dong Lee , Young Yun
IPC分类号： A47F3/04 , F25D11/02 , F25D17/04 , F25D17/06 , F25D23/06
CPC分类号： F25D23/061 , F25D17/045 , F25D17/065 , F25D2317/063 , F25D2317/0664 , F25D2317/067 , F25D2317/0672 , F25D2400/06
摘要： Disclosed is a refrigerator with a freezing chamber and a cooling chamber, in which an evaporating unit is provided in a means for partitioning between the freezing chamber and the cooling chamber. The refrigerator comprises of freezing and cooling chambers, each of the freezing and cooling chambers being provided with at least one received space; an evaporator; and a means for transmitting and controlling a cooling air heat-exchanged with the evaporator toward at least one place in the freezing and cooling chambers, wherein a means for partitioning the freezing and cooling chambers from each other has a predetermined space therein, the predetermined space is provided with the evaporator and at least one means for transmitting and controlling the cooling air.
摘要翻译：公开了一种具有冷冻室和冷却室的冰箱，其中在用于在冷冻室和冷却室之间分配的装置中设置有蒸发单元。冰箱包括冷冻室和冷却室，每个冷冻室和冷却室设有至少一个接收空间; 蒸发器; 以及用于将与蒸发器热交换的冷却空气朝向冷冻和冷却室中的至少一个位置传送和控制的装置，其中用于将冷冻室和冷却室彼此分隔的装置在其中具有预定空间，预定空间设置有蒸发器和至少一个用于传送和控制冷却空气的装置。

3. 发明授权

US09546811B2 Indicating device and refrigerator having the same 有权
标题翻译：指示装置和冰箱具有相同的功能
公开(公告)号：US09546811B2
公开(公告)日：2017-01-17
申请号：US13613875
申请日：2012-09-13
申请人： Myung Ju Lee , Young Yun , Sung Cheol Kang
发明人： Myung Ju Lee , Young Yun , Sung Cheol Kang
IPC分类号： F25B49/00 , F25D29/00
CPC分类号： F25D29/00 , F25D2400/361 , F25D2500/06 , F25D2700/00 , F25D2700/08 , F25D2700/16
摘要： Disclosed herein is a refrigerator capable of varying a storage condition for food in accordance with a state of the food, thereby storing the food in a fresher state for a prolonged period of time. The refrigerator includes an indicating device to measure a state of food. The indicating device is provided to be portable, separately from a refrigerator body. The indicating device includes a measurement terminal, which come into contact with food, only when contact is needed. The refrigerator also includes an input unit to receive data about a state of food, a determination unit to determine a storage condition for the food, based on the input food state data, and a controller to control driving of the cooling device, based on the determined food storage condition. The indicating device includes a measurement unit to obtain food state data, and a display to display the food state data.
摘要翻译：本文公开了一种能够根据食品的状态改变食物的储存条件的冰箱，从而将食物更长时间地储存在更新鲜的状态。冰箱包括用于测量食物状态的指示装置。指示装置被设置为便携式，与冰箱主体分离。指示装置仅在需要接触时包括与食物接触的测量端子。冰箱还包括输入单元，用于接收关于食物状态的数据，确定单元，用于基于所输入的食物状态数据来确定食物的储存条件;以及控制器，用于基于所述输入食物状态数据来控制所述冷却装置的驱动确定食物储存条件。指示装置包括获取食物状态数据的测量单元和显示食物状态数据的显示器。

4. 发明授权

US08399301B2 Mounting structures for integrated circuit modules 有权
标题翻译：集成电路模块的安装结构
公开(公告)号：US08399301B2
公开(公告)日：2013-03-19
申请号：US13064081
申请日：2011-03-04
申请人： Sung-Joo Park , Ki-Hyun Ko , Young Yun , Soo-Kyung Kim
发明人： Sung-Joo Park , Ki-Hyun Ko , Young Yun , Soo-Kyung Kim
IPC分类号： H01L21/02
CPC分类号： H05K1/0246 , H01L2924/0002 , H05K1/181 , H05K2201/10022 , H05K2201/10159 , H05K2201/10522 , H01L2924/00
摘要： A structure of an integrated circuit module includes a wiring board, a plurality of integrated circuits and at least one terminating resistance circuit. The wiring board has a mounting region on at least one surface thereof. The plurality of integrated circuits are mounted in the mounting region of the wiring board and spaced from one another in a first direction. The at least one terminating resistance circuit is arranged between at least two adjacent integrated circuits, and coupled to an output of a last of the plurality of integrated circuits.
摘要翻译：集成电路模块的结构包括布线板，多个集成电路和至少一个终端电阻电路。布线板在其至少一个表面上具有安装区域。多个集成电路安装在布线板的安装区域中并沿第一方向彼此间隔开。至少一个终端电阻电路被布置在至少两个相邻的集成电路之间，并且耦合到多个集成电路的最后一个的输出端。

