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1. 发明申请

US20070040206A1 High dielectric material composed of sintered body of rare earth sulfide 审中-公开
标题翻译：高介电材料由稀土硫化物烧结体组成
公开(公告)号：US20070040206A1
公开(公告)日：2007-02-22
申请号：US10550625
申请日：2004-03-22
申请人： Shinji Hirai , Toshiyuki Nishimura , Yoichiro Uemura , Shigenori Morita , Michihiro Ohta , Kazumasa Igarashi
发明人： Shinji Hirai , Toshiyuki Nishimura , Yoichiro Uemura , Shigenori Morita , Michihiro Ohta , Kazumasa Igarashi
IPC分类号： H01L29/94
CPC分类号： C04B35/547 , C04B35/64 , C04B35/645 , C04B2235/3224 , C04B2235/3227 , C04B2235/3229 , C04B2235/408 , C04B2235/446 , C04B2235/5436 , C04B2235/666 , C04B2235/762 , C04B2235/765 , H01G4/1209
摘要： A high-dielectric material which is especially useful as a material for a high-capacitance capacitor and which has a high dielectric constant is provided. The high-dielectric material is composed of a sintered body of a rare-earth sulfide, the high-dielectric material having a crystal structure of tetragonal β type, a chemical composition represented by Ln2S3 (where Ln represents a rare-earth metal), a frequency domain within the range of 0.5 kHz to 1,000 kHz, and a value of relative dielectric constant of more than 1,000 at room temperature.
摘要翻译：提供了特别可用作高容量电容器材料并具有高介电常数的高介电材料。高电介质材料由稀土类硫化物的烧结体构成，具有四方β型晶体结构的高电介质材料，Ln 2 S 2表示的化学成分， 3（其中Ln表示稀土金属），频域在0.5kHz至1,000kHz范围内，相对介电常数在室温下大于1000。

2. 发明申请

US20060201161A1 Cooling device for electronic component using thermo-electric conversion material 审中-公开
标题翻译：使用热电转换材料的电子部件冷却装置
公开(公告)号：US20060201161A1
公开(公告)日：2006-09-14
申请号：US10540523
申请日：2003-12-26
申请人： Shinji Hirai , Toshiyuki Nishimura , Yoichiro Uemura , Shigenori Morita , Kazumasa Igarashi
发明人： Shinji Hirai , Toshiyuki Nishimura , Yoichiro Uemura , Shigenori Morita , Kazumasa Igarashi
IPC分类号： F25B21/02 , H01L35/28 , F25D23/12
CPC分类号： H01L23/38 , H01L35/32 , H01L2924/0002 , H01L2924/00
摘要： A cooling device for a heat-generating electronic component such as a semiconductor integrated circuit element is provided. In particular, a cooling device using a thermoelectric conversion material is provided. A cooling device for an electronic component includes a thermoelectric conversion material disposed between two electrodes that function as a cathode and an anode and are electrically short-circuited. The thermoelectric conversion material is either a p-type material or an n-type material or a combination of p-type and n-type materials arranged alternately in series. This cooling device is brought into contact with an electronic component requiring cooling so that one electrode side in contact with the thermoelectric conversion material becomes a low-temperature side and the other electrode side becomes a high-temperature side. A temperature difference between the two electrodes causes the thermoelectric conversion material to produce a thermoelectromotive force which generates current to cool the high-temperature side.
摘要翻译：提供了一种用于诸如半导体集成电路元件的发热电子部件的冷却装置。特别地，提供了使用热电转换材料的冷却装置。电子部件的冷却装置包括设置在两个电极之间的热电转换材料，该电极用作阴极和阳极并且电短路。热电转换材料是p型材料或n型材料，或者是串联交替布置的p型和n型材料的组合。该冷却装置与需要冷却的电子部件接触，使得与热电转换材料接触的一个电极侧成为低温侧，另一个电极侧成为高温侧。两个电极之间的温差导致热电转换材料产生产生电流以冷却高温侧的热电动势。

