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1. 发明专利

JP2005103562A Non-lead-based joining material 审中-公开
标题翻译：非铅基接合材料
公开(公告)号：JP2005103562A
公开(公告)日：2005-04-21
申请号：JP2003337126
申请日：2003-09-29
申请人： Toshiba Corp , 株式会社東芝
发明人： TADAUCHI KIMIHIRO , KOMATSU IZURU , MATSUMOTO KAZUTAKA , SUZUKI ISAO , IMAMURA HIROKO
IPC分类号： B23K35/26 , C22C13/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a soldering material of high joining reliability and excellent in wettability which contains no lead as an environment-harmonized material suitable for mounting/joining electronic components on/with a substrate, and prevents oxidation of zinc.
SOLUTION: Non-lead-based joining particles are obtained by selecting either zirconium or molybdenum as additive element to the tin-zinc binary system or the tin-zinc-bismuth ternary system, and excellent joining reliability is ensured by improving the characteristic of zinc-containing solder which is easily oxidized. The non-lead-based joining particles are applicable to a micro electric connection area of an IC package such as BGA (ball grid array) and CSP (chip scale package) used for the surface mounting as joining particles for metallic members.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供具有高接合可靠性和优异的润湿性的焊接材料，其不含铅作为适合于将电子部件安装/接合在基板上的环境协调材料，并且防止锌的氧化。解决方案：通过选择锆或钼作为锡锌二元体系或锡 - 锌 - 铋三元体系的添加元素，可以获得非铅基接合颗粒，并且通过改善特性来确保优异的接合可靠性的容易氧化的含锌焊料。非铅系接合粒子适用于作为金属部件的接合粒子的表面安装用的BGA（球栅阵列），CSP（芯片尺寸封装）等IC封装的微电连接区域。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2001187451A PRINTING HEAD, PRODUCTION METHOD THEREFOR, ORIFICE PLATE USED IN THE HEAD, AND PRODUCTION METHOD THEREFOR 失效
公开(公告)号：JP2001187451A
公开(公告)日：2001-07-10
申请号：JP2000322891
申请日：2000-10-23
申请人： TOSHIBA TEC KK , TOSHIBA CORP
发明人： SUZUKI ISAO , SHIMOZATO MASASHI , ITO HIROSHI
IPC分类号： B41J2/045 , B41J2/055 , B41J2/135
摘要： PROBLEM TO BE SOLVED: To improve the printing resolution without causing deterioration of the printing quality. SOLUTION: This device comprises an orifice plate 6 having a plurality of orifices 7, and a head body 5 provided integrally with the orifice plate, sectioned into a plurality of ink chambers 12 for guiding an ink to each of the orifices, for ejecting the ink from the corresponding orifice by increasing the pressure of each ink chamber, wherein each orifice has a necking for limiting the ink ejecting direction error substantially to ±5 mrad or less with respect to the orifice central axis.

3. 发明专利

JPH10303518A BOARD FOR MOUNTING ELECTRONIC COMPONENT, ELECTRONIC COMPONENT MOUNTING BOARD AND METHOD OF BONDING TIN/ZINC ALLOY 失效
公开(公告)号：JPH10303518A
公开(公告)日：1998-11-13
申请号：JP10848797
申请日：1997-04-25
申请人： TOSHIBA CORP
发明人： TADAUCHI KIMIHIRO , TEJIMA KOICHI , KOMATSU IZURU , NAKAMURA SHINICHI , SUZUKI ISAO
IPC分类号： H05K1/02 , B23K35/14 , B23K35/26 , H01L23/488 , H05K1/11 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To mount fine components on a board with sufficient strengths and with a high density by using metal material which never causes lead contamination by a method wherein a metal layer whose main component is zinc is formed on the surface of a circuit interconnection metal layer and a metal layer whose main components are tin and zinc is formed on the metal layer. SOLUTION: Circuit interconnection metal layers on a circuit board are wetted with solder material whose main compoennts are tin and zinc to mount electronic components. At that time, zinc-rich layers are provided near the boundary surfaces between the solder material and the circuit interconnection metal layers. The zinc-rich layers may be formed by the deposition from the solder material. For instance, 1st circuit interconnection copper layers 2 are formed on the surface of a board 4 and interconnection copper layers 3 are formed also in the board 4. Then, solder which is eutectic material containing, for instance, more than 90.9% of tin and 9% of zinc is melted and dropped onto the copper interconnection layers 2 on the surface of the board 4, solder layers 1 which are 3rd metal layers 3 are formed on the surfaces of pads and the solder layers 1 are also formed on the surfaces of the copper interconnection layers 2 on the rear of the board 4.