5. 发明授权

US07738277B2 Semiconductor memory device, memory device support and memory module 有权
标题翻译：半导体存储器件，存储器件支持和存储器模块
公开(公告)号：US07738277B2
公开(公告)日：2010-06-15
申请号：US11905675
申请日：2007-10-03
申请人： Sungjoo Park , Ki-Hyun Ko , Young Yun , Sookyung Kim
发明人： Sungjoo Park , Ki-Hyun Ko , Young Yun , Sookyung Kim
IPC分类号： G11C5/06
CPC分类号： H01L25/0657 , G11C5/04 , H01L2225/06513 , H01L2225/06541 , H01L2924/0002 , H01L2924/00
摘要： In one embodiment, the semiconductor memory device includes at least a first semiconductor memory die, and a surface of the semiconductor memory device includes a plurality of connectors. At least one of the plurality of connectors is electrically connected to the first semiconductor memory die. The plurality of connectors include at least first and second control signal connectors. The first control signal connector is for a first control signal of a first type, the second control signal connector is for a second control signal of the first type, and the first and second control signal connectors are disposed in different areas of the surface. For example, the first type may be a chip select signal, a clock enable signal, or an on die termination enable signal.
摘要翻译：在一个实施例中，半导体存储器件至少包括第一半导体存储器管芯，并且半导体存储器件的表面包括多个连接器。多个连接器中的至少一个电连接到第一半导体存储器管芯。多个连接器包括至少第一和第二控制信号连接器。第一控制信号连接器用于第一类型的第一控制信号，第二控制信号连接器用于第一类型的第二控制信号，并且第一和第二控制信号连接器设置在表面的不同区域中。例如，第一类型可以是芯片选择信号，时钟使能信号或芯片上终止使能信号。

6. 发明申请

US20060251001A1 Rate matching method in mobile communication system 有权
公开(公告)号：US20060251001A1
公开(公告)日：2006-11-09
申请号：US11404175
申请日：2006-04-13
申请人： Young Yun , Ki Kim , Sung Kwon , Young Lee , Sung Hong
发明人： Young Yun , Ki Kim , Sung Kwon , Young Lee , Sung Hong
IPC分类号： H04J3/08 , H04B7/14
CPC分类号： H04L1/0071 , H03M13/11 , H03M13/271 , H03M13/2792 , H03M13/2903 , H03M13/2957 , H03M13/6362 , H03M13/6368 , H03M13/6375 , H03M13/6381 , H03M13/6508 , H04L1/0041 , H04L1/0066 , H04L1/0069 , H04L1/08 , H04W88/181
摘要： A rate matching method is provided for a mobile communication system that performs an adjustment to a code rate based on an optimal level by puncturing or repetition to respective bit streams of transport channels. The rate matching method is preferably applicable to uplink and downlink rate matching for channel coding including turbo coding, convolutional coding and the like. The rate matching method for uplink can include executing coding for bits of a transport channel, and branching off the bits into a plurality of sequences, constructing a first interleaving pattern for the plurality of sequences, constructing a virtual interleaving pattern for at least one sequence based on a mapping rule with a corresponding first interleaving pattern and calculating different bit shifting values in each column of each virtual interleaving pattern. Then, a bit position to be punctured is determined in each constructed virtual interleaving pattern using the calculated bit shifting values.

7. 发明申请

US20050108615A1 Transmission power control apparatus in wireless communication system and method therefor 有权
标题翻译：无线通信系统中的发射功率控制装置及其方法
公开(公告)号：US20050108615A1
公开(公告)日：2005-05-19
申请号：US10987869
申请日：2004-11-12
申请人： Jong An , Ki Kim , Young Yun , Soon Kwon , Chan Kyung , Suk Yoon
发明人： Jong An , Ki Kim , Young Yun , Soon Kwon , Chan Kyung , Suk Yoon
IPC分类号： H04B7/26 , H04B7/005 , H03M13/00
CPC分类号： H04W52/16 , H04W52/50
摘要： The present invention provides an apparatus and method for controlling transmission powers of R-CQICH (reverse-channel quality indicator channel) and R-ACKCH (reverse-acknowledgment channel) independently. The present invention includes the steps of receiving a first parameter corresponding to the R-CQICH and a second parameter corresponding to the R-ACKCH from a base station via an overhead message and independently determining transmission powers of the R-CQICH and the R-ACKCH using the first and second parameters.
摘要翻译：本发明提供了独立地控制R-CQICH（反向信道质量指示信道）和R-ACKCH（反向确认信道）的发射功率的装置和方法。本发明包括以下步骤：经由开销消息从基站接收对应于R-CQICH的第一参数和对应于R-ACKCH的第二参数，并独立地确定R-CQICH和R-ACKCH的发送功率使用第一和第二参数。