3. 发明授权

US10025432B2 Capacitive touch panel 有权
公开(公告)号：US10025432B2
公开(公告)日：2018-07-17
申请号：US14128442
申请日：2012-06-20
申请人： Hiroaki Kishioka , Mayumi Kishioka , Tomohide Banba , Mitsuru Honjo , Naoki Nagaoka , Kazumasa Igarashi , Yuki Hasegawa , Hiroshi Wada , Yuki Tsubaki , Tomotake Nashiki
发明人： Hiroaki Kishioka , Tomohide Banba , Mitsuru Honjo , Naoki Nagaoka , Kazumasa Igarashi , Yuki Hasegawa , Hiroshi Wada , Yuki Tsubaki , Tomotake Nashiki
IPC分类号： G06F3/044 , C09J133/08 , G02F1/1333 , H03K17/96 , B32B7/12 , B23B27/08 , B32B27/28 , B32B27/30 , B32B27/34 , B32B27/36 , B32B27/40 , C09J7/24 , H01L27/32
摘要： Provided is a capacitive touch panel which has enhanced sensitivity and is usable in an image display panel, etc. in this capacitive touch panel, a window, a first transparent film having a first transparent conductive electrode pattern formed on one surface thereof, and a second transparent film having a second transparent conductive electrode pattern which is formed on one surface thereof and disposed with respect to the first transparent film in such a manner as to allow a capacitance to be formed therebetween, are stacked in turn. The capacitive touch panel comprises a first transparent inter-layer resin provided between the window and the first transparent film, and a second transparent inter-layer resin provided between the first transparent film and the second transparent film, wherein the first transparent inter-layer resin has a dielectric constant greater than that of the second transparent inter-layer resin.

4. 发明申请

US20100059113A1 DYE-SENSITIZED SOLAR CELL 审中-公开
标题翻译：透明的太阳能电池
公开(公告)号：US20100059113A1
公开(公告)日：2010-03-11
申请号：US12514122
申请日：2007-10-26
申请人： Yuki Hasegawa , Kazumasa Igarashi , Kenichi Hiwatashi , Naoto Masuyama
发明人： Yuki Hasegawa , Kazumasa Igarashi , Kenichi Hiwatashi , Naoto Masuyama
IPC分类号： H01L31/042
CPC分类号： H01G9/2077 , H01G9/2031 , H01G9/2059 , H01M14/005 , Y02E10/542
摘要： A dye-sensitized solar cell is provided, which includes glass substrates (1, 1′) each formed with an electrically conductive transparent electrode film and bonded to each other in opposed relation with a seal member (7), and an electrolyte solution filled in a space between the glass substrates. The seal member (7) is composed of a material cured by photopolymerizing a photopolymerizable composition essentially containing a hydrogenated elastomer derivative having at least one (meth)acryloyl group at least one of its opposite molecular terminals, and the glass substrates (1, 1′) each have a portion coated with a silane coupling agent of a (meth)acryloxyalkylsilane in contact with the seal member (7). Therefore, the dye-sensitized solar cell has higher adhesive sealability and excellent durability.
摘要翻译：提供一种染料敏化太阳能电池，其包括各自形成有导电透明电极膜并且与密封构件（7）相对地彼此结合的玻璃基板（1,1'），并且填充有电解液玻璃基板之间的空间。密封构件（7）由通过光聚合组合物固化的材料构成，所述光致聚合组合物基本上含有至少一个（甲基）丙烯酰基基团的氢化弹性体衍生物，其至少一个相对的分子末端，玻璃基板（1,1' ）各自具有涂覆有与密封构件（7）接触的（甲基）丙烯酰氧基烷基硅烷的硅烷偶联剂的部分。因此，染料敏化太阳能电池具有更高的粘合密封性和优异的耐久性。

