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    • 4. 发明授权
    • Electrical wiring structure, electro-optical device, and electronic apparatus
    • 电气布线结构,电光装置和电子设备
    • US07212272B2
    • 2007-05-01
    • US10782402
    • 2004-02-19
    • Kazuyoshi SakaiTadashi Watanabe
    • Kazuyoshi SakaiTadashi Watanabe
    • G02F1/1345
    • G02F1/136286G02F1/1345G02F2001/13629
    • An electro-optical device and an electronic apparatus are provided with reduced wiring resistance. A second wiring pattern for connecting an upper wiring connected to a mounting terminal to a first inter-substrate conducting terminal includes a base electrode. An inorganic insulating film is not attached to the sides of the base electrode. As a result, the upper wiring on each side of the base electrode and the first inter-substrate conducting terminal are electrically connected to the base electrode through the sides. The path from the mounting terminal to the first inter-substrate conducting terminal is formed in the order of upper wiring, one side of the base electrode, base electrode, the other side of the base electrode, and then the first inter-substrate conducting terminal. The second wiring pattern uses the base electrode formed of a metal film to sharply reduce wiring resistance.
    • 电光装置和电子设备具有降低的布线电阻。 用于将连接到安装端子的上部布线连接到第一基板间导电端子的第二布线图案包括基极。 无机绝缘膜不附着在基极侧。 结果,基极和第一基板间导电端子的每一侧的上部布线通过侧面电连接到基极。 从安装端子到第一基板间导电端子的路径按照上布线,基极的一侧,基底电极,基极的另一侧的顺序形成,然后形成第一基板间导电端子 。 第二布线图案使用由金属膜形成的基极电极,以显着降低布线电阻。