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    • 1. 发明申请
    • High voltage transistor
    • 高压晶体管
    • US20050104123A1
    • 2005-05-19
    • US10878273
    • 2004-06-28
    • Yong KimDong LeeHee Chang
    • Yong KimDong LeeHee Chang
    • H01L21/8247H01L27/105H01L27/115H01L29/78H01L29/788H01L29/792H01L29/94H01L31/072
    • H01L29/7833H01L27/105
    • Provided is a high voltage transistor in a flash memory device comprising: a source/drain junction of a DDD structure consisting of a high-concentration impurity region and a low-concentration impurity region surrounding the high-concentration impurity region, the high-concentration impurity region being formed in parallel with a gate electrode at a distance spaced by a location in which a contact hole is formed, and having a rectangular shape whose width is the same as or wider than that of the contact hole and whose length is the same as or narrower than that of an active region through which the gate electrode passes. Accordingly, a current density to pass the gate electrode neighboring the contact hole portion and a current density to pass the gate electrode at a portion where the contact hole cannot be formed become uniform. A uniform and constant saturation current can be obtained regardless of the number of the contact hole.
    • 提供一种闪速存储器件中的高压晶体管,包括:由高浓度杂质区域和围绕高浓度杂质区域的低浓度杂质区域构成的DDD结构的源极/漏极结,高浓度杂质 区域与栅电极平行地形成在与形成接触孔的位置隔开的距离处,并且具有与接触孔的宽度相同或更宽的矩形形状,并且其长度与 或比栅电极通过的有源区的窄。 因此,与接触孔部相邻的栅电极的电流密度以及在不能形成接触孔的部分通过栅电极的电流密度变得均匀。 无论接触孔的数量如何,都可以获得均匀和恒定的饱和电流。
    • 2. 发明申请
    • Method of forming gate oxide layer in semiconductor device
    • 在半导体器件中形成栅氧化层的方法
    • US20050048723A1
    • 2005-03-03
    • US10880691
    • 2004-06-30
    • Min LeeHee ChangJum KimJung Ahn
    • Min LeeHee ChangJum KimJung Ahn
    • H01L21/336H01L21/316H01L21/8234H01L21/8247H01L27/088H01L27/105
    • H01L27/11526H01L21/823462H01L27/105H01L27/11534Y10S438/981
    • Provided is related to a method of forming a semiconductor device comprises steps of: providing a semiconductor substrate having a low voltage region and a high voltage region; forming a pad oxide layer and a pad nitride layer in sequence on the semiconductor substrate; removing the pad nitride layer and the pad oxide layer on the semiconductor substrate of the high voltage region, wherein a surface of the semiconductor substrate of the high voltage region is exposed and recessed; forming a sacrificial oxide layer on the surface of the semiconductor substrate of the high voltage region; removing the sacrificial layer; forming a first gate oxide layer on the surface of the semiconductor substrate of the high voltage region; removing the pad oxide layer and the pad nitride layer left on the semiconductor substrate of the low voltage region, wherein a surface of the semiconductor substrate of the low voltage region is exposed and recessed; and forming a second gate oxide layer on the first gate oxide layer and the surface of the semiconductor substrate of the low voltage region.
    • 提供一种形成半导体器件的方法,包括以下步骤:提供具有低电压区域和高电压区域的半导体衬底; 在半导体衬底上依次形成焊盘氧化物层和焊盘氮化物层; 去除高电压区域的半导体衬底上的衬垫氮化物层和衬垫氧化物层,其中高压区域的半导体衬底的表面被暴露和凹陷; 在高电压区域的半导体衬底的表面上形成牺牲氧化物层; 去除牺牲层; 在所述高电压区域的半导体衬底的表面上形成第一栅氧化层; 去除低电压区域的半导体衬底上留下的衬垫氧化物层和衬垫氮化物层,其中低电压区域的半导体衬底的表面露出并凹陷; 以及在所述第一栅极氧化物层和所述低电压区域的所述半导体衬底的表面上形成第二栅极氧化物层。