5. 发明授权

US5814894A Semiconductor device, production method thereof, and tape carrier for semiconductor device used for producing the semiconductor device 失效
标题翻译：半导体装置及其制造方法以及用于制造半导体装置的半导体装置用带载体
公开(公告)号：US5814894A
公开(公告)日：1998-09-29
申请号：US627996
申请日：1996-04-04
申请人： Kazumasa Igarashi , Megumu Nagasawa , Satoshi Tanigawa , Hideyuki Usui , Nobuhiko Yoshio , Hisataka Ito , Tadao Okawa
发明人： Kazumasa Igarashi , Megumu Nagasawa , Satoshi Tanigawa , Hideyuki Usui , Nobuhiko Yoshio , Hisataka Ito , Tadao Okawa
IPC分类号： C08G73/10 , H01L21/56 , H01L23/12 , H01L23/28 , H01L23/29 , H01L23/31 , H01L23/498
CPC分类号： H01L23/3121 , H01L21/563 , H01L23/293 , H01L23/49816 , H01L23/49827 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/73203 , H01L2224/73204 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15174 , H01L2924/15311
摘要： A semiconductor device capable of preventing the occurrence of defect of electroconductivity, wherein a semiconductor chip 1 equipped with electrodes 11 is mounted on an auxiliary wiring plate 2 in the state of facing the surface of the electrode 11 side, leading conductors 23 are disposed in the inside of the auxiliary wiring plate 2, one end of each leading conductor 23 forms an internal electrode 21 projecting from the surface of the auxiliary wiring plate 2 at the side of mounting the semiconductor chip 1, the other end of the leading conductor 23 forms an external electrode 22 projecting from the surface of the auxiliary wiring plate opposite to the side of mounting the semiconductor chip 1, and each of the internal electrodes 21 is connected to each of the electrodes 11 of the semiconductor chip 1, at least a gap between the semiconductor chip 1 and the auxiliary wiring plate 2 is encapsulated with a heat-welding polyimide resin layer.
摘要翻译：一种能够防止导电性缺陷发生的半导体器件，其中，在与电极11侧的表面相对的状态下，在辅助布线板2上安装有配备有电极11的半导体芯片1，将导体23设置在在辅助配线板2的内部，每个引导导体23的一端形成从辅助布线板2的表面在安装半导体芯片1侧突出的内部电极21，引出导体23的另一端形成从辅助配线板的与安装半导体芯片1的一侧相反的表面突出的外部电极22，并且每个内部电极21连接到半导体芯片1的每个电极11，至少在半导体芯片1和辅助布线板2用热焊接聚酰亚胺树脂层封装。

6. 发明授权

US5053314A Positively photosensitive polyimide composition 失效
标题翻译：最新的光敏聚酰亚胺组合物
公开(公告)号：US5053314A
公开(公告)日：1991-10-01
申请号：US462243
申请日：1990-01-09
申请人： Tsuguo Yamaoka , Amane Mochizuki , Kazumasa Igarashi , Toshihiko Omote
发明人： Tsuguo Yamaoka , Amane Mochizuki , Kazumasa Igarashi , Toshihiko Omote
IPC分类号： G03F7/039
CPC分类号： G03F7/039
摘要： A positively photosensitive polyimide composition is disclosed, which composition comprises polyimide having repeating unit represented by formula (I): ##STR1## wherein Ar.sup.1 represents a tetravalent aromatic hydrocarbon group; Ar.sup.2 represents a divalent aromatic hydrocarbon group having an acyloxy group at the ortho-position and/or the meta-position of the aromatic ring; Ar.sup.3 represents a divalent aromatic hydrocarbon group; and the subunit having an amount ratio of m in the repeating unit is present in an amount of at least 20% by weight based on the polyimide. The composition exhibits high photosensitivity in reproduction of a fine pattern and excellent dimensional stability.

7. 发明授权

US06333139B1 Circuit-forming substrate and circuit substrate 有权
标题翻译：电路形成基板和电路基板
公开(公告)号：US06333139B1
公开(公告)日：2001-12-25
申请号：US09365786
申请日：1999-08-03
申请人： Toshihiko Omote , Yasuhito Funada , Hideyuki Usui , Masanori Ueno , Kazumasa Igarashi
发明人： Toshihiko Omote , Yasuhito Funada , Hideyuki Usui , Masanori Ueno , Kazumasa Igarashi
IPC分类号： G03C500
CPC分类号： B32B15/08 , G03F7/037 , H05K1/056 , Y10T428/12229 , Y10T428/1241 , Y10T428/12431 , Y10T428/12806 , Y10T428/12903 , Y10T428/24917 , Y10T428/31681
摘要： There are provided a circuit-forming substrate comprising a long stainless steel foil having formed on one surface or both surfaces thereof a polyimide resin layer wholly or partially, and a circuit substrate formed by using the circuit-forming substrate, wherein a conductor layer is finely patterned on the circuit-forming substrate. The circuit-forming substrate sufficiently satisfies low cost, high density and high reliability, scarcely causes warping of the substrate itself, and has excellent workability.
摘要翻译：提供了一种电路形成基板，其包括长整个或不表面的聚酰亚胺树脂层的一个表面或两个表面上形成的长的不锈钢箔，以及通过使用电路形成基板形成的电路基板，其中导体层是细的在电路形成衬底上图案化。电路形成基板充分满足低成本，高密度和高可靠性，几乎不引起基板本身翘曲，并且具有优异的可加工性。