4. 发明专利

JPH10278279A MANUFACTURE OF PRINT HEAD 失效
公开(公告)号：JPH10278279A
公开(公告)日：1998-10-20
申请号：JP32636497
申请日：1997-11-27
申请人： TOSHIBA CORP , TEC CORP
发明人： ITO HIROSHI , SUZUKI ISAO
IPC分类号： B41J2/135 , B23K26/382 , B41J2/145 , B41J2/16 , B23K26/00
摘要： PROBLEM TO BE SOLVED: To collectively form a plurality of orifice holes each having an inverted tapered shape by enhancing the accuracy of the diameter of the hole without generating clogging. SOLUTION: A polyimide sheet 12 is adhered to a print head 10 on which a plurality of ink supplying grooves 1 are formed. A metallic mask 13 having a plurality of openings formed on its surface is adhered to the surface of the polyimide sheet 12 by positioning each opening to the respective ink supplying groove 1. An KrF exima laser light is emitted on the polyimide sheet 12 through the metallic mask 13 by changing the emission angle thereof, thereby forming an orifice hole 27 having an inverted tapered shape on the polyimide sheet 12.

5. 发明专利

JPH07176337A ELECTRONIC PARTS LEAD TERMINAL 失效
公开(公告)号：JPH07176337A
公开(公告)日：1995-07-14
申请号：JP28242394
申请日：1994-10-24
申请人： TOSHIBA CORP
发明人： INABA MICHIHIKO , TEJIMA KOICHI , SUZUKI ISAO , SAKURAI HISAHARU
IPC分类号： H01R13/03 , H01L23/50
摘要： PURPOSE:To improve soldering, weather resistance and metal bonding by reduc ing the content of element added to the surface of an electronic parts lead terminal further than that of elements added to the inside of the electronic parts lead terminal. CONSTITUTION:The amount of elements such as Fe, Ni, Sn, Zn, Cr, Zr or the like to be added to the surface of an electronic parts lead terminal of a lead fame, etc., is set smaller than that inside the lead terminal. Thus, excellent soldering, soldering endurance and metal bonding of pure copper can be obtained while the mechanical strength of the lead terminal is kept at a high level. It is preferable that the lontent of elements added in a depth up to 0.1mum from the surface of the lead terminal is smaller than that in a depth of 0.6mum or more.

6. 发明专利

JPH06168975A BONDING WIRE 失效
公开(公告)号：JPH06168975A
公开(公告)日：1994-06-14
申请号：JP19668693
申请日：1993-07-15
申请人： TOSHIBA CORP
发明人： SATO MICHIO , SUZUKI ISAO , YAMAMORI KAZUHIRO
IPC分类号： H01L21/60 , C22C9/00
摘要： PURPOSE:To improve creep strength and bonding quality, by using a Cu bonding wire containing a specific amount of specific metal. CONSTITUTION:In virtue of fine amount addition, In, B, Bi, Ge and Si retard the recovery of dislocation and grain boundary transfer at the time of recrystallization, so that the recrystallization temperature is increased, and the grain boundary breaking of a Cu bonding wire is prevented. The content is set to be 20-360wtppm. As, Zn, K, Sr, Mg, Ca and Tl vaporize from Cu at the time of Cu ball formation, so that the permeation of oxygen into the Cu ball and the hardening of the Cu ball are prevented. The content is set to be 10-650wtppm. Sb, P, Li, Sn, Pb and Cd react with permeated oxygen at the time of Cu ball formation, and generate oxide, which evaporates from the Cu ball and softens it. The content is set to be 25-250wtppm. Letting the above metal groups be as A, B and C, the combination of A and B or the combination of A and C is added to high purity copper.