8. 发明申请

US20110165736A1 Mounting structures for integrated circuit modules 有权
标题翻译：集成电路模块的安装结构
公开(公告)号：US20110165736A1
公开(公告)日：2011-07-07
申请号：US13064081
申请日：2011-03-04
申请人： Sung-Joo Park , Ki-Hyun Ko , Young Yun , Soo-Kyung Kim
发明人： Sung-Joo Park , Ki-Hyun Ko , Young Yun , Soo-Kyung Kim
IPC分类号： H01L21/50
CPC分类号： H05K1/0246 , H01L2924/0002 , H05K1/181 , H05K2201/10022 , H05K2201/10159 , H05K2201/10522 , H01L2924/00
摘要： A structure of an integrated circuit module includes a wiring board, a plurality of integrated circuits and at least one terminating resistance circuit. The wiring board has a mounting region on at least one surface thereof. The plurality of integrated circuits are mounted in the mounting region of the wiring board and spaced from one another in a first direction. The at least one terminating resistance circuit is arranged between at least two adjacent integrated circuits, and coupled to an output of a last of the plurality of integrated circuits.
摘要翻译：集成电路模块的结构包括布线板，多个集成电路和至少一个终端电阻电路。布线板在其至少一个表面上具有安装区域。多个集成电路安装在布线板的安装区域中并沿第一方向彼此间隔开。至少一个终端电阻电路被布置在至少两个相邻的集成电路之间，并且耦合到多个集成电路的最后一个的输出端。

9. 发明申请

US20100214814A1 SEMICONDUCTOR MEMORY DEVICE, MEMORY DEVICE SUPPORT AND MEMORY MODULE 失效
标题翻译：半导体存储器件，存储器件支持和存储器模块
公开(公告)号：US20100214814A1
公开(公告)日：2010-08-26
申请号：US12774015
申请日：2010-05-05
申请人： Sungjoo Park , Ki-Hyun Ko , Young Yun , Sookyung Kim
发明人： Sungjoo Park , Ki-Hyun Ko , Young Yun , Sookyung Kim
IPC分类号： G11C5/06
CPC分类号： H01L25/0657 , G11C5/04 , H01L2225/06513 , H01L2225/06541 , H01L2924/0002 , H01L2924/00
摘要： In one embodiment, the semiconductor memory device includes at least a first semiconductor memory die, and a surface of the semiconductor memory device includes a plurality of connectors. At least one of the plurality of connectors is electrically connected to the first semiconductor memory die. The plurality of connectors include at least first and second control signal connectors. The first control signal connector is for a first control signal of a first type, the second control signal connector is for a second control signal of the first type, and the first and second control signal connectors are disposed in different areas of the surface. For example, the first type may be a chip select signal, a clock enable signal, or an on die termination enable signal.
摘要翻译：在一个实施例中，半导体存储器件至少包括第一半导体存储器管芯，并且半导体存储器件的表面包括多个连接器。多个连接器中的至少一个电连接到第一半导体存储器管芯。多个连接器包括至少第一和第二控制信号连接器。第一控制信号连接器用于第一类型的第一控制信号，第二控制信号连接器用于第一类型的第二控制信号，并且第一和第二控制信号连接器设置在表面的不同区域中。例如，第一类型可以是芯片选择信号，时钟使能信号或芯片上终止使能信号。

10. 发明申请

US20080179649A1 Mounting structures for integrated circuit modules 有权
标题翻译：集成电路模块的安装结构
公开(公告)号：US20080179649A1
公开(公告)日：2008-07-31
申请号：US12010138
申请日：2008-01-22
申请人： Sung-Joo Park , Ki-Hyun Ko , Young Yun , Soo-Kyung Kim
发明人： Sung-Joo Park , Ki-Hyun Ko , Young Yun , Soo-Kyung Kim
IPC分类号： H01L29/94 , H01L21/00
CPC分类号： H05K1/0246 , H01L2924/0002 , H05K1/181 , H05K2201/10022 , H05K2201/10159 , H05K2201/10522 , H01L2924/00
摘要： A structure of an integrated circuit module includes a wiring board, a plurality of integrated circuits and at least one terminating resistance circuit. The wiring board has a mounting region on at least one surface thereof. The plurality of integrated circuits are mounted in the mounting region of the wiring board and spaced from one another in a first direction. The at least one terminating resistance circuit is arranged between at least two adjacent integrated circuits, and coupled to an output of a last of the plurality of integrated circuits.
摘要翻译：集成电路模块的结构包括布线板，多个集成电路和至少一个终端电阻电路。布线板在其至少一个表面上具有安装区域。多个集成电路安装在布线板的安装区域中并沿第一方向彼此间隔开。至少一个终端电阻电路被布置在至少两个相邻的集成电路之间，并且耦合到多个集成电路的最后一个的输出端。

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