8. 发明授权

US5120573A Process for producing metal/polyimide composite article 失效
标题翻译：生产金属/聚酰亚胺复合材料的方法
公开(公告)号：US5120573A
公开(公告)日：1992-06-09
申请号：US416280
申请日：1989-09-27
申请人： Kunio Miyazaki , Osamu Miura , Ryuji Watanabe , Yukio Ookoshi , Toshio Miyamoto , Mikio Aizawa , Kazumasa Igarashi , Amane Mochizuki
发明人： Kunio Miyazaki , Osamu Miura , Ryuji Watanabe , Yukio Ookoshi , Toshio Miyamoto , Mikio Aizawa , Kazumasa Igarashi , Amane Mochizuki
IPC分类号： C08G73/10 , H01B1/22 , H01B3/30 , H01L21/48 , H05K1/03
CPC分类号： H01B1/22 , C08G73/1007 , H01B3/306 , H01L21/481 , H05K1/0346 , H01L2224/16225
摘要： The present invention provides a process for producing a metal/polyimide composite article such as high-density wiring boards. This metal/polyimide composite article is produced by a method which comprises coating a polyamic acid alkyl ester represented by the following formula on a metallic film and curing it: ##STR1## wherein R.sub.1 and R.sub.2 which may be identical or different each represents an organic group of 1 or more carbon atoms.

9. 发明授权

US08765833B2 UV-curable optical resin adhesive composition 失效
标题翻译： UV固化光学树脂胶粘剂组合物
公开(公告)号：US08765833B2
公开(公告)日：2014-07-01
申请号：US13359982
申请日：2012-01-27
申请人： Kazumasa Igarashi , Yuki Hasegawa
发明人： Kazumasa Igarashi , Yuki Hasegawa
IPC分类号： C03C25/10 , C08G18/67 , C08J3/28 , C08F2/46 , C08G61/04
CPC分类号： C08G18/8116 , C08G18/6216 , C08G18/73 , C09D175/16 , G02F2001/133331 , G02F2202/28 , H01L2924/0002 , C08G18/62 , H01L2924/00
摘要： A UV-curable optical resin adhesive composition is provided having excellent transparency, adhesion reliability, and durability without causing any adverse affect on image qualities such as luminance and contrast, and suitable for a reworking (repairing) process. The UV-curable optical resin adhesive composition fills a gap between an image display panel and a protective cover plate. The UV-curable optical resin adhesive composition contains, a urethane acrylate-based polymer (A) having a (meth) acryloyl group and a hydroxyl group on side chains thereof, and a photopolymerization initiator (B).
摘要翻译：提供了具有优异的透明性，粘合可靠性和耐久性的UV固化光学树脂粘合剂组合物，而不对诸如亮度和对比度的图像质量造成任何不利影响，并且适合于再加工（修复）工艺。紫外线固化型光学树脂粘合剂组合物填充图像显示面板和保护盖板之间的间隙。紫外线固化型光学树脂粘合剂组合物含有在侧链具有（甲基）丙烯酰基和羟基的氨基甲酸酯丙烯酸酯类聚合物（A）和光聚合引发剂（B）。

10. 发明申请

US20120214896A1 UV-CURABLE OPTICAL RESIN ADHESIVE COMPOSITION 失效
标题翻译： UV可固化光学树脂粘合剂组合物
公开(公告)号：US20120214896A1
公开(公告)日：2012-08-23
申请号：US13359982
申请日：2012-01-27
申请人： Kazumasa Igarashi , Yuki Hasegawa
发明人： Kazumasa Igarashi , Yuki Hasegawa
IPC分类号： C09J175/16
CPC分类号： C08G18/8116 , C08G18/6216 , C08G18/73 , C09D175/16 , G02F2001/133331 , G02F2202/28 , H01L2924/0002 , C08G18/62 , H01L2924/00
摘要： A UV-curable optical resin adhesive composition is provided having excellent transparency, adhesion reliability, and durability without causing any adverse affect on image qualities such as luminance and contrast, and suitable for a reworking (repairing) process. The UV-curable optical resin adhesive composition fills a gap between an image display panel and a protective cover plate. The UV-curable optical resin adhesive composition contains, a urethane acrylate-based polymer (A) having a (meth) acryloyl group and a hydroxyl group on side chains thereof, and a photopolymerization initiator (B).
摘要翻译：提供了具有优异的透明性，粘合可靠性和耐久性的UV固化光学树脂粘合剂组合物，而不对诸如亮度和对比度的图像质量造成任何不利影响，并且适合于再加工（修复）工艺。紫外线固化型光学树脂粘合剂组合物填充图像显示面板和保护盖板之间的间隙。紫外线固化型光学树脂粘合剂组合物含有在侧链具有（甲基）丙烯酰基和羟基的氨基甲酸酯丙烯酸酯类聚合物（A）和光聚合引发剂（B）。

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