7. 发明专利

JPH06168974A BONDING WIRE 失效
公开(公告)号：JPH06168974A
公开(公告)日：1994-06-14
申请号：JP19668593
申请日：1993-07-15
申请人： TOSHIBA CORP
发明人： SATO MICHIO , SUZUKI ISAO , YAMAMORI KAZUHIRO
IPC分类号： H01L21/60 , C22C9/00
摘要： PURPOSE:To improve creep strength and bonding quality, by using a Cu bonding wire containing a specific amount of specific metal. CONSTITUTION:In virtue of very small amount addition, Zn, Hf, Ti, Cr and Mn retard the recovery of dislocation and grain boundary transfer at the time of recrystallization, so that the recrystallization temperature is increased, and the grain boundary breaking of a Cu bonding wire is prevented. The content is set to be 20-560wtppm. Sb, P, Li, Sn, Pb and Cd react with permeated oxygen at the time of Cu ball formation, and generate oxide, which evaporates from the Cu ball and softens it. The content is set to be 25-250wtppm. As, Zn, K, Sr, Mg, Ca and Tl vaporize from Cu at the time of Cu ball formation, so that the permeation of oxygen into the Cu ball and the hardening of the Cu ball are prevented. The content is set to be 10-650wtppm. Letting the above metal groups be A, B and C, the combination of A and B or the combination of A and C is added to high purity copper.

8. 发明专利

JPH02223369A LINEAR MOTOR 失效
公开(公告)号：JPH02223369A
公开(公告)日：1990-09-05
申请号：JP4348189
申请日：1989-02-23
申请人： TOSHIBA CORP
发明人： ISHIBASHI AYANORI , SUZUKI ISAO , KUSUNOKI SHIGEO , TAKEUCHI FUMIAKI
IPC分类号： H02K33/18 , H02K41/035
摘要： PURPOSE:To enable conducting the detection of a position with a good accuracy without being subject to the influence of a vibration by providing a position transducer composed of a rotary member turning in company with the movement of a moving body and a detector for detecting the rotating quantity of said rotating member at the position on the other edge part side relative to a movable element in said moving body. CONSTITUTION:A position transducer 32 is composed of a disc 33 being a rotator and a detector 34 for detecting the rotating quantity of the disc 33. The disc 33 is provided at one end of a roller shaft 29 to rotate integrally therewith. The detector 34 is composed of a light-emitting element 35 and a light-receiving element 36, which elements are fitted to a moving body 25 so as to bold the circumferential part of the disc 33 between and to detect the rotating quantity of the disc 33 by detecting the passage of the translucent part of said disc 33. As the disk 33 rotates on the basis of the movement of the moving body 25, the moving position of the moving body 25 is detected by detection of the rotating quantity of the disc 33. Thus, the detection of a moving position can be conducted with a good accuracy without being subject to the influence of vibration, etc.

9. 发明专利

JPS6321841A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS6321841A
公开(公告)日：1988-01-29
申请号：JP16556386
申请日：1986-07-16
申请人： TOSHIBA CORP
发明人： SATO MICHIO , SUZUKI ISAO , YAMAMORI KAZUHIRO
IPC分类号： H01L21/60
摘要： PURPOSE:To improve the breakage life of a creep due to the load of a tensile stress generated in a temperature cycle by using a copper alloy for suppressing a recrystallization as a bonding wire of a semiconductor element. CONSTITUTION:A wire material which contains 20-560ppm (hereinafter wt ppm is used) of one or more elements selected from Zr, Hf, Ti, Cr and Mn and 25-250ppm or one or more elements selected from Sb, P, Li, Sn, Pb and Cd or 10-650ppm of one or more elements selected from As, Zn, K, Sr, Mg, Ca and T, and the residue of Cu is used as a wire bonding material in a semiconductor device which uses a wire bonding as the connection of a semiconductor chip. Thus, the semiconductor device which uses a copper wire having a strong creep strength and an excellent bondability with high reliability is obtained.

10. 发明专利

JPS61241961A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS61241961A
公开(公告)日：1986-10-28
申请号：JP8258285
申请日：1985-04-19
申请人： TOSHIBA CORP
发明人： SATO MICHIO , SUZUKI ISAO
IPC分类号： C22C32/00 , C22C9/00 , H01L21/60 , H01L23/49
摘要： PURPOSE:To improve creep strength, low-cycle fatigue strength and corrosion resistance, by using wire material comprising specified single crystal copper alloy as a lead wire for wire bonding. CONSTITUTION:As a lead wire for wire bonding, wire material comprising a single crystal copper alloy, which includes 0.2-1.0vol% of at least one kind of material selected from among the group comprising aluminum oxide, silicon oxide, titanium oxide, zirconium oxide, chromium oxide and beryllium oxide, is used. In order to keep strength at high temperature, it is necessary that the size of a particle is 70nm or less and an interval between the particles is 900nm or less. For this purpose, internal oxidation treatment is carried out within a temperature range of 800-1,050 deg.C for 3-24hr. Thus creep due to the load of tensile stress and the fracture life due to low cycle fatigue are improved to a large extent. The fracture life is increased, and corrosion resistance becomes excellent.

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